SKET 800/14G H4 Absolute Maximum Ratings Symbol Conditions Values Unit Tc = 85 °C 808 A Tc = 100 °C 597 A Tj = 25 °C 37000 A Tj = 130 °C 32000 A Tj = 25 °C 6845000 A²s Tj = 130 °C 5120000 A²s VRSM 1500 V VRRM 1400 V Chip IT(AV) ITSM i2t SEMIPACK® 6 Thyristor Modules SKET 800/14G H4 sinus 180° 10 ms 10 ms VDRM (di/dt)cr Tj = 130 °C (dv/dt)cr Tj = 130 °C Tj Visol • Precious metal pressure contacts for high reliability • Thyristor with amplifying gate • UL recognized, file no. E 63 532 Typical Applications* • DC motor control (e. g. for machine tools) • Temperature control (e. g. for ovens, chemical processes) • Softstart application V 200 A/µs 2000 V/µs -40 ... 130 °C Module Tstg Features 1400 a.c.; 50 Hz; r.m.s. -40 ... 125 °C 1 min 4000 V 1s 4800 V Characteristics Symbol Conditions min. typ. max. Unit V Chip VT Tj = 25 °C, IT = 3000 A 1.45 1.55 VT(TO) Tj = 130 °C 0.78 0.83 V rT Tj = 130 °C 0.22 0.25 m IDD;IRD Tj = 130 °C, VDD = VDRM; VRD = VRRM 150 mA tgd Tj = 25 °C, IG = 1 A, diG/dt = 1 A/µs 1 µs tgr VD = 0.67 * VDRM 2 µs tq Tj = 130 °C 200 IH Tj = 25 °C 1000 2000 mA IL Tj = 25 °C, RG = 33 1500 2500 mA VGT Tj = 25 °C, d.c. 3 V IGT Tj = 25 °C, d.c. 300 mA VGD Tj = 130 °C, d.c. IGD Tj = 130 °C, d.c. Rth(j-c) Rth(j-c) Rth(j-c) continuous DC sin. 180° rec. 120° µs 0.25 V 10 mA per chip 0.0405 K/W per module 0.0405 K/W per chip 0.042 K/W per module 0.042 K/W per chip 0.043 K/W per module 0.043 K/W Module Rth(c-s) chip 0.01 K/W module 0.01 K/W Nm Ms to heatsink M6 5.1 6.9 Mt to terminal M12 15.3 20.7 Nm 5 * 9,81 m/s² a w 2150 g SKET © by SEMIKRON Rev. 0 – 08.03.2012 1 SKET 800/14G H4 Fig. 1L: Power dissipation per thyristor vs. on-state current Fig. 1R: Power dissipation per thyristor vs. ambient temperature Fig. 5: Recovered charge vs. current decrease Fig. 6: Transient thermal impedance vs. time Fig. 7: On-state characteristics Fig. 8: Surge overload current vs. time 2 Rev. 0 – 08.03.2012 © by SEMIKRON SKET 800/14G H4 Fig. 9: Gate trigger characteristics SKET SEMIPACK 6 This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our staff. © by SEMIKRON Rev. 0 – 08.03.2012 3