MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision Datasheet

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com
Vishay Beyschlag
Precision Thin Film Chip Resistors
FEATURES
• Rated dissipation P70 up to 0.4 W for size 1206
• AEC-Q200 qualified
• Approved to EN 140401-801
• Superior temperature cycling robustness
• Sulfur resistance verified according to
ASTM B 809
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Automotive-grade MC AT precision thin film chip resistors
are the perfect choice for most fields of modern
precision electronics where reliability and stability is of major
concern. Typical applications include automotive,
telecommunication,
industrial,
medical
equipment,
precision test, and measuring equipment.
APPLICATIONS
• Automotive
• Telecommunication
• Industrial equipment
• Medical equipment
TECHNICAL SPECIFICATIONS
DESCRIPTION
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
0402
0603
0805
1206
Metric size code
RR1005M
RR1608M
RR2012M
RR3216M
Resistance range
47  to 221 k
47  to 511 k
47  to 1 M
47  to 1 M
Imperial size
Resistance tolerance
± 0.1 %
Temperature coefficient
± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
Rated dissipation P70 (1)
Operating voltage, Umax. ACRMS or DC
0.100 W
0.125 W
0.200 W
0.400 W
50 V
75 V
150 V
200 V
Permissible film temperature, F max. (1)
155 °C
Operating temperature range
-55 °C to 155 °C
Insulation voltage:
1 min; Uins
75 V
100 V
200 V
300 V
Continuous
75 V
75 V
75 V
75 V
Failure rate: FITobserved
 0.1 x 10-9/h
Note
(1) Please refer to APPLICATION INFORMATION below.
Revision: 03-Jun-15
Document Number: 28785
1
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APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow
support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is
not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder
joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and
temperature limits in order to maintain a desired stability.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
OPERATION MODE
Rated dissipation, P70
STANDARD
POWER
MCS 0402 AT
0.063 W
0.100 W
MCT 0603 AT
0.100 W
0.125 W
MCU 0805 AT
0.125 W
0.200 W
MCA 1206 AT
0.250 W
0.400 W
-55 °C to 125 °C
-55 °C to 155 °C
125 °C
155 °C
MCS 0402 AT
47  to 221 k
47  to 221 k
MCT 0603 AT
47  to 511 k
47  to 511 k
MCU 0805 AT
47  to 1 M
47  to 1 M
MCA 1206 AT
47  to 1 M
47  to 1 M
1000 h
 0.1 %
 0.2 %
8000 h
 0.2 %
 0.4 %
225 000 h
 0.6 %
-
Operating temperature range
Permissible film temperature, F max.
Max. resistance change at P70
for resistance range, R/R after:
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
TOLERANCE
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
± 15 ppm/K
47  to 100 k
47  to 10 k
± 25 ppm/K
47  to 511 k
± 0.1 %
47  to 221 k
± 10 ppm/K
47  to 22.1 k
± 25 ppm/K
47  to 1 M
± 15 ppm/K
± 0.1 %
47  to 332 k
± 10 ppm/K
47  to 33.2 k
± 25 ppm/K
47  to 1 M
± 15 ppm/K
± 10 ppm/K
Revision: 03-Jun-15
± 0.1 %
± 10 ppm/K
± 15 ppm/K
E-SERIES
47  to 221 k
± 25 ppm/K
MCS 0402 AT
RESISTANCE
± 0.1 %
47  to 511 k
E24; E192
E24; E192
E24; E192
E24; E192
47  to 43.2 k
Document Number: 28785
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PACKAGING
TYPE / SIZE
CODE
QUANTITY
E1
1000
E0
10 000
P1
1000
P5
5000
PW
20 000
P1
1000
P5
5000
PW
20 000
P1
1000
P5
5000
CARRIER TAPE
MCS 0402 AT
WIDTH
PITCH
REEL
DIAMETER
8 mm
2 mm
180 mm/7"
8 mm
4 mm
180 mm/7"
MCT 0603 AT
330 mm/13"
Paper tape acc.
IEC 60286-3
type 1a
180 mm/7"
MCU 0805 AT
8 mm
4 mm
330 mm/13"
MCA 1206 AT
8 mm
4 mm
180 mm/7"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MCT0603MD4641BPW00
M
C
T
0
6
0
3
M
D
4
6
4
1
B
P
W
0
TYPE/SIZE
VERSION
TCR
RESISTANCE
TOLERANCE
PACKAGING
MCS0402
MCT0603
MCU0805
MCA1206
M = AT
(Automotive)
F = ± 10 ppm/K
E = ± 15 ppm/K
D = ± 25 ppm/K
3 digit value
1 digit multiplier
B = ± 0.1 %
P1
P5
PW
E0
E1
Multiplier
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
0
Product Description: MCT 0603-25 0.1 % AT PW 4K64
MCT
0603
-25
0.1 %
AT
PW
4K64
TYPE
SIZE
TCR
TOLERANCE
VERSION
PACKAGING
RESISTANCE
MCS
MCT
MCU
MCA
0402
0603
0805
1206
± 10 ppm/K
± 15 ppm/K
± 25 ppm/K
± 0.1 %
AT =
Automotive
P1
P5
PW
E0
E1
4K64 = 4.64 k
Note
• Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION.
Revision: 03-Jun-15
Document Number: 28785
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (Al2O3) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure matte tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with
potential risk of early field failures (feasible for R  10 ).
Only accepted products are laid directly into the paper tape
in accordance with IEC 60286-3 Type 1a (1).
ASSEMBLY
Vishay Beyschlag
All products comply with the IEC 62474, Material
Declaration for Products of and for the Electrotechnical
Industry.
The dedicated database (2), that lists declarable substances,
ensures full compliance with the following directives:
• 2000/53/EC End of Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series. The detail
specification refers to the climatic categories 55/125/56,
which relates to the “standard operation mode” of this
datasheet.
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
Conformity is attested by the use of the CECC logo (
)
as the mark of conformity on the package label. For
extended resistance ranges (> 100 k, > 47  for 0402) and
TCR ± 10 ppm/K the certification according to DIN
EN 140401-801:2008-05 is pending.
The resistors are RoHS-compliant; the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
The resistors are qualified according to AEC-Q200.
Vishay
Beyschlag
has
achieved
“Approval
of
Manufacturer” in accordance with IECQ 03-1. The release
certificate for “Technology Approval Schedule” in
accordance with CECC 240001 based on IECQ 03-3-1 is
granted for the Vishay Beyschlag manufacturing process.
RELATED PRODUCTS
For more information about products with higher operation
temperature please refer to the professional datasheet
(www.vishay.com/doc?28760).
Chip resistor arrays may be used in sensing applications
or
precision
amplifiers
where
close
matching
between multiple resistors is necessary. Please refer to the
ACAS AT - Precision datasheet (www.vishay.com/doc?28770).
MC AT Precision is also available with gold termination for
conductive gluing. Please refer to the datasheet
(www.vishay.com/doc?28877).
For high power and high temperature applications
MCW 0406 AT wide terminal thin film chip resistors offer
extremely high power ratings in compact 0406 case size and
extraordinary temperature cycling robustness.
Please refer to the datasheets for
precision (www.vishay.com/doc?28847) and
professional (www.vishay.com/doc?28796) specification.
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) IEC 62474 database can be found at: http://std.iec.ch/iec62474.
Revision: 03-Jun-15
Document Number: 28785
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com
Vishay Beyschlag
Rated Power in %
FUNCTIONAL PERFORMANCE
Standard Mode
Power Mode
100
80
60
40
20
0
- 55
0
50
70
100
125
155
180
Ambient Temperature in °C
For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION, above
Current Noise A1
Derating
10
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
1
µV/V
0.1
0.01
10 Ω
100 Ω
1 kΩ
10 kΩ
100 kΩ
1 MΩ
Resistance Value R
Current noise A1 in accordance with IEC 60195
Current Noise
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The components are approved under the IECQ-CECC
quality assessment system for electronic components.
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
Revision: 03-Jun-15
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
Document Number: 28785
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TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER (2)
Stability for product types:
MCS 0402 AT
47  to 221 k
MCT 0603 AT
47  to 511 k
MCU 0805 AT
47  to 1 M
MCA 1206 AT
47  to 1 M
4.5
-
Resistance
4.8.4.2
-
Temperature
coefficient
At (20 / -55 / 20) °C and
(20 / 155 / 20) °C
Endurance at 70 °C:
Standard operation mode
U = P 70 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
Endurance at 70 °C:
Power operation mode
U = P 70 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
-
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
± (0.15 % R + 0.02 )
± (0.3 % R + 0.02 )
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.02 )
67 (Cy)
Damp heat,
steady state,
accelerated
Standard operation mode
(85 ± 2) °C
(85 ± 5) % RH
U = 0.1 x P 70 x R ;
U  0.3 x Umax.; 1000 h
± (0.5 % R + 0.05 )
4.25.1
-
4.25.3
4.24
4.37
± 0.1 % R
± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K
± (0.1 % R + 0.02 )
± (0.2 % R + 0.02 )
± (0.2 % R + 0.02 )
± (0.4 % R + 0.05 )
Climatic sequence:
Standard operation mode
4.23
4.23.2
2 (Ba)
Dry heat
125 °C; 16 h
4.23.3
30 (Db)
Damp heat, cyclic
55 °C; 24 h;  90 % RH;
1 cycle
4.23.4
1 (Aa)
Cold
-55 °C; 2 h
4.23.5
13 (M)
Low air pressure
8.5 kPa; 2 h; (25 ± 10) °C
4.23.6
30 (Db)
Damp heat, cyclic
55 °C; 24 h;  90 % RH;
5 cycles
4.23.7
-
DC load
1 (Aa)
Storage at low
temperature
-55 °C; 2 h
± (0.05 % R + 0.01 )
Rapid change of
temperature
30 min at -55 °C and
30 min at 155 °C;
1000 cycles
± (0.25 % R + 0.02 )
Extended rapid change
of temperature
30 min at -40 °C;
30 min at 125 °C (3);
MCS 0402 AT: 3000 cycles
MCT 0603 AT: 2000 cycles
MCU 0805 AT: 1500 cycles
MCA 1206 AT: 1000 cycles
± (0.25 % R + 0.05 );
( 50 % of initial shear force)
Short time overload:
Standard operation mode
U = 2.5 x P 70 x R or
U = 2 × Umax.;
whichever is the less severe;
5s
± (0.05 % R + 0.01 )
-
4.19
4.13
Revision: 03-Jun-15
14 (Na)
-
U=
± (0.25 % R + 0.02 )
P 70 x R  Umax.; 1 min
Document Number: 28785
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TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER (2)
Stability for product types:
4.27
MCS 0402 AT
47  to 221 k
MCT 0603 AT
47  to 511 k
MCU 0805 AT
47  to 1 M
MCA 1206 AT
47  to 1 M
Severity no. 4:
U = 10 x P 70 x R or
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
-
Single pulse high
voltage overload:
Standard operation mode
-
Periodic electric
overload:
Standard operation mode
15 x P 70 x R or
U = 2 x Umax.
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 0.05)
Electro Static Discharge
(Human Body Model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402 AT: 500 V
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
± (0.5 % R + 0.05)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude  1.5 mm or
200 m/s2; 7.5 h
± (0.05 % R + 0.01)
no visible damage
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (95 % covered);
no visible damage
± (0.25 % R + 0.05)
U=
4.39
4.40
-
4.22
6 (Fc)
4.17.2
58 (Td)
Solderability
4.18.2
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.05 % R + 0.01)
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32
21 (Ue3)
Shear (adhesion)
4.33
21 (Ue1)
Substrate bending
4.7
-
4.35
-
RR1005M and RR1608M; 9 N
RR2012M and RR3216M; 45 N
No visible damage
Depth 2 mm, 3 times
± (0.05 % R + 0.01)
no visible damage;
no open circuit in bent position
Voltage proof
URMS = Uins; (60 ± 5) s
No flashover or breakdown
Flammability
Needle flame test; 10 s
No burning after 30 s
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their
respective test conditions.
(3) Tested on a 4-layer printed circuit board with SAC micro alloy.
Revision: 03-Jun-15
Document Number: 28785
7
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DIMENSIONS
Tt
W
WT
H
Tb
L
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
WT
(mm)
Tt
(mm)
Tb
(mm)
MASS
(mg)
MCS 0402 AT
0.32 ± 0.05
1.0 ± 0.05
0.5 ± 0.05
> 75 % of W
0.2 + 0.1/- 0.15
0.2 ± 0.1
0.6
MCT 0603 AT
0.45 + 0.1/- 0.05
1.55 ± 0.05
0.85 ± 0.1
> 75 % of W
0.3 + 0.15/- 0.2
0.3 + 0.15/- 0.2
1.9
MCU 0805 AT
0.52 ± 0.1
2.0 ± 0.1
1.25 ± 0.15
> 75 % of W
0.4 + 0.1/- 0.2
0.4 + 0.1/- 0.2
4.6
MCA 1206 AT
0.55 ± 0.1
3.2 + 0.1/- 0.2
1.6 ± 0.15
> 75 % of W
0.5 ± 0.25
0.5 ± 0.25
9.2
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE / SIZE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 AT
-
-
-
-
0.35
0.55
0.55
1.45
MCT 0603 AT
0.55
1.10
1.10
2.75
0.65
0.70
0.95
2.05
MCU 0805 AT
0.80
1.25
1.50
3.30
0.90
0.90
1.40
2.70
MCA 1206 AT
1.40
1.50
1.90
4.40
1.50
1.15
1.75
3.80
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depend on
board materials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards
IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly
influenced by many other parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation
mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and
adjacent conductor areas.
Revision: 03-Jun-15
Document Number: 28785
8
For technical questions, contact: [email protected]
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Revision: 02-Oct-12
1
Document Number: 91000