24AA08/24LC08B
8K I2C™ Serial EEPROM
Device Selection Table
Part
Number
24AA08
24LC08B
Note 1:
Description:
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
1.7-5.5
400 kHz(1)
I
2.5-5.5
400 kHz
I, E
The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 A and 1 mA, respectively.
The 24XX08 also has a page write capability for up to
16 bytes of data. The 24XX08 is available in the
standard 8-pin PDIP, surface mount SOIC, TSSOP, 2x3
DFN, 2x3 TDFN and MSOP packages, and is also
available in the 5-lead SOT-23, or 4-lead Chip Scale
package. All packages are Pb-free and RoHS
compliant.
100 kHz for VCC <2.5V.
Features:
• Single Supply with Operation down to 1.7V for
24AA08 Devices, 2.5V for 24LC08B Devices
• Low-Power CMOS Technology:
- Read current 1 mA, max.
- Standby current 1 A, max.
• 2-Wire Serial Interface, I2C™ Compatible
• Schmitt Trigger inputs for Noise Suppression
• Output Slope Control to eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 3 ms, typical
• Self-Timed Erase/Write Cycle
• 16-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, TDFN, MSOP and 5-lead SOT-23, or 4-lead
Chip Scale
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I):
-40°C to +85°C
- Automotive (E): -40°C to +125°C
Block Diagram
HV
Generator
WP
Memory
Control
Logic
I/O
Control
Logic
EEPROM
Array
XDEC
Page
Latches
I/O
SCL
YDEC
SDA
Sense Amp.
R/W Control
VCC
VSS
Package Types
PDIP/MSOP/SOIC/TSSOP
A0
1
8
VCC
A1
2
7
WP
A2
3
6
SCL
VSS
4
5
SDA
Note:
DFN/TDFN
SOT-23-5
SCL
1
Vss
2
SDA
3
5
WP
A0 1
A1 2
A2 3
VSS 4
4
Vcc
CS (Chip Scale)2
8 VCC
7 WP
VCC
1
2
VSS
6 SCL
SCL
3
4
SDA
5 SDA
(Top Down View,
Balls Not Visible)
Pins A0, A1 and A2 are not used by the 24XX08. (No
internal connections).
2002-2012 Microchip Technology Inc.
DS21710K-page 1
24AA08/24LC08B
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
DC CHARACTERISTICS
Param.
Symbol
No.
Characteristic
VCC = +1.7V to +5.5V
Industrial (I):
TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
Min.
Typ.
Max.
Units
Conditions
—
WP, SCL and SDA pins
—
—
—
—
—
D1
VIH
High-level input voltage
0.7 VCC
—
—
V
—
D2
VIL
Low-level input voltage
—
—
0.3 VCC
V
—
D3
VHYS
Hysteresis of Schmitt
Trigger inputs (SDA,
SCL pins)
0.05 VCC
—
—
V
(Note)
D4
VOL
Low-level output voltage
—
—
0.40
V
IOL = 3.0 mA, VCC = 2.5V
D5
ILI
Input leakage current
—
—
±1
A
VIN = .1V to VCC
D6
ILO
Output leakage current
—
—
±1
A
VOUT = .1V to VCC
D7
CIN,
COUT
Pin capacitance
(all inputs/outputs)
—
—
10
pF
VCC = 5.0V (Note)
TA = 25°C, FCLK = 1 MHz
D8
ICC write Operating current
—
0.1
3
mA
VCC = 5.5V, SCL = 400 kHz
D9
ICC
—
0.05
1
mA
—
D10
ICCS
—
—
0.01
—
1
5
A
A
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
Note:
read
Standby current
This parameter is periodically sampled and not 100% tested.
DS21710K-page 2
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
Symbol
No.
Characteristic
VCC = +1.7V to +5.5V
Industrial (I):
TA = -40°C to +85°C
Automotive (E):
TA = -40°C to +125°C
Min.
Typ.
Max.
Units
Conditions
1
FCLK
Clock frequency
—
—
—
—
400
100
kHz
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
2
THIGH
Clock high time
600
4000
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
3
TLOW
Clock low time
1300
4700
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
4
TR
SDA and SCL rise time
(Note 1)
—
—
—
—
300
1000
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
5
TF
SDA and SCL fall time
—
—
300
ns
(Note 1)
6
THD:STA
Start condition hold time
600
4000
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
7
TSU:STA
Start condition setup
time
600
4700
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
8
THD:DAT
Data input hold time
0
—
—
ns
(Note 2)
9
TSU:DAT
Data input setup time
100
250
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
10
TSU:STO
Stop condition setup
time
600
4000
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
11
TAA
Output valid from clock
(Note 2)
—
—
—
—
900
3500
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
12
TBUF
Bus free time: Time the
bus must be free before
a new transmission can
start
1300
4700
—
—
—
—
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
13
TOF
Output fall time from VIH
minimum to VIL
maximum
—
—
—
250
250
ns
2.5V VCC 5.5V
1.7V VCC 2.5V (24AA08)
14
TSP
Input filter spike
suppression
(SDA and SCL pins)
—
—
50
ns
(Notes 1 and 3)
15
TWC
Write cycle time (byte or
page)
—
—
5
ms
—
16
—
Endurance
1M
—
—
Note 1:
2:
3:
4:
cycles 25°C, (Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
2002-2012 Microchip Technology Inc.
DS21710K-page 3
24AA08/24LC08B
FIGURE 1-1:
BUS TIMING DATA
5
4
2
3
SCL
7
SDA
IN
8
6
10
9
14
12
11
SDA
OUT
FIGURE 1-2:
BUS TIMING START/STOP
D3
SCL
6
7
10
SDA
Start
DS21710K-page 4
Stop
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Name
PDIP
SOIC
TSSOP
DFN
TDFN
MSOP
SOT-23
CS
A0
1
1
1
1
1
1
—
—
Not Connected
A1
2
2
2
2
2
2
—
—
Not Connected
A2
3
3
3
3
3
3
—
—
Not Connected
VSS
4
4
4
4
4
4
2
2
Ground
SDA
5
5
5
5
5
5
3
4
Serial Address/Data I/O
SCL
6
6
6
6
6
6
1
3
Serial Clock
WP
7
7
7
7
7
7
5
—
Write-Protect Input
VCC
8
8
8
8
8
8
4
1
+1.7V to 5.5V Power Supply
2.1
Serial Address/Data Input/Output
(SDA)
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an opendrain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 k for 100 kHz, 2 k for 400 kHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
2.2
Serial Clock (SCL)
The SCL input is used to synchronize the data transfer
to and from the device.
2002-2012 Microchip Technology Inc.
2.3
Description
Write-Protect (WP)
The WP pin must be connected to either VSS or VCC.
If tied to VSS, normal memory operation is enabled
(read/write the entire memory 000-3FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
The Chip Scale package does not support the writeprotect feature.
2.4
A0, A1, A2
The A0, A1 and A2 pins are not used by the 24XX08.
They may be left floating or tied to either VSS or VCC.
DS21710K-page 5
24AA08/24LC08B
3.0
FUNCTIONAL DESCRIPTION
The 24XX08 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX08 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
FIGURE 4-1:
SCL
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited, although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occur it will replace data in a first-in firstout (FIFO) fashion.
4.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
Bus Not Busy (A)
Both data and clock lines remain high.
4.2
4.4
The 24XX08 does not generate any
Acknowledge bits if an internal programming cycle is in progress.
The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX08) will leave the data line
high to enable the master to generate the Stop
condition.
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
Start
Condition
Address or
Acknowledge
Valid
(D)
(C)
(A)
SDA
DS21710K-page 6
Data
Allowed
to Change
Stop
Condition
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
5.0
DEVICE ADDRESSING
FIGURE 5-1:
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a four-bit control code. For
the 24XX08, this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the block-select bits (B2, B1, B0). B2 is a “don’t
care” for the 24XX08. They are used by the master
device to select which of the four 256 word-blocks of
memory are to be accessed. These bits are in effect the
three Most Significant bits of the word address.
The last bit of the control byte defines the operation to
be performed. When set to ‘1’ a read operation is
selected. When set to ‘0’ a write operation is selected.
Following the Start condition, the 24XX08 monitors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX08 will select a read or write operation.
Operation
Control
Code
Block Select
R/W
Read
1010
Block Address
1
Write
1010
Block Address
0
FIGURE 5-2:
CONTROL BYTE
ALLOCATION
Read/Write Bit
Block
Select
Bits
Control Code
S
1
0
1
0
x
B1 B0 R/W ACK
Slave Address
Acknowledge Bit
Start Bit
x = “don’t care”
ADDRESS SEQUENCE BIT ASSIGNMENTS
Control Byte
1
0
1
0
X
Control
Code
B1 B0 R/W
Address Low Byte
A
7
•
•
•
•
•
•
A
0
Block
Select
bits
x = “don’t care”
2002-2012 Microchip Technology Inc.
DS21710K-page 7
24AA08/24LC08B
6.0
WRITE OPERATION
6.1
Byte Write
words prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received an
internal write cycle will begin (Figure 6-2).
Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmitted by the master is the word address and will be
written into the Address Pointer of the 24XX08. After
receiving another Acknowledge signal from the
24XX08, the master device will transmit the data word
to be written into the addressed memory location. The
24XX08 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX08 will not
generate Acknowledge signals (Figure 6-1).
6.2
Note:
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX08 in the same way as
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX08, which are temporarily stored in the onchip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order Address
Pointer bits are internally incremented by ‘1’. The
higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
FIGURE 6-1:
6.3
Page write operations are limited to writing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page-size’) and end at addresses that
are integer multiples of [page size – 1]. If
a Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
Write Protection
The WP pin allows the user to write-protect the entire
array (000-3FF) when the pin is tied to VCC. If the pin is
tied to VSS the write protection is disabled.
The Chip Select package does not support the writeprotect feature.
BYTE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1 0 1 0 X B1 B0 0
Control
Byte
Bus Activity
Block
Select
Bits
x = “don’t care”
FIGURE 6-2:
S
T
O
P
Data
P
A
C
K
A
C
K
A
C
K
PAGE WRITE
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1 0 1 0 X B1B0 0
Word
Address (n)
Control
Byte
Bus Activity
x = “don’t care”
DS21710K-page 8
Word
Address
Block
Select
Bits
Data (n + 1)
Data (n)
S
T
O
P
Data (n + 15)
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 7-1 for a flow diagram of
this operation.
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
2002-2012 Microchip Technology Inc.
DS21710K-page 9
24AA08/24LC08B
8.0
READ OPERATION
8.3
Sequential Read
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
Sequential reads are initiated in the same way as a
random read, except that once the 24XX08 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX08 to transmit the next sequentiallyaddressed 8-bit word (Figure 8-3).
8.1
To provide sequential reads, the 24XX08 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
Current Address Read
The 24XX08 contains an address counter that maintains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX08 issues an acknowledge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX08 discontinues transmission
(Figure 8-1).
8.2
8.4
Noise Protection
The 24XX08 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX08 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointer is set. The master then issues
the control byte again, but with the R/W bit set to a ‘1’.
The 24XX08 will then issue an acknowledge and transmit the 8-bit data word. The master will not acknowledge the transfer, but does generate a Stop condition
and the 24XX08 will discontinue transmission
(Figure 8-2).
FIGURE 8-1:
CURRENT ADDRESS READ
Bus Activity
Master
S
T
A
R
T
SDA Line
S 1 0 1 0 x B1 B0 1
Bus Activity
x = “don’t care”
DS21710K-page 10
Control
Byte
Block
Select
Bits
S
T
O
P
Data (n)
P
A
C
K
N
o
A
C
K
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
FIGURE 8-2:
RANDOM READ
Bus Activity
Master
SDA Line
S
T
Control
A
Byte
R
T
S 1 0 1 0 X B1B00
Control
Byte
A
C
K
A
Block C
Select K
Bits
x = “don’t care”
FIGURE 8-3:
Bus Activity
Master
SDA Line
Bus Activity
S
T
O
P
P
Data (n)
S 1 0 1 0 X B1B0 1
A
Block C
Select K
Bits
Bus Activity
S
T
A
R
T
Word
Address (n)
N
o
A
C
K
SEQUENTIAL READ
Control
Byte
Data (n)
Data (n + 1)
Data (n + 2)
S
T
O
P
Data (n + X)
P
1
A
C
K
2002-2012 Microchip Technology Inc.
A
C
K
A
C
K
A
C
K
N
o
A
C
K
DS21710K-page 11
24AA08/24LC08B
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (3.90 mm)
XXXXXXXX
T/XXYYWW
NNN
8-Lead TSSOP
24LC08B
I/P e3 13F
0527
Example:
24LC08BI
SN e3 0527
13F
Example:
XXXX
4L08
TYWW
I527
NNN
13F
8-Lead MSOP
Example:
XXXXXT
YWWNNN
4L8BI
52713F
5-Lead SOT-23
Example:
XXNN
DS21710K-page 12
Example:
M43F
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
8-Lead 2x3 DFN
Example:
XXX
YWW
NN
244
527
13
8-Lead 2x3 TDFN
Example:
XXX
YWW
NN
A44
527
13
Example:
4-Lead Chip Scale
XN
43
1st Line Marking
MSOP
SOT-23
DFN
TDFN
Part No.
TSSOP
24AA08
4A08
4A08T
B4NN
—
241
—
A41
—
24LC08B
4L08
4L8BT
M4NN
N4NN
244
245
A44
A45
Legend: XX...X
T
Y
YY
WW
NNN
e3
I-Temp
E-Temp
I-Temp
E-Temp
I-Temp
E-Temp
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2002-2012 Microchip Technology Inc.
DS21710K-page 13
24AA08/24LC08B
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
6&!
'!
9'&!
7"')
%!
7,8.
7
7
7:
;
<
&
&
&
=
=
##44!!
-
1!&
&
=
=
"#&
"#>#&
.
-
-
##4>#&
.
<
: 9&
-<
-?
&
&
9
-
9#4!!
<
)
?
)
<
1
=
=
69#>#&
9
*9#>#&
: *+
1,
-
!"#$%&"' ()"&'"!&)
&#*&&&#
+%&,&!&
- '!
!#.#
&"#'
#%!
&"!
!
#%!
&"!
!!
&$#/!#
'!
#&
.0
1,21!'!
&$& "!
**&
"&&
!
* ,<1
DS21710K-page 14
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21710K-page 15
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 16
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
!
""#$%& !'
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
2002-2012 Microchip Technology Inc.
DS21710K-page 17
24AA08/24LC08B
() )"* !
(+%+(
!
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
D
N
E
E1
NOTE 1
1
2
b
e
c
A
φ
A2
A1
L
L1
6&!
'!
9'&!
7"')
%!
99..
7
7
7:
;
<
&
: 8&
=
?1,
=
##44!!
<
&#
%%
=
: >#&
.
##4>#&
.
-
?1,
##49&
-
-
3
&9&
9
?
3
&&
9
.3
3
&
R
=
<R
9#4!!
=
9#>#&
)
=
-
!"#$%&"' ()"&'"!&)
&#*&&&#
'!
!#.#
&"#'
#%!
&"!
!
#%!
&"!
!!
&$#''!#
- '!
#&
.0
1,2 1!'!
&$& "!
**&
"&&
!
.32 %'!
("!"*&
"&&
(%
%
'&
"
!!
* ,<?1
DS21710K-page 18
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21710K-page 19
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 20
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21710K-page 21
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 22
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
,
!
(""!( !(-
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
b
N
E
E1
3
2
1
e
e1
D
A2
A
c
φ
A1
L
L1
6&!
'!
9'&!
7"')
%!
99..
7
7:
;
7
9#&
1,
:"&!#9#&
: 8&
=
##44!!
<
=
-
&#
%%
=
: >#&
.
=
-
##4>#&
.
-
=
<
: 9&
=
-
1,
3
&9&
9
=
?
3
&&
9
-
=
<
3
&
R
=
-R
9#4!!
<
=
?
9#>#&
)
=
'!
!#.#
&"#'
#%!
&"!
!
#%!
&"!
!!
&$#''!#
'!
#&
.0
1,2 1!'!
&$& "!
**&
"&&
!
* ,1
2002-2012 Microchip Technology Inc.
DS21710K-page 23
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 24
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
.
$*/0'-11%&.
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
2
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
6&!
'!
9'&!
7"')
%!
99..
7
7
7:
;
<
&
: 8&
<
&#
%%
,
&&4!!
-
.3
: 9&
1,
: >#&
.
.$
!##9&
-
=
.$
!##>#&
.
=
)
-
,
&&9&
9
-
,
&&&
.$
!##
U
=
=
,
&&>#&
1,
-1,
!"#$%&"' ()"&'"!&)
&#*&&&#
4' '
$
!#&)!&#!
- 4!!*!"&#
'!
#&
.0
1,2 1!'!
&$& "!
**&
"&&
!
.32 %'!
("!"*&
"&&
(%
%
'&
"
!!
* ,-,
2002-2012 Microchip Technology Inc.
DS21710K-page 25
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 26
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21710K-page 27
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 28
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
.
$*/0-11%2,(.
3
&'
!&"&4#*!(!!&
4%&
&#&
&&255***'
'54
2002-2012 Microchip Technology Inc.
DS21710K-page 29
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 30
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc.
DS21710K-page 31
24AA08/24LC08B
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21710K-page 32
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
APPENDIX A:
REVISION HISTORY
Revision C (12/2003)
Corrections to Section 1.0, Electrical Characteristics.
Section 9.1, 24LC08B standard marking code.
Revision D (02/2005)
Added DFN package.
Revision E (09/2005)
Revised Figure 3-1: Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 72 Random Read; Figure 7-3 Sequential Read; 8.3
Write-Protect (000-3FF).
Revision F (02/2007)
Updated Device Selection Table; Features section;
Changed 1.8V to 1.7V throughout document; Revised
Electrical Characteristics Ambient Temperature;
Replaced Package Drawings; Revised Product ID
System.
Revison G (02/2007)
Replaced Package Drawings.
Revision H (03/2008)
Added TDFN package.
Revision J (02/2009)
Moved Pin Descriptions to Section 2.0, renumbered
remaining sections. Added Figure 5-2.
Revision K (03/2012)
Added Chip Scale package; Revised Table 1-1, Table
2-1; Product ID System.
2002-2012 Microchip Technology Inc.
DS21710K-page 33
24AA08/24LC08B
NOTES:
DS21710K-page 34
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2002-2012 Microchip Technology Inc.
DS21710K-page 35
24AA08/24LC08B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
Technical Publications Manager
RE:
Reader Response
Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
Device: 24AA08/24LC08B
Literature Number: DS21710K
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21710K-page 36
2002-2012 Microchip Technology Inc.
24AA08/24LC08B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
X
Note 1:
Examples:
Temperature Package
Range
I2C
24AA08:
24AA08T:
= 1.7V, 8 Kbit
Serial EEPROM
= 1.7V, 8 Kbit I2C Serial EEPROM
(Tape and Reel)
24LC08B: = 2.5V, 8 Kbit I2C Serial EEPROM
24LC08BT: = 2.5V, 8 Kbit I2C Serial EEPROM
(Tape and Reel)
Temperature I
Range:
E
Package:
/XX
=
=
-40°C to +85°C
-40°C to +125°C
P
=
SN
=
ST
=
MC =
MS =
OT
=
MNY(1)=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic DFN (2x3x0.90mm body), 8-lead
Plastic MSOP (Micro Small Outline), 8-lead
Plastic SOT-23, 5-lead (Tape and Reel only)
Plastic Dual Flat (TDFN), No lead package,
2x3 mm body, 8-lead
CS16K(2)= Chip Scale (CS), 4-lead (I-temp, “AA”, Tape
and Reel only)
a)
24AA08-I/P: Industrial Temperature,1.7V,
PDIP package
b)
24AA08-I/SN: Industrial Temperature,1.7V,
SOIC package
c)
24AA08T-I/OT: Industrial Temperature,
1.7V, SOT-23 package, Tape and Reel
d)
24AA08T-I/CS16K: Industrial Temperature,
1.7V, CS package, Tape and Reel
e)
24LC08B-I/P: Industrial Temperature, 2.5V,
PDIP package
f)
24LC08B-E/SN: Automotive Temp.,2.5V
SOIC package
g)
24LC08BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, Tape and Reel
“Y” indicates a Nickel, Palladium, Gold (NiPdAu) finish.
2002-2012 Microchip Technology Inc.
DS21710K-page 37
24AA08/24LC08B
NOTES:
DS21710K-page 38
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620761007
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21710K-page 39
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21710K-page 40
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/29/11
2002-2012 Microchip Technology Inc.