MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional Datasheet

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
Vishay Beyschlag
Professional Thin Film Chip Resistors
FEATURES
• Operating temperature up to 175 °C for 1000 h
• Rated dissipation P85 up to 0.4 W for size 1206
• AEC-Q200 qualified
• Approved to EN 140401-801
• Sulfur resistance verified according to
ASTM B 809
• Superior temperature cycling robustness

Automotive grade MC AT professional thin film chip
resistors are the perfect choice for most fields of modern
professional electronics where reliability and stability is of
major concern. Typical applications include automotive,
telecommunication,
industrial,
medical
equipment,
precision test, and measuring equipment.
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Automotive
• Telecommunication
• Medical equipment
• Industrial equipment
TECHNICAL SPECIFICATIONS
DESCRIPTION
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
0402
0603
0805
1206
Metric size code
RR1005M
RR1608M
RR2012M
RR3216M
Resistance range
2.43  to 221 k; 0 
1  to 511 k; 0 
1  to 1 M; 0 
1  to 1 M; 0 
Imperial size
Resistance tolerance
± 1 %, ± 0.5 %
Temperature coefficient
± 50 ppm/K; ± 25 ppm/K
Rated dissipation P85 (1)
Operating voltage, Umax. ACRMS or DC
0.100 W
0.150 W
0.200 W
0.400 W
50 V
75 V
150 V
200 V
200 V
300 V
Permissible film temperature, F max. (1)
175 °C
Operating temperature range (1)
-55 °C to 175 °C
Insulation voltage:
1 min; Uins
75 V
Failure rate: FITobserved
100 V
 0.1 x 10-9/h
Note
(1) Please refer to APPLICATION INFORMATION below.
Revision: 29-Sep-15
Document Number: 28760
1
For technical questions, contact: [email protected]
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APPLICATION INFORMATION
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow
support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is
not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder
joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime. At the maximum permissible film temperature of 175 °C the useful lifetime is specified for 1000 h. The
designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order
to maintain a desired stability.
MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION
STANDARD
POWER
ADVANCED
TEMPERATURE
P70
P70
P85
MCS 0402 AT
0.063 W
0.100 W
0.100 W
MCT 0603 AT
0.100 W
0.125 W
0.150 W
MCU 0805 AT
0.125 W
0.200 W
0.200 W
OPERATION MODE
Rated dissipation
MCA 1206 AT
0.250 W
0.400 W
0.400 W
-55 °C to 125 °C
-55 °C to 155 °C
-55 °C to 175 °C
125 °C
155 °C
175 °C
MCS 0402 AT
2.43  to 221 k
2.43  to 221 k
2.43  to 221 k
MCT 0603 AT
1  to 511 k
1  to 511 k
1  to 511 k
MCU 0805 AT
1  to 1 M
1  to 1 M
1  to 1 M
MCA 1206 AT
1  to 1 M
1  to 1 M
1  to 1 M
1000 h
 0.15 %
 0.3 %
 0.5 %
8000 h
 0.25 %
 0.5 %
-
225 000 h
 1.0 %
-
-
TOLERANCE
RESISTANCE
E-SERIES
Operating temperature range
Permissible film temperature, F max.
Max. resistance change at rated
dissipation for resistance range,
|R/R| after:
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
± 50 ppm/K
±1%
2.43  to 221 k
E24; E96
MCS 0402 AT
± 25 ppm/K
± 0.5 %
10  to 221 k
E24; E192
Jumper (1), Imax. = 0.63 A
 20 m
0
-
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
± 50 ppm/K
±1%
1  to 511 k
E24; E96
± 25 ppm/K
± 0.5 %
10  to 511 k
E24; E192
Jumper (1), Imax. = 1 A
 20 m
0
-
± 50 ppm/K
±1%
1  to 1 M
E24; E96
± 25 ppm/K
± 0.5 %
10  to 1 M
E24; E192
Jumper (1), Imax. = 1.5 A
 20 m
0
-
± 50 ppm/K
±1%
1  to 1 M
E24; E96
± 25 ppm/K
± 0.5 %
10  to 1 M
E24; E192
 20 m
0
-
Jumper
(1),
Imax. = 2 A
Note
(1) The temperature coefficient of resistance (TCR) is not specified for 0  jumpers.
Revision: 29-Sep-15
Document Number: 28760
2
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PACKAGING
TYPE / SIZE
CODE
QUANTITY
MCS 0402 AT
E0
P5
PACKAGING STYLE
WIDTH
PITCH
PACKAGING DIMENSIONS
10 000
8 mm
2 mm
Ø 180 mm/7"
5000
8 mm
Ø 180 mm/7"
MCT 0603 AT
4 mm
PW
20 000
P5
5000
8 mm
Tape and reel
cardboard tape acc.
IEC 60286-3 Type 1a
Ø 330 mm/13"
8 mm
Ø 180 mm/7"
MCU 0805 AT
4 mm
PW
20 000
8 mm
P5
5000
8 mm
MCA 1206 AT
Ø 330 mm/13"
4 mm
Ø 180 mm/7"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: MCT0603MD4641DPW00
Part Number: MCT0603MZ0000ZP500
M
C
T
0
6
0
3
M
D
4
6
4
1
D
P
W
0
TYPE / SIZE
VERSION
TCR
RESISTANCE
TOLERANCE
PACKAGING
MCS0402
MCT0603
MCU0805
MCA1206
M = AT
(automotive)
D = ± 25 ppm/K
C = ± 50 ppm/K
Z = jumper
3 digit value
1 digit multiplier
D = ± 0.5 %
F=±1%
Z = jumper
E0
P5
PW
0
Multiplier
8 = *10-2
9 = *10-1
0 = *100
1 = *101
2 = *102
3 = *103
4 = *104
0000 = jumper
Product Description: MCT 0603-25 0.5 % AT PW 4K64
Product Description: MCT 0603 AT P5 0R0
MCT
0603
-25
0.5 %
AT
PW
4K64
TYPE
SIZE
TCR
TOLERANCE
VERSION
PACKAGING
RESISTANCE
MCS
MCT
MCU
MCA
0402
0603
0805
1206
± 25 ppm/K
± 50 ppm/K
± 0.5 %
±1%
AT = automotive
E0
P5
PW
4K64 = 4.64 k
0R0 = jumper
Note
• Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION.
Revision: 29-Sep-15
Document Number: 28760
3
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DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of special metal alloy is deposited on a
high grade ceramic substrate (Al2O3) and conditioned to
achieve the desired temperature coefficient. Specially
designed inner contacts are deposited on both sides. A
special laser is used to achieve the target value by smoothly
cutting a meander groove in the resistive layer without
damaging the ceramics. The resistor elements are covered
by a unique protective coating designed for electrical,
mechanical and climatic protection. The terminations
receive a final pure matte tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure and optical inspection
performed on 100 % of the individual chip resistors. This
includes full screening for the elimination of products with
potential risk of early field failures (feasible for R  10 ).
Only accepted products are laid directly into the paper tape
in accordance with IEC 60286-3 Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant; the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
The products do not contain any of the banned substances
as per IEC 62474, GADSL, or the SVHC list, see
www.vishay.com/how/leadfree.
Vishay Beyschlag
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are approved within the IECQ-CECC Quality
Assessment System for Electronic Components to the detail
specification EN 140401-801 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series. The detail
specification refers to the climatic categories 55/125/56,
which relates to the “standard operation mode” of this
datasheet.
Conformity is attested by the use of the CECC logo (
) as
the mark of conformity on the package label.
The resistors are qualified according to AEC-Q200.
Vishay
Beyschlag
has
achieved
“Approval
of
Manufacturer” in accordance with IECQ 03-1. The release
certificate for “Technology Approval Schedule” in
accordance with CECC 240001 based on IECQ 03-3-1 is
granted for the Vishay Beyschlag manufacturing process.
RELATED PRODUCTS
For more information about products with better TCR and
tighter tolerance please refer to the precision datasheet:
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT
- Precision (www.vishay.com/doc?28785).
Chip resistor arrays may be used in sensing applications or
precision amplifiers where close matching between multiple
resistors is necessary. Please refer to datasheet:
ACAS 0606 AT, ACAS 0612 AT - Precision 
(www.vishay.com/doc?28770).
MC AT series is also available with gold termination for
conductive gluing. Please refer to datasheet:
MC ATAU - Precision (www.vishay.com/doc?28877).
For high power and high temperature applications
MCW 0406 AT wide terminal thin film chip resistors offer
extremely high power ratings in compact 0406 case size and
extraordinary temperature cycling robustness. Please refer
to the datasheets:
MCW 0406 AT - Precision
(www.vishay.com/doc?28847) and
MCW 0406 AT - Professional
(www.vishay.com/doc?28796).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474.
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at
www.gadsl.org.
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table.
Revision: 29-Sep-15
Document Number: 28760
4
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Applicable Dissipation Pϑamb/P70
FUNCTIONAL PERFORMANCE
Standard Mode
Power Mode
%
Advanced Temperature Mode
100
80
60
40
20
0
- 50
0
50
70
85 100
125
155
175
Ambient Temperature in °C
For permissible resistance change please refer to table MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION, above
MCS 0402 AT
^
Pulse Load Pmax.
Derating
100
MCT 0603 AT
MCU 0805 AT
W
MCA 1206 AT
10
1
0.1
10 µs
100 µs
1 ms
10 ms
100 ms
1s
10 s
Pulse Duration t i
Maximum pulse load, single pulse; applicable if P  0 and n  1000 and Û  Ûmax.;
for permissible resistance change equivalent to 8000 h operation in standard operation mode
MCS 0402 AT
^
Continuous Pulse Load Pmax.
Single Pulse
100
MCT 0603 AT
MCU 0805 AT
W
MCA 1206 AT
10
1
0.1
10 µs
100 µs
1 ms
10 ms
100 ms
1s
10 s
Pulse Duration t i
Maximum pulse load, continuous pulses; applicable if P  P (amb) and Û  Ûmax.;
for permissible resistance change equivalent to 8000 h operation in standard operation mode
Continuous Pulse
Revision: 29-Sep-15
Document Number: 28760
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Pulse Voltage Ûmax.
FUNCTIONAL PERFORMANCE
1 kV
100 V
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
10 V
10 µs
100 µs
1 ms
10 ms
100 ms
1s
10 s
Pulse Duration t i
Maximum pulse voltage, single and continuous pulses; applicable if Pˆ  Pˆ max.;
for permissible resistance change equivalent to 8000 h operation in standard operation mode
Test Voltage
Pulse Voltage
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
10 kV
1 kV
100 V
10 V
10 Ω
100 Ω
1 kΩ
10 kΩ
100 kΩ
1 MΩ
Resistance Value R
Pulse load rating in accordance with EN 60115-1 clause 4.27; 1.2 μs/50 μs; 5 pulses at 12 s interval;
for permissible resistance change ± (0.5 % R + 0.05 )
Test Voltage
1.2/50 Pulse
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
10 kV
1 kV
100 V
10 V
10 Ω
100 Ω
1 kΩ
10 kΩ
100 kΩ
1 MΩ
Resistance Value R
Pulse load rating in accordance with EN 60115-1 clause 4.27; 10 μs/700 μs;
10 pulses at 1 min intervals; for permissible resistance change ± (0.5 % R + 0.05 )
10/700 Pulse
Revision: 29-Sep-15
Document Number: 28760
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FUNCTIONAL PERFORMANCE
Current Noise Voltage Ratio
3
MCS 0402 AT
MCT 0603 AT
MCU 0805 AT
MCA 1206 AT
1
µV/V
0.1
0.01
1Ω
10 Ω
100 Ω
1 kΩ
10 kΩ
100 kΩ
1 MΩ
Resistance Value R
In accordance with IEC 60195
|Z |/R
Current Noise Voltage Ratio
2.0
1.5
1.0
MCT 0603 AT
MCU 0805 AT
0.5
0.1
0.3
1
3
10 GHz 20
Frequency f
|Z|/R for 49.9  chip resistor
RF-Behavior
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-801, detail specification
IEC 60068-2-xx, test methods
The components are approved under the IECQ-CECC
quality assessment system for electronic components.
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-801. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
Revision: 29-Sep-15
The testing also covers most of the requirements specified
by EIA/ECA-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on printed circuit
boards in accordance with EN 60115-8, 2.4.2, unless
otherwise specified.
Document Number: 28760
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TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.5 OR BETTER
Stability for product types:
MCS 0402 AT
2.43  to 221 k
MCT 0603 AT
1  to 511 k
MCU 0805 AT
1  to 1 M
MCA 1206 AT
1  to 1 M
4.5
-
Resistance
4.8
-
Temperature
coefficient
At (20/-55/20) °C and
(20/155/20) °C
Endurance at 70 °C:
standard operation mode
U = P 70 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.15 % R + 0.05 )
± (0.25 % R + 0.05 )
Endurance at 70 °C:
power operation mode
U = P 70 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (0.3 % R + 0.05 )
± (0.5 % R + 0.05 )
Endurance at 85 °C:
advanced temperature
operation mode
U = P 85 x R or U = Umax.;
whichever is the less severe;
1.5 h on; 0.5 h off;
85 °C; 1000 h
± (0.5 % R + 0.05 )
-
Endurance at
upper category
temperature
125 °C; 1000 h
155 °C; 1000 h
175 °C; 1000 h
± (0.15 % R + 0.05 )
± (0.3 % R + 0.05 )
± (0.5 % R + 0.05 )
4.24
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.1 % R + 0.05 )
4.37
67 (Cy)
Damp heat,
steady state,
accelerated
Standard operation mode
(85 ± 2) °C
(85 ± 5) % RH
U = 0.1 x P 70 x R ;
U  0.3 x Umax.; 1000 h
± (0.5 % R + 0.05 )
4.25.1
-
4.25.3
± 50 ppm/K; ± 25 ppm/K
Climatic sequence:
standard operation mode
4.23
4.23.2
± 1 % R; ± 0.5 % R
2 (Ba)
dry heat
155 °C; 16 h
4.23.3
30 (Db)
damp heat, cyclic
55 °C; 24 h;  90 % RH;
1 cycle
4.23.4
1 (Aa)
cold
-55 °C; 2 h
4.23.5
13 (M)
low air pressure
8.5 kPa; 2 h; (25 ± 10) °C
4.23.6
30 (Db)
damp heat, cyclic
55 °C; 24 h;  90 % RH;
5 cycles
4.23.7
-
DC load
1 (Aa)
Storage at low
temperature
-55 °C; 2 h
± (0.1 % R + 0.01 )
Rapid change of
temperature
30 min at -55 °C and
30 min at 155 °C;
1000 cycles
± (0.25 % R + 0.05 )
Extended rapid change
of temperature
30 min at -40 °C;
30 min at 125 °C (2);
MCS 0402 AT: 3000 cycles
MCT 0603 AT: 2000 cycles
MCU 0805 AT: 1500 cycles
MCA 1206 AT: 1000 cycles
± (0.25 % R + 0.05 );
( 50 % of initial shear force)
-
4.19
14 (Na)
4.13
Revision: 29-Sep-15
-
Short time overload;
standard operation mode
Short time overload;
power operation mode
U=
± (0.5 % R + 0.05 )
P 70 x R  Umax.; 1 min
U = 2.5 x P 70 x R or
U = 2 × Umax.;
whichever is the less severe;
5s
± (0.1 % R + 0.01 )
± (0.25 % R + 0.05 )
Document Number: 28760
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TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.5 OR BETTER
Stability for product types:
4.27
-
4.39
-
4.40
4.22
4.17
-
6 (Fc)
58 (Td)
Single pulse high
voltage overload:
standard operation mode
Single pulse high
voltage overload:
power operation mode
Periodic electric
overload:
standard operation mode
Periodic electric
overload:
power operation mode
MCS 0402 AT
2.43  to 221 k
MCT 0603 AT
1  to 511 k
MCU 0805 AT
1  to 1 M
MCA 1206 AT
1  to 1 M
Severity no. 4:
U = 10 x P 70 x R
U = 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs/700 μs
U = 15 x P 70 x R
U = 2 x Umax.
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.25 % R + 0.05)
± (0.5 % R + 0.05)
± (0.5 % R + 0.05)
± (1.0 % R + 0.05)
Electro static discharge
(human body model)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402 AT: 500 V
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
± (0.5 % R + 0.05)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude  1.5 mm or
200 m/s2; 7.5 h
± (0.1 % R + 0.01)
no visible damage
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (95 % covered);
no visible damage
Solderability
4.18
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.1 % R + 0.01)
no visible damage
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32
21 (Ue3)
Shear (adhesion)
4.33
21 (Ue1)
Substrate bending
Depth 2 mm, 3 times
± (0.1 % R + 0.01)
no visible damage;
no open circuit in bent position
4.7
-
Voltage proof
URMS = Uins; (60 ± 5) s
No flashover or breakdown
Flammability
IEC 60695-11-5 (1)
needle flame test; 10 s
No burning after 30 s
4.35
-
RR1005M and RR1608M; 9 N
RR2012M and RR3216M; 45 N
No visible damage
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) Tested on a 4-layer printed circuit board with SAC micro alloy.
Revision: 29-Sep-15
Document Number: 28760
9
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
Vishay Beyschlag
DIMENSIONS
Tt
W
WT
H
Tb
L
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
WT
(mm)
Tt
(mm)
Tb
(mm)
MASS
(mg)
MCS 0402 AT
0.32 ± 0.05
1.0 ± 0.05
0.5 ± 0.05
> 75 % of W
0.2 + 0.1/- 0.15
0.2 ± 0.1
0.6
MCT 0603 AT
0.45 + 0.1/- 0.05
1.55 ± 0.05
0.85 ± 0.1
> 75 % of W
0.3 + 0.15/- 0.2
0.3 + 0.15/- 0.2
1.9
MCU 0805 AT
0.52 ± 0.1
2.0 ± 0.1
1.25 ± 0.15
> 75 % of W
0.4 + 0.1/- 0.2
0.4 + 0.1/- 0.2
4.6
MCA 1206 AT
0.55 ± 0.1
3.2 + 0.1/- 0.2
1.6 ± 0.15
> 75 % of W
0.5 ± 0.25
0.5 ± 0.25
9.2
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE / SIZE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 AT
-
-
-
-
0.35
0.55
0.55
1.45
MCT 0603 AT
0.55
1.10
1.10
2.75
0.65
0.70
0.95
2.05
MCU 0805 AT
0.80
1.25
1.50
3.30
0.90
0.90
1.40
2.70
MCA 1206 AT
1.40
1.50
1.90
4.40
1.50
1.15
1.75
3.80
Notes
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depend on
board materials and design.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by
many other parameters.
Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation
mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and
adjacent conductor areas.
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 29-Sep-15
Document Number: 28760
10
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000