si-3000kmseries an en

SI-3000KM series
Application Note
Surface Molding Series Regulator IC
SI-3000KM series
Jun 2015 Rev.2.0
SANKEN ELECTRIC CO., LTD.
SI-3000KM
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Contents
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1. General Description
1-1 Features
----------
3
1-2 Application
----------
3
1-3 Type
----------
3
2-1 Package Information
----------
4
2-2 Ratings
----------
5
2-3 Circuit Diagram
----------
10
3-1 Voltage Control
----------
12
3-2 Overcurrent Protection
----------
12
3-3 Thermal Shutdown
----------
13
4-1 External Components
----------
14
4-2 Pattern Design Notes
----------
15
5-1 Output ON / OFF Control
----------
16
5-2 Thermal Design
----------
16
6-1 SI-3012KM
----------
18
6-2 SI-3010KM
----------
20
2. Specification
3. Operational Description
4. Cautions
5. Applications
6. Typical Characteristics
2
SI-3000KM
1. General Description
The SI-3000KM is a series regulator IC using a hyposaturation type PNP bipolar transistor in the power
section and it can be used with the low difference of input/output voltages. It is provided with an ON / OFF
terminal which operates in Active High mode and the current consumption of circuits at OFF time is zero.
● 1-1 Features
-
-
Output current 1A
Output current is 1A at maximum with the outline of TO-252-5L.
Hyposaturation (Vdif = 0.6 Vmax / Io = 1A)
It can be designed with low difference of input/output voltages.
ON/OFF function
The ON/OFF terminal which can be directly controlled by TLL logic signals is provided.
Low current consumption
Current consumption of circuits at OFF time is zero.
Quiescent Current at no load is 600μA at maximum.
High ripple attenuation ratio
75dB: F = 100 - 120kHz at Vo = 5V
Built-in Overcurrent protection / Thermal shutdown
The automatic restoration and Foldback type overcurrent protection and Thermal shutdown
circuit are built in.
● 1-2 Application
For on-board local power supplies, power supplies for OA equipment, stabilization of secondary output
voltage of regulator and power supply for communication equipment
-
● 1-3 Type
Type: Semiconductor integrated circuits (monolithic IC)
Structure: Resin molding type (transfer molding)
3
SI-3000KM
2. Specification
Unit: mm
● 2-1 Package Information
*1
3***KM
*2
SK
*3
*4
1
2
3
4
5
Pin assignment
1.Vc
2.VIN
3.GND
4.Vout
5.Sense(or ADJ terminal for SI-3010KM/SI-3012KM)
Marking Method
*1:Product Name
*2:Logo Mark
*3:Lot Number
1st letter:The last digit of year
2nd letter:Month
1 to 9 for Jan. to Sept.,O for Oct.
N for Nov. D for Dec.
3rd letter:day
1 to 9day: for ”1”to “9”
10 to 31day:for “A” to”Z”
(But,“ B”,”I”,”O”,”Q” is removed.
*4:Administer number (Seven
digit)
The stem part has same potential as No. 3 pin (GND).
Product mass: about 0.33 g
4
SI-3000KM
● 2-2 Ratings
2-2-1 Absolute Maximum Ratings
Parameter
Symbol
DC Input Voltage
Output Control Terminal
Voltage
DC Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance
(Junction to Air)
Thermal Resistance
(Junction to Case)
VIN
Ta = 25°C
Ratings
SI-3012KM/3025KM
SI-3010KM/2050KM
/3033KM
/3090KM/3120KM
17
35*1
Units
V
VC
VIN
V
Io
PD*2
Tj
Tstg
1.0
1
-30 ro +125
-30 to +125
A
W
℃
℃
θj-a
95
℃/W
θj-c
6
℃/W
*1: A built-in input-overvoltage-protection circuit shuts down the output voltage at the Input Overvoltage
Shutdown Voltage of the electrical characteristics.
*2: When mounted on glass-epoxy board of 900mm2 (copper laminate area 4.3%).
2-2-2 Recommended Conditions
Parameter
Symbol
Ratings
SI-3012KM
SI-3025KM
SI-3033KM
SI-3010KM
SI-3050KM
SI-3090KM
SI-3120KM
2.4*2 to
6.0*1
2.4*2 to
5.0*1
*2 to 6.0*1
2.4*2 to
27*1
2.4*2 to
17*1
*2 to 20*1
*2 to 25*1
Units
Input
Voltage
VIN
Output
Current
Io
0 to 1.0
A
Top
-30 to 85
℃
Tj
-20 to 100
℃
Operational
Ambient
Temperature
Junction
Temperature
in
Operation
V
*1: VIN (max) and Io (max) are restricted by the relationship PD (max) = (VIN – Vo) × Io .
*2: Refer to the Dropout Voltage parameter.
5
SI-3000KM
2-2-3 Electrical Characteristics(1) (SI-3012KM,SI-3025KM,SI-3033KM)
Ta = 25°C
Ratings
Parameter
Symbol
SI-3012KM(Vo adjustable)
min
Input
Voltage
VIN
VO
(Vadj)
Conditio
ns
Output
Voltage
Settings
Line
Regulation
⊿
VOLINE
Conditio
ns
Load
Regulation
⊿
VOLOAD
Conditio
ns
Circuit
Current at
Output OFF
Temperature
Coefficient
of Output
Voltage
Ripple
Rejection
Overcurrent
Protection
Starting
Current*2
VC
Termin
al
Control
Voltage
(Output
ON)*3
Control
Voltage
(Output
OFF)
Control
Current
(Output
ON)
Control
Current
(Output
OFF)
min
typ
SI-3033KM
max
*1
(1.24)
(1.28)
(1.32)
min
typ
Units
max
*1
2.45
2.5
2.55
V
3.234
3.300
3.366
V
VIN=3.3V,Io=10mA
VIN=3.3V,Io=10mA
15
15
mV
VIN=3.3V,Io=10mA
40
VIN=3.3V,Io=10mA
40
40
mV
VIN=3.3V, Io=0 to
1A(Vo=2.5V)
VIN=3.3V, Io=0 to 1A
0.4
VIN=5V, Io=0 to 1A
0.4
Io=0.5A(Vo=2.5V)
0.4
Io=0.5A
0.6
Io=0.5A
0.6
Io=1A(Vo=2.5V)
0.6
Io=1A
350
Iq
VIN=5V,Io=10mA
15
VIN=3.3 to 8V,
Io=10mA(Vo=2.5V)
VDIF2
Conditio
ns
Quiescent
Circuit
Current
max
2.4*1
VDIF1
Conditio
ns
Dropout
Voltage
typ
SI-3025KM
Io=1A
350
350
Conditio
ns
VIN=3.3V,Io=0A,VC=2V,
R2=24kΩ
VIN=3.3V,Io=0A,VC=2V
VIN=5V,Io=0A,VC=2V
Iq(OFF)
1
1
1
VIN=3.3V,VC=0V
VIN=3.3V,VC=0V
VIN=5V,VC=0V
⊿Vo/
⊿Ta
±0.3
±0.3
±0.3
Conditio
ns
Tj=0 to 100℃(Vo=2.5V)
Tj=0 to 100℃
Tj=0 to 100℃
RREJ
55
55
55
Conditio
ns
VIN=3.3V,f=100 to
120Hz,Vo=2.5V
VIN=3.3V,f=100 to 120Hz
VIN=5V,f=100 to 120Hz
1.1
1.1
mV/℃
1.1
Conditio
ns
VC,IH
μA
μA
Conditio
ns
IS1
V
VIN=3.3V
VIN=3.3V
2.2
A
VIN=5V
2.2
dB
2.2
V
VC,IL
0.8
0.8
0.8
IC,IH
Conditio
ns
40
40
40
IC,IL
Conditio
ns
VC=2V
-5
0
VC=0V
VC=2V
-5
0
VC=0V
VC=2V
-5
0
μA
VC=0V
*1: Refer to the clause of a difference in input and output voltage.
*2: Is1 is specified at the 5% drop point of output voltage Vo on the condition that VIN = overcurrent
protection starting current, Io = 10mA.
*3: Output is OFF when the output control terminal Vc is open. Each input level is equivalent to LS-TTL
level. Therefore, the device can be driven directly by LS-TTLs.
Attention …
As PD=(VIN-Vo)×Io, VIN(MAX) and Io(MAX) must be referred to the data of P17, copper area vs power
dissipation upon actual applications.
6
SI-3000KM
2-2-3 Electrical Characteristics(2) (SI-3010KM,SI-3050KM,SI-3090KM)
Ta = 25°C
Ratings
Parameter
Symbol
SI-3010KM(Vo adjustable)
min
Input
Voltage
VIN
VO or
(Vadj)
Conditio
ns
Output
Voltage
Settings
typ
max
2.4*1
(0.98)
(1.00)
(1.02)
VIN=7V, Io=0 to 1A(Vo=5V)
VDIF1
Conditio
ns
Io=0.5A(Vo=5V)
Temperature
Coefficient
of Output
Voltage
Ripple
Rejection
Overcurrent
Protection
Starting
Current*2
VC
Termin
al
Control
Voltage
(Output
ON)*3
Control
Voltage
(Output
OFF)
Control
Current
(Output
ON)
Control
Current
(Output
OFF)
Input
Overvoltage
Shutdown
Voltage
min
typ
Units
max
5.00
5.10
V
8.82
9.00
9.18
V
⊿
VOLOAD
Conditio
ns
Circuit
Current at
Output OFF
SI-3090KM
max
VIN=7V,Io=10mA
Load
Regulation
VIN=11V,Io=10mA
30
75
54
mV
VIN=6 to 11V,
Io=10mA(Vo=5V)
VIN=6 to 11V,Io=10mA
75
VIN=10 to 15V,Io=10mA
40
40
mV
VIN=7V, Io=0 to 1A
0.3
0.3
0.6
Io=1A
600
VIN=7V,Io=0A,VC=2V,
R2=10kΩ
VIN=7V,Io=0A,VC=2V
600
VIN=11,Io=0A,VC=2V
1
μA
VIN=7V,VC=0V
VIN=7V,VC=0V
VIN=11V,VC=0V
⊿Vo/
⊿Ta
±0.5
±0.5
±1.0
Conditio
ns
Tj=0 to 100℃(Vo=5V)
Tj=0 to 100℃
Tj=0 to 100℃
RREJ
75
75
68
Conditio
ns
VIN=7V,f=100 to
120Hz,Vo=5V
VIN=7V,f=100 to 120Hz
VIN=11V,f=100 to 120Hz
mV/℃
1.1
Conditio
ns
VC,IH
μA
1
Conditio
ns
IS1
V
Io=1A
600
1
Iq(OFF)
0.3
Io=0.5A
0.6
Io=1A(Vo=5V)
Iq
VIN=11V, Io=0 to 1A
Io=0.5A
0.6
VDIF2
Conditio
ns
Conditio
ns
typ
*1
4.90
VIN=7V,Io=10mA
⊿
VOLINE
Conditio
ns
Quiescent
Circuit
Current
min
*1
Line
Regulation
Dropout
Voltage
SI-3050KM
1.1
VIN=7V
1.1
VIN=7V
2.0
dB
A
VIN=11V
2.0
2.0
V
0.8
VC,IL
40
IC,IH
Conditio
ns
-5
VOVP
33
0
40
VC=2V
-5
VC=0V
0
VC=2V
-5
VC=0V
26
Io=10mA
0.8
40
VC=2V
IC,IL
Conditio
ns
Conditio
ns
0.8
0
μA
VC=0V
30
Io=10mA
Io=10mA
V
*1: Refer to the clause of a difference in input and output voltage.
*2: Is1 is specified at the 5% drop point of output voltage Vo on the condition that VIN = overcurrent protection
starting current, Io = 10mA.
*3: Output is OFF when the output control terminal Vc is open. Each input level is equivalent to LS-TTL level.
Therefore, the device can be driven directly by LS-TTLs.
Attention …
SI-3010KM,SI-3050KM,SI-3090KM cannot be used in the following applications because the built-in
foldback-type overcurrent protection may cause errors during start-up stage;
7
SI-3000KM
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) Vo
adjustment by raising ground voltage
As PD=(VIN-Vo)×Io, VIN(MAX) and Io(MAX) must be referred to the data of P17, copper area vs power
dissipation upon actual applications.
2-2-3 Electrical Characteristics(3) (SI-3120KM)
Ratings
Parameter
SI-3120KM
Symbol
min
Input
Voltage
VIN
VO or
(Vadj)
Conditio
ns
Output
Voltage
Settings
typ
max
*1
V
11.76
12.00
12.24
V
VIN=7V,Io=10mA
Line
Regulation
⊿
VOLINE
Conditio
ns
Load
Regulation
⊿
VOLOAD
Conditio
ns
VIN=14V, Io=0 to 1A
VDIF1
Conditio
ns
Io=0.5A
Dropout
Voltage
Quiescent
Circuit
Current
Circuit
Current at
Output OFF
Temperature
Coefficient
of Output
Voltage
Ripple
Rejection
Overcurrent
Protection
Starting
Current*2
VC
Termin
al
Control
Voltage
(Output
ON)*3
Control
Voltage
(Output
OFF)
Control
Current
(Output
ON)
Control
Current
(Output
OFF)
Input
Overvoltage
Shutdown
Voltage
72
mV
VIN=13 to 18V,
Io=10mA
180
mV
0.3
0.6
VDIF2
Conditio
ns
600
Iq
VIN=14V,Io=0A,VC=2V,
Iq(OFF)
1
μA
μA
Conditio
ns
VIN=7V,VC=0V
⊿Vo/
⊿Ta
±1.5
Conditio
ns
Tj=0 to 100℃
RREJ
Conditio
ns
VIN=14V,f=100 to 120Hz
mV/℃
66
dB
1.1
Conditio
ns
VC,IH
V
Io=1A
Conditio
ns
IS1
Ta = 25°C
Units
A
VIN=14V
2.0
V
VC,IL
0.8
IC,IH
Conditio
ns
40
VC=2V
IC,IL
Conditio
ns
-5
VOVP
33
Conditio
ns
0
μA
VC=0V
Io=10mA
V
*1: Refer to the clause of a difference in input and output voltage.
*2: Is1 is specified at the 5% drop point of output voltage Vo on the condition that VIN = overcurrent protection
starting current, Io = 10mA.
*3: Output is OFF when the output control terminal Vc is open. Each input level is equivalent to LS-TTL level.
Therefore, the device can be driven directly by LS-TTLs.
8
SI-3000KM
Attention …
SI-3120KM cannot be used in the following applications because the built-in foldback-type overcurrent
protection may cause errors during start-up stage;
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) Vo
adjustment by raising ground voltage
As PD=(VIN-Vo)×Io, VIN(MAX) and Io(MAX) must be referred to the data of P17, copper area vs power
dissipation upon actual applications.
9
SI-3000KM
● 2-3 Circuit Diagram
2-3-1 Block Diagram
(SI-3010KM,SI-3012KM)
(SI-3025KM,SI-3033KM,SI-3050KM,SI-3090KM,SI-3120KM)
2-3-2 Typical Connection Diagram
Load
(SI-3010KM,SI-3012KM)
Load
(SI-3025KM,SI-3033KM,SI-3050KM,SI-3090KM,SI-3120KM)
*1 For SI-3012KM,SI-3025KM,SI-3033KM.
It is the setup to use a ultra-low ESR capacitor such as a ceramics-capacitor for Co with these models.
When an electrolytic-capacitor is used for Co, they may oscillate at low-temperature.
*1 For SI-3010KM,SI-3050KM,SI-3090KM,SI-3120KM.
As for these models,they may oscillate when a ultra-low ESR capacitor such as ceramic-capacitor is used for Co.
10
SI-3000KM
*2: D1: Reverse biased protection diodes
In the case of reverse bias between input and output, this diode will be required.
(Recommended diodes: SJPL-H2 made by Sanken)
It is unnecessary in case of Vo≦3.3V.
R1, R2: resistors for setting output voltages
Output voltages can be adjusted by connecting R1 and R2 as shown in the above figure.
R2: 10kΩ is recommended.(In case of the SI-3120KM,24kΩ is recommended.)
R1=(Vo-VADJ) /(VADJ /R2)
*3: In the case that Vo ≦ 1.5V is set, R3 should be inserted. 10kΩ is recommended for R3.
Regardless of the setup voltage, R3 is unnecessary in case of the SI-3012KM.
11
SI-3000KM
3. Operational Description
● 3-1 Voltage Control
In the SI-3000KM series, the driving circuit is controlled by comparing the reference voltage with the ADJ
terminal voltage (voltage divided by Vo detection resistor in fixed output products) to stabilize the output
voltage by varying the voltage between the emitter and collector of a main PNP power transistor. The
product of voltage between emitter and collector and the output current at this moment is consumed as heat.
● 3-2 Overcurrent Protection
3-2-1 Overcurrent Protection Characterization for
SI-3012KM,SI-3025KM,SI-3033KM
The Drooping type overcurrent protection function is provided in these models. In the case of the series
regulator, as the output voltage drops subject to the overcurrent protection, the difference of input/output
voltages increases to cause significant heating. Special care should be taken for the current limiting type
overcurrent protection, since large current flows continuously.
Output Voltage
<Example of Drooping type overcurrent protection characteristic>
Output Current
3-2-2 Overcurrent Protection Characterization for
SI-3010KM,SI-3050KM,SI-3090KM,SI-3120KM
The foldback type overcurrent protection function is provided in these models. After operation of the
overcurrent protection function, if the load resistance decreases and the output voltage drops, the output
current of products is squeezed to reduce the increase of loss. However, in the case of the foldback type
overcurrent protection function, since current limiting is also made at start-up, the function may not be used
for the following applications, as it may cause a start-up error.
(1) Constant current loads
(2) Plus/minus power supply
(3) DC power supply
(4) Output voltage adjustment by grounding-up
Output
voltage
出力電圧
< Example of Foldback Overcurrent Protection>
出力電流
Output
Current
12
SI-3000KM
● 3-3 Thermal Shutdown
This IC is provided with the overheat protection circuit which detects the semiconductor junction
temperature of the IC to limit the driving current, when the junction temperature exceeds the set value
(around 150°C). Since the minimum operating temperature of the overheat protection circuit is 130°C, the
thermal design of Tj <125°C is required. Since the overheat protection has no hysteresis, as soon as the
overload state is released and Tj falls below the set temperature, the normal operation is automatically
restored. When the overheat protection function is operated in the overload state, the output voltage falls,
but at the same time the output current is decreased and in the consequence, overheat protection operation
and automatic restoration are repeated in a short interval, resulting eventually in the waveforms of output
voltage oscillation.
Output
voltage
出力電圧
<Example of Thermal Shutdown>
Junction
Temperature
ジャンクション温度
*Note for thermal shutdown characteristic
This circuit protects the IC against overheat resulting from the instantaneous short circuit, but it should
be noted that this function does not assure the operation including reliability in the state that overheat
continues due to long time short circuit.
13
SI-3000KM
4. Cautions
● 4-1 External Components
4-1-1 Input Capacitor CIN
The input capacitor is required to eliminate noise and stabilize the operation and values of 0.47μF - 22μF
are recommended. Any of ceramic capacitors or electrolytic ones may be used for the input capacitor.
4-1-2 Output Capacitor Co
Co for SI-3010KM,SI-3050KM,SI-3090KM,SI-3120KM
In the output capacitor Co, larger capacitance than the recommended value is required for phase
compensation. Equivalent series resistance values (ESR) of capacitors are limited, and depending on
products, therefore the type of recommended capacitors is limited.
Recommended ESR values for SI-3010KM,SI-3050KM,SI-3090KM,SI-3120KM: 2Ω > ESR > 0.2Ω
It is recommended to use electrolytic capacitors. When capacitors with ultra-low ESR such as ceramic
capacitors, functional polymer capacitors,OS-capacitors etc., are used, phase margin is decreased, possibly
causing the oscillation of output voltage. Therefore these capacitors can not be used.
Co for SI-3012KM,SI-3025KM,SI-3033KM
Using a ceramics capacitor and a function polymer capacitor, OS-capacitor etc., is recommended.
As for these models,when a big-ESR capacitor such as electrolytic-capacitors was used, phase margin is
decreased and possibly causing the oscillation of output voltage. ESR's increase in the low temperature condition.
Therefore,
an electrolytic-capacitor can't be recommended because output may oscillate at a low temperature even when the
output doesn't oscillate at a room temperature.
4-1-3 Reverse bias protection diode D1
In the case of falling-down of the input voltage, it is recommended to insert a protection diode D1 against
the reverse bias between input and output. However, in the case of setting the Vout < 3.3V or lower, D1 is
not required including the case of reverse bias. In order to select a suitable D1, it should be taken into
consideration that the diode has adequate forward current withstand voltage against the instantaneous
discharge of energy stored in output capacitor Co.
The permissible value of the forward current per unit time of diode is specified in IFSM (A) and in the case
of our diode, it is specified at 50Hz half wave (10ms), but it should be noted that different companies may
specify different times. The selection of diode should be made by converting the specified time into the
actual discharging time so as to meet the required IFSM (A). The discharging time of Co is normally shorter
than 1ms, but it is recommended to do the conversion with 1ms in consideration of margin.
For conversion into IFSM, calculation should be made by using the equations (1) and (2).
2
 I FSM 

  t1  X
 2 
--- (1)
As for IFSM, please refer to the catalog of each company.
t1 = specified time in catalog of each company
Converted IFSM=
2 X
t2
--- (2)
t2: converted time (discharging time of Co)
14
SI-3000KM
<Graph 1>
Idis A
Charge at 5V
CoCo vs Idis(放電電流)
vs. Idis (discharge current)
Reference
120
100
80
60
40
20
0
1
10
100
1000
Co uF
On the assumption of Cout = 470μF, IFSM of around 90A or more (in 1ms time period) is required and
according to our specifications of diode, IFSM is specified for 10ms, therefore the diode of 30A has the
tolerated dose of 94.8A (in 1ms) to prove that it is usable.
● 4-2 Pattern Design Notes
4-2-1 Input / Output Capacitor
The input capacitor C1 and the output capacitor C2 should be connected to the IC as close as possible. If
the rectifying capacitor for AC rectifier circuit is on the input side, it can be used as an input capacitor.
However, if it is no close to the IC, the input capacitor should be connected in addition to the rectifying
capacitor.
4-2-2 ADJ Terminal (Output Voltage Set-up for SI-3010KM & SI-3012KM)
The ADJ terminal is a feedback detection terminal for controlling the output voltage. The output voltage
set-up is achieved by connecting R1 and R2.
SI-3010KM: it should be set in a manner that IADJ is around 100μA.
SI-3012KM: it should be set in a manner that IADJ is around 50μA.
R1, R2 and output voltage can be obtained by the following equations:
IADJ=VADJ/R2
*VADJ = 1. 0V ± 2% (SI-3010KM), R2 = 10kΩ recommended
*VADJ = 1. 28V ± 3% (SI-3012KM), R2 = 24kΩ recommended
R1 = (Vo-VADJ) / IADJ
R2 = VADJ / IADJ
Vout = R1× (VADJ / R2) + VADJ
15
SI-3000KM
5. Applications
● 5-1 Output ON / OFF Control
The ON/OFF control of output can be made by directly applying voltage to No. 1 Vc terminal. When the
Vc terminal is open, the operation is in OFF. The Vc terminal is in OFF below 0.8V and in ON at above
2V.
● 5-2 Thermal Design
5-2-1 Calculation of heat dissipation
Heat generation of the surface mounting IC is generally dependent on size, material and copper foil area of
the mounted printed circuit board. Full attention should be paid to heat dissipation and adequate margin be
taken into consideration at thermal design. In order to enhance the heat dissipation effect, it is
recommended to enlarge the copper foil area connected to the stem part on the back side of the product.
The copper foil area of the printed circuit board significantly affects the heat dissipation effect.
As the junction temperature Tj (MAX) is an inherent value, it must be observed strictly. For
this purpose, heat sink design (thermal resistance of board) which is appropriate for Pd
(MAX) and Ta MAX is required. This is graphically shown in the heat derating curve for
easy understanding. The heat dissipation design is done in the following procedure.
1) The maximum ambient temperature in the set Ta MAX is obtained.
2) The maximum loss PdMAX which varies the input/output conditions is obtained.
Pd = (VIN - Vout) × Iout
3) The area of copper foil is determined from the intersection point in the heat derating
curve below shown.
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SI-3000KM
For reference information, the graph of copper foil area vs. thermal resistance between
junction temperature and ambient temperature θj-a and the graph of copper foil area vs.
permissible dissipation that both are in the single side copper foil board FR - 4 are shown
below.
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SI-3000KM
6. Typical Characteristics
6.1 SI-3012KM
(Ta = 25°C)
*Set Vout = 2.5V (R2 = 24kΩ)
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SI-3000KM
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SI-3000KM
6.1 SI-3010KM
(Ta = 25°C)
*Set Vout = 5V (R2 = 10kΩ)
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SI-3000KM
Notice
・ The contents of this description are subject to change without prior notice for improvement etc.
Please make sure that any information to be used is the latest one.
・ Any example of operation or circuitry described in this application note is only for reference, and
we are not liable to any infringement of industrial property rights, intellectual property rights or
any other rights owned by third parties resulting from such examples.
・ In the event that you use any product described here in combination with other products, please
review the feasibility of combination at your responsibility.
・ Although we endeavor to improve the quality and reliability of our product, in the case of
semi-conductor components, defects or failures which occur at a certain rate of probability are
inevitable. The user should take into adequate consideration the safety design in the equipment or
the system in order to prevent accidents causing death or injury, fires, social harms etc..
・ Products described here are designed to be used in the general-purpose electronic equipment
(home appliances, office equipment, communication terminals, measuring equipment etc.). If
used in the equipment or system requiring super-high reliability (transport machinery and its
control equipment, traffic signal control equipment, disaster/crime prevention system, various
safety apparatus etc.), please consult with our sales office. Please do not use our product for the
equipment requiring ultrahigh reliability (aerospace equipment, atomic control, medical
equipment for life support etc.) without our written consent.
・ The products described here are not of radiation proof type.
・ The contents of this brochure shall not be transcribed nor copied without our written consent.
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