PCMFxUSB30 series Common-mode EMI filter for differential channels with integrated ESD protection Rev. 1 — 01 April 2016 Product data sheet 1. Product profile 1.1 General description Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are designed to provide low insertion loss for differential high-speed signals on each channel while unwanted common-mode signals are attenuated. Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line. Table 1. Product overview Type number Number of channels Package Name PCMF1USB30 1 WLCSP5 PCMF2USB30 2 WLCSP10 PCMF3USB30 3 WLCSP15 1.2 Features and benefits One, two and three differential channels common-mode EMI filters with integrated ESD protection ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2 Superior common-mode suppression over a wide frequency range Superior RF performance compared to other integrated filters or discrete filters with external ESD protection Extremely high symmetry between line pairs Industry-standard Wafer Level Chip Scale Packages: WLCSP5, 10 and 15 for smaller footprint 1.3 Applications Smartphone, cellular and cordless phone Tablet PC and Mobile Internet Device (MID) USB 3.1, USB 2.0, HDMI 2.0, HDMI 1.4 MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI) General-purpose EMI and Radio-Frequency Interference (RFI) filter and downstream ESD protection PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 2. Pinning information Table 2. Pin Pinning Symbol Description Simplified outline Graphic symbol PCMF1USB30 (WLCSP5_2-1-2) A1 CH1_IN+ channel 1+, external A2 CH1_IN channel 1, external B1 GND_CH1 ground channel 1 C1 CH1_OUT+ channel 1+, internal C2 CH1_OUT channel 1, internal 2 A1 C1 A2 C2 B1 1 A B C Transparent top view WLCSP5_2-1-2 B1 aaa-019784 PCMF2USB30 (WLCSP10_4-2-4) A1 CH1_IN+ channel 1+, external A2 CH1_IN channel 1, external A3 CH2_IN+ channel 2+, external A4 CH2_IN channel 2, external B1 GND_CH1 ground channel 1 B2 GND_CH2 ground channel 2 C1 CH1_OUT+ channel 1+, internal C2 CH1_OUT channel 1, internal C3 CH2_OUT+ channel 2+, internal C4 CH2_OUT channel 2, internal 4 A1, 3 C1, 3 A2, 4 C2, 4 B2 3 2 B1 1 B1, B2 - no internal connection A B aaa-019785 C Transparent top view WLCSP10_4-2-4 PCMF3USB30 (WLCSP15_6-3-6) A1 CH1_IN+ channel 1+, external A2 CH1_IN channel 1, external A3 CH2_IN+ channel 2+, external A4 CH2_IN channel 2, external A5 CH3_IN+ channel 3+, external A6 CH3_IN channel 3, external B1 GND_CH1 ground channel 1 B2 GND_CH2 ground channel 2 B3 GND_CH3 ground channel 3 C1 CH1_OUT+ channel 1+, internal C2 CH1_OUT channel 1, internal C3 CH2_OUT+ channel 2+, internal C4 CH2_OUT channel 2, internal C5 CH3_OUT+ channel 3+, internal C6 CH3_OUT channel 3, internal PCMFXUSB30_SER Product data sheet 6 A1, 3, 5 C1, 3, 5 A2, 4, 6 C2, 4, 6 B3 5 4 B2 3 B1, B2, B3 - no internal connection aaa-019786 2 B1 1 A B C Transparent top view WLCSP15_6-3-6 All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 3. Ordering information Table 3. Ordering information Type number Package Name Description Version PCMF1USB30 WLCSP5 wafer level chip-size package; 5 bumps (2-1-2) PCMF1USB30 PCMF2USB30 WLCSP10 wafer level chip-size package; 10 bumps (4-2-4) PCMF2USB30 PCMF3USB30 WLCSP15 wafer level chip-size package; 15 bumps (6-3-6) PCMF3USB30 4. Marking Table 4. Marking codes Type number Marking code PCMF1USB30 PF1S PCMF2USB30 PF2S PCMF3USB30 PF3S 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VI input voltage VESD electrostatic discharge voltage Min Max Unit 0.5 5 V contact discharge 15 15 kV air discharge 15 15 kV contact discharge 2 2 kV air discharge 2 2 kV 7 7 A IEC 61000-4-2, level 4; all input pins to ground IEC 61000-4-2, level 4; all output pins to ground PCMFXUSB30_SER Product data sheet tp = 8/20 s IPPM rated peak pulse current Tstg storage temperature 40 +125 C Tamb ambient temperature 40 +85 C All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 6. Characteristics 6.1 Channel characteristics Table 6. Channel characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit - 3 - - 0.25 - pF Rs(ch) channel series resistance single line; input to output Cd diode capacitance f = 1 MHz; VI = 2.5 V IRM reverse leakage current per line; VI = 5 V - - 100 nA VBR breakdown voltage IR = 1 mA 6 9 - V VF forward voltage IF = 10 mA - 0.8 - V Rdyn dynamic resistance TLP - 0.14 - - 0.14 - positive transient - 0.22 - negative transient - 0.22 - Min Typ Max Unit - 12 - dB f = 2.6 GHz - 38 - dB f = 5 GHz - 18 - dB [1] - 0.3 - dB [1] - 6 - GHz [1] [2] positive transient negative transient surge [3] [1] This parameter is guaranteed by design. [2] 100 ns Transmission Line Pulse (TLP); 50 W; pulser at 70 ns to 90 ns. [3] According to IEC 61000-4-5 (8/20 ms). 6.2 Frequency characteristics Table 7. Frequency characteristics Symbol Parameter Conditions Common mode: S21cc il [1] insertion loss f = 800 MHz Differential mode: S21dd il insertion loss f3dB [1] PCMFXUSB30_SER Product data sheet f = 1 MHz cut-off frequency Normalized to attenuation at 1 MHz. All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection aaa-019777 0 aaa-019778 0 Scc21 (dB) Sdd21 (dB) -10 -2 -20 S21dd pin 1 - 2 -4 S21cc pin 1 - 2 S21dd pin 5 - 6 S21cc pin 5 - 6 -30 -6 -40 -8 107 108 109 -50 107 1010 108 109 f (Hz) Fig 1. Differential-mode insertion loss; typical values aaa-021982 0 1010 f (Hz) Fig 2. Common-mode insertion loss; typical values aaa-019779 115 Sdd21 (db) Zdif (Ω) -20 Mag S21dd A3 - A4 > C1 - C2 105 Mag S21dd A5 - A6 > C1 - C2 -40 Z reference Z DUT 95 -60 -80 107 108 109 1010 85 40.4 1011 40.6 f (Hz) 40.8 41.0 41.2 t (ns) tr = 200 ps Fig 3. Differential crosstalk; typical values PCMFXUSB30_SER Product data sheet Fig 4. Differential Time Domain Reflectometer (TDR) plot; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Data rate: 10 Gbit/s Vertical scale: 173 mV/div Horizontal scale: 20 ps/div Fig 5. USB 3.1 eye diagram, test board with PCMF2USB30; typical values Data rate: 10 Gbit/s Vertical scale: 180 mV/div Horizontal scale: 20 ps/div Fig 6. PCMFXUSB30_SER Product data sheet USB 3.1 eye diagram, test board without device; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Data rate: 5 Gbit/s Vertical scale: 169 mV/div Horizontal scale: 40 ps/div Fig 7. USB 3.1 eye diagram, test board with PCMF2USB30; typical values Data rate: 5 Gbit/s Vertical scale: 179 mV/div Horizontal scale: 40 ps/div Fig 8. PCMFXUSB30_SER Product data sheet USB 3.1 eye diagram, test board without device; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Test frequency: 148.5 MHz Differential swing voltage: 861 mV Horizontal scale: 34 ps/div Fig 9. HDMI 2.0 eye diagram TP1, test board with PCMF2USB30; typical values Test frequency: 148.5 MHz Differential swing voltage: 917 mV Horizontal scale: 34 ps/div Fig 10. HDMI 2.0 eye diagram TP1, test board without device; typical values PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Test frequency: 148.5 MHz Differential swing voltage: 849 mV Horizontal scale: 34 ps/div Remark: Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and worst case positive skew. Fig 11. HDMI 2.0 eye diagram TP2, test board with PCMF2USB30; typical values Test frequency: 148.5 MHz Differential swing voltage: 909 mV Horizontal scale: 34 ps/div Remark: Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and worst case positive skew. Fig 12. HDMI 2.0 eye diagram TP2, test board without device; typical values PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Vertical scale: 145 mV/div Horizontal scale: 15.6 ns/div Fig 13. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board with PCMF2USB30; typical values Vertical scale: 146 mV/div Horizontal scale: 15.6 ns/div Fig 14. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board without device; typical values PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Vertical scale: 145 mV/div Horizontal scale: 15.6 ns/div Fig 15. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board with PCMF2USB30; typical values Vertical scale: 146 mV/div Horizontal scale: 15.6 ns/div Fig 16. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board without device; typical values PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection aaa-019781 25 aaa-019782 0 I (A) I (A) 20 -5 15 -10 10 -15 5 -20 0 0 5 10 15 20 25 -25 -25 -20 -15 -10 -5 VCL (V) 0 VCL (V) Transmission Line Pulse (TLP) = 100 ns; Transmission Line Pulse (TLP) = 100 ns; tr = 1 ns tr = 1 ns Fig 17. Dynamic resistance with positive clamping; typical values Fig 18. Dynamic resistance with negative clamping; typical values aaa-021984 25 aaa-021983 0 I (A) I (A) 20 -5 15 -10 10 -15 5 -20 0 0 5 10 15 20 25 -25 -25 -20 VCL (V) -15 -10 -5 0 VCL (V) Very-Fast Transmission Line Pulse (VF-TLP) = 5 ns; tr = 600 ps Fig 19. Dynamic resistance with positive clamping; typical values Very-Fast Transmission Line Pulse (VF-TLP) = 5 ns; tr = 600 ps Fig 20. Dynamic resistance with negative clamping; typical values The device uses an advanced clamping structure showing a negative dynamic resistance. This snapback behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snapback state after exceeding breakdown voltage (due to an ESD pulse for instance). PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection aaa-022150 10 aaa-022151 0 I (A) I (A) 8 -2 6 -4 4 -6 2 -8 0 0 2 4 6 8 10 -10 -10 -8 -6 -4 -2 VCL (V) According to IEC 61000-4-5 (8/20 s) According to IEC 61000-4-5 (8/20 s) Fig 21. Dynamic resistance with positive clamping; typical values PCMFXUSB30_SER Product data sheet 0 VCL (V) Fig 22. Dynamic resistance with negative clamping; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 7. Application information The device is designed to provide high-level ESD protection and common-mode filtering for differential high-speed data line pairs such as: • • • • • • USB 3.1 HDMI 2.0 Transition-Minimized Differential Signaling (TMDS) DisplayPort external Serial Advanced Technology Attachment (eSATA) Low Voltage Differential Signaling (LVDS) When designing the PCB, give careful consideration to impedance matching and signal coupling. Do not connect the protected signal lines to unlimited current sources like, for example, a battery. Fig 23. Application diagram: protecting and filtering the differential data lines of a USB Type-C connector evaluation dongle with PCMF1USB30 Since the SuperSpeed TX/RX lines are separated by GND or VBUS from the Hi-Speed lines, PCMF1USB30 makes it easy to achieve same signal lengths, straight routing, and optimal positioning for ESD protection directly at the connector. PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 8. Package outline WLCSP5: wafer level chip-size package; 5 bumps (2-1-2) PCMF1USB30 D bump A1 index area A1 E A detail X e 1/2 e b C e1 B1 B e2 A bump A1 index area 1 2 X 0 1 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b D E e e1 e2 max 0.60 0.38 0.31 0.82 1.22 nom 0.57 0.37 0.26 0.77 1.17 0.40 0.40 0.80 min 0.54 0.36 0.21 0.72 1.12 pcmf1usb30_po Outline version References IEC JEDEC JEITA PCMF1USB30 European projection Issue date 16-03-22 Fig 24. Package outline WLCSP5 PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection WLCSP10: wafer level chip-size package; 10 bumps (4-2-4) PCMF2USB30 D bump A1 index area A1 E A detail X e b C e1 B1 B B2 e2 A bump A1 index area 1 2 3 4 e3 X 1/2 e 0 1 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b D E e e1 e2 max 0.60 0.38 0.31 1.62 1.22 nom 0.57 0.37 0.26 1.57 1.17 0.40 0.40 0.80 min 0.54 0.36 0.21 1.52 1.12 e3 0.80 pcmf2usb30_po Outline version References IEC JEDEC JEITA PCMF2USB30 European projection Issue date 16-03-22 Fig 25. Package outline WLCSP10 PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 16 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection WLCSP15: wafer level chip-size package; 15 bumps (6-3-6) PCMF3USB30 D bump A1 index area A1 E A detail X e 1/2 e b C e1 B2 B1 B B3 e2 A 1 bump A1 index area 2 3 4 5 6 e3 X 0 1 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b D E e e1 e2 e3 max 0.60 0.38 0.31 2.42 1.22 nom 0.57 0.37 0.26 2.37 1.17 0.40 0.40 0.80 0.80 min 0.54 0.36 0.21 2.32 1.12 pcmf3usb30_po Outline version References IEC JEDEC JEITA PCMF3USB30 European projection Issue date 16-03-22 Fig 26. Package outline WLCSP15 PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 17 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 9. Soldering WLCSP5: Solder footprint and stencil aperture PCMF1USB30 Hx P see detail X P solder land (SL) Hy solder paste deposit (SP) solder land plus solder paste SL = SP solder resist opening (SR) SR occupied area detail X Dimensions in mm recommend stencil thickness: 0.1 mm P SL SP SR Hx Hy 0.40 0.25 0.25 0.325 1.00 1.40 16-03-22 pcmf1usb30_fr Fig 27. Soldering footprint WLCSP5 (PCMF1USB30) PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 18 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection WLCSP10: Solder footprint and stencil aperture PCMF2USB30 Hx P see detail X P solder land (SL) Hy solder paste deposit (SP) solder land plus solder paste SL = SP solder resist opening (SR) SR occupied area P1 Dimensions in mm detail X recommend stencil thickness: 0.1 mm P P1 SL SP SR Hx Hy 0.40 0.80 0.25 0.25 0.325 1.80 1.40 16-03-22 pcmf2usb30_fr Fig 28. Soldering footprint WLCSP10 (PCMF2USB30) WLCSP15: Solder footprint and stencil aperture PCMF3USB30 Hx P see detail X P solder land (SL) Hy solder paste deposit (SP) solder land plus solder paste SL = SP solder resist opening (SR) SR occupied area P1 detail X Dimensions in mm recommend stencil thickness: 0.1 mm P P1 SL SP SR Hx Hy 0.40 0.80 0.25 0.25 0.325 2.60 1.40 16-03-22 pcmf3usb30_fr Fig 29. Soldering footprint WLCSP15 (PCMF3USB30) PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 19 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 10. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes PCMFXUSB30_SER v.1 20160401 Product data sheet - - PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 20 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. PCMFXUSB30_SER Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 21 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PCMFXUSB30_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 01 April 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 22 of 23 PCMFxUSB30 series NXP Semiconductors Common-mode EMI filter for differential channels with ESD protection 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 6.1 6.2 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Channel characteristics . . . . . . . . . . . . . . . . . . 4 Frequency characteristics. . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 21 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contact information. . . . . . . . . . . . . . . . . . . . . 22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 01 April 2016 Document identifier: PCMFXUSB30_SER