MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−89, 3 LEAD CASE 463C−03 ISSUE C DATE 31 JUL 2003 SCALE 4:1 A −X− 3 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 463C−01 OBSOLETE, NEW STANDARD 463C−02. B −Y− S K G 2 PL D 0.08 (0.003) M DIM A B C D G H J K L M N S 3 PL X Y N M C J −T− STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR STYLE 2: PIN 1. ANODE 2. N/C 3. CATHOD E STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE SEATING PLANE MILLIMETERS MIN NOM MAX 1.50 1.60 1.70 0.75 0.85 0.95 0.60 0.70 0.80 0.23 0.28 0.33 0.50 BSC 0.53 REF 0.10 0.15 0.20 0.30 0.40 0.50 1.10 REF −−− −−− 10 _ −−− −−− 10 _ 1.50 1.60 1.70 INCHES NOM MAX 0.063 0.067 0.034 0.040 0.028 0.031 0.011 0.013 0.020 BSC 0.021 REF 0.004 0.006 0.008 0.012 0.016 0.020 0.043 REF −−− −−− 10 _ −−− −−− 10 _ 0.059 0.063 0.067 MIN 0.059 0.030 0.024 0.009 GENERIC MARKING DIAGRAM* STYLE 4: PIN 1. CATHODE 2. CATHODE 3. ANODE 3 xx D 1 H 2 H xx = Specific Device Code D = Date Code L *This information is generic. Please refer to device data sheet for actual part marking. G RECOMMENDED PATTERN OF SOLDER PADS DOCUMENT NUMBER: STATUS: 98AON11472D ON SEMICONDUCTOR STANDARD NEW STANDARD: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 SC−89, 3 LEAD http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON11472D PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PROCUTION. REQ. BY B. PICKARD 04 APR 2002 A UPDATED DIM K. WAS 0.010 IN/MIN. ADDED NOMINAL DIM’S TO IN AND MM. REQ. BY D. TRUHITTE 06 MAY 2002 B ADDED STYLES 1 THRU 4, COPIED FROM CASE 463. ADDED DIM “S” ON DWG. REQ. BY D. TRUHITTE 07 JAN 2003 C FIXED TABLE HEADERS 31 JUL 2003 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. Semiconductor Components Industries, LLC, 2003 July, 2003 − Rev. 03C Case Outline Number: 463C