DATASHEET

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1-888-IN
Low Resistance, Single 8-Channel, CMOS
Analog Multiplexer
The Hl-1818A is a monolithic, high performance CMOS
analog multiplexer offering built-in channel selection
decoding plus an inhibit (enable) input for disabling all
channels. Dielectric Isolation (Dl) processing is used for
enhanced reliability and performance. Substrate leakage
and parasitic capacitance are much lower, resulting in
extremely low static errors and high throughput rates. Low
output leakage (typically 0.1nA) and low channel ON
resistance (250) assure optimum performance in low level
or current mode applications.
The HI-1818A is a single-ended, 8-Channel multiplexer, and is
ideally suited for medical instrumentation, telemetry systems,
and microprocessor based data acquisition systems.
HI-1818A
FN3141.4
Features
• Signal Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+15V
• “ON” Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . 250
• Input Leakage (Max) . . . . . . . . . . . . . . . . . . . . . . . . .50nA
• Access Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350ns
• Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . .5mW
• DTL/TTL Compatible Address
• Operation . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Applications
• Data Acquisition Systems
• Precision Instrumentation
• Demultiplexing
• Selector Switch
Ordering Information
PART NUMBER
HI1-1818A-2
TEMP.
RANGE (oC)
-55 to 125
PACKAGE
16 Ld CERDIP
PKG.
DWG. #
F16.3
Pinout
HI-1818A (CERDIP)
TOP VIEW
ADDRESS A1 1
1
16 ADDRESS A0
+5V SUPPLY 2
15 -VSUPPLY
ENABLE 3
14 +VSUPPLY
ADDRESS A2 4
13 IN 1
IN 8 5
12 OUT
IN 7 6
11 IN 2
IN 6 7
10 IN 3
IN 5 8
9 IN 4
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002, 2004. All Rights Reserved
HI-1818A
Truth Table
HI-1818A TRUTH TABLE
HI-1818A TRUTH TABLE
ADDRESS
A2
A1
A0
L
L
L
L
L
H
L
H
L
L
H
H
H
L
L
ADDRESS
EN
A1
A0
EN
“ON” CHANNEL
H
L
H
L
6
H
H
L
L
7
3
H
H
H
L
8
4
X
X
X
H
None
“ON” CHANNEL
A2
L
1
L
2
L
L
L
5
Functional Block Diagram
HI-1818A
DIGITAL ADDRESS
A0
A1
ENABLE
A2
ADDRESS
INPUT
BUFFERS
ENABLE
BUFFER
MULTIPLEX
SWITCHES
N
IN 1
P
DECODERS
OUT
IN 8
N
P
Schematic Diagrams
ADDRESS INPUT BUFFER
P3
P5
P1
V+
N1
P4
VCC
A
D1
200
All N-Channel Bodies to VAll P-Channel Bodies to V+
Unless Otherwise Specified
P6
P7
P8
P9
P10
N6
N7
N8
N9
N10
D2
ADDRESS
INPUT
V-
P2
N4
A
N2
N5
N3
V-
2
FN3141.4
November 19, 2004
HI-1818A
Schematic Diagrams
ADDRESS DECODER
V+
EN
P11
A2 OR
A2
P12
A1 OR
A1
All N-Channel Bodies to VAll P-Channel Bodies to V+
TO P-CHANNEL
SWITCH
P13
A0 OR
A0
P15
P14
P16
TO N-CHANNEL
SWITCH
N11
N12
N15
N14
N13
V-
N16
IN SWITCH CELL
MULTIPLEXER SWITCH
FROM DECODE
N18
V+
All N-Channel Bodies to VAll P-Channel Bodies to V+
Unless Otherwise Specified
IN
N17
OUT
N19
V+
P17
P18
FROM DECODE
3
FN3141.4
November 19, 2004
HI-1818A
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V
Logic Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
Analog Signal (VIN, VOUT) . . . . . . . . . . . . . . . . (V-) -2V to (V+) +2V
Digital Input Voltage (VEN, VA) . . . . . . . . . . . . . . . . . . . . (V-) to (V+)
Thermal Resistance (Typical, Note 1)
JA (oC/W)
JC (oC/W)
CERDIP Package. . . . . . . . . . . . . . . . .
80
20
Maximum Junction Temperature
Ceramic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief 379 for details.
Electrical Specifications
Supplies = +15V, -15V, +5V; VAL = 0.4V, VAH = 4.0V, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP (oC)
MIN
TYP
MAX
UNITS
DYNAMIC CHARACTERISTICS
Access Time, tA
Note 4
25
-
350
500
ns
Full
-
-
1000
ns
Break-Before-Make Delay, tOPEN
25
-
25
-
ns
Enable Delay (ON), tON(EN)
25
-
300
500
ns
Enable Delay (OFF), tOFF(EN)
Settling Time
To 0.1%
Full
-
-
1000
ns
25
-
300
500
ns
Full
-
-
1000
ns
25
-
1.08
-
s
25
-
2.8
-
s
Channel Input Capacitance, CS(OFF)
25
-
4
-
pF
Channel Output Capacitance, CD(OFF)
25
-
20
-
pF
Input to Output Capacitance, CDS(OFF)
25
-
0.6
-
pF
Digital Input Capacitance, CA
25
-
5
-
pF
Full
-
-
0.4
V
To 0.025%
DIGITAL INPUT CHARACTERISTICS
Input Low Threshold, VAL
Input High Threshold, VAH
Note 3
Input Leakage Current, IA
Full
4.0
-
-
V
Full
-
-
1
A
Full
-15
-
+15
V
25
-
250
400

Full
-
-
500

ANALOG CHANNEL CHARACTERISTICS
Analog Signal Range, VlN
ON Resistance, rON
Note 2
OFF Input Leakage Current, IS(OFF)
Full
-
-
50
nA
ON Channel Leakage Current, lD(ON)
Full
-
-
250
nA
OFF Output Leakage Current, ID(OFF)
Full
-
-
250
nA
4
FN3141.4
November 19, 2004
HI-1818A
Electrical Specifications
Supplies = +15V, -15V, +5V; VAL = 0.4V, VAH = 4.0V, Unless Otherwise Specified (Continued)
PARAMETER
TEST CONDITIONS
TEMP (oC)
MIN
TYP
MAX
UNITS
POWER SUPPLY CHARACTERISTICS
Power Dissipation, PD
Full
-
-
27.5
mW
Current, I+
Full
-
-
0.5
mA
Current, I-
Full
-
-
1
mA
Current, IL
Full
-
-
1
mA
NOTES:
2. VOUT = 10V, IOUT = 1mA.
3. To drive from DTL/TTL circuits, 1k pull-up resistors to 5.0V supply are recommended.

4. Time measured to 90% of final output level; VOUT = -5.0V to 5.0V, Digital Inputs = 0V to 4.0V.
Test Circuits and Waveforms
+15V -15V +5V
A2 V+
VAH = 4.0V
50%
ENABLE DRIVE
(VA)
VAL = 0V
tON
(EN)
VA
10%
ENABLE DRIVE
2V/DIV.
VL
A1
IN 1
HI-1818A
A0
IN 2-8
EN
OUTPUT
90%
V-
+5V
ENABLED
(S1 ON)
OUT
50

200

12.5
pF
DISABLED
OUTPUT
2V/DIV.
tOFF
(EN)
100ns/DIV.
FIGURE 1B. TEST CIRCUIT
FIGURE 1A. MEASUREMENT POINTS
FIGURE 1C. WAVEFORMS
FIGURE 1. ENABLE DELAYS
+15V -15V +5V
A2 V+
4.0V
50%
OUTPUT
+5V
IN 2
S1 ON
EN
S2 ON
IN 3-8
A0
VA
50%
VA INPUT
2V/DIV.
VL
IN 1
A1 HI-1818A
ADDRESS
DRIVE (VA)
0V
V-
50

OUT
200

12.5
pF
OUTPUT
1V/DIV.
tOPEN
100ns/DIV.
FIGURE 2A. MEASUREMENT POINTS
FIGURE 2B. TEST CIRCUIT
FIGURE 2C. WAVEFORMS
FIGURE 2. BREAK-BEFORE-MAKE DELAY
5
FN3141.4
November 19, 2004
HI-1818A
1mA
V2
IN
OUT
VIN
V2
RON =
A
1mA
350
60
SWITCH CURRENT (mA)
300
125oC
ON RESISTANCE ()
OUT
V
250
25oC
200
-55oC
150
-55oC
40
125oC
20
25oC
0
-20
125oC
-40
100
-10
-8
-6
-4
-2
0
2
4
ANALOG INPUT (V)
6
8
10
FIGURE 3. ON RESISTANCE vs ANALOG INPUT VOLTAGE
OFF LEAKAGE
EN
4V
OUT
10V
-10
-8
-6
10V
8
10
ACCESS TIME TEST CIRCUIT
OUT
A ID(ON)
EN
A1
-4
-2
0
2
4
6
VOLTAGE ACROSS SWITCH (V)
FIGURE 4. ON CHANNEL CURRENT vs VOLTAGE
+5V
A0
25oC
-55oC
ON LEAKAGE
A ID(OFF)
10V
-60
IN 1
IN 2
-5V
IN 3-8
OUT
10
k
HI-1818A
10V
50pF
A0 A1 A2 EN
0.4V
NOTE:
OUT
EN
A
10V
50
0V TO 4V
Two measurements per channel:
10V and 10V

IS(OFF)
4V
Two measurements per device
for ID(OFF): 10V and 10V
10V

100nA
4V
10nA
A0 INPUT
50%
ID(ON) - ID(OFF)
2V/DIV.
HI-1818A
1nA
+5V
IS(OFF)
HI-1818A
100pA
OUTPUT
5V/DIV.
-5V
10%
10pA
25
50
75
TEMPERATURE (oC)
100
125
FIGURE 5. LEAKAGE CURRENTS vs TEMPERATURE
6
tA
100ns/DIV.
FIGURE 6. ACCESS TIME
FN3141.4
November 19, 2004
HI-1818A
Die Characteristics
METALLIZATION:
PASSIVATION:
Type: CuAl
Thickness: 16kÅ 2kÅ
Type: Nitride/Silox
Thickness: Silox: 12kÅ 2kÅ, Nitride: 3.5kÅ 1kÅ
WORST CASE CURRENT DENSITY:
1.43 x 105 A/cm2 at 25mA
Metallization Mask Layout
HI-1818A
VL
A1
A0
-VSUPPLY
EN
+VSUPPLY
A2
IN 1
OUTPUT
IN 8
IN 7
IN 6 IN 5
7
IN 4 IN 3 IN 2
FN3141.4
November 19, 2004
HI-1818A
Ceramic Dual-In-Line Frit Seal Packages (CERDIP)
F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A)
16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE
LEAD FINISH
c1
-D-
-A-
BASE
METAL
(c)
E
M
-Bbbb S
C A-B S
Q
-C-
SEATING
PLANE
S1
b2
b
ccc M
C A-B S
eA/2
-
0.200
-
5.08
-
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
0.840
-
21.34
5
E
0.220
0.310
5.59
7.87
5
c
aaa M C A - B S D S
D S
NOTES
0.014
eA
e
MAX
b

A A
MIN
A
A
L
MILLIMETERS
MAX
M
(b)
D
BASE
PLANE
MIN
b1
SECTION A-A
D S
INCHES
SYMBOL
NOTES:
1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
e
0.100 BSC
2.54 BSC
-
eA
0.300 BSC
7.62 BSC
-
eA/2
0.150 BSC
3.81 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
6
S1
0.005
-
0.13
-
7
105o
90o
105o
-
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.

90o
aaa
-
0.015
-
0.38
-
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2, 3
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
N
16
5. This dimension allows for off-center lid, meniscus, and glass
overrun.
16
8
Rev. 0 4/94
6. Dimension Q shall be measured from the seating plane to the
base plane.
7. Measure dimension S1 at all four corners.
8. N is the maximum number of terminal positions.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
8
FN3141.4
November 19, 2004