PIC16C712/716 8-Bit CMOS Microcontrollers with A/D Converter and Capture/Compare/PWM Devices included in this Data Sheet: • PIC16C716 18-pin PDIP, SOIC, Windowed CERDIP • High-performance RISC CPU • Only 35 single-word instructions to learn • All single-cycle instructions except for program branches which are two cycle • Operating speed: DC – 20 MHz clock input DC – 200 ns instruction cycle Device Program Memory Data Memory PIC16C712 1K 128 PIC16C716 2K 128 • Interrupt capability (up to 7 internal/external interrupt sources) • Eight-level deep hardware stack • Direct, Indirect and Relative Addressing modes • Power-on Reset (POR) • Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) • Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation • Brown-out detection circuitry for Brown-out Reset (BOR) • Programmable code-protection • Power-saving Sleep mode • Selectable oscillator options • Low-power, high-speed CMOS EPROM technology • Fully static design • In-Circuit Serial Programming(ICSP™) • Wide operating voltage range: 2.5V to 5.5V • High Sink/Source Current 25/25 mA • Commercial, Industrial and Extended temperature ranges • Low-power consumption: - < 2 mA @ 5V, 4 MHz - 22.5 A, typical @ 3V, 32 kHz - < 1 A, typical standby current 1999-2013 Microchip Technology Inc. RA2/AN2 RA3/AN3/VREF 1 18 2 17 RA4/T0CKI MCLR/VPP VSS RB0/INT RB1/T1OSO/T1CKI RB2/T1OSI RB3/CCP1 3 16 4 5 6 7 8 PIC16C716 PIC16C712 Microcontroller Core Features: 15 14 13 12 11 9 10 1 20 2 19 3 18 RA1/AN1 RA0/AN0 OSC1/CLKIN OSC2/CLKOUT VDD RB7 RB6 RB5 RB4 20-pin SSOP RA2/AN2 RA3/AN3/VREF RA4/T0CKI MCLR/VPP VSS VSS RB0/INT RB1/T1OSO/T1CKI RB2/T1OSI RB3/CCP1 4 5 6 7 8 PIC16C716 PIC16C712 • PIC16C712 Pin Diagrams 17 16 15 14 13 9 12 10 11 RA1/AN1 RA0/AN0 OSC1/CLKIN OSC2/CLKOUT VDD VDD RB7 RB6 RB5 RB4 Peripheral Features: • Timer0: 8-bit timer/counter with 8-bit prescaler • Timer1: 16-bit timer/counter with prescaler can be incremented during Sleep via external crystal/clock • Timer2: 8-bit timer/counter with 8-bit period register, prescaler and postscaler • Capture, Compare, PWM module • Capture is 16-bit, max. resolution is 12.5 ns, Compare is 16-bit, max. resolution is 200 ns, PWM maximum resolution is 10-bit • 8-bit multi-channel Analog-to-Digital converter DS41106C-page 1 PIC16C712/716 Key Features PIC® Mid-Range Reference Manual (DS33023) PIC16C712 PIC16C716 Operating Frequency DC – 20 MHz DC – 20 MHz Resets (and Delays) POR, BOR (PWRT, OST) POR, BOR (PWRT, OST) Program Memory (14-bit words) 1K 2K Data Memory (bytes) 128 128 Interrupts 7 7 I/O Ports Ports A,B Ports A,B Timers 3 3 Capture/Compare/PWM modules 1 1 8-bit Analog-to-Digital Module 4 input channels 4 input channels PIC16C7XX FAMILY OF DEVICES Clock Memory PIC16C710 PIC16C71 PIC16C711 PIC16C712 PIC16C715 PIC16C716 Maximum Frequency of Operation (MHz) 20 20 20 20 20 20 20 20 EPROM Program Memory (x14 words) 512 1K 1K 1K 2K 2K 2K 4K Data Memory (bytes) Timer Module(s) Capture/Compare/ Peripherals PWM Module(s) Serial Port(s) (SPI™/I2C™, USART) A/D Converter (8-bit) Channels 36 36 68 128 128 128 128 192 TMR0 TMR0 TMR0 TMR0 TMR1 TMR2 TMR0 TMR0 TMR1 TMR2 TMR0 TMR1 TMR2 TMR0 TMR1 TMR2 — — — 1 — 1 1 2 — — — — — — SPI/I2C SPI/I2C, USART 4 4 4 4 4 4 5 5 Interrupt Sources 4 4 4 7 4 7 8 11 I/O Pins 13 13 13 13 13 13 22 22 2.5-6.0 3.0-6.0 2.5-6.0 2.5-5.5 2.5-5.5 2.5-5.5 2.5-5.5 2.5-5.5 Yes Yes Yes Yes Yes Yes Yes Yes Yes — Yes Yes Yes Yes Yes Yes Voltage Range (Volts) Features PIC16C72A PIC16C73B In-Circuit Serial Programming™ Brown-out Reset Packages DS41106C-page 2 18-pin DIP, 18-pin DIP, 18-pin DIP, 18-pin DIP, 18-pin DIP, 18-pin DIP, 28-pin SDIP, 28-pin SDIP, SOIC; SOIC SOIC; SOIC; SOIC; SOIC; SOIC, SSOP SOIC 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 1999-2013 Microchip Technology Inc. PIC16C712/716 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 Memory Organization ................................................................................................................................................................... 9 3.0 I/O Ports ..................................................................................................................................................................................... 21 4.0 Timer0 Module ........................................................................................................................................................................... 29 5.0 Timer1 Module ........................................................................................................................................................................... 31 6.0 Timer2 Module ........................................................................................................................................................................... 36 7.0 Capture/Compare/PWM (CCP) Module(s) ................................................................................................................................. 39 8.0 Analog-to-Digital Converter (A/D) Module.................................................................................................................................. 45 9.0 Special Features of the CPU...................................................................................................................................................... 51 10.0 Instruction Set Summary ............................................................................................................................................................ 67 11.0 Development Support................................................................................................................................................................. 69 12.0 Electrical Characteristics ............................................................................................................................................................ 73 13.0 Packaging Information................................................................................................................................................................ 89 Revision History .................................................................................................................................................................................. 95 Conversion Considerations ................................................................................................................................................................. 95 Migration from Base-line to Mid-Range Devices ................................................................................................................................. 95 Index ................................................................................................................................................................................................... 97 On-Line Support................................................................................................................................................................................. 101 Reader Response .............................................................................................................................................................................. 102 PIC16C712/716 Product Identification System .................................................................................................................................. 103 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. 1999-2013 Microchip Technology Inc. DS41106C-page 3 PIC16C712/716 NOTES: DS41106C-page 4 1999-2013 Microchip Technology Inc. PIC16C712/716 1.0 DEVICE OVERVIEW There are two devices (PIC16C712, PIC16C716) covered by this data sheet. This document contains device-specific information. Additional information may be found in the PIC® MidRange Reference Manual, (DS33023), which may be obtained from your local Microchip Sales Representative or downloaded from the Microchip web site. The Reference Manual should be considered a complementary document to this data sheet, and is highly recommended reading for a better understanding of the device architecture and operation of the peripheral modules. FIGURE 1-1: Figure 1-1 is the block diagram for both devices. The pinouts are listed in Table 1-1. PIC16C712/716 BLOCK DIAGRAM 13 EPROM 1K X 14 or 2K x 14 Program Memory Program Bus RAM Addr(1) RA0/AN0 RA1/AN1 RA2/AN2 RA3/AN3/VREF RA4/T0CKI PORTB 9 Addr MUX Instruction Reg Direct Addr 7 8 Indirect Addr FSR Reg STATUS Reg 8 3 OSC1/CLKIN OSC2/CLKOUT Timing Generation Oscillator Start-up Timer Power-on Reset Timer0 ALU 8 Watchdog Timer Brown-out Reset MCLR Timer1 RB0/INT RB1/T1OSO/T1CKI RB2/T1OSI RB3/CCP1 RB4 RB5 RB6 RB7 MUX Power-up Timer Instruction Decode & Control PORTA RAM 128 x 8 File Registers 8 Level Stack (13-bit) 14 8 Data Bus Program Counter W Reg VDD, VSS Timer2 CCP1 A/D Note 1: Higher order bits are from the STATUS register. 1999-2013 Microchip Technology Inc. DS41106C-page 5 PIC16C712/716 TABLE 1-1: Pin Name MCLR/VPP MCLR PIC16C712/716 PINOUT DESCRIPTION PIC16C712/716 DIP, SOIC SSOP 4 4 16 Type Type I ST Master clear (Reset) input. This pin is an active low Reset to the device. Programming voltage input I ST I CMOS Oscillator crystal input or external clock source input. ST buffer when configured in RC mode. CMOS otherwise. External clock source input. 15 O — O — Description 18 CLKIN OSC2/CLKOUT OSC2 Buffer P VPP OSC1/CLKIN OSC1 Pin 17 CLKOUT Oscillator crystal output. Connects to crystal or resonator in crystal oscillator mode. In RC mode, OSC2 pin outputs CLKOUT which has 1/4 the frequency of OSC1, and denotes the instruction cycle rate. PORTA is a bidirectional I/O port. RA0/AN0 RA0 AN0 17 RA1/AN1 RA1 AN1 18 RA2/AN2 RA2 AN2 1 RA3/AN3/VREF RA3 AN3 VREF 2 RA4/T0CKI RA4 3 T0CKI 19 I/O I TTL Analog Digital I/O Analog input 0 I/O I TTL Analog Digital I/O Analog input 1 I/O I TTL Analog Digital I/O Analog input 2 I/O I I TTL Analog Analog Digital I/O Analog input 3 A/D Reference Voltage input. I/O ST/OD I ST Digital I/O. Open drain when configured as output. Timer0 external clock input 20 1 2 3 Legend: TTL = TTL-compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels OD = Open drain output SM = SMBus compatible input. An external resistor is required if this pin is used as an output NPU = N-channel pull-up PU = Weak internal pull-up No-P diode = No P-diode to VDD AN = Analog input or output I = input O = output P = Power L = LCD Driver DS41106C-page 6 1999-2013 Microchip Technology Inc. PIC16C712/716 TABLE 1-1: PIC16C712/716 PINOUT DESCRIPTION (CONTINUED) Pin Name PIC16C712/716 DIP, SOIC SSOP Pin Buffer Type Type Description PORTB is a bidirectional I/O port. PORTB can be software programmed for internal weak pull-ups on all inputs. RB0/INT RB0 INT 6 RB1/T1OSO/T1CKI RB1 T1OSO 7 7 I/O I TTL ST Digital I/O External Interrupt I/O O TTL — I ST Digital I/O Timer1 oscillator output. Connects to crystal in oscillator mode. Timer1 external clock input. I/O I TTL — Digital I/O Timer1 oscillator input. Connects to crystal in oscillator mode. I/O I/O TTL ST Digital I/O Capture1 input, Compare1 output, PWM1 output. 8 T1CKI RB2/T1OSI RB2 T1OSI 8 RB3/CCP1 RB3 CCP1 9 RB4 10 12 I/O TTL Digital I/O Interrupt on change pin. RB5 11 12 I/O TTL Digital I/O Interrupt on change pin. RB6 12 13 I/O TTL I ST Digital I/O Interrupt on change pin. ICSP programming clock. RB7 13 14 I/O TTL I/O ST VSS 5 5, 6 P — Ground reference for logic and I/O pins. VDD 14 15, 16 P — Positive supply for logic and I/O pins. 9 10 Digital I/O Interrupt on change pin. ICSP programming data. Legend: TTL = TTL-compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input with CMOS levels OD = Open drain output SM = SMBus compatible input. An external resistor is required if this pin is used as an output NPU = N-channel pull-up PU = Weak internal pull-up No-P diode = No P-diode to VDD AN = Analog input or output I = input O = output P = Power L = LCD Driver 1999-2013 Microchip Technology Inc. DS41106C-page 7 PIC16C712/716 NOTES: DS41106C-page 8 1999-2013 Microchip Technology Inc. PIC16C712/716 2.0 MEMORY ORGANIZATION There are two memory blocks in each of these PIC® microcontroller devices. Each block (Program Memory and Data Memory) has its own bus so that concurrent access can occur. FIGURE 2-2: PC<12:0> CALL, RETURN RETFIE, RETLW Additional information on device memory may be found in the PIC® Mid-Range Reference Manual, (DS33023). 2.1 PROGRAM MEMORY MAP AND STACK OF PIC16C716 13 Stack Level 1 Program Memory Organization The PIC16C712/716 has a 13-bit Program Counter (PC) capable of addressing an 8K x 14 program memory space. PIC16C712 has 1K x 14 words of program memory and PIC16C716 has 2K x 14 words of program memory. Accessing a location above the physically implemented address will cause a wraparound. FIGURE 2-1: PROGRAM MEMORY MAP AND STACK OF THE PIC16C712 PC<12:0> CALL, RETURN RETFIE, RETLW User Memory Space The Reset vector is at 0000h and the interrupt vector is at 0004h. Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-chip Program Memory 07FFh 13 0800h Stack Level 1 1FFFh User Memory Space Stack Level 8 Reset Vector 0000h Interrupt Vector 0004h 0005h On-chip Program Memory 03FFh 0400h 1FFFh 1999-2013 Microchip Technology Inc. DS41106C-page 9 PIC16C712/716 2.2 Data Memory Organization The data memory is partitioned into multiple banks which contain the General Purpose Registers and the Special Function Registers. Bits RP1 and RP0 are the bank select bits. RP1(1) RP0 (STATUS<6:5>) = 00 Bank 0 = 01 Bank 1 = 10 Bank 2 (not implemented) = 11 Bank 3 (not implemented) Note 1: Maintain this bit clear to ensure upward compatibility with future products. Each bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the Special Function Registers. Above the Special Function Registers are General Purpose Registers, implemented as static RAM. All implemented banks contain Special Function Registers. Some “high use” Special Function Registers from one bank may be mirrored in another bank for code reduction and quicker access. 2.2.1 GENERAL PURPOSE REGISTER FILE The register file can be accessed either directly, or indirectly through the File Select Register FSR (see Section 2.5 “Indirect Addressing, INDF and FSR Registers”). FIGURE 2-3: REGISTER FILE MAP File Address File Address 00h INDF(1) INDF(1) 80h 01h TMR0 OPTION_REG 81h 02h PCL PCL 82h 03h STATUS STATUS 83h 04h FSR FSR 84h 05h PORTA TRISA 85h 06h PORTB TRISB 86h 07h DATACCP TRISCCP 87h 88h 08h 89h 09h 0Ah PCLATH PCLATH 8Ah 0Bh INTCON INTCON 8Bh 0Ch PIR1 PIE1 8Ch 0Eh TMR1L PCON 8Eh 0Fh TMR1H 8Fh 10h T1CON 90h 11h TMR2 12h T2CON 8Dh 0Dh 91h PR2 92h 93h 13h 14h 94h 15h CCPR1L 95h 16h CCPR1H 96h 17h CCP1CON 97h 18h 98h 19h 99h 1Ah 9Ah 1Bh 9Bh 1Ch 9Ch 9Dh 1Dh 1Eh ADRES 1Fh ADCON0 20h General Purpose Registers 96 Bytes 9Eh ADCON1 9Fh General Purpose Registers 32 Bytes A0h BFh C0h 7Fh FFh Bank 0 Bank 1 Unimplemented data memory locations, read as ‘0’. Note 1: Not a physical register. DS41106C-page 10 1999-2013 Microchip Technology Inc. PIC16C712/716 2.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers can be classified into two sets; core (CPU) and peripheral. Those registers associated with the core functions are described in detail in this section. Those related to the operation of the peripheral features are described in detail in that peripheral feature section. The Special Function Registers are registers used by the CPU and Peripheral Modules for controlling the desired operation of the device. These registers are implemented as static RAM. A list of these registers is give in Table 2-1. TABLE 2-1: Addr SPECIAL FUNCTION REGISTER SUMMARY Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: Value on POR, all other BOR Resets (4) Bank 0 INDF(1) Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 0000 0000 01h TMR0 Timer0 Module’s Register xxxx xxxx uuuu uuuu 02h PCL(1) Program Counter’s (PC) Least Significant Byte 0000 0000 0000 0000 00h (1) 03h STATUS 04h FSR(1) 05h PORTA(5,6) 06h (5,6) 07h PORTB (4) RP1 RP0 TO PD Z DC C Indirect Data Memory Address Pointer DATACCP 08h-09h IRP (4) — — —(7) — PORTA Data Latch when written: PORTA pins when read PORTB Data Latch when written: PORTB pins when read (7) —(7) (7) — (7) — — — 0Ah PCLATH 0Bh INTCON(1) 0Ch PIR1 --xx xxxx --xu uuuu xxxx xxxx uuuu uuuu (7) DCCP (7) — DT1CK Unimplemented (1,2) rr01 1xxx rr0q quuu xxxx xxxx uuuu uuuu xxxx xxxx xxxx xuxu — Write Buffer for the upper 5 bits of the Program Counter — — — — GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000 0Dh — 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 10h T1CON 11h TMR2 12h T2CON Unimplemented ---0 0000 ---0 0000 — — — T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON Timer2 Module’s Register — — --00 0000 --uu uuuu 0000 0000 0000 0000 TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 13h-14h 15h CCPR1L Capture/Compare/PWM Register1 (LSB) xxxx xxxx uuuu uuuu 16h CCPR1H Capture/Compare/PWM Register1 (MSB) xxxx xxxx uuuu uuuu 17h CCP1CON 18h-1Dh — 1Eh ADRES 1Fh ADCON0 — — DC1B1 DC1B0 CCP1M3 CCP1M2 CCP1M1 CCP1M0 Unimplemented — A/D Result Register ADCS1 ADCS0 --00 0000 --00 0000 — xxxx xxxx uuuu uuuu CHS2 CHS1 CHS0 GO/DONE — ADON 0000 00-0 0000 00-0 Legend: x = unknown, u = unchanged, q = value depends on condition, — = unimplemented, read as ‘0’, Shaded locations are unimplemented, read as ‘0’. Note 1: These registers can be addressed from either bank. 2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for PC<12:8> whose contents are transferred to the upper byte of the program counter. 3: Other (non Power-up) Resets include: external Reset through MCLR and the Watchdog Timer Reset. 4: The IRP and RP1 bits are reserved. Always maintain these bits clear. 5: On any device Reset, these pins are configured as inputs. 6: This is the value that will be in the port output latch. 7: Reserved bits; Do Not Use. 1999-2013 Microchip Technology Inc. DS41106C-page 11 PIC16C712/716 TABLE 2-1: Addr SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED) Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: Value on POR, all other BOR Resets (4) Bank 1 80h INDF(1) 81h OPTION_ REG 82h PCL(1) 83h STATUS(1) 84h FSR (1) 85h TRISA 86h TRISB 87h TRISCCP 88h-89h — 8Ah PCLATH(1,2) 8Bh INTCON(1) 8Ch PIE1 8Dh — 8Eh PCON 8Fh-91h 92h 93h-9Eh 9Fh — PR2 Addressing this location uses contents of FSR to address data memory (not a physical register) RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 PD Z DC C Program Counter’s (PC) Least Significant Byte IRP(4) RP1(4) RP0 TO — —(7) — rr01 1xxx rr0q quuu xxxx xxxx uuuu uuuu PORTA Data Direction Register --x1 1111 --x1 1111 PORTB Data Direction Register 1111 1111 1111 1111 —(7) —(7) — — GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 — — — — POR BOR ---- --qq ---- --uu —(7) —(7) —(7) TCCP —(7) TT1CK Unimplemented — Unimplemented — — — — 1111 1111 1111 1111 Unimplemented — — ---0 0000 ---0 0000 — — Unimplemented — xxxx x1x1 xxxx x1x1 — Write Buffer for the upper 5 bits of the Program Counter Timer2 Period Register ADCON1 1111 1111 1111 1111 0000 0000 0000 0000 Indirect Data Memory Address Pointer — 0000 0000 0000 0000 — — — PCFG2 PCFG1 PCFG0 — — ---- -000 ---- -000 Legend: x = unknown, u = unchanged, q = value depends on condition, — = unimplemented, read as ‘0’, Shaded locations are unimplemented, read as ‘0’. Note 1: These registers can be addressed from either bank. 2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for PC<12:8> whose contents are transferred to the upper byte of the program counter. 3: Other (non Power-up) Resets include: external Reset through MCLR and the Watchdog Timer Reset. 4: The IRP and RP1 bits are reserved. Always maintain these bits clear. 5: On any device Reset, these pins are configured as inputs. 6: This is the value that will be in the port output latch. 7: Reserved bits; Do Not Use. DS41106C-page 12 1999-2013 Microchip Technology Inc. PIC16C712/716 2.2.2.1 Status Register It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register because these instructions do not affect the Z, C or DC bits from the STATUS register. For other instructions, not affecting any Status bits, see the “Instruction Set Summary.” The STATUS register, shown in Figure 2-4, contains the arithmetic status of the ALU, the Reset status and the bank select bits for data memory. The STATUS register can be the destination for any instruction, as with any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. Note 1: These devices do not use bits IRP and RP1 (STATUS<7:6>). Maintain these bits clear to ensure upward compatibility with future products. 2: The C and DC bits operate as a borrow and digit borrow bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. For example, CLRF STATUS will clear the upper-three bits and set the Z bit. This leaves the STATUS register as 000u u1uu (where u = unchanged). FIGURE 2-4: R/W-0 IRP R/W-0 RP1 STATUS REGISTER (ADDRESS 03h, 83h) R/W-0 RP0 R-1 TO R-1 PD R/W-x Z R/W-x DC R/W-x C bit7 bit 7: bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset IRP: Register Bank Select bit (used for indirect addressing) 1 = Bank 2, 3 (100h-1FFh) – not implemented, maintain clear 0 = Bank 0, 1 (00h-FFh) – not implemented, maintain clear bit 6-5: RP1:RP0: Register Bank Select bits (used for direct addressing) 01 = Bank 1 (80h-FFh) 00 = Bank 0 (00h-7Fh) Each bank is 128 bytes Note: RP1 = not implemented, maintain clear bit 4: TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT Time-out occurred bit 3: PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2: Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1: DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) (for borrow the polarity is reversed) 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0: C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) 1 = A carry-out from the most significant bit of the result occurred 0 = No carry-out from the most significant bit of the result occurred Note: For borrow the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register. 1999-2013 Microchip Technology Inc. DS41106C-page 13 PIC16C712/716 2.2.2.2 OPTION_REG Register Note: The OPTION_REG register is a readable and writable register, which contains various control bits to configure the TMR0 prescaler/WDT postscaler (single assignable register known also as the prescaler), the External INT Interrupt, TMR0 and the weak pull-ups on PORTB. FIGURE 2-5: To achieve a 1:1 prescaler assignment for the TMR0 register, assign the prescaler to the Watchdog Timer. OPTION_REG REGISTER (ADDRESS 81h) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit7 bit0 bit 7: RBPU: PORTB Pull-up Enable bit 1 = PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6: INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RB0/INT pin 0 = Interrupt on falling edge of RB0/INT pin bit 5: T0CS: TMR0 Clock Source Select bit 1 = Transition on RA4/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4: T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on RA4/T0CKI pin 0 = Increment on low-to-high transition on RA4/T0CKI pin bit 3: PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ - n = Value at POR Reset bit 2-0: PS2:PS0: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 DS41106C-page 14 TMR0 Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 WDT Rate 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1999-2013 Microchip Technology Inc. PIC16C712/716 2.2.2.3 INTCON Register Note: The INTCON Register is a readable and writable register which contains various enable and flag bits for the TMR0 register overflow, RB Port change and External RB0/INT pin interrupts. FIGURE 2-6: Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. INTCON REGISTER (ADDRESS 0Bh, 8Bh) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE PEIE T0IE INTE RBIE T0IF INTF RBIF bit7 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 7: GIE: Global Interrupt Enable bit 1 = Enables all unmasked interrupts 0 = Disables all interrupts bit 6: PEIE: Peripheral Interrupt Enable bit 1 = Enables all unmasked peripheral interrupts 0 = Disables all peripheral interrupts bit 5: T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4: IINTE: RB0/INT External Interrupt Enable bit 1 = Enables the RB0/INT external interrupt 0 = Disables the RB0/INT external interrupt bit 3: RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2: T0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1: INTF: RB0/INT External Interrupt Flag bit 1 = The RB0/INT external interrupt occurred (must be cleared in software) 0 = The RB0/INT external interrupt did not occur bit 0: RBIF: RB Port Change Interrupt Flag bit 1 = At least one of the RB7:RB4 pins changed state (must be cleared in software) 0 = None of the RB7:RB4 pins have changed state 1999-2013 Microchip Technology Inc. DS41106C-page 15 PIC16C712/716 2.2.2.4 PIE1 Register Note: This register contains the individual enable bits for the peripheral interrupts. FIGURE 2-7: Bit PEIE (INTCON<6>) must be set to enable any peripheral interrupt. PIE1 REGISTER (ADDRESS 8Ch) U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — ADIE — — — CCP1IE TMR2IE TMR1IE bit7 bit0 bit 7: Unimplemented: Read as ‘0’ bit 6: ADIE: A/D Converter Interrupt Enable bit 1 = Enables the A/D interrupt 0 = Disables the A/D interrupt R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 5-3: Unimplemented: Read as ‘0’ bit 2: CCP1IE: CCP1 Interrupt Enable bit 1 = Enables the CCP1 interrupt 0 = Disables the CCP1 interrupt bit 1: TMR2IE: TMR2 to PR2 Match Interrupt Enable bit 1 = Enables the TMR2 to PR2 match interrupt 0 = Disables the TMR2 to PR2 match interrupt bit 0: TMR1IE: TMR1 Overflow Interrupt Enable bit 1 = Enables the TMR1 overflow interrupt 0 = Disables the TMR1 overflow interrupt DS41106C-page 16 1999-2013 Microchip Technology Inc. PIC16C712/716 2.2.2.5 PIR1 Register Note: This register contains the individual flag bits for the peripheral interrupts. FIGURE 2-8: Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. PIR1 REGISTER (ADDRESS 0Ch) U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 — ADIF — — — CCP1IF TMR2IF TMR1IF bit7 bit0 bit 7: Unimplemented: Read as ‘0’ bit 6: ADIF: A/D Converter Interrupt Flag bit 1 = An A/D conversion completed (must be cleared in software) 0 = The A/D conversion is not complete R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 5-3: Unimplemented: Read as ‘0’ bit 2: CCP1IF: CCP1 Interrupt Flag bit Capture Mode: 1 = A TMR1 register capture occurred (must be cleared in software) 0 = No TMR1 register capture occurred Compare Mode: 1 = A TMR1 register compare match occurred (must be cleared in software) 0 = No TMR1 register compare match occurred PWM Mode: Unused in this mode bit 1: TMR2IF: TMR2 to PR2 Match Interrupt Flag bit 1 = TMR2 to PR2 match occurred (must be cleared in software) 0 = No TMR2 to PR2 match occurred bit 0: TMR1IF: TMR1 Overflow Interrupt Flag bit 1 = TMR1 register overflowed (must be cleared in software) 0 = TMR1 register did not overflow 1999-2013 Microchip Technology Inc. DS41106C-page 17 PIC16C712/716 2.2.2.6 PCON Register Note: The Power Control (PCON) register contains a flag bit to allow differentiation between a Power-on Reset (POR) to an external MCLR Reset or WDT Reset. These devices contain an additional bit to differentiate a Brown-out Reset condition from a Power-on Reset condition. FIGURE 2-9: If the BODEN Configuration bit is set, BOR is ‘1’ on Power-on Reset. If the BODEN Configuration bit is clear, BOR is unknown on Power-on Reset. The BOR Status bit is a “don’t care” and is not necessarily predictable if the brown-out circuit is disabled (the BODEN Configuration bit is clear). BOR must then be set by the user and checked on subsequent resets to see if it is clear, indicating a brown-out has occurred. PCON REGISTER (ADDRESS 8Eh) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-q — — — — — — POR BOR bit7 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 7-2: Unimplemented: Read as ‘0’ bit 1: POR: Power-on Reset Status bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0: BOR: Brown-out Reset Status bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) DS41106C-page 18 1999-2013 Microchip Technology Inc. PIC16C712/716 2.3 PCL and PCLATH The Program Counter (PC) specifies the address of the instruction to fetch for execution. The PC is 13 bits wide. The low byte is called the PCL register. This register is readable and writable. The high byte is called the PCH register. This register contains the PC<12:8> bits and is not directly readable or writable. All updates to the PCH register go through the PCLATH register. 2.3.1 STACK The stack allows a combination of up to 8 program calls and interrupts to occur. The stack contains the return address from this branch in program execution. 2.4 Program Memory Paging The CALL and GOTO instructions provide 11 bits of address to allow branching within any 2K program memory page. When doing a CALL or GOTO instruction, the upper bit of the address is provided by PCLATH<3>. When doing a CALL or GOTO instruction, the user must ensure that the page select bit is programmed so that the desired program memory page is addressed. If a return from a CALL instruction (or interrupt) is executed, the entire 13-bit PC is pushed onto the stack. Therefore, manipulation of the PCLATH<3> bit is not required for the return instructions (which POPs the address from the stack). Mid-range devices have an 8-level deep x 13-bit wide hardware stack. The stack space is not part of either program or data space and the Stack Pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not modified when the stack is PUSHed or POPed. After the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). 1999-2013 Microchip Technology Inc. DS41106C-page 19 PIC16C712/716 2.5 EXAMPLE 2-2: Indirect Addressing, INDF and FSR Registers The INDF register is not a physical register. Addressing INDF actually addresses the register whose address is contained in the FSR register (FSR is a pointer). This is indirect addressing. EXAMPLE 2-1: HOW TO CLEAR RAM USING INDIRECT ADDRESSING MOVLW MOVWF CLRF INCF BTFSS GOTO NEXT INDIRECT ADDRESSING 0x20 FSR INDF FSR FSR,4 NEXT ;initialize pointer ; to RAM ;clear INDF register ;inc pointer ;all done? ;NO, clear next CONTINUE • • • • Register file 05 contains the value 10h Register file 06 contains the value 0Ah Load the value 05 into the FSR register A read of the INDF register will return the value of 10h • Increment the value of the FSR register by one (FSR = 06) • A read of the INDR register now will return the value of 0Ah. : ;YES, continue An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS<7>), as shown in Figure 2-10. However, IRP is not used in the PIC16C712/716. Reading INDF itself indirectly (FSR = 0) will produce 00h. Writing to the INDF register indirectly results in a no-operation (although Status bits may be affected). A simple program to clear RAM locations 20h-2Fh using indirect addressing is shown in Example 2-2. FIGURE 2-10: DIRECT/INDIRECT ADDRESSING Direct Addressing RP1:RP0 6 Indirect Addressing from opcode 0 IRP FSR register 0 (2) (2) bank select 7 bank select location select 00 00h 01 80h 10 100h (3) Data Memory(1) 7Fh Bank 0 FFh Bank 1 17Fh Bank 2 location select 11 180h (3) 1FFh Bank 3 Note 1: For register file map detail see Figure 2-3. 2: Maintain clear for upward compatibility with future products. 3: Not implemented. DS41106C-page 20 1999-2013 Microchip Technology Inc. PIC16C712/716 3.0 I/O PORTS Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. Additional information on I/O ports may be found in the PIC® Mid-Range Reference Manual, (DS33023). 3.1 PORTA and the TRISA Register PORTA is a 5-bit wide bidirectional port. The corresponding data direction register is TRISA. Setting a TRISA bit (= 1) will make the corresponding PORTA pin an input, (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISA bit (= 0) will make the corresponding PORTA pin an output, (i.e., put the contents of the output latch on the selected pin). Reading the PORTA register reads the status of the pins whereas writing to it will write to the port latch. All write operations are read-modify-write operations. Therefore, a write to a port implies that the port pins are read, the value is modified, and then written to the port data latch. 1999-2013 Microchip Technology Inc. Pin RA4 is multiplexed with the Timer0 module clock input to become the RA4/T0CKI pin. The RA4/T0CKI pin is a Schmitt Trigger input and an open drain output. All other RA port pins have TTL input levels and full CMOS output drivers. PORTA pins, RA3:0, are multiplexed with analog inputs and analog VREF input. The operation of each pin is selected by clearing/setting the control bits in the ADCON1 register (A/D Control Register1). Note: On a Power-on Reset, these pins are configured as analog inputs and read as ‘0’. The TRISA register controls the direction of the RA pins, even when they are being used as analog inputs. The user must ensure the bits in the TRISA register are maintained set when using them as analog inputs. EXAMPLE 3-1: INITIALIZING PORTA BCF CLRF STATUS, RP0 PORTA BSF MOVLW STATUS, RP0 0xEF MOVWF TRISA BCF STATUS, RP0 ; ; ; ; ; ; ; ; ; ; Initialize PORTA by clearing output data latches Select Bank 1 Value used to initialize data direction Set RA<3:0> as inputs RA<4> as outputs ; Return to Bank 0 DS41106C-page 21 PIC16C712/716 FIGURE 3-1: BLOCK DIAGRAM OF RA3:RA0 DATA BUS D Q VDD VDD WR PORT Q CK P Data Latch D WR TRIS N Q VSS VSS Analog input mode Q CK I/O pin TRIS Latch TTL Input Buffer RD TRIS Q D EN RD PORT To A/D Converter FIGURE 3-2: BLOCK DIAGRAM OF RA4/T0CKI PIN DATA BUS D Q WR PORT CK Q I/O Pin N Data Latch D WR TRIS Q CK VSS VSS Schmitt Trigger Input Buffer Q TRIS Latch RD TRIS Q D ENEN RD PORT TMR0 Clock Input DS41106C-page 22 1999-2013 Microchip Technology Inc. PIC16C712/716 TABLE 3-1: PORTA FUNCTIONS Name Bit# Buffer RA0/AN0 RA1/AN1 RA2/AN2 RA3/AN3/VREF bit 0 bit 1 bit 2 bit 3 TTL TTL TTL TTL Function Input/output or analog input Input/output or analog input Input/output or analog input Input/output or analog input or VREF Input/output or external clock input for Timer0 RA4/T0CKI bit 4 ST Output is open drain type Legend: TTL = TTL input, ST = Schmitt Trigger input TABLE 3-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets — —(1) RA2 RA1 RA0 --xx xxxx --xu uuuu — — —(1) PORTA Data Direction Register --11 1111 --11 1111 — — ---- -000 ---- -000 Address Name 05h PORTA — 85h TRISA 9Fh ADCON1 — RA4 — RA3 — PCFG2 PCFG1 PCFG0 Legend: x = unknown, u = unchanged, — = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA. Note 1: Reserved bits; Do Not Use. 1999-2013 Microchip Technology Inc. DS41106C-page 23 PIC16C712/716 3.2 PORTB and the TRISB Register Each of the PORTB pins has a weak internal pull-up. A single control bit can turn on all the pull-ups. This is performed by clearing bit RBPU (OPTION_REG<7>). The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on a Power-on Reset. PORTB is an 8-bit wide bidirectional port. The corresponding data direction register is TRISB. Setting a TRISB bit (= 1) will make the corresponding PORTB pin an input, (i.e., put the corresponding output driver in a High-Impedance mode). Clearing a TRISB bit (= 0) will make the corresponding PORTB pin an output, (i.e., put the contents of the output latch on the selected pin). EXAMPLE 3-2: INITIALIZING PORTB BCF CLRF STATUS, RP0 PORTB BSF MOVLW STATUS, RP0 0xCF MOVWF TRISB ; ; ; ; ; ; ; ; ; ; Initialize PORTB by clearing output data latches Select Bank 1 Value used to initialize data direction Set RB<3:0> as inputs RB<5:4> as outputs ; RB<7:6> as inputs FIGURE 3-3: BLOCK DIAGRAM OF RB0 PIN VDD RBPU(1) DATA BUS WR PORT weak VDD P pull-up Data Latch D Q I/O pin CK TRIS Latch D Q WR TRIS TTL Input Buffer CK VSS RD TRIS Q RD PORT D EN RB0/INT Schmitt Trigger Buffer Note 1: DS41106C-page 24 RD PORT To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). 1999-2013 Microchip Technology Inc. PIC16C712/716 PORTB pins RB3:RB1 are multiplexed with several peripheral functions (Table 3-3). PORTB pins RB3:RB0 have Schmitt Trigger input buffers. PORTB. The “mismatch” outputs of RB7:RB4 are OR’ed together to generate the RB Port Change Interrupt with flag bit RBIF (INTCON<0>). When enabling peripheral functions, care should be taken in defining TRIS bits for each PORTB pin. Some peripherals override the TRIS bit to make a pin an output, while other peripherals override the TRIS bit to make a pin an input. Since the TRIS bit override is in effect while the peripheral is enabled, read-modifywrite instructions (BSF, BCF, XORWF) with TRISB as destination should be avoided. The user should refer to the corresponding peripheral section for the correct TRIS bit settings. This interrupt can wake the device from Sleep. The user, in the Interrupt Service Routine, can clear the interrupt in the following manner: Four of PORTB’s pins, RB7:RB4, have an interrupt-onchange feature. Only pins configured as inputs can cause this interrupt to occur (i.e., any RB7:RB4 pin configured as an output is excluded from the interrupton-change comparison). The input pins, RB7:RB4, are compared with the old value latched on the last read of The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt-on-change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. FIGURE 3-4: a) b) Any read or write of PORTB will end the mismatch condition. Clear flag bit RBIF. A mismatch condition will continue to set flag bit RBIF. Reading PORTB will end the mismatch condition and allow flag bit RBIF to be cleared. BLOCK DIAGRAM OF RB1/T1OSO/T1CKI PIN RBPU(1) T1OSCEN T1CS TMR1CS 1 Data Bus RD DATACCP 0 DATACCP<0> D WR DATACCP CK VDD Q Weak P Pull-up Q VDD TRISCCP<0> D WR TRISCCP CK 1 Q RB1/T1OSO/T1CKI 0 Q PORTB<1> D WR PORTB CK 1 Q VSS 0 Q TRISB<1> D WR TRISB CK Q Q T1OSCEN TMR1CS 1 TTL Buffer RD PORTB 0 T1CLKIN ST Buffer Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). 1999-2013 Microchip Technology Inc. DS41106C-page 25 PIC16C712/716 FIGURE 3-5: BLOCK DIAGRAM OF RB2/T1OSI PIN VDD RBPU(1) weak P pull-up T1OSCEN VDD PORTB<2> DATA BUS WR PORTB D Q CK RB1/T1OSO/T1CKI Q VSS TRISB<2> D WR TRISB Q CK Q T1OSCEN RD PORTB TTL Buffer Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). FIGURE 3-6: BLOCK DIAGRAM OF RB3/CCP1 PIN RBPU(1) CCPON 0 CCPON DATACCP<2> D WR DATACCP CK CCPOUT RD DATACCP CCPIN 1 DATA BUS 1 Q 0 VDD Q weak P pull-up VDD TRISCCP<2> D WR TRISCCP CK Q 1 Q RB3/CCP1 0 CCP Output Mode PORTB<3> D WR PORTB CK Q 1 Q 0 VSS TRISB<3> D WR TRISB CK Q Q CCPON 1 RD PORTB 0 TTL Buffer Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). DS41106C-page 26 1999-2013 Microchip Technology Inc. PIC16C712/716 FIGURE 3-7: BLOCK DIAGRAM OF RB7:RB4 PINS VDD RBPU(1) DATA BUS weak P pull-up VDD Data Latch D Q WR PORT I/O pin CK TRIS Latch D Q WR TRIS VSS TTL Buffer CK ST Buffer RD TRIS Q Latch D EN RD PORT Q1 Set RBIF Q From other RB7:RB4 pins D RD PORT EN Q3 RB7:RB6 in Serial Programming mode Note 1: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit (OPTION_REG<7>). TABLE 3-3: Name PORTB FUNCTIONS Bit# Buffer Function TTL/ST(1) Input/output pin or external interrupt input. Internal software programmable weak pull-up. (1) Input/output pin or Timer1 oscillator output, or Timer1 clock input. Internal RB1/T1OS0/ bit 1 TTL/ST software programmable weak pull-up. See Timer1 section for detailed T1CKI operation. (1) Input/output pin or Timer1 oscillator input. Internal software programmable RB2/T1OSI bit 2 TTL/ST weak pull-up. See Timer1 section for detailed operation. (1) Input/output pin or Capture 1 input, or Compare 1 output, or PWM1 output. RB3/CCP1 bit 3 TTL/ST Internal software programmable weak pull-up. See CCP1 section for detailed operation. RB4 bit 4 TTL Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. RB5 bit 5 TTL Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. RB6 bit 6 TTL/ST(2) Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. Serial programming clock. RB7 bit 7 TTL/ST(2) Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. Serial programming data. Legend: TTL = TTL input, ST = Schmitt Trigger input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt or peripheral input. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. RB0/INT bit 0 1999-2013 Microchip Technology Inc. DS41106C-page 27 PIC16C712/716 TABLE 3-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on: POR, BOR Value on all other Resets 06h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu 86h TRISB 1111 1111 1111 1111 81h OPTION_REG 1111 1111 1111 1111 PORTB Data Direction Register RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB. DS41106C-page 28 1999-2013 Microchip Technology Inc. PIC16C712/716 4.0 TIMER0 MODULE Additional information on external clock requirements is available in the PIC® Mid-Range Reference Manual, (DS33023). The Timer0 module timer/counter has the following features: • • • • • • 4.2 8-bit timer/counter Readable and writable Internal or external clock select Edge select for external clock 8-bit software programmable prescaler Interrupt on overflow from FFh to 00h An 8-bit counter is available as a prescaler for the Timer0 module or as a postscaler for the Watchdog Timer, respectively (Figure 4-2). For simplicity, this counter is being referred to as “prescaler” throughout this data sheet. Note that there is only one prescaler available, which is mutually exclusively shared between the Timer0 module and the Watchdog Timer. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the Watchdog Timer and vice-versa. Figure 4-1 is a simplified block diagram of the Timer0 module. Additional information on timer modules is available in the PIC® Mid-Range Reference Manual, (DS33023). 4.1 The prescaler is not readable or writable. Timer0 Operation The PSA and PS2:PS0 bits (OPTION_REG<3:0>) determine the prescaler assignment and prescale ratio. Timer0 can operate as a timer or as a counter. Clearing bit PSA will assign the prescaler to the Timer0 module. When the prescaler is assigned to the Timer0 module, prescale values of 1:2, 1:4, ..., 1:256 are selectable. Timer mode is selected by clearing bit T0CS (OPTION_REG<5>). In timer mode, the Timer0 module will increment every instruction cycle (without prescaler). If the TMR0 register is written, the increment is inhibited for the following two instruction cycles. The user can work around this by writing an adjusted value to the TMR0 register. Setting bit PSA will assign the prescaler to the Watchdog Timer (WDT). When the prescaler is assigned to the WDT, prescale values of 1:1, 1:2, ..., 1:128 are selectable. Counter mode is selected by setting bit T0CS (OPTION_REG<5>). In Counter mode, Timer0 will increment on every rising or falling edge of pin RA4/ T0CKI. The incrementing edge is determined by the Timer0 Source Edge Select bit T0SE (OPTION_REG<4>). Clearing bit T0SE selects the rising edge. Restrictions on the external clock input are discussed below. When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x....etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the WDT. Note: When an external clock input is used for Timer0, it must meet certain requirements. The requirements ensure the external clock can be synchronized with the internal phase clock (TOSC). Also, there is a delay in the actual incrementing of Timer0 after synchronization. FIGURE 4-1: Prescaler Writing to TMR0 when the prescaler is assigned to Timer0 will clear the prescaler count, but will not change the prescaler assignment. TIMER0 BLOCK DIAGRAM Data Bus FOSC/4 0 PSout 1 1 Programmable Prescaler(2) RA4/T0CKI pin T0SE(1) 0 8 Sync with Internal clocks TMR0 PSout (2-cycle delay) 3 T0CS(1) PS2, PS1, PS0(1) PSA(1) Set Interrupt Flag bit T0IF on overflow Note 1: T0CS, T0SE, PSA, PS2:PS0 (OPTION_REG<5:0>). 2: The prescaler is shared with Watchdog Timer (refer to Figure 4-2 for detailed block diagram). 1999-2013 Microchip Technology Inc. DS41106C-page 29 PIC16C712/716 4.2.1 SWITCHING PRESCALER ASSIGNMENT 4.3 The TMR0 interrupt is generated when the TMR0 register overflows from FFh to 00h. This overflow sets bit T0IF (INTCON<2>). The interrupt can be masked by clearing bit T0IE (INTCON<5>). Bit T0IF must be cleared in software by the Timer0 module Interrupt Service Routine before re-enabling this interrupt. The TMR0 interrupt cannot awaken the processor from Sleep since the timer is shut off during Sleep. The prescaler assignment is fully under software control (i.e., it can be changed “on the fly” during program execution). Note: To avoid an unintended device Reset, a specific instruction sequence (shown in the PIC® Mid-Range Reference Manual, DS33023) must be executed when changing the prescaler assignment from Timer0 to the WDT. This sequence must be followed even if the WDT is disabled. FIGURE 4-2: Timer0 Interrupt BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER Data Bus CLKOUT (=Fosc/4) 0 RA4/T0CKI pin 8 M U X 1 M U X 0 1 SYNC 2 Cycles TMR0 Reg T0SE T0CS 0 1 Watchdog Timer Set flag bit T0IF on Overflow PSA 8-bit Prescaler M U X 8 8-to-1 MUX PS2:PS0 PSA 1 0 WDT Enable bit MUX PSA WDT Time-out Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION_REG<5:0>). TABLE 4-1: REGISTERS ASSOCIATED WITH TIMER0 Address Name 01h TMR0 0Bh,8Bh INTCON 81h OPTION_REG 85h TRISA Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Timer0 Module’s Register GIE PEIE RBPU INTEDG — — Value on: POR, BOR Value on all other Resets xxxx xxxx uuuu uuuu T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 —(1) Bit 4 --11 1111 --11 1111 PORTA Data Direction Register Legend: x = unknown, u = unchanged, — = unimplemented locations read as ‘0’. Shaded cells are not used by Timer0. Note 1: Reserved bit; Do Not Use. DS41106C-page 30 1999-2013 Microchip Technology Inc. PIC16C712/716 5.0 TIMER1 MODULE 5.1 The Timer1 module timer/counter has the following features: • 16-bit timer/counter (Two 8-bit registers; TMR1H and TMR1L) • Readable and writable (Both registers) • Internal or external clock select • Interrupt on overflow from FFFFh to 0000h • Reset from CCP module trigger Timer1 can operate in one of these modes: • As a timer • As a synchronous counter • As an asynchronous counter The operating mode is determined by the clock select bit, TMR1CS (T1CON<1>). Timer1 has a control register, shown in Figure 5-1. Timer1 can be enabled/disabled by setting/clearing control bit TMR1ON (T1CON<0>). Figure 5-2 is a simplified block diagram of the Timer1 module. Additional information on timer modules is available in the PIC® Mid-Range Reference Manual, (DS33023). FIGURE 5-1: Timer1 Operation In timer mode, Timer1 increments every instruction cycle. In counter mode, it increments on every rising edge of the external clock input. When the Timer1 oscillator is enabled (T1OSCEN is set), the RB2/T1OSI and RB1/T1OSO/T1CKI pins become inputs. That is, the TRISB<2:1> value is ignored. Timer1 also has an internal “Reset input”. This Reset can be generated by the CCP module (see Section 7.0 “Capture/Compare/PWM (CCP) Module(s)”). T1CON: TIMER1 CONTROL REGISTER (ADDRESS 10h) U-0 U-0 — — R/W-0 R/W-0 R/W-0 T1CKPS1 T1CKPS0 T1OSCEN R/W-0 T1SYNC R/W-0 R/W-0 TMR1CS TMR1ON bit7 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 7-6: Unimplemented: Read as ‘0’ bit 5-4: T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits 11 = 1:8 Prescale value 10 = 1:4 Prescale value 01 = 1:2 Prescale value 00 = 1:1 Prescale value bit 3: T1OSCEN: Timer1 Oscillator Enable Control bit 1 = Oscillator is enabled 0 = Oscillator is shut off Note: The oscillator inverter and feedback resistor are turned off to eliminate power drain bit 2: T1SYNC: Timer1 External Clock Input Synchronization Control bit TMR1CS = 1 1 = Do not synchronize external clock input 0 = Synchronize external clock input TMR1CS = 0 This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0. bit 1: TMR1CS: Timer1 Clock Source Select bit 1 = External clock from pin RB1/T1OSO/T1CKI (on the rising edge) 0 = Internal clock (FOSC/4) bit 0: TMR1ON: Timer1 On bit 1 = Enables Timer1 0 = Stops Timer1 1999-2013 Microchip Technology Inc. DS41106C-page 31 PIC16C712/716 FIGURE 5-2: TIMER1 BLOCK DIAGRAM Set flag bit TMR1IF on Overflow TMR1H Synchronized clock input 0 TMR1 TMR1L 1 TMR1ON on/off T1SYNC T1OSC RB1/T1OSO/T1CKI RB2/T1OSI 1 T1OSCEN FOSC/4 Enable Internal Oscillator(1) Clock Synchronize Prescaler 1, 2, 4, 8 det 0 2 T1CKPS1:T1CKPS0 TMR1CS Sleep input Note 1: When the T1OSCEN bit is cleared, the inverter and feedback resistor are turned off. This eliminates power drain. 5.2 Timer1 Module and PORTB Operation When Timer1 is configured as timer running from the main oscillator, PORTB<2:1> operate as normal I/O lines. When Timer1 is configured to function as a counter however, the clock source selection may affect the operation of PORTB<2:1>. Multiplexing details of the Timer1 clock selection on PORTB are shown in Figure 3-4 and Figure 3-5. The clock source for Timer1 in the Counter mode can be from one of the following: 1. 2. 3. External circuit connected to the RB1/T1OSO/ T1CKI pin Firmware controlled DATACCP<0> bit, DT1CKI Timer1 oscillator Table 5-1 shows the details of Timer1 mode selections, control bit settings, TMR1 and PORTB operations. DS41106C-page 32 1999-2013 Microchip Technology Inc. PIC16C712/716 TABLE 5-1: TMR1 Module Mode Off TMR1 MODULE AND PORTB OPERATION Clock Source Control Bits N/A T1CON = --xx 0x00 FOSC/4 T1CON = --xx 0x01 TMR1 Module Operation Off TMR1 module uses the main oscillator as clock source. TMR1ON can turn on or turn off Timer1. Counter External circuit T1CON = --xx 0x11 TMR1 module uses the external TR1SCCP = ---- -x-1 signal on the RB1/T1OSO/ T1CKI pin as a clock source. TMR1ON can turn on or turn off Timer1. DT1CK can read the signal on the RB1/T1OSO/ T1CKI pin. Firmware T1CON = --xx 0x11 DATACCP<0> bit drives RB1/ TR1SCCP = ---- -x-0 T1OSO/T1CKI and produces the TMR1 clock source. TMR1ON can turn on or turn off Timer1. The DATACCP<0> bit, DT1CK, can read and write to the RB1/T1OSO/T1CKI pin. Timer1 oscillator T1CON = --xx 1x11 RB1/T1OSO/T1CKI and RB2/ T1OSI are configured as a 2 pin crystal oscillator. RB1/T1OSI/ T1CKI is the clock input for TMR1. TMR1ON can turn on or turn off Timer1. DATACCP<1> bit, DT1CK, always reads ‘0’ as input and can not write to the RB1/T1OSO/T1CK1 pin. Timer 1999-2013 Microchip Technology Inc. PORTB<2:1> Operation PORTB<2:1> function as normal I/O PORTB<2:1> function as normal I/O PORTB<2> functions as normal I/O. PORTB<1> always reads ‘0’ when configured as input. If PORTB<1> is configured as output, reading PORTB<1> will read the data latch. Writing to PORTB<1> will always store the result in the data latch, but not to the RB1/T1OSO/T1CKI pin. If the TMR1CS bit is cleared (TMR1 reverts to the timer mode), then pin PORTB<1> will be driven with the value in the data latch. PORTB<2:1> always read ‘0’ when configured as inputs. If PORTB<2:1> are configured as outputs, reading PORTB<2:1> will read the data latches. Writing to PORTB<2:1> will always store the result in the data latches, but not to the RB2/ T1OSI and RB1/T1OSO/T1CKI pins. If the TMR1CS and T1OSCEN bits are cleared (TMR1 reverts to the timer mode and TMR1 oscillator is disabled), then pin PORTB<2:1> will be driven with the value in the data latches. DS41106C-page 33 PIC16C712/716 5.3 Timer1 Oscillator 5.4 Timer1 Interrupt A crystal oscillator circuit is built in between pins T1OSI (input) and T1OSO (amplifier output). It is enabled by setting control bit T1OSCEN (T1CON<3>). The oscillator is a low-power oscillator rated up to 200 kHz. It will continue to run during Sleep. It is primarily intended for a 32 kHz crystal. Table 5-2 shows the capacitor selection for the Timer1 oscillator. The TMR1 Register pair (TMR1H:TMR1L) increments from 0000h to FFFFh and rolls over to 0000h. The TMR1 interrupt, if enabled, is generated on overflow which is latched in interrupt flag bit TMR1IF (PIR1<0>). This interrupt can be enabled/disabled by setting/clearing TMR1 interrupt enable bit TMR1IE (PIE1<0>). The Timer1 oscillator is identical to the LP oscillator. The user must provide a software time delay to ensure proper oscillator start-up. 5.5 TABLE 5-2: If the CCP module is configured in Compare mode to generate a “Special Event Trigger” (CCP1M3:CCP1M0 = 1011), this signal will reset Timer1 and start an A/D conversion (if the A/D module is enabled). CAPACITOR SELECTION FOR THE TIMER1 OSCILLATOR Osc Type Freq. C1 C2 LP 32 kHz 100 kHz 200 kHz 33 pF 15 pF 15 pF 33 pF 15 pF 15 pF Note: The Special Event Triggers from the CCP1 module will not set interrupt flag bit TMR1IF (PIR1<0>). Timer1 must be configured for either Timer or Synchronized Counter mode to take advantage of this feature. If Timer1 is running in Asynchronous Counter mode, this reset operation may not work. These values are for design guidance only. Note 1: Higher capacitance increases the stability of oscillator but also increases the start-up time. 2: Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. TABLE 5-3: Resetting Timer1 using a CCP Trigger Output In the event that a write to Timer1 coincides with a Special Event Trigger from CCP1, the write will take precedence. In this mode of operation, the CCPR1H:CCPR1L registers pair effectively becomes the period register for Timer1. REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER Value on POR, BOR Value on all other Resets Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0Bh,8Bh GIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u INTCON PEIE 0Ch PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 8Ch PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu 10h T1CON — — 07h DATACC P — — — — — DCCP — DT1CK ---- -x-x ---- -u-u 87h TRISCCP — — — — — TCCP — TT1CK ---- -1-1 ---- -1-1 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used by the Timer1 module. DS41106C-page 34 1999-2013 Microchip Technology Inc. PIC16C712/716 NOTES: 1999-2013 Microchip Technology Inc. DS41106C-page 35 PIC16C712/716 6.0 TIMER2 MODULE Timer2 has a control register, shown in Figure 6-1. Timer2 can be shut off by clearing control bit TMR2ON (T2CON<2>) to minimize power consumption. The Timer2 module timer has the following features: • • • • • • 8-bit timer (TMR2 register) 8-bit period register (PR2) Readable and writable (both registers) Software programmable prescaler (1:1, 1:4, 1:16) Software programmable postscaler (1:1 to 1:16) Interrupt on TMR2 match of PR2 FIGURE 6-1: U-0 — Figure 6-2 is a simplified block diagram of the Timer2 module. Additional information on timer modules is available in the PIC® Mid-Range Reference Manual, (DS33023). T2CON: TIMER2 CONTROL REGISTER (ADDRESS 12h) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON R/W-0 R/W-0 T2CKPS1 T2CKPS0 bit7 bit0 bit 7: Unimplemented: Read as ‘0’ bit 6-3: TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits 0000 = 1:1 Postscale 0001 = 1:2 Postscale 0010 = 1:3 Postscale 0011 = 1:4 Postscale 0100 = 1:5 Postscale 0101 = 1:6 Postscale 0110 = 1:7 Postscale 0111 = 1:8 Postscale 1000 = 1:9 Postscale 1001 = 1:10 Postscale 1010 = 1:11 Postscale 1011 = 1:12 Postscale 1100 = 1:13 Postscale 1101 = 1:14 Postscale 1110 = 1:15 Postscale 1111 = 1:16 Postscale bit 2: TMR2ON: Timer2 On bit 1 = Timer2 is on 0 = Timer2 is off bit 1-0: T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits 00 = Prescaler is 1 01 = Prescaler is 4 1x = Prescaler is 16 FIGURE 6-2: Sets flag bit TMR2IF R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset TIMER2 BLOCK DIAGRAM TMR2 output Reset Postscaler 1:1 to 1:16 EQ 4 DS41106C-page 36 TMR2 Reg Comparator Prescaler 1:1, 1:4, 1:16 FOSC/4 2 PR2 Reg 1999-2013 Microchip Technology Inc. PIC16C712/716 6.1 Timer2 Operation 6.2 Timer2 can be used as the PWM time base for PWM mode of the CCP module. Timer2 Interrupt The Timer2 module has an 8-bit period register PR2. Timer2 increments from 00h until it matches PR2 and then resets to 00h on the next increment cycle. PR2 is a readable and writable register. The PR2 register is initialized to FFh upon Reset. The TMR2 register is readable and writable, and is cleared on any device Reset. The input clock (FOSC/4) has a prescale option of 1:1, 1:4 or 1:16, selected by control bits T2CKPS1:T2CKPS0 (T2CON<1:0>). The match output of TMR2 goes through a 4-bit postscaler (which gives a 1:1 to 1:16 scaling inclusive) to generate a TMR2 interrupt (latched in flag bit TMR2IF, (PIR1<1>)). The prescaler and postscaler counters are cleared when any of the following occurs: • a write to the TMR2 register • a write to the T2CON register • any device Reset (Power-on Reset, MCLR Reset, Watchdog Timer Reset, or Brown-out Reset) TMR2 is not cleared when T2CON is written. TABLE 6-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER Value on POR, BOR Value on all other Resets Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 0Bh,8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -00- -000 0000 -000 8Ch PIE1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 0000 -000 11h TMR2 12h T2CON 92h PR2 Legend: Timer2 Module’s Register — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 Timer2 Period Register 0000 0000 0000 0000 T2CKPS0 -000 0000 -000 0000 1111 1111 1111 1111 x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used by the Timer2 module. 1999-2013 Microchip Technology Inc. DS41106C-page 37 PIC16C712/716 NOTES: DS41106C-page 38 1999-2013 Microchip Technology Inc. PIC16C712/716 7.0 CAPTURE/COMPARE/PWM (CCP) MODULE(S) Additional information on the CCP module is available in the PIC® Mid-Range Reference Manual, (DS33023). Each CCP (Capture/Compare/PWM) module contains a 16-bit register, which can operate as a 16-bit capture register, as a 16-bit compare register or as a PWM master/slave Duty Cycle register. Table 7-1 shows the timer resources of the CCP module modes. TABLE 7-1: CCP Mode Timer Resource Capture Compare PWM Timer1 Timer1 Timer2 Capture/Compare/PWM Register 1 (CCPR1) is comprised of two 8-bit registers: CCPR1L (low byte) and CCPR1H (high byte). The CCP1CON register controls the operation of CCP1. All are readable and writable. FIGURE 7-1: U-0 — bit7 U-0 — CCP MODE – TIMER RESOURCE CCP1CON REGISTER (ADDRESS 17h) R/W-0 DC1B1 R/W-0 R/W-0 DC1B0 CCP1M3 R/W-0 CCP1M2 R/W-0 R/W-0 CCP1M1 CCP1M0 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 7-6: Unimplemented: Read as ‘0’ bit 5-4: DC1B1:DC1B0: PWM Least Significant bits Capture Mode: Unused Compare Mode: Unused PWM Mode: These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L. bit 3-0: CCP1M3:CCP1M0: CCP1 Mode Select bits 0000 = Capture/Compare/PWM off (resets CCP1 module) 0100 = Capture mode, every falling edge 0101 = Capture mode, every rising edge 0110 = Capture mode, every 4th rising edge 0111 = Capture mode, every 16th rising edge 1000 = Compare mode, set output on match (CCP1IF bit is set) 1001 = Compare mode, clear output on match (CCP1IF bit is set) 1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is unaffected) 1011 = Compare mode, trigger special event (CCP1IF bit is set; CCP1 resets TMR1 and starts an A/D conversion (if A/D module is enabled)) 11xx = PWM mode FIGURE 7-2: R/W-1 — bit7 R/W-1 — TRISCCP REGISTER (ADDRESS 87H) R/W-1 — R/W-1 — R/W-1 — bit 7-3: Reserved bits; Do Not Use bit 2: TCCP – Tri-state control bit for CCP 0 = Output pin driven 1 = Output pin tristated bit 1: Reserved bit; Do Not Use bit 0: TT1CK – Tri-state control bit for T1CKI pin 0 = T1CKI pin is an output 1 = T1CKI pin is an input 1999-2013 Microchip Technology Inc. R/W-1 TCCP R/W-1 — R/W-1 TT1CK bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset DS41106C-page 39 PIC16C712/716 7.1 7.1.4 Capture Mode In Capture mode, CCPR1H:CCPR1L captures the 16-bit value of the TMR1 register when an event occurs on pin RB3/CCP1. An event is defined as: • • • • every falling edge every rising edge every 4th rising edge every 16th rising edge An event is selected by control bits CCP1M3:CCP1M0 (CCP1CON<3:0>). When a capture is made, the interrupt request flag bit CCP1IF (PIR1<2>) is set. It must be cleared in software. If another capture occurs before the value in register CCPR1 is read, the old captured value will be lost. FIGURE 7-3: CAPTURE MODE OPERATION BLOCK DIAGRAM Prescaler 1, 4, 16 Set flag bit CCP1IF (PIR1<2>) RB3/CCP1 Pin There are four prescaler settings, specified by bits CCP1M3:CCP1M0. Whenever the CCP module is turned off, or the CCP module is not in Capture mode, the prescaler counter is cleared. This means that any Reset will clear the prescaler counter. Switching from one capture prescaler to another may generate an interrupt. Also, the prescaler counter will not be cleared, therefore the first capture may be from a non-zero prescaler. Example 7-1 shows the recommended method for switching between capture prescalers. This example also clears the prescaler counter and will not generate the “false” interrupt. EXAMPLE 7-1: CHANGING BETWEEN CAPTURE PRESCALERS CLRF MOVLW CCP1CON NEW_CAPT_PS MOVWF CCP1CON ;Turn CCP module off ;Load the W reg with ; the new prescaler ; mode value and CCP ON ;Load CCP1CON with this ; value CCPR1H and edge detect CCP PRESCALER CCPR1L Capture Enable TMR1H TMR1L CCP1CON<3:0> Q’s 7.1.1 CCP PIN CONFIGURATION In Capture mode, the CCP output must be disabled by setting the TRISCCP<2> bit. Note: 7.1.2 If the RB3/CCP1 is configured as an output by clearing the TRISCCP<2> bit, a write to the DCCP bit can cause a capture condition. TIMER1 MODE SELECTION Timer1 must be running in Timer mode or Synchronized Counter mode for the CCP module to use the capture feature. In Asynchronous Counter mode, the capture operation may not work. 7.1.3 SOFTWARE INTERRUPT When the Capture mode is changed, a false capture interrupt may be generated. The user should keep bit CCP1IE (PIE1<2>) clear to avoid false interrupts and should clear the flag bit CCP1IF following any such change in Operating mode. DS41106C-page 40 1999-2013 Microchip Technology Inc. PIC16C712/716 7.2 7.2.1 Compare Mode The user must configure the RB3/CCP1 pin as the CCP output by clearing the TRISCCP<2> bit. In Compare mode, the 16-bit CCPR1 register value is constantly compared against the TMR1 register pair value. When a match occurs, the RB3/CCP1 pin is either: Note: • driven High • driven Low • remains Unchanged 7.2.2 The action on the pin is based on the value of control bits CCP1M3:CCP1M0 (CCP1CON<3:0>). At the same time, interrupt flag bit CCP1IF is set. FIGURE 7-4: 7.2.3 7.2.4 Special Event Trigger SOFTWARE INTERRUPT MODE SPECIAL EVENT TRIGGER In this mode, an internal hardware trigger is generated which may be used to initiate an action. Set flag bit CCP1IF (PIR1<2>) The Special Event Trigger output of CCP1 resets the TMR1 register pair. This allows the CCPR1 register to effectively be a 16-bit programmable period register for Timer1. CCPR1H CCPR1L Comparator The Special Event Trigger output of CCP1 also starts an A/D conversion (if the A/D module is enabled). TMR1L Note: TABLE 7-2: TIMER1 MODE SELECTION When generate software interrupt is chosen the CCP1 pin is not affected. Only a CCP interrupt is generated (if enabled). Special Event Trigger will: Reset Timer1, but not set interrupt flag bit TMR1IF (PIR1<0>), and set bit GO/DONE (ADCON0<2>) which starts an A/D conversion TMR1H Clearing the CCP1CON register will force the RB3/CCP1 compare output latch to the default low level. This is neither the PORTB I/O data latch nor the DATACCP latch. Timer1 must be running in Timer mode or Synchronized Counter mode if the CCP module is using the compare feature. In Asynchronous Counter mode, the compare operation may not work. COMPARE MODE OPERATION BLOCK DIAGRAM Q S Output Logic match RB3/CCP1 R Pin TRISCCP<2> Output Enable CCP1CON<3:0> Mode Select CCP PIN CONFIGURATION The Special Event Trigger from the CCP1 module will not set interrupt flag bit TMR1IF (PIR1<0>). REGISTERS ASSOCIATED WITH CAPTURE, COMPARE, AND TIMER1 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets Address Name 07h DATACCP 0Bh,8Bh INTCON 0Ch PIR1 0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu 10h T1CON 15h CCPR1L Capture/Compare/PWM Register 1 (LSB) 16h CCPR1H Capture/Compare/PWM Register 1 (MSB) 17h CCP1CON — 87h TRISCCP — — — — — TCCP — 8Ch PIE1 — ADIE — — — CCP1IE TMR2IE — — — — — DCCP — DT1CK xxxx xxxx xxxx xuxu GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u — ADIF — — — CCP1IF TMR2IF — — — TMR1IF -0-- -000 -0-- -000 T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu DC1B1 DC1B0 xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 TT1CK xxxx x1x1 xxxx x1x1 TMR1IE -0-- -000 -0-- -000 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used by Capture and Timer1. 1999-2013 Microchip Technology Inc. DS41106C-page 41 PIC16C712/716 7.3 7.3.1 PWM Mode In Pulse Width Modulation (PWM) mode, the CCP1 pin produces up to a 10-bit resolution PWM output. Since the CCP1 pin is multiplexed with the PORTB data latch, the TRISCCP<2> bit must be cleared to make the CCP1 pin an output. Note: Clearing the CCP1CON register will force the CCP1 PWM output latch to the default low level. This is neither the PORTB I/O data latch nor the DATACCP latch. Figure 7-5 shows a simplified block diagram of the CCP module in PWM mode. For a step by step procedure on how to set up the CCP module for PWM operation, see Section 7.3.3 “SetUp for PWM Operation”. FIGURE 7-5: SIMPLIFIED PWM BLOCK DIAGRAM The PWM period is specified by writing to the PR2 register. The PWM period can be calculated using the following formula: PWM period = [(PR2) + 1] • 4 • TOSC • (TMR2 prescale value) PWM frequency is defined as 1 / [PWM period]. When TMR2 is equal to PR2, the following three events occur on the next increment cycle: • TMR2 is cleared • The CCP1 pin is set (exception: if PWM duty cycle = 0%, the CCP1 pin will not be set) • The PWM duty cycle is latched from CCPR1L into CCPR1H Note: CCP1CON<5:4> Duty cycle registers CCPR1L 7.3.2 CCPR1H (Slave) R Comparator Q RB3/CCP1 TMR2 (Note 1) S TRISCCP<2> Comparator Clear Timer, CCP1 pin and latch D.C. PR2 Note 1: 8-bit timer is concatenated with 2-bit internal Q clock or 2 bits of the prescaler to create 10-bit time base. A PWM output (Figure 7-6) has a time base (period) and a time that the output stays high (duty cycle). The frequency of the PWM is the inverse of the period (1/ period). FIGURE 7-6: PWM OUTPUT Period = PR2+1 PWM PERIOD The Timer2 postscaler (see Section 6.0 “Timer2 Module”) is not used in the determination of the PWM frequency. The postscaler could be used to have a servo update rate at a different frequency than the PWM output. PWM DUTY CYCLE The PWM duty cycle is specified by writing to the CCPR1L register and to the CCP1CON<5:4> bits. Up to 10-bit resolution is available. The CCPR1L contains the eight MSbs and the CCP1CON<5:4> contains the two LSbs. This 10-bit value is represented by CCPR1L:CCP1CON<5:4>. The following equation is used to calculate the PWM duty cycle in time: PWM duty cycle = (CCPR1L:CCP1CON<5:4>) • Tosc • (TMR2 prescale value) CCPR1L and CCP1CON<5:4> can be written to at any time, but the duty cycle value is not latched into CCPR1H until after a match between PR2 and TMR2 occurs (i.e., the period is complete). In PWM mode, CCPR1H is a read-only register. The CCPR1H register and a 2-bit internal latch are used to double buffer the PWM duty cycle. This double buffering is essential for glitchless PWM operation. When the CCPR1H and 2-bit latch match TMR2 concatenated with an internal 2-bit Q clock or 2 bits of the TMR2 prescaler, the CCP1 pin is cleared. Maximum PWM resolution (bits) for a given PWM frequency: FOSC log FPWM = bits log(2) ( Duty Cycle TMR2 = PR2 TMR2 = Duty Cycle (CCPR1H) TMR2 = PR2 DS41106C-page 42 Note: ) If the PWM duty cycle value is longer than the PWM period the CCP1 pin will not be cleared. For an example PWM period and duty cycle calculation, see the PIC® Mid-Range Reference Manual, (DS33023). 1999-2013 Microchip Technology Inc. PIC16C712/716 7.3.3 SET-UP FOR PWM OPERATION The following steps should be taken when configuring the CCP module for PWM operation: 1. 2. 3. 4. 5. Set the PWM period by writing to the PR2 register. Set the PWM duty cycle by writing to the CCPR1L register and CCP1CON<5:4> bits. Make the CCP1 pin an output by clearing the TRISCCP<2> bit. Set the TMR2 prescale value and enable Timer2 by writing to T2CON. Configure the CCP1 module for PWM operation. TABLE 7-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 20 MHz PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz Timer Prescaler (1, 4, 16) PR2 Value Maximum Resolution (bits) TABLE 7-4: 16 0xFF 10 4 0xFF 10 1 0xFF 10 1 0x3F 8 1 0x1F 7 1 0x17 5.5 REGISTERS ASSOCIATED WITH PWM AND TIMER2 Address Name 07h DATACCP 0Bh,8Bh INTCON Value on POR, BOR Value on all other Resets Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 — — — — — DCCP — DT1CK xxxx xxxx xxxx xuxu GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 0Ch PIR1 11h TMR2 12h T2CON 15h CCPR1L Capture/Compare/PWM Register 1 (LSB) 16h CCPR1H Capture/Compare/PWM Register 1 (MSB) 17h CCP1CON — 87h TRISCCP 8Ch PIE1 92h PR2 Timer2 Module’s Register — 0000 0000 0000 0000 TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000 xxxx xxxx uuuu uuuu xxxx xxxx uuuu uuuu — DC1B1 DC1B0 — — — — — TCCP — TT1CK xxxx x1x1 xxxx x1x1 — ADIE — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- -000 Timer2 Module’s Period Register CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000 1111 1111 1111 1111 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used by PWM and Timer2. 1999-2013 Microchip Technology Inc. DS41106C-page 43 PIC16C712/716 7.4 CCP1 Module and PORTB Operation When the CCP module is disabled, PORTB<3> operates as a normal I/O pin. When the CCP module is enabled, PORTB<3> operation is affected. Multiplexing details of the CCP1 module are shown on PORTB<3>, refer to Figure 3.6. Table 7-5 below shows the effects of the CCP module operation on PORTB<3> TABLE 7-5: CCP1 Module Mode Off Capture Compare PWM . CCP1 MODULE AND PORTB OPERATION Control Bits CCP1 Module Operation CCP1CON = --xx 0000 Off CCP1CON = --xx 01xx The CCP1 module will capture an event TRISCCP = ---- -1-x on the RB3/CCP1 pin which is driven by an external circuit. The DCCP bit can read the signal on the RB3/CCP1 pin. CCP1CON = --xx 01xx The CCP1 module will capture an event TRISCCP = ---- -0-x on the RB3/CCP1 pin which is driven by the DCCP bit. The DCCP bit can read the signal on the RB3/CCP1 pin. CCP1CON = --xx 10xx The CCP1 module produces an output TRISCCP = ---- -0-x on the RB3/CCP1 pin when a compare event occurs. The DCCP bit can read the signal on the RB3/CCP1 pin. CCP1CON = --xx 11xx The CCP1 module produces the PWM TRISCCP = ---- -0-x signal on the RB3/CCP1 pin. The DCCP bit can read the signal on the RB3/CCP1 pin. DS41106C-page 44 PORTB<3> Operation PORTB<3> functions as normal I/O. PORTB<3> always reads ‘0’ when configured as input. If PORTB<3> is configured as output, reading PORTB<3> will read the data latch. Writing to PORTB<3> will always store the result in the data latch, but it does not drive the RB3/CCP1 pin. 1999-2013 Microchip Technology Inc. PIC16C712/716 8.0 ANALOG-TO-DIGITAL CONVERTER (A/D) MODULE Additional information on the A/D module is available in the PIC® Mid-Range Reference Manual, (DS33023). The Analog-to-Digital (A/D) Converter module has four inputs. The A/D allows conversion of an analog input signal to a corresponding 8-bit digital number (refer to Application Note AN546 for use of A/D Converter). The output of the sample and hold is the input into the converter, which generates the result via successive approximation. The analog reference voltage is software selectable to either the device’s positive supply voltage (VDD) or the voltage level on the RA3/AN3/VREF pin. The A/D converter has a unique feature of being able to operate while the device is in Sleep mode. To operate in Sleep, the A/D conversion clock must be derived from the A/D’s internal RC oscillator. FIGURE 8-1: R/W-0 R/W-0 ADCS1 ADCS0 bit7 The A/D module has three registers. These registers are: • A/D Result Register (ADRES) • A/D Control Register 0 (ADCON0) • A/D Control Register 1 (ADCON1) A device Reset forces all registers to their Reset state. This forces the A/D module to be turned off, and any conversion is aborted. The ADCON0 register, shown in Figure 8-1, controls the operation of the A/D module. The ADCON1 register, shown in Figure 8-2, configures the functions of the port pins. The port pins can be configured as analog inputs (RA3 can also be a voltage reference) or as digital I/O. ADCON0 REGISTER (ADDRESS 1Fh) R/W-0 CHS2 R/W-0 CHS1 R/W-0 CHS0 R/W-0 GO/DONE U-0 — R/W-0 ADON bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 7-6: ADCS1:ADCS0: A/D Conversion Clock Select bits 00 = FOSC/2 01 = FOSC/8 10 = FOSC/32 11 = FRC (clock derived from the internal ADC RC oscillator) bit 5-3: CHS2:CHS0: Analog Channel Select bits 000 = channel 0, (RA0/AN0) 001 = channel 1, (RA1/AN1) 010 = channel 2, (RA2/AN2) 011 = channel 3, (RA3/AN3) 1xx = reserved, do not use bit 2: GO/DONE: A/D Conversion Status bit If ADON = 1 1 = A/D conversion in progress (setting this bit starts the A/D conversion) 0 = A/D conversion not in progress (This bit is automatically cleared by hardware when the A/D conversion is complete) bit 1: Unimplemented: Read as ‘0’ bit 0: ADON: A/D On bit 1 = A/D converter module is operating 0 = A/D converter module is shutoff and consumes no operating current 1999-2013 Microchip Technology Inc. DS41106C-page 45 PIC16C712/716 FIGURE 8-2: U-0 — bit7 ADCON1 REGISTER (ADDRESS 9Fh) U-0 — U-0 — U-0 — U-0 — R/W-0 PCFG2 R/W-0 PCFG1 R/W-0 PCFG0 bit0 R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’ -n = Value at POR Reset bit 7-3: Unimplemented: Read as ‘0’ bit 2-0: PCFG2:PCFG0: A/D Port Configuration Control bits PCFG2:PCFG0 0x0 0x1 100 101 11x RA0 A A A A D RA1 A A A A D RA2 A A D D D RA3 A VREF A VREF D VREF VDD RA3 VDD RA3 VDD A = Analog input D = Digital I/O DS41106C-page 46 1999-2013 Microchip Technology Inc. PIC16C712/716 The ADRES register contains the result of the A/D conversion. When the A/D conversion is complete, the result is loaded into the ADRES register, the GO/DONE bit (ADCON0<2>) is cleared and the A/D Interrupt Flag bit ADIF is set. The block diagram of the A/D module is shown in Figure 8-3. 1. The value that is in the ADRES register is not modified for a Power-on Reset. The ADRES register will contain unknown data after a Power-on Reset. 2. After the A/D module has been configured as desired, the selected channel must be acquired before the conversion is started. The analog input channels must have their corresponding TRIS bits selected as an input. To determine acquisition time, see Section 8.1 “A/D Acquisition Requirements”. After this acquisition time has elapsed, the A/D conversion can be started. The following steps should be followed for doing an A/D conversion: 3. 4. 5. OR 6. 7. FIGURE 8-3: Configure the A/D module: • Configure analog pins/voltage reference/ and digital I/O (ADCON1) • Select A/D input channel (ADCON0) • Select A/D conversion clock (ADCON0) • Turn on A/D module (ADCON0) Configure A/D interrupt (if desired): • Clear ADIF bit • Set ADIE bit • Set GIE bit Wait the required acquisition time. Start conversion: • Set GO/DONE bit (ADCON0) Wait for A/D conversion to complete, by either: • Polling for the GO/DONE bit to be cleared • Waiting for the A/D interrupt Read A/D Result register (ADRES), clear bit ADIF if required. For the next conversion, go to step 1 or step 2 as required. The A/D conversion time per bit is defined as TAD. A minimum wait of 2TAD is required before next acquisition starts. A/D BLOCK DIAGRAM CHS2:CHS0 VIN 011 (Input voltage) RA3/AN3/VREF 010 RA2/AN2 A/D Converter 001 RA1/AN1 VDD 000 RA0/AN0 000 or 010 or 100 or 110 or 111 VREF (Reference voltage) 001 or 011 or 101 PCFG2:PCFG0 1999-2013 Microchip Technology Inc. DS41106C-page 47 PIC16C712/716 8.1 A/D Acquisition Requirements To calculate the minimum acquisition time, TACQ, see the PIC® Mid-Range Reference Manual, (DS33023). This equation calculates the acquisition time to within 1/2 LSb error (512 steps for the A/D). The 1/2 LSb error is the maximum error allowed for the A/D to meet its specified accuracy. For the A/D converter to meet its specified accuracy, the Charge Holding capacitor (CHOLD) must be allowed to fully charge to the input channel voltage level. The analog input model is shown in Figure 8-4. The source impedance (RS) and the internal sampling switch (RSS) impedance directly affect the time required to charge the capacitor CHOLD. The sampling switch (RSS) impedance varies over the device voltage (VDD). The source impedance affects the offset voltage at the analog input (due to pin leakage current). The maximum recommended impedance for analog sources is 10 k. After the analog input channel is selected (changed) this acquisition must be done before the conversion can be started. FIGURE 8-4: Note: When the conversion is started, the holding capacitor is disconnected from the input pin. ANALOG INPUT MODEL VDD Rs ANx CPIN 5 pF VA Sampling Switch VT = 0.6V VT = 0.6V RIC 1k SS RSS CHOLD = DAC capacitance = 51.2 pF I leakage 500 nA VSS Legend: CPIN VT I leakage RIC SS CHOLD DS41106C-page 48 = input capacitance = threshold voltage = leakage current at the pin due to various junctions = interconnect resistance = sampling switch = sample/hold capacitance (from DAC) VDD 6V 5V 4V 3V 2V 5 6 7 8 9 10 11 Sampling Switch (k) 1999-2013 Microchip Technology Inc. PIC16C712/716 8.2 Selecting the A/D Conversion Clock 8.3 The A/D conversion time per bit is defined as TAD. The A/D conversion requires 9.5TAD per 8-bit conversion. The source of the A/D conversion clock is software selectable. The four possible options for TAD are: • • • • For correct A/D conversions, the A/D conversion clock (TAD) must be selected to ensure a minimum TAD time of 1.6 s. Table 8-1 shows the resultant TAD times derived from the device operating frequencies and the A/D clock source selected. ADCS1:ADCS0 2TOSC 00 8TOSC 01 32TOSC Note 1: When reading the port register, all pins configured as analog input channels will read as cleared (a low level). Pins configured as digital inputs, will convert an analog input. Analog levels on a digitally configured input will not affect the conversion accuracy. 2: Analog levels on any pin that is defined as a digital input (including the AN3:AN0 pins), may cause the input buffer to consume current that is out of the devices specification. TAD vs. DEVICE OPERATING FREQUENCIES AD Clock Source (TAD) Operation The ADCON1 and TRISA registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their corresponding TRIS bits set (input). If the TRIS bit is cleared (output), the digital output level (VOH or VOL) will be converted. The A/D operation is independent of the state of the CHS2:CHS0 bits and the TRIS bits. 2TOSC 8TOSC 32TOSC Internal RC oscillator TABLE 8-1: Configuring Analog Port Pins 10 Device Frequency 20 MHz 100 ns(2) ns(2) 400 1.6 s 5 MHz ns(2) 400 1.6 s 6.4 s 1.25 MHz 333.33 kHz 1.6 s 6 s 6.4 s 24 s(3) 25.6 s(3) 96 s(3) 11 RC(5) 2-6 s(1,4) 2-6 s(1,4) 2-6 s(1) 2-6 s(1,4) Legend: Shaded cells are outside of recommended range. Note 1: The RC source has a typical TAD time of 4 s. 2: These values violate the minimum required TAD time. 3: For faster conversion times, the selection of another clock source is recommended. 4: When device frequency is greater than 1 MHz, the RC A/D conversion clock source is recommended for Sleep operation only. 5: For extended voltage devices (LC), please refer to Electrical Specifications section. 1999-2013 Microchip Technology Inc. DS41106C-page 49 PIC16C712/716 8.4 Note: 8.5 A/D Conversions GO/DONE bit will be set, starting the A/D conversion, and the Timer1 counter will be reset to zero. Timer1 is reset to automatically repeat the A/D acquisition period with minimal software overhead (moving the ADRES to the desired location). The appropriate analog input channel must be selected and the minimum acquisition done before the “Special Event Trigger” sets the GO/ DONE bit (starts a conversion). The GO/DONE bit should NOT be set in the same instruction that turns on the A/D. Use of the CCP Trigger An A/D conversion can be started by the “Special Event Trigger” of the CCP1 module. This requires that the CCP1M3:CCP1M0 bits (CCP1CON<3:0>) be programmed as 1011 and that the A/D module is enabled (ADON bit is set). When the trigger occurs, the TABLE 8-2: If the A/D module is not enabled (ADON is cleared), then the “Special Event Trigger” will be ignored by the A/D module, but will still reset the Timer1 counter. SUMMARY OF A/D REGISTERS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR, BOR Value on all other Resets PORTA — — —(1) RA4 RA3 RA2 RA1 RA0 --xx xxxx --xu uuuu 0Bh,8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 — ADIF — — — CCP1IF TMR2IF TMR1IF -0-- -000 -0-- -000 1Eh ADRES A/D Result Register ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE — — — —(1) ---1 1111 ---1 1111 — — — CCP1IE TMR2IE TMR1IE -0-- -000 -0-- 0000 — — — PCFG2 PCFG1 ---- -000 Address Name 05h 1Fh ADCON0 85h TRISA 8Ch PIE1 — ADIE 9Fh ADCON1 — — ADON PORTA Data Direction Register PCFG0 xxxx xxxx uuuu uuuu 0000 00-0 0000 00-0 ---- -000 Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’. Shaded cells are not used for A/D conversion. Note 1: Reserved bits; Do Not Use. DS41106C-page 50 1999-2013 Microchip Technology Inc. PIC16C712/716 9.0 SPECIAL FEATURES OF THE CPU The PIC16C712/716 devices have a host of features intended to maximize system reliability, minimize cost through elimination of external components, provide power-saving operating modes and offer code protection. These are: • OSC Selection • Reset: - Power-on Reset (POR) - Power-up Timer (PWRT) - Oscillator Start-up Timer (OST) - Brown-out Reset (BOR) • Interrupts • Watchdog Timer (WDT) • Sleep • Code protection • ID locations • In-Circuit Serial Programming™ (ICSP™) Sleep mode is designed to offer a very low-current Power-Down mode. The user can wake-up from Sleep through external Reset, Watchdog Timer Wake-up, or through an interrupt. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost, while the LP crystal option saves power. A set of Configuration bits are used to select various options. Additional information on special features is available in the PIC® Mid-Range Reference Manual, (DS33023). 9.1 Configuration Bits The Configuration bits can be programmed (read as ‘0’) or left unprogrammed (read as ‘1’) to select various device configurations. These bits are mapped in program memory location 2007h. The user will note that address 2007h is beyond the user program memory space. In fact, it belongs to the special test/configuration memory space (2000h-3FFFh), which can be accessed only during programming. These devices have a Watchdog Timer, which can be shut off only through Configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in Reset until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay on power-up only and is designed to keep the part in Reset while the power supply stabilizes. With these two timers on-chip, most applications need no external Reset circuitry. 1999-2013 Microchip Technology Inc. DS41106C-page 51 PIC16C712/716 FIGURE 9-1: CP1 CP0 CONFIGURATION WORD CP1 CP0 CP1 CP0 — BODEN CP1 CP0 PWRTE bit13 WDTE FOSC1 FOSC0 bit0 Register:CONFIG Address2007h bit 13-8, 5-4: CP1:CP0: Code Protection bits (2) Code Protection for 2K Program memory (PIC16C716) 11 = Programming code protection off 10 = 0400h-07FFh code protected 01 = 0200h-07FFh code protected 00 = 0000h-07FFh code protected bit 13-8, 5-4: Code Protection for 1K Program memory bits (PIC16C712) 11 = Programming code protection off 10 = Programming code protection off 01 = 0200h-03FFh code-protected 00 = 0000h-03FFh code-protected bit 7: bit 6: bit 3: bit 2: bit 1-0: Note 1: 2: Unimplemented: Read as ‘1’ BODEN: Brown-out Reset Enable bit (1) 1 = BOR enabled 0 = BOR disabled PWRTE: Power-up Timer Enable bit (1) 1 = PWRT disabled 0 = PWRT enabled WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled FOSC1:FOSC0: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE. Ensure the Power-up Timer is enabled anytime Brown-out Reset is enabled. All of the CP1:CP0 pairs have to be given the same value to enable the code protection scheme listed. DS41106C-page 52 1999-2013 Microchip Technology Inc. PIC16C712/716 9.2 TABLE 9-1: Oscillator Configurations 9.2.1 Ranges Tested: OSCILLATOR TYPES The PIC16CXXX can be operated in four different Oscillator modes. The user can program two Configuration bits (FOSC1 and FOSC0) to select one of these four modes: • • • • LP XT HS RC 9.2.2 In XT, LP or HS modes, a crystal or ceramic resonator is connected to the OSC1/CLKIN and OSC2/CLKOUT pins to establish oscillation (Figure 9-2). The PIC16CXXX oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1/ CLKIN pin (Figure 9-3). CRYSTAL/CERAMIC RESONATOR OPERATION (HS, XT OR LP OSC CONFIGURATION) RF(3) Sleep OSC2 RS(2) C2(1) To internal logic TABLE 9-2: Osc Type LP XT HS OSC1 OSC2 68-100 pF 15-68 pF 15-68 pF 10-68 pF 10-22 pF 68-100 pF 15-68 pF 15-68 pF 10-68 pF 10-22 pF CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Crystal Freq Cap. Range C1 Cap. Range C2 32 kHz 33 pF 33 pF 200 kHz 15 pF 15 pF 200 kHz 47-68 pF 47-68 pF 1 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 4 MHz 15 pF 15 pF 8 MHz 15-33 pF 15-33 pF 20 MHz 15-33 pF 15-33 pF These values are for design guidance only. See notes at bottom of page. 2: 3: PIC16C7XX Note 1: See Table 9-1 and Table 9-2 for recommended values of C1 and C2. 2: A series resistor (RS) may be required for AT strip cut crystals. 3: RF varies with the crystal chosen. FIGURE 9-3: 455 kHz 2.0 MHz 4.0 MHz 8.0 MHz 16.0 MHz Note 1: OSC1 XTAL XT Freq These values are for design guidance only. See notes at bottom of page. CRYSTAL OSCILLATOR/CERAMIC RESONATORS C1(1) Mode HS Low-Power Crystal Crystal/Resonator High-Speed Crystal/Resonator Resistor/Capacitor FIGURE 9-2: CERAMIC RESONATORS 4: Recommended values of C1 and C2 are identical to the ranges tested (Table 9-1). Higher capacitance increases the stability of the oscillator, but also increases the start-up time. Since each resonator/crystal has its own characteristics, the user should consult the resonator/crystal manufacturer for appropriate values of external components. Rs may be required in HS mode, as well as XT mode to avoid overdriving crystals with low drive level specification. EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION) OSC1 Clock from ext. system PIC16C7XX Open OSC2 1999-2013 Microchip Technology Inc. DS41106C-page 53 PIC16C712/716 9.2.3 RC OSCILLATOR 9.3 For timing insensitive applications, the “RC” device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values and the operating temperature. In addition to this, the oscillator frequency will vary from unit-to-unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 9-4 shows how the R/C combination is connected to the PIC16CXXX. FIGURE 9-4: RC OSCILLATOR MODE VDD REXT OSC1 CEXT Internal Clock PIC16C7XX VSS FOSC/4 Recommended values: OSC2/CLKOUT 3 k REXT 100 k CEXT > 20pF Reset The PIC16CXXX differentiates between various kinds of Reset: • • • • • • Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during Sleep WDT Reset (during normal operation) WDT Wake-up (during Sleep) Brown-out Reset (BOR) Some registers are not affected in any Reset condition; their status is unknown on POR and unchanged in any other Reset. Most other registers are reset to a “Reset state” on Power-on Reset (POR), on the MCLR and WDT Reset, on MCLR Reset during Sleep and Brownout Reset (BOR). They are not affected by a WDT Wake-up, which is viewed as the resumption of normal operation. The TO and PD bits are set or cleared differently in different Reset situations as indicated in Table 9-4. These bits are used in software to determine the nature of the Reset. See Table 9-6 for a full description of Reset states of all registers. A simplified block diagram of the on-chip Reset circuit is shown in Figure 9-6. The PIC microcontrollers have a MCLR noise filter in the MCLR Reset path. The filter will detect and ignore small pulses. It should be noted that a WDT Reset does not drive MCLR pin low. DS41106C-page 54 1999-2013 Microchip Technology Inc. PIC16C712/716 9.4 Power-On Reset (POR) 9.5 Power-up Timer (PWRT) A Power-on Reset pulse is generated on-chip when VDD rise is detected (to a level of 1.5V-2.1V). To take advantage of the POR, just tie the MCLR pin directly (or through a resistor) to VDD. This will eliminate external RC components usually needed to create a Power-on Reset. A maximum rise time for VDD is specified (parameter D004). For a slow rise time, see Figure 9-5. The Power-up Timer provides a fixed nominal time-out (parameter #33), on power-up only, from the POR. The Power-up Timer operates on an internal RC oscillator. The chip is kept in Reset as long as the PWRT is active. The PWRT’s time delay allows VDD to rise to an acceptable level. A Configuration bit is provided to enable/disable the PWRT. When the device starts normal operation (exits the Reset condition), device operating parameters (voltage, frequency, temperature,...) must be met to ensure operation. If these conditions are not met, the device must be held in Reset until the operating conditions are met. Brown-out Reset may be used to meet the startup conditions. The power-up time delay will vary from chip to chip due to VDD, temperature, and process variation. See DC parameters for details. FIGURE 9-5: EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) 9.6 Oscillator Start-up Timer (OST) The Oscillator Start-up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over (parameter #32). This ensures that the crystal oscillator or resonator has started and stabilized. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from Sleep. VDD VDD R 9.7 Brown-Out Reset (BOR) R1 MCLR C PIC16C7XX Note 1: External Power-on Reset circuit is required only if VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: R < 40 k is recommended to make sure that voltage drop across R does not violate the device’s electrical specification. 3: R1 = 100 to 1 k will limit any current flowing into MCLR from external capacitor C in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). The PIC16C712/716 members have on-chip Brownout Reset circuitry. A Configuration bit, BODEN, can disable (if clear/programmed) or enable (if set) the Brown-out Reset circuitry. If VDD falls below 4.0V, refer to VBOR parameter D005(VBOR) for a time greater than parameter (TBOR) in Table 12-6. The brown-out situation will reset the chip. A Reset is not guaranteed to occur if VDD falls below 4.0V for less than parameter (TBOR). On any Reset (Power-on, Brown-out, Watchdog, etc.) the chip will remain in Reset until VDD rises above VBOR. The Power-up Timer will now be invoked and will keep the chip in Reset an additional 72 ms. If VDD drops below VBOR while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be re-initialized. Once VDD rises above VBOR, the Power-Up Timer will execute a 72 ms Reset. The Power-up Timer should always be enabled when Brown-out Reset is enabled. Figure 9-7 shows typical Brown-out situations. For operations where the desired brown-out voltage is other than 4V, an external brown-out circuit must be used. Figure 9-8, 9-9 and 9-10 show examples of external brown-out protection circuits. 1999-2013 Microchip Technology Inc. DS41106C-page 55 PIC16C712/716 FIGURE 9-6: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External Reset MCLR WDT Module SLEEP WDT Time-out Reset VDD rise detect Power-on Reset VDD Brown-out Reset S BODEN OST/PWRT OST Chip_Reset R 10-bit Ripple counter Q OSC1 (1) On-chip RC OSC PWRT 10-bit Ripple counter PWRT See Table 9-3 for time-out BODEN situations. Enable PWRT Enable OST Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin. FIGURE 9-7: BROWN-OUT SITUATIONS VDD Internal Reset VBOR 72 ms VDD Internal Reset VBOR <72 ms 72 ms VDD Internal Reset DS41106C-page 56 VBOR 72 ms 1999-2013 Microchip Technology Inc. PIC16C712/716 FIGURE 9-8: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 1 VDD FIGURE 9-10: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 3 VDD VDD 33k MCP809 Q1 10k Vss MCLR 40k bypass capacitor VDD VDD RST PIC16C7XX MCLR PIC16C7XX Note 1: This circuit will activate Reset when VDD goes below (Vz + 0.7V) where Vz = Zener voltage. 2: Internal Brown-out Reset circuitry should be disabled when using this circuit. FIGURE 9-9: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 2 VDD VDD R1 Q1 MCLR R2 40k PIC16C7XX Note 1: This brown-out circuit is less expensive, albeit less accurate. Transistor Q1 turns off when VDD is below a certain level such that: R1 VDD x This brown-out protection circuit employs Microchip Technology’s MCP809 microcontroller supervisor. The MCP8XX and MCP1XX families of supervisors provide push-pull and open collector outputs with both high and low active Reset pins. There are 7 different trip point selections to accommodate 5V and 3V systems 9.8 Time-out Sequence On power-up the time-out sequence is as follows: First PWRT time-out is invoked after the POR time delay has expired. Then OST is activated. The total time-out will vary based on oscillator configuration and the status of the PWRT. For example, in RC mode with the PWRT disabled, there will be no time-out at all. Figure 9-11, Figure 9-12, and Figure 9-13 depict time-out sequences on power-up. Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then bringing MCLR high will begin execution immediately (Figure 9-13). This is useful for testing purposes or to synchronize more than one PIC16CXXX device operating in parallel. Table 9-5 shows the Reset conditions for some Special Function Registers, while Table 9-6 shows the Reset conditions for all the registers. = 0.7V R1 + R2 2: Internal Brown-out Reset should be disabled when using this circuit. 3: Resistors should be adjusted for the characteristics of the transistor. 1999-2013 Microchip Technology Inc. DS41106C-page 57 PIC16C712/716 9.9 Power Control/Status Register (PCON) The BOR Status bit is a “don’t care” and is not necessarily predictable if the brown-out circuit is disabled (the BODEN Configuration bit is clear). BOR must then be set by the user and checked on subsequent Resets to see if it is clear, indicating a brown-out has occurred. The Power Control/Status Register, PCON has two bits. Bit 0 is Brown-out Reset Status bit, BOR. If the BODEN Configuration bit is set, BOR is ‘1’ on Power-on Reset. If the BODEN Configuration bit is clear, BOR is unknown on Power-on Reset. TABLE 9-3: Bit 1 is POR (Power-on Reset Status bit). It is cleared on a Power-on Reset and unaffected otherwise. The user must set this bit following a Power-on Reset. TIME-OUT IN VARIOUS SITUATIONS Power-up Oscillator Configuration Brown-out Wake-up from Sleep PWRTE = 0 PWRTE = 1 XT, HS, LP 72 ms + 1024TOSC 1024TOSC 72 ms + 1024TOSC 1024TOSC RC 72 ms — 72 ms — TABLE 9-4: STATUS BITS AND THEIR SIGNIFICANCE POR BOR TO PD 0 x 1 1 Power-on Reset 0 x 0 x Illegal, TO is set on POR 0 x x 0 Illegal, PD is set on POR 1 0 1 1 Brown-out Reset 1 1 0 1 WDT Reset 1 1 0 0 WDT Wake-up 1 1 u u MCLR Reset during normal operation 1 1 1 0 MCLR Reset during Sleep or interrupt wake-up from Sleep TABLE 9-5: RESET CONDITION FOR SPECIAL REGISTERS Program Counter STATUS Register PCON Register Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during Sleep 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 1uuu ---- --uu PC + 1 uuu0 0uuu ---- --uu 000h 0001 1uuu ---- --u0 uuu1 0uuu ---- --uu Condition WDT Wake-up Brown-out Reset Interrupt wake-up from Sleep PC + 1(1) Legend: u = unchanged, x = unknown, – = unimplemented bit read as ‘0’. Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). DS41106C-page 58 1999-2013 Microchip Technology Inc. PIC16C712/716 TABLE 9-6: Register INITIALIZATION CONDITIONS FOR ALL REGISTERS OF THE PIC16C712/716 Power-on Reset, Brown-out Reset MCLR Resets WDT Reset Wake-up via WDT or Interrupt xxxx xxxx uuuu uuuu uuuu uuuu INDF N/A N/A N/A TMR0 xxxx xxxx uuuu uuuu uuuu uuuu 0000h 0000h PC + 1(2) STATUS 0001 1xxx 000q quuu(3) uuuq quuu(3) FSR xxxx xxxx uuuu uuuu uuuu uuuu PORTA(4) --0x 0000 --xx xxxx --xu uuuu PORTB(5) xxxx xxxx uuuu uuuu uuuu uuuu DATACCP ---- -x-x ---- -u-u ---- -u-u PCLATH ---0 0000 ---0 0000 ---u uuuu INTCON 0000 -00x 0000 -00u uuuu -uuu(1) ---- 0000 ---- 0000 ---- uuuu(1) -0-- 0000 -0-- 0000 -u-- uuuu(1) TMR1L xxxx xxxx uuuu uuuu uuuu uuuu TMR1H xxxx xxxx uuuu uuuu uuuu uuuu T1CON --00 0000 --uu uuuu --uu uuuu TMR2 0000 0000 0000 0000 uuuu uuuu T2CON -000 0000 -000 0000 -uuu uuuu CCPR1L xxxx xxxx uuuu uuuu uuuu uuuu CCPR1H xxxx xxxx uuuu uuuu uuuu uuuu CCP1CON --00 0000 --00 0000 --uu uuuu ADRES xxxx xxxx uuuu uuuu uuuu uuuu ADCON0 0000 00-0 0000 00-0 uuuu uu-u OPTION_REG 1111 1111 1111 1111 uuuu uuuu TRISA --11 1111 --11 1111 --uu uuuu TRISB 1111 1111 1111 1111 uuuu uuuu TRISCCP xxxx x1x1 xxxx x1x1 xxxx xuxu ---- 0000 ---- 0000 ---- uuuu -0-- 0000 -0-- 0000 -u-- uuuu PCON ---- --0q ---- --uq ---- --uq PR2 1111 1111 1111 1111 1111 1111 ADCON1 ---- -000 ---- -000 ---- -uuu W PCL PIR1 PIE1 Legend: Note 1: 2: 3: 4: 5: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’, q = value depends on condition One or more bits in INTCON and/or PIR1 will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 9-5 for Reset value for specific condition. On any device Reset, these pins are configured as inputs. This is the value that will be in the port output latch. 1999-2013 Microchip Technology Inc. DS41106C-page 59 PIC16C712/716 FIGURE 9-11: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 9-12: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET FIGURE 9-13: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET DS41106C-page 60 1999-2013 Microchip Technology Inc. PIC16C712/716 9.10 Interrupts The RB0/INT pin interrupt, the RB port change interrupt and the TMR0 overflow interrupt flags are contained in the INTCON register. The PIC16C712/716 devices have up to 7 sources of interrupt. The Interrupt Control Register (INTCON) records individual interrupt requests in flag bits. It also has individual and global interrupt enable bits. Note: The peripheral interrupt flags are contained in the Special Function Registers, PIR1 and PIR2. The corresponding interrupt enable bits are contained in Special Function Registers, PIE1 and PIE2, and the peripheral interrupt enable bit is contained in Special Function Register, INTCON. Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit. A Global Interrupt Enable bit, GIE (INTCON<7>) enables (if set) all unmasked interrupts or disables (if cleared) all interrupts. When bit GIE is enabled, and an interrupt’s flag bit and mask bit are set, the interrupt will vector immediately. Individual interrupts can be disabled through their corresponding enable bits in various registers. Individual interrupt bits are set, regardless of the status of the GIE bit. The GIE bit is cleared on Reset. When an interrupt is responded to, the GIE bit is cleared to disable any further interrupt, the return address is pushed onto the stack and the PC is loaded with 0004h. Once in the Interrupt Service Routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid recursive interrupts. For external interrupt events, such as the INT pin or PORTB change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends when the interrupt event occurs. The latency is the same for one or two cycle instructions. Individual interrupt flag bits are set, regardless of the status of their corresponding mask bit or the GIE bit. The “return from interrupt” instruction, RETFIE, exits the interrupt routine, as well as sets the GIE bit, which re-enables interrupts. FIGURE 9-14: INTERRUPT LOGIC T0IF T0IE INTF INTE ADIF ADIE Wake-up (If in Sleep mode) Interrupt to CPU RBIF RBIE PEIE CCP1IF CCP1IE GIE TMR2IF TMR2IE TMR1IF TMR1IE 1999-2013 Microchip Technology Inc. DS41106C-page 61 PIC16C712/716 9.10.1 INT INTERRUPT 9.11 External interrupt on RB0/INT pin is edge triggered, either rising if bit INTEDG (OPTION_REG<6>) is set, or falling if the INTEDG bit is clear. When a valid edge appears on the RB0/INT pin, flag bit INTF (INTCON<1>) is set. This interrupt can be disabled by clearing enable bit INTE (INTCON<4>). Flag bit INTF must be cleared in software in the Interrupt Service Routine before re-enabling this interrupt. The INT interrupt can wake-up the processor from Sleep, if bit INTE was set prior to going into Sleep. The status of global interrupt enable bit GIE decides whether or not the processor branches to the interrupt vector following wake-up. See Section 9.13 “Power-down Mode (Sleep)” for details on Sleep mode. 9.10.2 TMR0 INTERRUPT An overflow (FFh 00h) in the TMR0 register will set flag bit T0IF (INTCON<2>). The interrupt can be enabled/disabled by setting/clearing enable bit T0IE (INTCON<5>). (Section 4.0 “Timer0 Module”) During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt, (i.e., W register and STATUS register). This will have to be implemented in software. Example 9-1 stores and restores the W and STATUS registers. The register, W_TEMP, must be defined in each bank and must be defined at the same offset from the bank base address (i.e., if W_TEMP is defined at 0x20 in bank 0, it must also be defined at 0xA0 in bank 1). The example: a) b) c) d) e) f) 9.10.3 Context Saving During Interrupts Stores the W register. Stores the STATUS register in bank 0. Stores the PCLATH register. Executes the Interrupt Service Routine code (User-generated). Restores the STATUS register (and bank select bit). Restores the W and PCLATH registers. PORTB INTCON CHANGE An input change on PORTB<7:4> sets flag bit RBIF (INTCON<0>). The interrupt can be enabled/disabled by setting/clearing enable bit RBIE (INTCON<4>). (Section 3.2 “PORTB and the TRISB Register”) EXAMPLE 9-1: SAVING STATUS, W, AND PCLATH REGISTERS IN RAM MOVWF SWAPF CLRF MOVWF MOVF MOVWF CLRF BCF MOVF MOVWF : :(ISR) : MOVF MOVWF SWAPF W_TEMP STATUS,W STATUS STATUS_TEMP PCLATH, W PCLATH_TEMP PCLATH STATUS, IRP FSR, W FSR_TEMP ;Copy W to TEMP register, could be bank one or zero ;Swap status to be saved into W ;bank 0, regardless of current bank, Clears IRP,RP1,RP0 ;Save status to bank zero STATUS_TEMP register ;Only required if using pages 1, 2 and/or 3 ;Save PCLATH into W ;Page zero, regardless of current page ;Return to Bank 0 ;Copy FSR to W ;Copy FSR from W to FSR_TEMP PCLATH_TEMP, W PCLATH STATUS_TEMP,W MOVWF SWAPF STATUS W_TEMP,F ;Restore PCLATH ;Move W into PCLATH ;Swap STATUS_TEMP register into W ;(sets bank to original state) ;Move W into STATUS register ;Swap W_TEMP SWAPF W_TEMP,W ;Swap W_TEMP into W DS41106C-page 62 1999-2013 Microchip Technology Inc. PIC16C712/716 9.12 Watchdog Timer (WDT) The Watchdog Timer is as a free running, on-chip, RC oscillator which does not require any external components. This RC oscillator is separate from the RC oscillator of the OSC1/CLKIN pin. That means that the WDT will run, even if the clock on the OSC1/CLKIN and OSC2/CLKOUT pins of the device have been stopped, for example, by execution of a SLEEP instruction. During normal operation, a WDT Time-out generates a device Reset (Watchdog Timer Reset). If the device is in Sleep mode, a WDT Time-out causes the device to wake-up and continue with normal operation (Watchdog Timer Wake-up). The TO bit in the STATUS register will be cleared upon a Watchdog Timer Time-out. WDT time-out period values may be found in the Electrical Specifications section under TWDT (parameter #31). Values for the WDT prescaler (actually a postscaler, but shared with the Timer0 prescaler) may be assigned using the OPTION_REG register. Note: The CLRWDT and SLEEP instructions clear the WDT and the postscaler, if assigned to the WDT, and prevent it from timing out and generating a device Reset condition. Note: When a CLRWDT instruction is executed and the prescaler is assigned to the WDT, the prescaler count will be cleared, but the prescaler assignment is not changed. . The WDT can be permanently disabled by clearing Configuration bit WDTE (Section 9.1 “Configuration Bits”). FIGURE 9-15: WATCHDOG TIMER BLOCK DIAGRAM From TMR0 Clock Source (Figure 4-2) 0 1 WDT Timer Postscaler M U X 8 8-to-1 MUX PS2:PS0 PSA WDT Enable Bit To TMR0 (Figure 4-2) 0 1 MUX WDT Time-out Note: PSA and PS2:PS0 are bits in the OPTION_REG register. FIGURE 9-16: PSA SUMMARY OF WATCHDOG TIMER REGISTERS Address Name Bits 13:8 Bit 7 Bit 6 Bit 5 Bit 4 CP1 CP0 2007h Config. bits (1) — BODEN(1) 81h OPTION_REG N/A RBPU INTEDG T0CS T0SE Bit 3 Bit 2 PWRTE(1) WDTE PSA PS2 Bit 1 Bit 0 FOSC1 FOSC0 PS1 PS0 Legend: Shaded cells are not used by the Watchdog Timer. Note 1: See Figure 9-1 for operation of these bits. 1999-2013 Microchip Technology Inc. DS41106C-page 63 PIC16C712/716 9.13 Power-down Mode (Sleep) Power-Down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the PD bit (STATUS<3>) is cleared, the TO (STATUS<4>) bit is set, and the oscillator driver is turned off. The I/O ports maintain the status they had, before the SLEEP instruction was executed (driving high, low, or high-impedance). For lowest current consumption in this mode, place all I/O pins at either VDD or VSS, ensure no external circuitry is drawing current from the I/O pin, powerdown the A/D and the disable external clocks. Pull all I/ O pins, that are high-impedance inputs, high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on-chip pull-ups on PORTB should be considered. The MCLR pin must be at a logic high level (VIHMC). 9.13.1 WAKE-UP FROM SLEEP The device can wake up from Sleep through one of the following events: 1. 2. 3. External Reset input on MCLR pin. Watchdog Timer Wake-up (if WDT was enabled). Interrupt from INT pin, RB port change, or some peripheral interrupts. External MCLR Reset will cause a device Reset. All other events are considered a continuation of program execution and cause a “wake-up”. The TO and PD bits in the STATUS register can be used to determine the cause of device Reset. The PD bit, which is set on power-up, is cleared when SLEEP is invoked. The TO bit is cleared if a WDT Time-out occurred (and caused wake-up). The following peripheral interrupts can wake the device from Sleep: 1. 2. 3. TMR1 interrupt. Timer1 must be operating as an asynchronous counter. CCP Capture mode interrupt. Special Event Trigger (Timer1 in Asynchronous mode using an external clock). Other peripherals cannot generate interrupts, since during Sleep, no on-chip clocks are present. DS41106C-page 64 1999-2013 Microchip Technology Inc. PIC16C712/716 When the SLEEP instruction is being executed, the next instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction and then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have a NOP after the SLEEP instruction. 9.13.2 WAKE-UP USING INTERRUPTS When global interrupts are disabled (GIE cleared) and any interrupt source has both its interrupt enable bit and interrupt flag bit set, one of the following will occur: • If the interrupt occurs before the execution of a SLEEP instruction, the SLEEP instruction will complete as a NOP. Therefore, the WDT and WDT FIGURE 9-17: postscaler will not be cleared, the TO bit will not be set and PD bits will not be cleared. • If the interrupt occurs during or after the execution of a SLEEP instruction, the device will immediately wake-up from Sleep. The SLEEP instruction will be completely executed before the wake-up. Therefore, the WDT and WDT postscaler will be cleared, the TO bit will be set and the PD bit will be cleared. Even if the flag bits were checked before executing a SLEEP instruction, it may be possible for flag bits to become set before the SLEEP instruction completes. To determine whether a SLEEP instruction executed, test the PD bit. If the PD bit is set, the SLEEP instruction was executed as a NOP. To ensure that the WDT is cleared, a CLRWDT instruction should be executed before a SLEEP instruction. WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 TOST(2) CLKOUT(4) INT pin INTF flag (INTCON<1>) Interrupt Latency (Note 2) GIE bit (INTCON<7>) Processor in Sleep INSTRUCTION FLOW PC Instruction fetched Instruction executed Note 1: 2: 3: 4: 9.14 PC Inst(PC) = Sleep Inst(PC - 1) PC + 1 PC + 2 Inst(PC + 1) Inst(PC + 2) Sleep Inst(PC + 1) PC + 2 Dummy cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) XT, HS or LP Oscillator mode assumed. TOST = 1024TOSC (drawing not to scale) This delay will not be there for RC Osc mode. GIE = 1 assumed. In this case after wake-up, the processor jumps to the interrupt routine. If GIE = 0, execution will continue in-line. CLKOUT is not available in these osc modes, but shown here for timing reference. Program Verification/Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. Note: PC + 2 Microchip does not recommend code protecting windowed devices. 9.15 ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code-identification numbers. These locations are not accessible during normal execution, but are readable and writable during Program/Verify. It is recommended that only the 4 Least Significant bits of the ID location are used. For ROM devices, these values are submitted along with the ROM code. 1999-2013 Microchip Technology Inc. DS41106C-page 65 PIC16C712/716 9.16 In-Circuit Serial Programming™ PIC16CXXX microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data, and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices, and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. For complete details on serial programming, please refer to the In-Circuit Serial Programming™ (ICSP™) Guide, (DS30277). DS41106C-page 66 1999-2013 Microchip Technology Inc. PIC16C712/716 10.0 INSTRUCTION SET SUMMARY Each PIC16CXXX instruction is a 14-bit word divided into an OPCODE which specifies the instruction type and one or more operands which further specify the operation of the instruction. The PIC16CXXX instruction set summary in Table 10-2 lists byte-oriented, bitoriented, and literal and control operations. Table 10-1 shows the opcode field descriptions. For byte-oriented instructions, ‘f’ represents a file register designator and ‘d’ represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If ‘d’ is zero, the result is placed in the W register. If ‘d’ is one, the result is placed in the file register specified in the instruction. All instructions are executed within one single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles with the second cycle executed as a NOP. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Table 10-2 lists the instructions recognized by the MPASM assembler. Figure 10-1 shows the general formats that the instructions can have. Note: To maintain upward compatibility with future PIC16CXXX products, do not use the OPTION and TRIS instructions. For bit-oriented instructions, ‘b’ represents a bit field designator which selects the number of the bit affected by the operation, while ‘f’ represents the number of the file in which the bit is located. All examples use the following format to represent a hexadecimal number: For literal and control operations, ‘k’ represents an eight or eleven bit constant or literal value. where h signifies a hexadecimal digit. TABLE 10-1: OPCODE FIELD DESCRIPTIONS Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don’t care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d 0xhh FIGURE 10-1: Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) Program Counter TO Time-out bit PD Power-down bit Z Zero bit DC Digit Carry bit C Carry bit The instruction set is highly orthogonal and is grouped into three basic categories: • Byte-oriented operations • Bit-oriented operations • Literal and control operations 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1 PC GENERAL FORMAT FOR INSTRUCTIONS 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value A description of each instruction is available in the PIC® Mid-Range Reference Manual, (DS33023). 1999-2013 Microchip Technology Inc. DS41106C-page 67 PIC16C712/716 TABLE 10-2: Mnemonic, Operands PIC16CXXX INSTRUCTION SET Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f f, d f, d f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0000 dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff 0011 ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff C,DC,Z Z Z Z Z Z Z Z Z C C C,DC,Z Z 1,2 1,2 2 1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2 1,2 1,2 1,2 1,2 1,2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk 1,2 1,2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k k k k k k k Add literal and W AND literal with W Call subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into standby mode Subtract W from literal Exclusive OR literal with W C,DC,Z Z TO,PD Z TO,PD C,DC,Z Z Note 1: When an I/O register is modified as a function of itself (e.g., MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an external device, the data will be written back with a ‘0’. 2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 Module. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS41106C-page 68 1999-2013 Microchip Technology Inc. PIC16C712/716 11.0 DEVELOPMENT SUPPORT The PIC® microcontrollers are supported with a full range of hardware and software development tools: • Integrated Development Environment - MPLAB® IDE Software • Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C18 and MPLAB C30 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB ASM30 Assembler/Linker/Library • Simulators - MPLAB SIM Software Simulator • Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator • In-Circuit Debugger - MPLAB ICD 2 • Device Programmers - PICSTART® Plus Development Programmer - MPLAB PM3 Device Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits 11.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows® operating system-based application that contains: • A single graphical interface to all debugging tools - Simulator - Programmer (sold separately) - Emulator (sold separately) - In-Circuit Debugger (sold separately) • A full-featured editor with color-coded context • A multiple project manager • Customizable data windows with direct edit of contents • High-level source code debugging • Visual device initializer for easy register initialization • Mouse over variable inspection • Drag and drop variables from source to watch windows • Extensive on-line help • Integration of select third party tools, such as HI-TECH Software C Compilers and IAR C Compilers The MPLAB IDE allows you to: • Edit your source files (either assembly or C) • One touch assemble (or compile) and download to PIC MCU emulator and simulator tools (automatically updates all project information) • Debug using: - Source files (assembly or C) - Mixed assembly and C - Machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost-effective simulators, through low-cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increased flexibility and power. 1999-2013 Microchip Technology Inc. DS41106C-page 69 PIC16C712/716 11.2 MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel® standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM Assembler features include: • Integration into MPLAB IDE projects • User-defined macros to streamline assembly code • Conditional assembly for multi-purpose source files • Directives that allow complete control over the assembly process 11.5 MPLAB ASM30 Assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 C Compiler uses the assembler to produce its object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: • • • • • • Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 11.6 11.3 MPLAB C18 and MPLAB C30 C Compilers The MPLAB C18 and MPLAB C30 Code Development Systems are complete ANSI C compilers for Microchip’s PIC18 family of microcontrollers and dsPIC30F family of digital signal controllers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 11.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK Object Linker combines relocatable objects created by the MPASM Assembler and the MPLAB C18 C Compiler. It can link relocatable objects from precompiled libraries, using directives from a linker script. MPLAB ASM30 Assembler, Linker and Librarian MPLAB SIM Software Simulator The MPLAB SIM Software Simulator allows code development in a PC-hosted environment by simulating the PIC MCUs and dsPIC® DSCs on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a comprehensive stimulus controller. Registers can be logged to files for further run-time analysis. The trace buffer and logic analyzer display extend the power of the simulator to record and track program execution, actions on I/O, as well as internal registers. The MPLAB SIM Software Simulator fully supports symbolic debugging using the MPLAB C18 and MPLAB C30 C Compilers, and the MPASM and MPLAB ASM30 Assemblers. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. The MPLIB Object Librarian manages the creation and modification of library files of precompiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: • Efficient linking of single libraries instead of many smaller files • Enhanced code maintainability by grouping related modules together • Flexible creation of libraries with easy module listing, replacement, deletion and extraction DS41106C-page 70 1999-2013 Microchip Technology Inc. PIC16C712/716 11.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator The MPLAB ICE 2000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PIC microcontrollers. Software control of the MPLAB ICE 2000 In-Circuit Emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The architecture of the MPLAB ICE 2000 In-Circuit Emulator allows expansion to support new PIC microcontrollers. The MPLAB ICE 2000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft® Windows® 32-bit operating system were chosen to best make these features available in a simple, unified application. 11.8 MPLAB ICE 4000 High-Performance In-Circuit Emulator The MPLAB ICE 4000 In-Circuit Emulator is intended to provide the product development engineer with a complete microcontroller design tool set for high-end PIC MCUs and dsPIC DSCs. Software control of the MPLAB ICE 4000 In-Circuit Emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. 11.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a powerful, low-cost, run-time development tool, connecting to the host PC via an RS-232 or high-speed USB interface. This tool is based on the Flash PIC MCUs and can be used to develop for these and other PIC MCUs and dsPIC DSCs. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the Flash devices. This feature, along with Microchip’s In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers costeffective, in-circuit Flash debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single stepping and watching variables, and CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real time. MPLAB ICD 2 also serves as a development programmer for selected PIC devices. 11.10 MPLAB PM3 Device Programmer The MPLAB PM3 Device Programmer is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features a large LCD display (128 x 64) for menus and error messages and a modular, detachable socket assembly to support various package types. The ICSP™ cable assembly is included as a standard item. In Stand-Alone mode, the MPLAB PM3 Device Programmer can read, verify and program PIC devices without a PC connection. It can also set code protection in this mode. The MPLAB PM3 connects to the host PC via an RS-232 or USB cable. The MPLAB PM3 has high-speed communications and optimized algorithms for quick programming of large memory devices and incorporates an SD/MMC card for file storage and secure data applications. The MPLAB ICE 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high-speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, and up to 2 Mb of emulation memory. The MPLAB ICE 4000 In-Circuit Emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 1999-2013 Microchip Technology Inc. DS41106C-page 71 PIC16C712/716 11.11 PICSTART Plus Development Programmer 11.12 Demonstration, Development and Evaluation Boards The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus Development Programmer is CE compliant. A wide variety of demonstration, development and evaluation boards for various PIC MCUs and dsPIC DSCs allows quick application development on fully functional systems. Most boards include prototyping areas for adding custom circuitry and provide application firmware and source code for examination and modification. The boards support a variety of features, including LEDs, temperature sensors, switches, speakers, RS-232 interfaces, LCD displays, potentiometers and additional EEPROM memory. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various microcontroller applications. In addition to the PICDEM™ and dsPICDEM™ demonstration/development board series of circuits, Microchip has a line of evaluation kits and demonstration software for analog filter design, KEELOQ® security ICs, CAN, IrDA®, PowerSmart® battery management, SEEVAL® evaluation system, Sigma-Delta ADC, flow rate sensing, plus many more. Check the Microchip web page (www.microchip.com) and the latest “Product Selector Guide” (DS00148) for the complete list of demonstration, development and evaluation kits. DS41106C-page 72 1999-2013 Microchip Technology Inc. PIC16C712/716 12.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (†) Ambient temperature under bias.............................................................................................................-55°C to +125°C Storage temperature .............................................................................................................................. -65°C to +150°C Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4) ......................................... -0.3V to (VDD + 0.3V) Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +7.5V Voltage on MCLR with respect to VSS (Note 2) ......................................................................................... 0V to +13.25V Voltage on RA4 with respect to Vss ............................................................................................................... 0V to +8.5V Total power dissipation (Note 1) (PDIP and SOIC)...................................................................................................1.0W Total power dissipation (Note 1) (SSOP) ................................................................................................................0.65W Maximum current out of VSS pin ...........................................................................................................................300 mA Maximum current into VDD pin ..............................................................................................................................250 mA Input clamp current, IIK (VI < 0 or VI > VDD) 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA Maximum output current sunk by any I/O pin..........................................................................................................25 mA Maximum output current sourced by any I/O pin ....................................................................................................25 mA Maximum current sunk byPORTA and PORTB (combined).................................................................................200 mA Maximum current sourced by PORTA and PORTB (combined) ...........................................................................200 mA Note 1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL) 2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latch-up. Thus, a series resistor of 50-100 should be used when applying a “low” level to the MCLR/VPP pin rather than pulling this pin directly to VSS. † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 1999-2013 Microchip Technology Inc. DS41106C-page 73 PIC16C712/716 FIGURE 12-1: PIC16C712/716 VOLTAGE-FREQUENCY GRAPH, -40°C < TA < +125°C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 20 10 4 40 30 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. FIGURE 12-2: PIC16LC712/716 VOLTAGE-FREQUENCY GRAPH, 0°C < TA < +70°C 6.0 5.5 5.0 4.5 VDD (Volts) 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. DS41106C-page 74 1999-2013 Microchip Technology Inc. PIC16C712/716 12.1 DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended) PIC16C712/716-20 (Commercial, Industrial, Extended) Standard Operating Conditions (unless otherwise stated) +70°C for commercial Operating temperature 0°C TA +85°C for industrial -40°C TA -40°C TA +125°C for extended DC CHARACTERISTICS Param No. D001 D001A Sym. VDD Characteristic Supply Voltage Min. Typ† Max. Units 4.0 4.5 VBOR* — — — 5.5 5.5 5.5 V V V Conditions XT, RC and LP osc mode HS osc mode BOR enabled(7) D002* VDR RAM Data Retention Voltage(1) — 1.5 — V D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V See section on Power-on Reset for details D004* D004A* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 TBD — — — — V/ms PWRT enabled (PWRTE bit clear) PWRT disabled (PWRTE bit set) See section on Power-on Reset for details D005 VBOR Brown-out Reset voltage trip point 3.65 — 4.35 V D010 D013 IDD Supply Current(2,5) — — 0.8 4.0 2.5 8.0 mA mA FOSC = 4 MHz, VDD = 4.0V FOSC = 20 MHz, VDD = 4.0V D020 IPD Power-down Current(3,5) — — — — 10.5 1.5 1.5 2.5 42 16 19 19 A A A A VDD = 4.0V, WDT enabled,-40C to +85C VDD = 4.0V, WDT disabled, 0C to +70C VDD = 4.0V, WDT disabled,-40C to +85C VDD = 4.0V, WDT disabled,-40C to +125C D022* D022A* IWDT IBOR Module Differential Current(6) Watchdog Timer Brown-out Reset — — 6.0 TBD 20 200 A A WDTE bit set, VDD = 4.0V BODEN bit set, VDD = 5.0V 1A FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 — — — — 200 4 4 20 KHz MHz MHz MHz D021 D021B * † Note1: 2: 3: 4: 5: 6: 7: BODEN bit set All temperatures All temperatures All temperatures All temperatures These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS. For RC Osc mode, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm. Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. This is the voltage where the device enters the Brown-out Reset. When BOR is enabled, the device will operate correctly to this trip point. 1999-2013 Microchip Technology Inc. DS41106C-page 75 PIC16C712/716 12.2 DC Characteristics: PIC16LC712/716-04 (Commercial, Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature 0°C TA +70°C for commercial +85°C for industrial -40°C TA DC CHARACTERISTICS Param No. Sym. Characteristic Min. Typ† Max. Units 2.5 VBOR* — — 5.5 5.5 V V Conditions D001 VDD Supply Voltage D002* VDR RAM Data Retention Voltage(1) — 1.5 — V D003 VPOR VDD Start Voltage to ensure internal Power-on Reset signal — VSS — V See section on Power-on Reset for details D004* D004A* SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 TBD — — — — V/ms PWRT enabled (PWRTE bit clear) PWRT disabled (PWRTE bit set) See section on Power-on Reset for details D005 VBOR Brown-out Reset voltage trip point 3.65 — 4.35 V D010 IDD Supply Current(2,5) — 2.0 3.8 mA — 22.5 48 A XT, RC osc modes FOSC = 4 MHz, VDD = 3.0V (Note 4) LP osc mode FOSC = 32 kHz, VDD = 3.0V, WDT disabled — — — 7.5 0.9 0.9 30 5 5 A A A VDD = 3.0V, WDT enabled, -40C to +85C VDD = 3.0V, WDT disabled, 0C to +70C VDD = 3.0V, WDT disabled, -40C to +85C WDTE bit set, VDD = 4.0V BODEN bit set, VDD = 5.0V D010A D020 D021 D021A IPD Power-down Current(3,5) D022* D022A* IWDT IBOR Module Differential Current(6) Watchdog Timer Brown-out Reset — — 6.0 TBD 20 200 A A 1A FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 — — — — 200 4 4 20 KHz MHz MHz MHz * † Note1: 2: 3: 4: 5: 6: 7: BOR enabled (Note 7) BODEN bit set All temperatures All temperatures All temperatures All temperatures These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD and VSS. For RC Osc mode, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/2REXT (mA) with REXT in kOhm. Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from characterization and is for design guidance only. This is not tested. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. This is the voltage where the device enters the Brown-out Reset. When BOR is enabled, the device will operate correctly to this trip point. DS41106C-page 76 1999-2013 Microchip Technology Inc. PIC16C712/716 12.3 DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended) PIC16C712716-20 (Commercial, Industrial, Extended) PIC16LC712/716-04 (Commercial, Industrial) DC CHARACTERISTICS Param No. Sym. VIL D030 D030A D031 D032 D033 VIH D040 D040A D041 D042 D042A D043 D060 IIL D061 D063 Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR, OSC1 (in RC mode) OSC1 (in XT, HS and LP modes) Input High Voltage I/O ports with TTL buffer with Schmitt Trigger buffer MCLR OSC1 (XT, HS and LP modes) OSC1 (in RC mode) Input Leakage Current (Notes 2, 3) I/O ports MCLR, RA4/T0CKI OSC1 Standard Operating Conditions (unless otherwise stated) +70°C for commercial Operating temperature 0°C TA -40°C TA +85°C for industrial -40°C TA +125°C for extended Operating voltage VDD range as described in DC spec Section 12.1 “DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended) PIC16C712/716-20 (Commercial, Industrial, Extended)” and Section 12.2 “DC Characteristics: PIC16LC712/ 716-04 (Commercial, Industrial)” Min. Typ† Max. Units Conditions VSS VSS VSS Vss Vss — — — — — 0.8V 0.15VDD 0.2VDD 0.2VDD 0.3VDD V V V V V 4.5V VDD 5.5V otherwise VDD VDD V V 4.5V VDD 5.5V otherwise V V V V For entire VDD range Vss VPIN VDD, Pin at high-impedance Vss VPIN VDD Vss VPIN VDD, XT, HS and LP osc modes VDD = 5V, VPIN = VSS (Note 1) — 2.0 0.25VDD + 0.8V — 0.8VDD 0.8VDD 0.7VDD 0.9VDD — — VDD VDD VDD VDD — — 1 A — — — — 5 5 A A — — — (Note 1) IPURB PORTB weak pull-up current 50 250 400 A These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC Oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC MCU be driven with external clock in RC mode. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. D070 * † 1999-2013 Microchip Technology Inc. DS41106C-page 77 PIC16C712/716 DC CHARACTERISTICS Param No. D080 Sym. VOL D083 D090 Characteristic Output Low Voltage I/O ports OSC2/CLKOUT (RC Osc mode) VOH D092 Output High Voltage I/O ports (Note 3) OSC2/CLKOUT (RC Osc mode) D150* VOD D100 COSC2 D101 CIO Open-Drain High Voltage Capacitive Loading Specs on Output Pins OSC2 pin Standard Operating Conditions (unless otherwise stated) Operating temperature 0°C TA +70°C for commercial +85°C for industrial -40°C TA -40°C TA +125°C for extended Operating voltage VDD range as described in DC spec Section 12.1 “DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended) PIC16C712/716-20 (Commercial, Industrial, Extended)” and Section 12.2 “DC Characteristics: PIC16LC712/ 716-04 (Commercial, Industrial)” Min. Typ† Max. Units Conditions — — 0.6 V — — 0.6 V — — 0.6 V — — 0.6 V VDD-0.7 — — V VDD-0.7 — — V VDD-0.7 — — V VDD-0.7 — — V — — 8.5 V — — 15 pF IOL = 8.5 mA, VDD = 4.5V, -40C to +85C IOL = 7.0 mA, VDD = 4.5V, -40C to +125C IOL = 1.6 mA, VDD = 4.5V, -40C to +85C IOL = 1.2 mA, VDD = 4.5V, -40C to +125C IOH = -3.0 mA, VDD = 4.5V, -40C to +85C IOH = -2.5 mA, VDD = 4.5V, -40C to +125C IOH = -1.3 mA, VDD = 4.5V, -40C to +85C IOH = -1.0 mA, VDD = 4.5V, -40C to +125C RA4 pin In XT, HS and LP modes when external clock is used to drive OSC1. All I/O pins and OSC2 (in RC — — 50 pF mode) * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC Oscillator mode, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended that the PIC MCU be driven with external clock in RC mode. 2: The leakage current on the MCLR/VPP pin is strongly dependent on the applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as current sourced by the pin. DS41106C-page 78 1999-2013 Microchip Technology Inc. PIC16C712/716 12.4 12.4.1 AC (Timing) Characteristics TIMING PARAMETER SYMBOLOGY The timing parameter symbols have been created using one of the following formats: 1. TppS2ppS 2. TppS T F Frequency Lowercase letters (pp) and their meanings: pp cc CCP1 ck CLKOUT cs CS di SDI do SDO dt Data in io I/O port mc MCLR Uppercase letters and their meanings: S F Fall H High I Invalid (High-impedance) L Low 1999-2013 Microchip Technology Inc. T Time osc rd rw sc ss t0 t1 wr OSC1 RD RD or WR SCK SS T0CKI T1CKI WR P R V Z Period Rise Valid High-impedance DS41106C-page 79 PIC16C712/716 12.4.2 TIMING CONDITIONS The temperature and voltages specified in Table 12-1 apply to all timing specifications, unless otherwise noted. Figure 12-3 specifies the load conditions for the timing specifications. TABLE 12-1: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC Standard Operating Conditions (unless otherwise stated) Operating temperature 0°C TA +70°C for commercial -40°C TA +85°C for industrial -40°C TA +125°C for extended Operating voltage VDD range as described in DC spec Section 12.1 “DC Characteristics: PIC16C712/716-04 (Commercial, Industrial, Extended) PIC16C712/716-20 (Commercial, Industrial, Extended)” and Section 12.2 “DC Characteristics: PIC16LC712/716-04 (Commercial, Industrial)”. LC parts operate for commercial/industrial temp’s only. AC CHARACTERISTICS FIGURE 12-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS Load condition 2 Load condition 1 VDD/2 RL CL Pin VSS CL Pin VSS Legend: RL = 464 CL = 50 pF 15 pF DS41106C-page 80 for all pins except OSC2/CLKOUT for OSC2 output 1999-2013 Microchip Technology Inc. PIC16C712/716 12.4.3 TIMING DIAGRAMS AND SPECIFICATIONS FIGURE 12-4: EXTERNAL CLOCK TIMING Q4 Q1 Q2 Q3 Q4 Q1 OSC1 3 1 3 4 4 2 CLKOUT TABLE 12-2: Param No. 1A Sym. FOSC EXTERNAL CLOCK TIMING REQUIREMENTS Characteristic Min. External CLKIN Frequency (Note 1) DC — 4 MHz RC and XT osc modes DC — 4 MHz HS osc mode (-04) Oscillator Frequency (Note 1) 1 TOSC External CLKIN Period (Note 1) Oscillator Period (Note 1) Typ† Max. Units Conditions DC — 20 MHz HS osc mode (-20) DC — 200 kHz LP osc mode DC — 4 MHz RC osc mode 0.1 — 4 MHz XT osc mode 4 — 20 MHz HS osc mode 5 — 200 kHz LP osc mode 250 — — ns RC and XT osc modes 250 — — ns HS osc mode (-04) 50 — — ns HS osc mode (-20) 5 — — s LP osc mode 250 — — ns RC osc mode 250 — 10,000 ns XT osc mode 250 — 250 ns HS osc mode (-04) 50 — 250 ns HS osc mode (-20) 5 — — s LP osc mode — DC ns TCY = 4/FOSC 2 TCY Instruction Cycle Time (Note 1) 200 3* TosL, TosH External Clock in (OSC1) High or Low Time 100 — — ns XT oscillator 2.5 — — s LP oscillator 15 — — ns HS oscillator TosR, TosF External Clock in (OSC1) Rise or Fall Time — — 25 ns XT oscillator — — 50 ns LP oscillator — — 15 ns HS oscillator 4* * † These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at “min.” values with an external clock applied to the OSC1/CLKIN pin. When an external clock input is used, the “Max.” cycle time limit is “DC” (no clock) for all devices. 1999-2013 Microchip Technology Inc. DS41106C-page 81 PIC16C712/716 FIGURE 12-5: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 CLKOUT 13 19 14 12 18 16 I/O Pin (input) 15 17 I/O Pin (output) new value old value 20, 21 Note: Refer to Figure 12-3 for load conditions. TABLE 12-3: Param No. 10* CLKOUT AND I/O TIMING REQUIREMENTS Sym. Characteristic TosH2ckL OSC1 to CLKOUT Min. Typ† Max. — 75 200 Units Conditions ns Note 1 11* TosH2ckH OSC1¦ to CLKOUT¦ — 75 200 ns Note 1 12* TckR CLKOUT rise time — 35 100 ns Note 1 13* TckF CLKOUT fall time — 35 100 ns Note 1 14* TckL2ioV CLKOUT Ø to Port out valid — — 0.5TCY + 20 ns Note 1 15* TioV2ckH Port in valid before CLKOUT ¦ Tosc + 200 — — ns Note 1 16* TckH2ioI Port in hold after CLKOUT ¦ 0 — — ns Note 1 17* TosH2ioV OSC1¦ (Q1 cycle) to Port out valid — 50 150 ns 18* TosH2ioI OSC1¦ (Q2 cycle) to Port input invalid (I/O in hold time) Standard 100 — — ns Extended (LC) 200 — — ns 19* TioV2osH Port input valid to OSC1¦ (I/O in setup time) 0 — — ns 20* TioR Port output rise time Standard — 10 40 ns Extended (LC) — — 80 ns Standard — 10 40 ns Extended (LC) — — 80 ns 18A* 20A* 21* TioF Port output fall time 21A* 22††* TINP INT pin high or low time TCY — — ns 23††* TRBP RB7:RB4 change INT high or low time TCY — — ns * † These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. †† These parameters are asynchronous events not related to any internal clock edge. Note1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC. DS41106C-page 82 1999-2013 Microchip Technology Inc. PIC16C712/716 FIGURE 12-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Time-out 32 OSC Time-out Internal Reset Watchdog Timer Reset 31 34 34 I/O Pins Note: Refer to Figure 12-3 for load conditions. FIGURE 12-7: BROWN-OUT RESET TIMING BVDD VDD 35 TABLE 12-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER, AND BROWN-OUT RESET REQUIREMENTS Parameter No. Sym. Characteristic Min. Typ† Max. Units 30 TmcL 31* MCLR Pulse Width (low) 2 — — s VDD = 5V, -40°C to +125°C TWDT Watchdog Timer Time-out Period (No Prescaler) 7 18 33 ms VDD = 5V, -40°C to +125°C 32 TOST Oscillation Start-up Timer Period — 1024 TOSC — — TOSC = OSC1 period 33* TPWRT Power-up Timer Period 28 72 132 ms VDD = 5V, -40°C to +125°C 34 TIOZ I/O High-impedance from MCLR Low or WDT Reset — — 2.1 s 35 TBOR Brown-out Reset Pulse Width 100 — — s * † Conditions VDD BVDD (D005) These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 1999-2013 Microchip Technology Inc. DS41106C-page 83 PIC16C712/716 FIGURE 12-8: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS T0CKI 41 40 42 T1OSO/T1CKI 46 45 47 48 TMR0 or TMR1 Note: Refer to Figure 12-3 for load conditions. TABLE 12-5: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS Param No. Sym. Characteristic 40* Tt0H T0CKI High Pulse Width No Prescaler T0CKI Low Pulse Width With Prescaler No Prescaler With Prescaler 41* 42* 45* 46* 47* 48 * † Tt0L Min. Typ† Max. Units Conditions 0.5TCY + 20 — — ns 10 — — — — — — — — — — ns ns ns ns ns — — — — — — ns ns ns — — — — — — — — — — ns ns ns ns ns — — — — — — ns ns ns 0.5TCY + 20 10 Tt0P T0CKI Period TCY + 40 No Prescaler With Prescaler Greater of: 20 or TCY + 40 N Tt1H T1CKI High Time Synchronous, Prescaler = 1 0.5TCY + 20 Synchronous, Standard 15 Prescaler = 25 Extended (LC) 2,4,8 30 Asynchronous Standard 50 Extended (LC) Tt1L T1CKI Low Time Synchronous, Prescaler = 1 0.5TCY + 20 Synchronous, Standard 15 Prescaler = 25 Extended (LC) 2,4,8 30 Asynchronous Standard 50 Extended (LC) Tt1P T1CKI input period Synchronous Greater of: Standard 30 OR TCY + 40 N Extended (LC) Greater of: 50 OR TCY + 40 N 60 Asynchronous Standard 100 Extended (LC) Ft1 Timer1 oscillator input frequency range DC (oscillator enabled by setting bit T1OSCEN) TCKEZtmr1 Delay from external clock edge to timer increment 2Tosc Must also meet parameter 42 Must also meet parameter 42 N = prescale value (2, 4,..., 256) Must also meet parameter 47 Must also meet parameter 47 N = prescale value (1, 2, 4, 8) N = prescale value (1, 2, 4, 8) — — — — — 200 ns ns kHz — 7Tosc — These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS41106C-page 84 1999-2013 Microchip Technology Inc. PIC16C712/716 FIGURE 12-9: CAPTURE/COMPARE/PWM TIMINGS CCP1 (Capture Mode) 50 51 52 CCP1 (Compare or PWM Mode) 53 54 Note: Refer to Figure 12-3 for load conditions. TABLE 12-6: CAPTURE/COMPARE/PWM REQUIREMENTS Param No. Sym. Characteristic Min 50* TccL CCP1 input low time No Prescaler TccH CCP1 input high time No Prescaler With Prescaler Standard Extended (LC) 51* With Prescaler 52* TccP CCP1 input period 53* TccR CCP1 output rise time 54* * † TccF CCP1 output fall time Typ† Max Units Conditions 0.5TCY + 20 — — ns 10 — — ns 20 — — ns 0.5TCY + 20 — — ns Standard 10 — — ns Extended (LC) 20 — — ns 3TCY + 40 N — — ns Standard — 10 25 ns Extended (LC) — 25 45 ns Standard — 10 25 ns Extended (LC) — 25 45 ns N = prescale value (1,4, or 16) These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. 1999-2013 Microchip Technology Inc. DS41106C-page 85 PIC16C712/716 TABLE 12-7: A/D CONVERTER CHARACTERISTICS: PIC16C712/716-04 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16C712/716-20 (COMMERCIAL, INDUSTRIAL, EXTENDED) PIC16LC712/716-04 (COMMERCIAL, INDUSTRIAL) Param Sym. Characteristic No. A01 A02 NR Resolution EABS Total Absolute error Min. Typ† Max. Units Conditions — — 8-bits bit — — <±1 LSb VREF = VDD = 5.12V, VSS £ VAIN £ VREF VREF = VDD = 5.12V, VSS £ VAIN £ VREF A03 EIL Integral linearity error — — <±1 LSb VREF = VDD = 5.12V, VSS £ VAIN £ VREF A04 EDL Differential linearity error — — <±1 LSb VREF = VDD = 5.12V, VSS £ VAIN £ VREF A05 EFS Full scale error — — <±1 LSb VREF = VDD = 5.12V, VSS £ VAIN £ VREF A06 EOFF Offset error — — <±1 LSb VREF = VDD = 5.12V, VSS £ VAIN £ VREF — guaranteed (Note 3) — A10 — Monotonicity A20 VREF Reference voltage A25 VAIN Analog input voltage A30 ZAIN Recommended impedance of analog voltage source A40 IAD A/D conversion current (VDD) A50 IREF — 2.5V — VDD + 0.3 V VSS - 0.3 — VREF + 0.3 V — — 10.0 k Standard — 180 — A Extended (LC) — 90 — A 10 — 1000 A — — 10 A VREF input current (Note 2) VSS £ VAIN £ VREF Average current consumption when A/D is on. (Note 1) During VAIN acquisition. Based on differential of VHOLD to VAIN to charge CHOLD, see Section 9.1 “Configuration Bits”. During A/D Conversion cycle 2: 3: * † These parameters are characterized but not tested. Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes any such leakage from the A/D module. 2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input. 3: The A/D conversion result never decreases with an increase in the Input Voltage, and has no missing codes. DS41106C-page 86 1999-2013 Microchip Technology Inc. PIC16C712/716 FIGURE 12-10: A/D CONVERSION TIMING BSF ADCON0, GO 134 1 Tcy (TOSC/2) (1) 131 Q4 130 A/D CLK 132 7 A/D DATA 6 5 4 3 2 1 NEW_DATA OLD_DATA ADRES 0 ADIF GO DONE SAMPLING STOPPED SAMPLE Note1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. TABLE 12-8: A/D CONVERSION REQUIREMENTS Param Sym. Characteristic No. 130 TAD A/D clock period Standard Min. Typ† Max. Units Conditions 1.6 — — s TOSC based, VREF 3.0V Extended (LC) 2.0 — — s TOSC based, VREF full range Standard 2.0 4.0 6.0 s A/D RC Mode Extended (LC) 3.0 6.0 9.0 s A/D RC Mode 131 TCNV Conversion time (not including S/H time) (Note 1) 11 — 11 TAD 132 TACQ Acquisition time (Note 2) 20 — s 5* — — s The minimum time is the amplifier settling time. This may be used if the “new” input voltage has not changed by more than 1 LSb (i.e., 20.0 mV @ 5.12V) from the last sampled voltage (as stated on CHOLD). — TOSC/2 § — — If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This allows the SLEEP instruction to be executed. 1.5 § — — TAD 134 TGO 135 TSWC Switching from convert Æ sample time Q4 to A/D clock start : : * These parameters are characterized but not tested. † Data in “Typ” column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. : § This specification ensured by design. Note 1: ADRES register may be read on the following TCY cycle. 2: See Section 9.1 “Configuration Bits” for min. conditions. 1999-2013 Microchip Technology Inc. DS41106C-page 87 PIC16C712/716 NOTES: DS41106C-page 88 1999-2013 Microchip Technology Inc. PIC16C712/716 13.0 PACKAGING INFORMATION 13.1 Package Marking Information 18-Lead PDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN 18-Lead CERDIP Windowed PIC16C716-04/P 0510017 Example XXXXXXXX XXXXXXXX YYWWNNN 18-Lead SOIC (.300”) PIC16C 716/JW 0510017 Example XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX PIC16C712-20 /SO 0510017 YYWWNNN 20-Lead SSOP Example XXXXXXXXXXX XXXXXXXXXXX YYWWNNN PIC16C712 -20I/SS 0510017 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 1999-2013 Microchip Technology Inc. DS41106C-page 89 PIC16C712/716 13.2 Package Details The following sections give the technical details of the packages. 18-Lead Plastic Dual In-line (P) – 300 mil (PDIP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D 2 n 1 E A2 A L c A1 B1 p B eB Units Dimension Limits n p MIN INCHES* NOM 18 .100 .155 .130 MAX MILLIMETERS NOM 18 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 22.61 22.80 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .890 .898 .905 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 B1 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing § .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-007 DS41106C-page 90 MAX 4.32 3.68 8.26 6.60 22.99 3.43 0.38 1.78 0.56 10.92 15 15 1999-2013 Microchip Technology Inc. PIC16C712/716 18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E p E1 D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D h L c B MIN .093 .088 .004 .394 .291 .446 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 18 .050 .099 .091 .008 .407 .295 .454 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .462 .029 .050 8 .012 .020 15 15 MILLIMETERS NOM 18 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 11.33 11.53 0.25 0.50 0.41 0.84 0 4 0.23 0.27 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 11.73 0.74 1.27 8 0.30 0.51 15 15 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-051 1999-2013 Microchip Technology Inc. DS41106C-page 91 PIC16C712/716 18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D W2 2 n 1 W1 E A2 A c L A1 eB B1 p B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Ceramic Package Height Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing § Window Width Window Length * Controlling Parameter § Significant Characteristic JEDEC Equivalent: MO-036 Drawing No. C04-010 DS41106C-page 92 A A2 A1 E E1 D L c B1 B eB W1 W2 MIN .170 .155 .015 .300 .285 .880 .125 .008 .050 .016 .345 .130 .190 INCHES* NOM 18 .100 .183 .160 .023 .313 .290 .900 .138 .010 .055 .019 .385 .140 .200 MAX .195 .165 .030 .325 .295 .920 .150 .012 .060 .021 .425 .150 .210 MILLIMETERS NOM 18 2.54 4.32 4.64 3.94 4.06 0.38 0.57 7.62 7.94 7.24 7.37 22.35 22.86 3.18 3.49 0.20 0.25 1.27 1.40 0.41 0.47 8.76 9.78 3.30 3.56 4.83 5.08 MIN MAX 4.95 4.19 0.76 8.26 7.49 23.37 3.81 0.30 1.52 0.53 10.80 3.81 5.33 1999-2013 Microchip Technology Inc. PIC16C712/716 20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D B 2 1 n c A2 A L A1 Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Foot Angle Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L c B MIN .068 .064 .002 .299 .201 .278 .022 .004 0 .010 0 0 INCHES* NOM 20 .026 .073 .068 .006 .309 .207 .284 .030 .007 4 .013 5 5 MAX .078 .072 .010 .322 .212 .289 .037 .010 8 .015 10 10 MILLIMETERS NOM 20 0.65 1.73 1.85 1.63 1.73 0.05 0.15 7.59 7.85 5.11 5.25 7.06 7.20 0.56 0.75 0.10 0.18 0.00 101.60 0.25 0.32 0 5 0 5 MIN MAX 1.98 1.83 0.25 8.18 5.38 7.34 0.94 0.25 203.20 0.38 10 10 * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MO-150 Drawing No. C04-072 1999-2013 Microchip Technology Inc. DS41106C-page 93 PIC16C712/716 NOTES: DS41106C-page 94 1999-2013 Microchip Technology Inc. PIC16C712/716 APPENDIX A: REVISION HISTORY Version Date Revision Description A 2/99 This is a new data sheet. However, the devices described in this data sheet are the upgrades to the devices found in the PIC16C6X Data Sheet, DS30234, and the PIC16C7X Data Sheet, DS30390. B 9/05 Removed Preliminary Status. C 1/13 Added a note to each package outline drawing. APPENDIX B: CONVERSION CONSIDERATIONS There are no previous versions of this device. APPENDIX C: MIGRATION FROM BASE-LINE TO MID-RANGE DEVICES This section discusses how to migrate from a baseline device (i.e., PIC16C5X) to a mid-range device (i.e., PIC16CXXX). The following are the list of modifications over the PIC16C5X microcontroller family: 1. Instruction word length is increased to 14-bits. This allows larger page sizes both in program memory (2K now as opposed to 512 before) and register file (128 bytes now versus 32 bytes before). 2. A PC high latch register (PCLATH) is added to handle program memory paging. Bits PA2, PA1, PA0 are removed from STATUS register. 3. Data memory paging is redefined slightly. STATUS register is modified. 4. Four new instructions have been added: RETURN, RETFIE, ADDLW, and SUBLW. Two instructions TRIS and OPTION are being phased out although they are kept for compatibility with PIC16C5X. 5. OPTION_REG and TRIS registers are made addressable. 6. Interrupt capability is added. Interrupt vector is at 0004h. 7. Stack size is increased to 8 deep. 8. Reset vector is changed to 0000h. 9. Reset of all registers is revisited. Five different Reset (and wake-up) types are recognized. Registers are reset differently. 10. Wake-up from Sleep through interrupt is added. 1999-2013 Microchip Technology Inc. 11. Two separate timers, Oscillator Start-up Timer (OST) and Power-up Timer (PWRT) are included for more reliable power-up. These timers are invoked selectively to avoid unnecessary delays on power-up and wake-up. 12. PORTB has weak pull-ups and interrupt on change feature. 13. T0CKI pin is also a port pin (RA4) now. 14. FSR is made a full eight-bit register. 15. “In-circuit serial programming” is made possible. The user can program PIC16CXX devices using only five pins: VDD, VSS, MCLR/VPP, RB6 (clock) and RB7 (data in/out). 16. PCON STATUS register is added with a Poweron Reset Status bit (POR). 17. Code protection scheme is enhanced such that portions of the program memory can be protected, while the remainder is unprotected. 18. Brown-out protection circuitry has been added. Controlled by Configuration Word bit BODEN. Brown-out Reset ensures the device is placed in a Reset condition if VDD dips below a fixed setpoint. To convert code written for PIC16C5X to PIC16CXXX, the user should take the following steps: 1. 2. 3. 4. 5. Remove any program memory page select operations (PA2, PA1, PA0 bits) for CALL, GOTO. Revisit any computed jump operations (write to PC or add to PC, etc.) to make sure page bits are set properly under the new scheme. Eliminate any data memory page switching. Redefine data variables to reallocate them. Verify all writes to STATUS, OPTION, and FSR registers since these have changed. Change Reset vector to 0000h. DS41106C-page 95 PIC16C712/716 NOTES: DS41106C-page 96 1999-2013 Microchip Technology Inc. PIC16C712/716 INDEX A A/D ..................................................................................... 45 A/D Converter Enable (ADIE Bit) ............................... 16 A/D Converter Flag (ADIF Bit) ............................. 17, 47 A/D Converter Interrupt, Configuring ......................... 47 ADCON0 Register................................................ 11, 45 ADCON1 Register.......................................... 12, 45, 46 ADRES Register ............................................ 11, 45, 47 Analog Port Pins, Configuring.................................... 49 Block Diagram............................................................ 47 Block Diagram, Analog Input Model........................... 48 Channel Select (CHS2:CHS0 Bits) ............................ 45 Clock Select (ADCS1:ADCS0 Bits)............................ 45 Configuring the Module.............................................. 47 Conversion Clock (Tad) ............................................. 49 Conversion Status (GO/DONE Bit) ...................... 45, 47 Conversions ............................................................... 50 Converter Characteristics .......................................... 86 Module On/Off (ADON Bit)......................................... 45 Port Configuration Control (PCFG2:PCFG0 Bits) ...... 46 Sampling Requirements............................................. 48 Special Event Trigger (CCP)................................ 41, 50 Timing Diagram.......................................................... 87 Absolute Maximum Ratings ............................................... 73 ADCON0 Register........................................................ 11, 45 ADCS1:ADCS0 Bits ................................................... 45 ADON Bit ................................................................... 45 CHS2:CHS0 Bits........................................................ 45 GO/DONE Bit....................................................... 45, 47 ADCON1 Register .................................................. 12, 45, 46 PCFG2:PCFG0 Bits ................................................... 46 ADRES Register .................................................... 11, 45, 47 Analog-to-Digital Converter. See A/D Architecture PIC16C712/716 Block Diagram ................................... 5 Assembler MPASM Assembler.................................................... 70 B Banking, Data Memory ................................................ 10, 13 BOR. See Brown-out Reset Brown-Out Reset (BOR) .................................................... 55 Brown-out Reset (BOR) ................................... 51, 54, 58, 59 BOR Enable (BODEN Bit).......................................... 52 BOR Status (BOR Bit)................................................ 18 Timing Diagram.......................................................... 83 C C Compilers MPLAB C18 ............................................................... 70 MPLAB C30 ............................................................... 70 Capture (CCP Module) ...................................................... 40 Block Diagram............................................................ 40 CCP Pin Configuration............................................... 40 CCPR1H:CCPR1L Registers..................................... 40 Changing Between Capture Prescalers..................... 40 Software Interrupt ...................................................... 40 Timer1 Mode Selection .............................................. 40 Capture/Compare/PWM (CCP).......................................... 39 Capture Mode. See Capture CCP1CON Register ............................................. 11, 39 CCPR1H Register................................................ 11, 39 CCPR1L Register ................................................ 11, 39 Compare Mode. See Compare 1999-2013 Microchip Technology Inc. Enable (CCP1IE Bit).................................................. 16 Flag (CCP1IF Bit) ...................................................... 17 PWM Mode. See PWM Timer Resources ....................................................... 39 Timing Diagram ......................................................... 85 CCP1CON Register........................................................... 39 CCP1M3:CCP1M0 Bits ............................................. 39 CCP1X:CCP1Y Bits................................................... 39 Code Protection ........................................................... 51, 65 CP1:CP0 Bits............................................................. 52 Compare (CCP Module) .................................................... 41 Block Diagram ........................................................... 41 CCP Pin Configuration .............................................. 41 CCPR1H:CCPR1L Registers .................................... 41 Software Interrupt ...................................................... 41 Special Event Trigger .................................... 34, 41, 50 Timer1 Mode Selection.............................................. 41 Configuration Bits .............................................................. 51 Conversion Considerations ................................................ 95 Customer Change Notification Service ............................ 101 Customer Notification Service ......................................... 101 Customer Support............................................................ 101 D Data Memory ..................................................................... 10 Bank Select (RP1:RP0 Bits) ................................ 10, 13 General Purpose Registers ....................................... 10 Register File Map ...................................................... 10 Special Function Registers........................................ 11 DC Characteristics....................................................... 75, 77 Development Support ........................................................ 69 Direct Addressing .............................................................. 20 E Electrical Characteristics ................................................... 73 Errata ................................................................................... 3 External Power-on Reset Circuit........................................ 55 F Family of Devices PIC16C7XX ................................................................. 2 Firmware Instructions ........................................................ 67 I I/O Ports ............................................................................ 21 ID Locations................................................................. 51, 65 In-Circuit Serial Programming™ (ICSP™)................... 51, 65 Indirect Addressing ............................................................ 20 FSR Register ................................................. 10, 11, 20 INDF Register............................................................ 11 Instruction Format.............................................................. 67 Instruction Set.................................................................... 67 Summary Table ......................................................... 68 INT Interrupt (RB0/INT). See Interrupt Sources INTCON Register......................................................... 11, 15 GIE Bit ....................................................................... 15 INTE Bit ..................................................................... 15 INTF Bit ..................................................................... 15 PEIE Bit ..................................................................... 15 RBIE Bit ..................................................................... 15 RBIF Bit ............................................................... 15, 24 T0IE Bit...................................................................... 15 T0IF Bit ...................................................................... 15 Internet Address ............................................................... 101 DS41106C-page 97 PIC16C712/716 Interrupt Sources.......................................................... 51, 61 A/D Conversion Complete ......................................... 47 Block Diagram............................................................. 61 Capture Complete (CCP) ............................................ 40 Compare Complete (CCP) ......................................... 41 Interrupt-on-Change (RB7:RB4 ) ............................... 24 RB0/INT Pin, External ................................................ 62 TMR0 Overflow .................................................... 30, 62 TMR1 Overflow .................................................... 31, 34 TMR2 to PR2 Match .................................................. 37 TMR2 to PR2 Match (PWM) ................................ 36, 42 Interrupts, Context Saving During ...................................... 62 Interrupts, Enable Bits A/D Converter Enable (ADIE Bit) ............................... 16 CCP1 Enable (CCP1IE Bit).................................. 16, 40 Global Interrupt Enable (GIE Bit) ......................... 15, 61 Interrupt-on-Change (RB7:RB4) Enable (RBIE Bit) ..................................................... 15, 62 Peripheral Interrupt Enable (PEIE Bit) ....................... 15 RB0/INT Enable (INTE Bit) ........................................ 15 TMR0 Overflow Enable (T0IE Bit).............................. 15 TMR1 Overflow Enable (TMR1IE Bit) ........................ 16 TMR2 to PR2 Match Enable (TMR2IE Bit) ................ 16 Interrupts, Flag Bits A/D Converter Flag (ADIF Bit) ............................. 17, 47 CCP1 Flag (CCP1IF Bit) ................................ 17, 40, 41 Interrupt-on-Change (RB7:RB4) Flag (RBIF Bit) ............................................... 15, 24, 62 RB0/INT Flag (INTF Bit)............................................. 15 TMR0 Overflow Flag (T0IF Bit) ............................ 15, 62 TMR1 Overflow Flag (TMR1IF Bit) ............................ 17 TMR2 to PR2 Match Flag (TMR2IF Bit) ..................... 17 M Master Clear (MCLR) MCLR Reset, Normal Operation .................... 54, 58, 59 MCLR Reset, Sleep ................................................... 59 MCLR Reset, Sleep ............................................. 54, 58 Memory Organization Data Memory ............................................................. 10 Program Memory ......................................................... 9 Microchip Internet Web Site ............................................. 101 MPLAB ASM30 Assembler, Linker, Librarian .................... 70 MPLAB ICD 2 In-Circuit Debugger..................................... 71 MPLAB ICE 2000 High-Performance Universal In-Circuit Emulator ..................................................... 71 MPLAB ICE 4000 High-Performance Universal In-Circuit Emulator ..................................................... 71 MPLAB Integrated Development Environment Software ... 69 MPLAB PM3 Device Programmer...................................... 71 MPLINK Object Linker/MPLIB Object Librarian ................. 70 O OPCODE Field Descriptions .............................................. 67 OPTION_REG Register ............................................... 12, 14 INTEDG Bit ................................................................ 14 PS2:PS0 Bits ....................................................... 14, 29 PSA Bit................................................................. 14, 29 RBPU Bit .................................................................... 14 T0CS Bit............................................................... 14, 29 T0SE Bit ................................................................ 14, 29 Oscillator Configuration................................................ 51, 53 HS ........................................................................ 53, 58 LP......................................................................... 53, 58 RC .................................................................. 53, 54, 58 Selection (FOSC1:FOSC0 Bits) ................................. 52 DS41106C-page 98 XT ........................................................................ 53, 58 Oscillator, Timer1......................................................... 31, 34 Oscillator, WDT.................................................................. 63 P Packaging .......................................................................... 89 Details........................................................................ 90 Paging, Program Memory.............................................. 9, 19 PCON Register ............................................................ 18, 58 BOR Bit...................................................................... 18 POR Bit...................................................................... 18 PICSTART Plus Development Programmer...................... 72 PIE1 Register............................................................... 12, 16 ADIE Bit ..................................................................... 16 CCP1IE Bit ................................................................ 16 TMR1IE Bit ................................................................ 16 TMR2IE Bit ................................................................ 16 Pin Functions MCLR/VPP ................................................................... 6 RA0/AN0...................................................................... 6 RA1/AN1...................................................................... 6 RA2/AN2...................................................................... 6 RA3/AN3/VREF............................................................. 6 RA4/T0CKI .................................................................. 6 RB0/INT ....................................................................... 7 RB1.............................................................................. 7 RB2.............................................................................. 7 RB3.............................................................................. 7 RB4.............................................................................. 7 RB5.............................................................................. 7 RB6.............................................................................. 7 RB7.............................................................................. 7 VDD .............................................................................. 7 VSS .............................................................................. 7 Pinout Descriptions PIC16C712/716 Pinout Description ............................. 6 PIR1 Register .............................................................. 11, 17 ADIF Bit ..................................................................... 17 CCP1IF Bit................................................................. 17 TMR1IF Bit................................................................. 17 TMR2IF Bit ................................................................. 17 Pointer, FSR ...................................................................... 20 POR. See Power-on Reset PORTA Initialization ................................................................ 21 PORTA Register .................................................. 11, 21 RA3:RA0 Port Pins .................................................... 21 RA4/T0CKI Pin .......................................................... 22 TRISA Register.................................................... 12, 21 PORTB Block Diagram of RB1/T1OSO/T1CKI Pin................. 24 Block Diagram of RB2/T10SI Pin............................... 25 Block Diagram of RB3/CCP1 Pin ............................... 25 Initialization ................................................................ 23 PORTB Register .................................................. 11, 23 Pull-up Enable (RBPU Bit)......................................... 14 RB0/INT Edge Select (INTEDG Bit) .......................... 14 RB0/INT Pin, External................................................ 62 RB3:RB0 Port Pins .................................................... 23 RB7:RB4 Interrupt-on-Change .................................. 62 RB7:RB4 Interrupt-on-Change Enable (RBIE Bit) 15, 62 RB7:RB4 Interrupt-on-Change Flag (RBIF Bit)............................................... 15, 24, 62 RB7:RB4 Port Pins .................................................... 26 TRISB Register.................................................... 12, 23 1999-2013 Microchip Technology Inc. PIC16C712/716 PORTC TRISC Register.......................................................... 12 Postscaler, Timer2 Select (TOUTPS3:TOUTPS0 Bits) ............................ 36 Postscaler, WDT ................................................................ 29 Assignment (PSA Bit) .......................................... 14, 29 Block Diagram............................................................ 30 Rate Select (PS2:PS0 Bits) ................................. 14, 29 Switching Between Timer0 and WDT ........................ 30 Power-down Mode. See Sleep Power-on Reset (POR) .............................. 51, 54, 55, 58, 59 Oscillator Start-up Timer (OST) ........................... 51, 55 POR Status (POR Bit)................................................ 18 Power Control (PCON) Register ................................ 58 Power-down (PD Bit) ........................................... 13, 54 Power-on Reset Circuit, External............................... 55 Power-up Timer (PWRT) ..................................... 51, 55 PWRT Enable (PWRTE Bit)....................................... 52 Time-out (TO Bit) ................................................. 13, 54 Time-out Sequence.................................................... 57 Time-out Sequence on Power-up .............................. 60 Timing Diagram.......................................................... 83 Prescaler, Capture ............................................................. 40 Prescaler, Timer0............................................................... 29 Assignment (PSA Bit) .......................................... 14, 29 Block Diagram............................................................ 30 Rate Select (PS2:PS0 Bits) ................................. 14, 29 Switching Between Timer0 and WDT ........................ 30 Prescaler, Timer1............................................................... 32 Select (T1CKPS1:T1CKPS0 Bits).............................. 31 Prescaler, Timer2............................................................... 42 Select (T2CKPS1:T2CKPS0 Bits).............................. 36 Product Identification System .......................................... 103 Program Counter PCL Register........................................................ 11, 19 PCLATH Register .......................................... 11, 19, 62 Reset Conditions........................................................ 58 Program Memory ................................................................. 9 Interrupt Vector ............................................................ 9 Paging.................................................................... 9, 19 Program Memory Map ................................................. 9 Reset Vector ................................................................ 9 Program Verification .......................................................... 65 Programming, Device Instructions ..................................... 67 PWM (CCP Module) .......................................................... 42 Block Diagram............................................................ 42 CCPR1H:CCPR1L Registers..................................... 42 Duty Cycle.................................................................. 42 Example Frequencies/Resolutions ............................ 43 Output Diagram.......................................................... 42 Period......................................................................... 42 Set-Up for PWM Operation ........................................ 43 TMR2 to PR2 Match ............................................ 36, 42 TMR2 to PR2 Match Enable (TMR2IE Bit) ................ 16 TMR2 to PR2 Match Flag (TMR2IF Bit) ..................... 17 Q Q-Clock .............................................................................. 42 R RAM. See Data Memory Reader Response ............................................................ 104 Register File ....................................................................... 10 Register File Map ............................................................... 10 Reset ............................................................................ 51, 54 Block Diagram............................................................ 56 1999-2013 Microchip Technology Inc. Brown-out Reset (BOR). See Brown-out Reset (BOR) MCLR Reset. See MCLR Power-on Reset (POR). See Power-on Reset (POR) Reset Conditions for All Registers............................. 59 Reset Conditions for PCON Register ........................ 58 Reset Conditions for Program Counter ..................... 58 Reset Conditions for STATUS Register .................... 58 Timing Diagram ......................................................... 83 WDT Reset. See Watchdog Timer (WDT) Revision History ................................................................. 95 S Sleep ................................................................................. 64 Sleep ........................................................................... 51, 54 Software Simulator (MPLAB SIM) ..................................... 70 Special Event Trigger. See Compare Special Features of the CPU ............................................. 51 Special Function Registers ................................................ 11 Speed, Operating ................................................................ 1 Stack.................................................................................. 19 STATUS Register .................................................. 11, 13, 62 C Bit ........................................................................... 13 DC Bit ........................................................................ 13 IRP Bit ....................................................................... 13 PD Bit .................................................................. 13, 54 RP1:RP0 Bits............................................................. 13 TO Bit .................................................................. 13, 54 Z Bit ........................................................................... 13 T T1CON Register .......................................................... 11, 31 T1CKPS1:T1CKPS0 Bits........................................... 31 T1OSCEN Bit ............................................................ 31 T1SYNC Bit ............................................................... 31 TMR1CS Bit............................................................... 31 TMR1ON Bit .............................................................. 31 T2CON Register .......................................................... 11, 36 T2CKPS1:T2CKPS0 Bits........................................... 36 TMR2ON Bit .............................................................. 36 TOUTPS3:TOUTPS0 Bits ......................................... 36 Timer0 ............................................................................... 29 Block Diagram ........................................................... 29 Clock Source Edge Select (T0SE Bit) ................. 14, 29 Clock Source Select (T0CS Bit) .......................... 14, 29 Overflow Enable (T0IE Bit) ........................................ 15 Overflow Flag (T0IF Bit) ...................................... 15, 62 Overflow Interrupt ................................................ 30, 62 Prescaler. See Prescaler, Timer0 Timing Diagram ......................................................... 84 TMR0 Register .......................................................... 11 Timer1 ............................................................................... 31 Block Diagram ........................................................... 32 Capacitor Selection ................................................... 34 Clock Source Select (TMR1CS Bit)........................... 31 External Clock Input Sync (T1SYNC Bit) ................... 31 Module On/Off (TMR1ON Bit) ................................... 31 Oscillator.............................................................. 31, 34 Oscillator Enable (T1OSCEN Bit) .............................. 31 Overflow Enable (TMR1IE Bit) .................................. 16 Overflow Flag (TMR1IF Bit) ....................................... 17 Overflow Interrupt ................................................ 31, 34 Prescaler. See Prescaler, Timer1 Special Event Trigger (CCP) ............................... 34, 41 T1CON Register .................................................. 11, 31 Timing Diagram ......................................................... 84 TMR1H Register.................................................. 11, 31 DS41106C-page 99 PIC16C712/716 TMR1L Register ................................................... 11, 31 Timer2 Block Diagram............................................................ 36 Postscaler. See Postscaler, Timer2 PR2 Register .................................................. 12, 36, 42 Prescaler. See Prescaler, Timer2 T2CON Register .................................................. 11, 36 TMR2 Register ..................................................... 11, 36 TMR2 to PR2 Match Enable (TMR2IE Bit) ................ 16 TMR2 to PR2 Match Flag (TMR2IF Bit) ..................... 17 TMR2 to PR2 Match Interrupt ........................ 36, 37, 42 Timing Diagrams Time-out Sequence on Power-up .............................. 60 Wake-up from Sleep via Interrupt ............................... 65 Timing Diagrams and Specifications.................................. 81 A/D Conversion .......................................................... 87 Brown-out Reset (BOR) ............................................. 83 Capture/Compare/PWM (CCP).................................. 85 CLKOUT and I/O ........................................................ 82 External Clock ............................................................ 81 Oscillator Start-up Timer (OST) ................................. 83 Power-up Timer (PWRT) ........................................... 83 Reset.......................................................................... 83 Timer0 and Timer1..................................................... 84 Watchdog Timer (WDT) ............................................. 83 DS41106C-page 100 W W Register ......................................................................... 62 Wake-up from Sleep .......................................................... 51 Wake-up from Sleep .......................................................... 64 Interrupts ............................................................. 58, 59 MCLR Reset .............................................................. 59 Timing Diagram ......................................................... 65 WDT Reset ................................................................ 59 Watchdog Timer (WDT)............................................... 51, 63 Block Diagram ........................................................... 63 Enable (WDTE Bit) .............................................. 52, 63 Postscaler. See Postscaler, WDT Programming Considerations .................................... 63 RC Oscillator.............................................................. 63 Time-out Period ......................................................... 63 Timing Diagram ......................................................... 83 WDT Reset, Normal Operation ...................... 54, 58, 59 WDT Reset, Sleep ......................................... 54, 58, 59 WWW Address ................................................................ 101 WWW, On-Line Support ...................................................... 3 1999-2013 Microchip Technology Inc. PIC16C712/716 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 1999-2013 Microchip Technology Inc. DS41106C-page 101 PIC16C712/716 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: PIC16C712/716 Literature Number: DS41106C Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS41106C-page 102 1999-2013 Microchip Technology Inc. PIC16C712/716 PIC16C712/716 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X -XX Frequency Temperature Range Range /XX XXX Package Pattern Examples: a) b) Device: PIC16C712(1), PIC16C712T(2);VDD range 4.0V to 5.5V PIC16LC712(1), PIC16LC712T(2);VDD range 2.5V to 5.5V PIC16C716(1), PIC16C716T(2);VDD range 4.0V to 5.5V PIC16LC716(1), PIC16LC716T(2);VDD range 2.5V to 5.5V Frequency Range: 04 20 c) PIC16C716 – 04/P 301 = Commercial temp., PDIP package, 4 MHz, normal VDD limits, QTP pattern #301. PIC16LC712 – 04I/SO = Industrial temp., SOIC package, 200 kHz, Extended VDD limits. PIC16C712 – 20I/P = Industrial temp., PDIP package, 20MHz, normal VDD limits. Note 1: = 4 MHz = 20 MHz 2: Temperature Range: blank I E = 0C to 70C = -40C to +85C = -40C to +125C (Commercial) (Industrial) (Extended) Package: JW SO P SS = = = = Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise) 3: 4: C LC T = CMOS = Low Power CMOS = in tape and reel – SOIC, SSOP packages only. LC extended temperature device is not offered. LC is not offered at 20 MHz Windowed CERDIP SOIC PDIP SSOP * JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of each oscillator type (including LC devices). Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) 1999-2013 Microchip Technology Inc. DS41106C-page 103 PIC16C712/716 NOTES: 1999-2013 Microchip Technology Inc. DS41106C-page 104 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 1999-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620769751 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 1999-2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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