LT1767 - Monolithic 1.5A, 1.25MHz Step-Down Switching Regulators

LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
Monolithic 1.5A, 1.25MHz
Step-Down Switching Regulators
Features
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Description
1.5A Switch in a Small MSOP Package
Constant 1.25MHz Switching Frequency
High Power Exposed Pad (MS8E) Package
Wide Operating Voltage Range: 3V to 25V
High Efficiency 0.22Ω Switch
1.2V Feedback Reference Voltage
Fixed Output Voltages of 1.8V, 2.5V, 3.3V, 5V
2% Overall Output Tolerance
Uses Low Profile Surface Mount Components
Low Shutdown Current: 6µA
Synchronizable to 2MHz
Current Mode Loop Control
Constant Maximum Switch Current Rating at All Duty
Cycles*
Applications
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The LT®1767 is a 1.25MHz monolithic buck switching
regulator. A high efficiency 1.5A, 0.22Ω switch is included
on the die together with all the control circuitry required
to complete a high frequency, current mode switching
regulator. Current mode control provides fast transient
response and excellent loop stability.
New design techniques achieve high efficiency at high
switching frequencies over a wide operating range. A
low dropout internal regulator maintains consistent performance over a wide range of inputs from 24V systems
to Li-Ion batteries. An operating supply current of 1mA
improves efficiency, especially at lower output currents.
Shutdown reduces quiescent current to 6µA. Maximum
switch current remains constant at all duty cycles. Synchronization allows an external logic level signal to increase
the internal oscillator from 1.5MHz to 2MHz.
The LT1767 is available in an 8-pin MSOP fused lead-frame
package and a low thermal resistance exposed pad package.
Full cycle-by-cycle current limit and thermal shutdown are
provided. High frequency operation allows the reduction
of input and output filtering components and permits the
use of chip inductors.
DSL Modems
Portable Computers
Wall Adapters
Battery-Powered Systems
Distributed Power
L, LT, LTC, LTM, Linear Technology, the Linear logo and Burst Mode are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their respective
owners. Protected by U.S. Patents, including 6611131, 6498466.
Typical Application
Efficiency vs Load Current
12V to 3.3V Step-Down Converter
95
D2
CMDSH-3
VIN
12V
C3
2.2µF
CERAMIC
BOOST
VIN
OPEN
OR
HIGH
= ON
L1
5µH
VSW
LT1767-3.3
SHDN
SYNC
OUTPUT
3.3V
1.2A*
FB
GND
VC
CC
1.5nF
RC
4.7k
D1
UPS120
C1
10µF
CERAMIC
EFFICIENCY (%)
C2
0.1µF
85
80
75
70
*MAXIMUM OUTPUT CURRENT IS SUBJECT TO THERMAL DERATING.
VIN = 10V
VOUT = 5V
90
1767 TA01
0
0.2
0.4 0.6 0.8
1
LOAD CURRENT (A)
1.2
1.4
1767 TA01a
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Absolute Maximum Ratings
(Note 1)
Input Voltage ............................................................ 25V
BOOST Pin Above SW .............................................. 20V
Max BOOST Pin Voltage.............................................35V
SHDN Pin.................................................................. 25V
FB Pin Voltage ............................................................ 6V
FB Pin Current.......................................................... 1mA
SYNC Pin Current ................................................... 1mA
Operating Junction Temperature Range (Note 2)
LT1767E ............................................ – 40°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec) ................. 300°C
Pin Configuration
TOP VIEW
BOOST
VIN
SW
GND
1
2
3
4
TOP VIEW
8
7
6
5
BOOST
VIN
SW
GND
SYNC
VC
FB
SHDN
MS8 PACKAGE
8-LEAD PLASTIC MSOP
1
2
3
4
8
7
6
5
SYNC
VC
FB
SHDN
MS8E PACKAGE
8-LEAD PLASTIC MSOP
TJMAX = 125°C, θJA = 110°C/W
GROUND PIN CONNECTED TO LARGE COPPER AREA
TJMAX = 125°C, θJA = 40°C/W
GROUND PIN CONNECTED TO LARGE COPPER AREA ON PCB
Order Information
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LT1767EMS8#PBF
LT1767EMS8-1.8#PBF
LT1767EMS8#TRPBF
LTLS
8-Lead Plastic MSOP
–40°C to 125°C
LT1767EMS8-1.8#TRPBF
LTWG
8-Lead Plastic MSOP
–40°C to 125°C
LT1767EMS8-2.5#PBF
LT1767EMS8-2.5#TRPBF
LTWD
8-Lead Plastic MSOP
–40°C to 125°C
LT1767EMS8-3.3#PBF
LT1767EMS8-3.3#TRPBF
LTWE
8-Lead Plastic MSOP
–40°C to 125°C
LT1767EMS8-5#PBF
LT1767EMS8-5#TRPBF
LTWF
8-Lead Plastic MSOP
–40°C to 125°C
LT1767EMS8E#PBF
LT1767EMS8E#TRPBF
LTZG
8-Lead Plastic MSOP, Exposed Pad
–40°C to 125°C
LT1767EMS8E-1.8#PBF
LT1767EMS8E-1.8#TRPBF
LTZH
8-Lead Plastic MSOP, Exposed Pad
–40°C to 125°C
LT1767EMS8E-2.5#PBF
LT1767EMS8E-2.5#TRPBF
LTZJ
8-Lead Plastic MSOP, Exposed Pad
–40°C to 125°C
LT1767EMS8E-3.3#PBF
LT1767EMS8E-3.3#TRPBF
LTZK
8-Lead Plastic MSOP, Exposed Pad
–40°C to 125°C
LT1767EMS8E-5#PBF
LT1767EMS8E-5#TRPBF
LTZL
8-Lead Plastic MSOP, Exposed Pad
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
Consult LTC Marketing for information on nonstandard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
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Electrical Characteristics The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 15V, VC = 0.8V, Boost = VIN + 5V, SHDN, SYNC and switch open
unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
Maximum Switch Current Limit
TA = 0°C to 125°C
TA = < 0°C
1.5
1.3
2
3
3
Oscillator Frequency
3.3V < VIN < 25V
1.1
1.1
1.25
1.4
1.5
MHz
MHz
330
400
500
mV
mV
2.6
2.73
V
1
1.3
mA
6
20
45
µA
µA
l
Switch On Voltage Drop
ISW = –1.5A, 0°C ≤ TA ≤ 125°C and –1.3A, TA < 0°C
l
VIN Undervoltage Lockout
(Note 3)
l
VIN Supply Current
VFB = VNOM + 17%
l
Shutdown Supply Current
VSHDN = 0V, VIN = 25V, VSW = 0V
2.47
l
Feedback Voltage
3V < VIN < 25V, 0.4V < VC < 0.9V LT1767 (Adj)
(Note 3)
1.182
1.176
1.2
1.218
1.224
V
V
LT1767-1.8
l
1.764
1.8
1.836
V
LT1767-2.5
l
2.45
2.5
2.55
V
LT1767-3.3
l
3.234
3.3
3.366
V
LT1767-5
l
4.9
5
5.1
V
–0.25
–0.5
µA
10.5
14.7
19
29
15
21
27.5
42
21
30
39
60
kΩ
kΩ
kΩ
kΩ
150
350
l
500
850
1300
µMho
VFB = VNOM – 17%
l
80
120
160
µA
VFB = VNOM + 17%
l
70
110
180
µA
FB Input Current
LT1767 (Adj)
l
LT1767-1.8
LT1767-2.5
LT1767-3.3
LT1767-5
l
l
l
l
Error Amp Voltage Gain
0.4V < VC < 0.9V
Error Amp Transconductance
∆IVC = ±10µA
VC Pin Source Current
VC Pin Sink Current
VC Pin to Switch Current Transconductance
Duty Cycle = 0%
VC Pin 1.5A ISW Threshold
Maximum Switch Duty Cycle
A
A
l
FB Input Resistance
VC Pin Minimum Switching Threshold
UNITS
VC = 1.2V, ISW = 400mA
l
85
80
2.5
A/V
0.35
V
0.9
V
90
%
%
Minimum Boost Voltage Above Switch
ISW = –1.5A, 0°C ≤ TA ≤ 125°C and –1.3A, TA < 0°C
l
1.8
2.7
V
Boost Current
ISW = – 0.5A (Note 4)
ISW = –1.5A, 0°C ≤ TA ≤ 125°C and –1.3A, TA < 0°C (Note 4)
l
l
10
30
15
45
mA
mA
1.27
1.33
1.40
V
SHDN Input Current (Shutting Down)
SHDN = 60mV Above Threshold
l
–7
–10
–13
µA
SHDN Threshold Current Hysteresis
SHDN = 100mV Below Threshold
l
4
7
10
µA
1.5
2.2
V
SHDN Threshold Voltage
l
SYNC Threshold Voltage
SYNC Input Frequency
SYNC Pin Resistance
1.5
ISYNC = 1mA
2
20
MHz
kΩ
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Electrical Characteristics
Note 3: Minimum input voltage is defined as the voltage where the internal
regulator enters lockout. Actual minimum input voltage to maintain a
regulated output will depend on output voltage and load current. See
Applications Information.
Note 4: Current flows into the BOOST pin only during the on period of the
switch cycle.
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LT1767E is guaranteed to meet performance specifications
from 0°C to 125°C. Specifications over the – 40°C to 125°C operating
junction temperature range are assured by design, characterization and
correlation with statistical process controls.
TYPICAL PERFORMANCE Characteristics
FB vs Temperature (Adj)
Switch On Voltage Drop
1.22
Oscillator Frequency
400
1.20
1.19
1.18
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
25°C
300
1.40
250
–40°C
200
150
1.35
1.30
1.25
100
1.20
50
1.15
0
125
1.45
FREQUENCY (MHz)
SWITCH VOLTAGE (mV)
1.21
1.50
125°C
350
FB VOLTAGE (V)
TA = 25°C, unless otherwise noted.
1
0.5
SWITCH CURRENT (A)
0
1767 G01
1.10
–50
1.5
–25
1767 G02
0
25
50
75
TEMPERATURE (°C)
100
125
1767 G03
SHDN Threshold vs Temperature
SHDN Supply Current vs VIN
SHDN = 0V
1.34
1.32
–10
SHUTTING DOWN
5
SHDN INPUT (µA)
VIN CURRENT (µA)
SHDN THRESHOLD (V)
1.36
4
3
2
–25
0
25
50
75
TEMPERATURE (°C)
100
125
0
–8
–6
–4
STARTING UP
–2
1
1767 G04
4
–12
6
1.38
1.30
–50
SHDN IP Current vs Temperature
7
1.40
0
5
10
15
VIN (V)
20
25
30
1767 G05
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
1767 G06
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TYPICAL PERFORMANCE Characteristics
Minimum
Minimum Input
Input Voltage,
Voltage, 3.3V
3.3V Out
Out
SHDN Supply Current
VIN = 15V
5.5
VIN CURRENT (µA)
INPUT VOLTAGE (V)
6.0
TO START
5.0
4.5
4.0
3.5
2.5
1
250
1000
200
800
150
100
10
100
LOAD CURRENT (mA)
0
1k
MINIMUM
INPUT
VOLTAGE
600
400
200
50
TO RUN
3.0
1200
300
BOOST DIODE TIED TO VOUT
BOOST DIODE TIED TO VIN
6.5
Input Supply Current
VIN CURRENT (µA)
7.0
TA = 25°C, unless otherwise noted.
0.2
0
1767 G07
0.4 0.6 0.8
1
1.2
SHUTDOWN VOLTAGE (V)
0
1.4
0
5
10
15
20
INPUT VOLTAGE (V)
25
1767 G08
30
SWITCH CURRENT
1.0
20
0.5
10
FB CURRENT
0
0.2
0.4
0.6
0.8
FEEDBACK VOLTAGE (V)
1.5
1.3
L = 4.7µH
OUTPUT CURRENT (A)
1.5
Maximum Load Current,
VOUT = 2.5V
1.5
OUTPUT CURRENT (A)
SWITCH PEAK CURRENT (A)
40
FB INPUT CURRENT (µA)
2.0
0
1767 G09
Maximum Load Current,
VOUT = 5V
Current Limit Foldback
30
1.1
0.9
L = 2.2µH
0.7
L = 4.7µH
1.3
L = 2.2µH
1.1
L = 1.5µH
0.9
L = 1.5µH
1
0
1.2
1767 G10
0.5
0
5
10
15
INPUT VOLTAGE (V)
20
25
1767 G11
0.7
0
5
10
15
INPUT VOLTAGE (V)
20
25
1767 G12
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PIN FUNCTIONS
FB: The feedback pin is used to set output voltage using
an external voltage divider that generates 1.2V at the pin
with the desired output voltage. The fixed voltage 1.8V,
2.5V, 3.3V and 5V versions have the divider network included internally and the FB pin is connected directly to
the output. If required, the current limit can be reduced
during start up or short-circuit when the FB pin is below
0.5V (see the Current Limit Foldback graph in the Typical
Performance Characteristics section). An impedance of
less than 5kΩ (adjustable part only) at the FB pin is needed
for this feature to operate.
and the GND pin short. The GND pin of the MS8 package
is directly attached to the internal tab. This pin should
be attached to a large copper area to improve thermal
resistance. The exposed pad of the MS8E package is also
connected to GND. This should be soldered to a large
copper area to improve its thermal resistance.
BOOST: The BOOST pin is used to provide a drive voltage,
higher than the input voltage, to the internal bipolar NPN
power switch. Without this added voltage, the typical
switch voltage loss would be about 1.5V. The additional
boost voltage allows the switch to saturate and voltage
loss approximates that of a 0.22Ω FET structure.
SYNC: The sync pin is used to synchronize the internal
oscillator to an external signal. It is directly logic compatible and can be driven with any signal between 20% and
80% duty cycle. The synchronizing range is equal to initial
operating frequency, up to 2MHz. See Synchronization in
Applications Information section for details. When not in
use, this pin should be grounded.
VIN: This is the collector of the on-chip power NPN switch.
This pin powers the internal circuitry and internal regulator. At NPN switch on and off, high dI/dt edges occur
on this pin. Keep the external bypass capacitor and catch
diode close to this pin. All trace inductance in this path
will create a voltage spike at switch off, adding to the VCE
voltage across the internal NPN.
GND: The GND pin acts as the reference for the regulated
output, so load regulation will suffer if the “ground” end of
the load is not at the same voltage as the GND pin of the
IC. This condition will occur when load current or other
currents flow through metal paths between the GND pin
and the load ground point. Keep the ground path short
between the GND pin and the load and use a ground plane
when possible. Keep the path between the input bypass
6
VSW: The switch pin is the emitter of the on-chip power
NPN switch. This pin is driven up to the input pin voltage
during switch on time. Inductor current drives the switch
pin negative during switch off time. Negative voltage must
be clamped with an external catch diode with a VBR <0.8V.
SHDN: The shutdown pin is used to turn off the regulator and
to reduce input drain current to a few microamperes. The
1.33V threshold can function as an accurate undervoltage
lockout (UVLO), preventing the regulator from operating
until the input voltage has reached a predetermined level.
Float or pull high to put the regulator in the operating mode.
VC: The VC pin is the output of the error amplifier and the
input of the peak switch current comparator. It is normally
used for frequency compensation, but can do double duty
as a current clamp or control loop override. This pin sits
at about 0.35V for very light loads and 0.9V at maximum
load. It can be driven to ground to shut off the output.
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Block diagram
The LT1767 is a constant frequency, current mode buck
converter. This means that there is an internal clock and
two feedback loops that control the duty cycle of the power
switch. In addition to the normal error amplifier, there is a
current sense amplifier that monitors switch current on a
cycle-by-cycle basis. A switch cycle starts with an oscillator
pulse which sets the RS flip-flop to turn the switch on. When
switch current reaches a level set by the inverting input of
the comparator, the flip-flop is reset and the switch turns
off. Output voltage control is obtained by using the output
of the error amplifier to set the switch current trip point.
This technique means that the error amplifier commands
current to be delivered to the output rather than voltage.
A voltage fed system will have low phase shift up to the
resonant frequency of the inductor and output capacitor,
VIN
then an abrupt 180° shift will occur. The current fed system will have 90° phase shift at a much lower frequency,
but will not have the additional 90° shift until well beyond
the LC resonant frequency. This makes it much easier to
frequency compensate the feedback loop and also gives
much quicker transient response.
High switch efficiency is attained by using the BOOST pin
to provide a voltage to the switch driver which is higher
than the input voltage, allowing switch to be saturated.
This boosted voltage is generated with an external capacitor and diode. A comparator connected to the shutdown
pin disables the internal regulator, reducing supply
current.
0.01Ω
2
+
2.5V BIAS
REGULATOR
–
CURRENT
SENSE
AMPLIFIER
VOLTAGE GAIN = 40
INTERNAL
VCC
SLOPE COMP
∑
1
BOOST
0.35V
SYNC
1.25MHz
OSCILLATOR
8
+
CURRENT
COMPARATOR
S
RS
FLIP-FLOP
R
–
SHUTDOWN
COMPARATOR
3
VSW
6
FB
7µA
+
–
PARASITIC DIODES
DO NOT
FORWARD BIAS
1.33V
5
–
3µA
gm
7 VC
ERROR
AMPLIFIER
gm = 850µMho
+
SHDN
Q1
POWER
SWITCH
DRIVER
CIRCUITRY
1.2V
4
GND
1767 F01
Figure 1. Block Diagram
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APPLICATIONS INFORMATION
FB RESISTOR NETWORK
If an output voltage of 1.8V, 2.5V, 3.3V or 5V is required, the
respective fixed option part, -1.8, -2.5, -3.3 or -5, should be
used. The FB pin is tied directly to the output; the necessary
resistive divider is already included on the part. For other
voltage outputs, the adjustable part should be used and an
external resistor divider added. The suggested resistor (R2)
from FB to ground is 10k. This reduces the contribution of
FB input bias current to output voltage to less than 0.25%.
The formula for the resistor (R1) from VOUT to FB is:
R1=
R2 ( VOUT −1.2)
1.2 −R2(0.25µA)
(~0.4V at maximum load). This leads to a minimum input
voltage of:
VIN(MIN ) =
with DCMAX = 0.80 at output current below 0.5A, and
DCMAX = 0.75 at higher loads. The maximum duty cycle
decreases when the LT1767 is synchronized to an external
clock; DCMAX = 1 – 0.25µs • fCLK.
The maximum input voltage is determined by the absolute
maximum ratings of the VIN and BOOST pins and by the
minimum duty cycle DCMIN = 0.16:
VIN(MAX ) =
VSW
LT1767
ERROR
AMPLIFIER
OUTPUT
+
gm
–
1.2V
FB
R1
+
R2
10k
1767 F02
VC
GND
VOUT + VD
– VD + VSW
DCMAX
VOUT + VD
– VD + VSW
DCMIN
For a 12V input, the lowest practical output voltage is
1.8V. Minimum duty cycle will increase when the LT1767
is synchronized; DCMIN = 0.11µs • fCLK. Note that this is
a restriction on the operating input voltage; the circuit
will tolerate transient inputs up to the absolute maximum
ratings of the VIN and BOOST pins, provided the output
is not shorted.
For wider input voltage range, consult the related parts
table on the last page of this data sheet.
Figure 2. Feedback Network
Input Voltage Range
The input voltage range for LT1767 applications depends
on the output voltage, the absolute maximum ratings of
the VIN and BOOST pins, and the operating frequency.
The minimum input voltage is determined by either the
LT1767’s minimum operating voltage of 2.73V or by its
maximum duty cycle. The duty cycle is the fraction of
time that the internal switch is on and is determined by
the input and output voltages:
DC =
VOUT + VD
VIN – VSW + VD
Step-down regulators draw current from the input supply in
pulses. The rise and fall times of these pulses are very fast.
The input capacitor is required to reduce the voltage ripple
this causes at the input of LT1767 and force the switching
current into a tight local loop, thereby minimizing EMI. The
RMS ripple current can be calculated from:
where VD is the forward voltage drop of the catch diode
(~0.4V) and VSW is the voltage drop of the internal switch
8
INPUT CAPACITOR
IRIPPLE (RMS) =IOUT VOUT ( VIN − VOUT ) / VIN 2
Higher value, lower cost ceramic capacitors are now available
in smaller case sizes. These are ideal for input bypassing
since their high frequency capacitive nature removes most
ripple current rating and turn-on surge problems. At higher
switching frequency, the energy storage requirement of the
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APPLICATIONS INFORMATION
input capacitor is reduced so values in the range of 1µF
to 4.7µF are suitable for most applications. Y5V or similar
type ceramics can be used since the absolute value of capacitance is less important and has no significant effect on
loop stability. If operation is required close to the minimum
input required by the output of the LT1767, a larger value
may be required. This is to prevent excessive ripple causing
dips below the minimum operating voltage, resulting in
erratic operation.
If tantalum capacitors are used, values in the 22µF to 470µF
range are generally needed to minimize ESR and meet ripple
current and surge ratings. Care should be taken to ensure
the ripple and surge ratings are not exceeded. The AVX TPS
and Kemet T495 series are surge rated. AVX recommends
derating capacitor operating voltage by 2:1 for high surge
applications.
Unlike the input capacitor, RMS ripple current in the output
capacitor is normally low enough that ripple current rating
is not an issue. The current waveform is triangular, with
an RMS value given by:
VOUT USING 47µF, 0.1Ω
TANTALUM CAPACITOR
(10mV/DIV)
VOUT USING 2.2µF
CERAMIC CAPACITOR
(10mV/DIV)
VSW
(5V/DIV)
1767 F03
0.2µs/DIV
Figure 3. Output Ripple Voltage Waveform
OUTPUT CAPACITOR
IRIPPLE (RMS) =
Figure 3 shows a comparison of output ripple for a ceramic
and tantalum capacitor at 200mA ripple current.
0.29 (VOUT ) ( VIN − VOUT )
(L) ( f) (VIN )
The LT1767 will operate with both ceramic and tantalum
output capacitors. Ceramic capacitors are generally chosen
for their small size, very low ESR (effective series resistance),
and good high frequency operation, reducing output ripple
voltage. Typical ceramic output capacitors are in the 4.7µF
to 47µF range. Since the absolute value of capacitance
defines the pole frequency of the output stage, an X7R or
X5R type ceramic, which have good temperature stability,
is recommended.
Tantalum capacitors are usually chosen for their bulk capacitance properties, useful in high transient load applications.
ESR rather than capacitive value defines output ripple at
1.25MHz. Typical LT1767 applications require a tantalum
capacitor with less than 0.3Ω ESR at 22µF to 500µF.
INDUCTOR CHOICE AND MAXIMUM OUTPUT
CURRENT
Maximum output current for a buck converter is equal
to the maximum switch rating (IP) minus one half peak
to peak inductor current. In past designs, the maximum
switch current has been reduced by the introduction of
slope compensation. Slope compensation is required at
duty cycles above 50% to prevent an affect called subharmonic oscillation (see Application Note 19 for details).
The LT1767 has a new circuit technique that maintains a
constant switch current rating at all duty cycles.
For most applications, the output inductor will be in the
1µH to 10µH range. Lower values are chosen to reduce
the physical size of the inductor, higher values allow
higher output currents due to reduced peak to peak ripple
current, and reduces the current at which discontinuous
operation occurs. The following formula gives maximum
output current for continuous mode operation, implying
that the peak to peak ripple (2x the term on the right) is
less than the maximum switch current.
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Continuous Mode
IOUT (MAX ) =
especially with smaller inductors and lighter loads, so
don’t omit this step. Powdered iron cores are forgiving
because they saturate softly, whereas ferrite cores
saturate abruptly. Other core materials fall somewhere
in between.
( V ) ( VIN − VOUT )
IP − OUT
2 (L ) ( f ) ( VIN )
Discontinuous operation occurs when
IOUT(DIS) =
(VOUT )
2(L)(f)
IPEAK =IOUT +
For VIN = 8V, VOUT = 5V and L = 3.3µH,
IOUT (MAX ) =1.5 −
(
(5) (8 − 5)
)(
)
2 3.3 • 10− 6 1.25 • 106 (8)
=1.5 − 0.23 =1.27 A
Note that the worst case (minimum output current available) condition is at the maximum input voltage. For the
same circuit at 15V, maximum output current would be
only 1.1A.
When choosing an inductor, consider maximum load current, core and copper losses, allowable component height,
output voltage ripple, EMI, fault current in the inductor,
saturation, and of course, cost. The following procedure
is suggested as a way of handling these somewhat complicated and conflicting requirements.
1. Choose a value in microhenries from the graphs of
maximum load current. Choosing a small inductor
with lighter loads may result in discontinuous mode
of operation, but the LT1767 is designed to work well
in either mode.
Assume that the average inductor current is equal to
load current and decide whether or not the inductor
must withstand continuous fault conditions. If maximum load current is 0.5A, for instance, a 0.5A inductor
may not survive a continuous 2A overload condition.
Also, the instantaneous application of input or release
from shutdown, at high input voltages, may cause
saturation of the inductor. In these applications, the
soft-start circuit shown in Figure 10 should be used.
2. Calculate peak inductor current at full load current to
ensure that the inductor will not saturate. Peak current can be significantly higher than output current,
10
VOUT ( VIN − VOUT )
2 (L ) ( f) ( VIN )
VIN = Maximum input voltage
f = Switching frequency, 1.25MHz
3. Decide if the design can tolerate an “open” core geometry like a rod or barrel, which have high magnetic
field radiation, or whether it needs a closed core like a
toroid to prevent EMI problems. This is a tough decision
because the rods or barrels are temptingly cheap and
small and there are no helpful guidelines to calculate
when the magnetic field radiation will be a problem.
4. After making an initial choice, consider the secondary
things like output voltage ripple, second sourcing, etc.
Use the experts in the Linear Technology’s applications
department if you feel uncertain about the final choice.
They have experience with a wide range of inductor
types and can tell you about the latest developments
in low profile, surface mounting, etc.
Table 1
PART NUMBER
VALUE (uH) ISAT(Amps) DCR (Ω)
HEIGHT (mm)
Coiltronics
TP1-2R2
2.2
1.3
0.188
1.8
TP2-2R2
2.2
1.5
0.111
2.2
TP3-4R7
4.7
1.5
0.181
2.2
TP4- 100
10
1.5
0.146
3.0
LQH1C1R0M04
1.0
0.51
0.28
1.8
LQH3C1R0M24
1.0
1.0
0.06
2.0
LQH3C2R2M24
2.2
0.79
0.1
2.0
LQH4C1R5M04
1.5
1.0
0.09
2.6
CD73- 100
10
1.44
0.080
3.5
CDRH4D18-2R2
2.2
1.32
0.058
1.8
CDRH5D18-6R2
6.2
1.4
0.071
1.8
CDRH5D28-100
10
1.3
0.048
2.8
Murata
Sumida
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CATCH DIODE
Shutdown and Undervoltage Lockout
The suggested catch diode (D1) is a UPS120 Schottky, or
its Motorola equivalent, MBRM120LTI/MBRM130LTI. It is
rated at 2A average forward current and 20V/30V reverse
voltage. Typical forward voltage is 0.5V at 1A. The diode
conducts current only during switch off time. Peak reverse
voltage is equal to regulator input voltage. Average forward
current in normal operation can be calculated from:
Figure 4 shows how to add undervoltage lockout (UVLO)
to the LT1767. Typically, UVLO is used in situations where
the input supply is current limited, or has a relatively high
source resistance. A switching regulator draws constant
power from the source, so source current increases as
source voltage drops. This looks like a negative resistance
load to the source and can cause the source to current limit
or latch low under low source voltage conditions. UVLO
prevents the regulator from operating at source voltages
where these problems might occur.
ID ( AVG) =
IOUT ( VIN − VOUT )
VIN
BOOST PIN
OUTPUT
LT1767
For most applications, the boost components are a 0.1µF
capacitor and a CMDSH-3 diode. The anode is typically
connected to the regulated output voltage to generate
a voltage approximately VOUT above VIN to drive the
output stage. The output driver requires at least 2.7V of
headroom throughout the on period to keep the switch
fully saturated. However, the output stage discharges the
boost capacitor during the on time. If the output voltage is
less than 3.3V, it is recommended that an alternate boost
supply is used. The boost diode can be connected to the
input, although, care must be taken to prevent the 2x VIN
boost voltage from exceeding the BOOST pin absolute
maximum rating. The additional voltage across the switch
driver also increases power loss, reducing efficiency. If
available, an independent supply can be used with a local
bypass capacitor.
A 0.1µF boost capacitor is recommended for most applications. Almost any type of film or ceramic capacitor
is suitable, but the ESR should be <1Ω to ensure it can
be fully recharged during the off time of the switch. The
capacitor value is derived from worst-case conditions of
700ns on-time, 50mA boost current, and 0.7V discharge
ripple. This value is then guard banded by 2x for secondary
factors such as capacitor tolerance, ESR and temperature
effects. The boost capacitor value could be reduced under
less demanding conditions, but this will not improve circuit operation or efficiency. Under low input voltage and
low load conditions, a higher value capacitor will reduce
discharge ripple and improve start up operation.
VSW
7µA
IN
VIN
1.33V
3µA
R1
VCC
+
SHDN
C1
R2
GND
1767 F04
Figure 4. Undervoltage Lockout
An internal comparator will force the part into shutdown
below the minimum VIN of 2.6V. This feature can be
used to prevent excessive discharge of battery-operated
systems. If an adjustable UVLO threshold is required, the
shutdown pin can be used. The threshold voltage of the
shutdown pin comparator is 1.33V. A 3µA internal current
source defaults the open pin condition to be operating (see
Typical Performance Graphs). Current hysteresis is added
above the SHDN threshold. This can be used to set voltage
hysteresis of the UVLO using the following:
VH − VL
7µA
1.33V
R2 =
( VH −1.33V )
R1=
R1
+ 3µA
VH – Turn-on threshold
VL – Turn-off threshold
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Example: switching should not start until the input is
above 4.75V and is to stop if the input falls below 3.75V.
VH = 4.75V
VL = 3.75V
4.75V − 3.75V
=143k
7µA
1.33V
R2 =
= 49.4k
(4.75V −1.33V) + 3µA
143k
R1=
Keep the connections from the resistors to the SHDN
pin short and make sure that the interplane or surface
capacitance to the switching nodes are minimized. If high
resistor values are used, the SHDN pin should be bypassed
with a 1nF capacitor to prevent coupling problems from
the switch node.
LAYOUT CONSIDERATIONS
As with all high frequency switchers, when considering
layout, care must be taken in order to achieve optimal
electrical, thermal and noise performance. For maximum efficiency, switch rise and fall times are typically
in the nanosecond range. To prevent noise both radiated
and conducted, the high speed switching current path,
shown in Figure 5, must be kept as short as possible.
This is implemented in the suggested layout of Figure 6.
Shortening this path will also reduce the parasitic trace
inductance of approximately 25nH/inch. At switch-off, this
parasitic inductance produces a flyback spike across the
LT1767 switch. When operating at higher currents and
input voltages, with poor layout, this spike can generate
voltages across the LT1767 that may exceed its absolute
maximum rating. A ground plane should always be used
under the switcher circuitry to prevent interplane coupling
and overall noise.
SYNCHRONIZATION
VIN
The SYNC pin, is used to synchronize the internal oscillator
to an external signal. The SYNC input must pass from a
logic level low, through the maximum synchronization
threshold with a duty cycle between 20% and 80%. The
input can be driven directly from a logic level output. The
synchronizing range is equal to initial operating frequency
up to 2MHz. This means that minimum practical sync
frequency is equal to the worst-case high self-oscillating
frequency (1.5MHz), not the typical operating frequency
of 1.25MHz. Caution should be used when synchronizing
above 1.6MHz because at higher sync frequencies the
amplitude of the internal slope compensation used to
prevent subharmonic switching is reduced. This type of
subharmonic switching only occurs at input voltages less
than twice output voltage. Higher inductor values will tend
to eliminate this problem. See Frequency Compensation
section for a discussion of an entirely different cause of
subharmonic switching before assuming that the cause
is insufficient slope compensation. Application Note 19
has more details on the theory of slope compensation.
12
LT1767
SW
HIGH
FREQUENCY
CIRCULATING
PATH
VIN C3
L1
D1 C1
5V
LOAD
1767 F05
Figure 5. High Speed Switching Path
The VC and FB components should be kept as far away as
possible from the switch and boost nodes. The LT1767
pinout has been designed to aid in this. The ground for
these components should be separated from the switch
current path. Failure to do so will result in poor stability
or subharmonic like oscillation.
Board layout also has a significant effect on thermal resistance. Soldering the exposed pad to as large a copper
area as possible and placing feedthroughs under the pad
to a ground plane, will reduce die temperature and increase
the power capacity of the LT1767. For the nonexposed
package, Pin 4 is connected directly to the pad inside the
package. Similar treatment of this pin will result in lower
die temperatures.
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D2
CMDSH-3
C2
0.1µF
VIN
12V
BOOST
VIN
C3
2.2µF
CERAMIC
OPEN
OR
HIGH
= ON
L1
5µH
OUTPUT
2.5V
1.2A
VSW
LT1767-2.5
SHDN
SYNC
FB
GND
VC
CC
1.5nF
RC
4.7k
C1
10µF
CERAMIC
D1
UPS120
1767 F06a
C3
VIN
GND
MINIMIZE LT1767,
C3, D1 LOOP
D2
PLACE FEEDTHROUGHS
AROUND GROUND PIN
AND UNDER GROUND PAD
FOR GOOD THERMAL
CONDUCTIVITY
SYNC
C2
SHDN
KEEP FB AND VC
COMPONENTS
AWAY FROM
HIGH INPUT
COMPONENTS
CC
D1
L1
RC
C1
CONNECT TO
GROUND PLANE
GND
VOUT
KELVIN SENSE
VOUT
1767 F06
Figure 6. Typical Application and Suggested Layout (Topside Only Shown)
THERMAL CALCULATIONS
Power dissipation in the LT1767 chip comes from four
sources: switch DC loss, switch AC loss, boost circuit
current, and input quiescent current. The following
formulas show how to calculate each of these losses.
These formulas assume continuous mode operation, so
they should not be used for calculating efficiency at light
load currents.
Switch loss:
2
PSW =
R SW (IOUT ) ( VOUT )
VIN
+17ns (IOUT ) ( VIN ) ( f)
Boost current loss for VBOOST = VOUT:
PBOOST =
VOUT 2 (IOUT / 50)
VIN
Quiescent current loss:
PQ =VIN (0.001)
RSW = Switch resistance (≈ 0.27Ω when hot)
17ns = Equivalent switch current/voltage overlap time
f = Switch frequency
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Example: with VIN = 10V, VOUT = 5V and IOUT = 1A:
2
PSW
(0.27)(1) (5) + 17 • 10−9
=
(
10
= 0.135+ 0.21= 0.34W
) (1) (10) (1.25 • 10 )
6
2
PBOOST
(5) (1/ 50) = 0.05W
=
FREQUENCY COMPENSATION
10
PQ =10 (0.001)= 0.01W
Total power dissipation is 0.34 + 0.05 + 0.01 = 0.4W.
Thermal resistance for LT1767 package is influenced
by the presence of internal or backside planes. With a
full plane under the package, thermal resistance for the
exposed pad package will be about 40°C/W. No plane
will increase resistance to about 150°C/W. To calculate
die temperature, use the appropriate thermal resistance
number and add in worst-case ambient temperature:
TJ = TA + θJA (PTOT)
When estimating ambient, remember the nearby catch
diode and inductor will also be dissipating power.
PDIODE =
( VF ) ( VIN − VOUT ) (ILOAD )
VIN
VF = Forward voltage of diode (assume 0.5V at 1A)
PDIODE =
(0.5) (12 − 5) (1) = 0.29W
12
Notice that the catch diode’s forward voltage contributes
a significant loss in the overall system efficiency. A larger,
lower VF diode can improve efficiency by several percent.
PINDUCTOR = (ILOAD) (LDCR)
LDCR = Inductor DC resistance (assume 0.1Ω)
PINDUCTOR = (1) (0.1) = 0.1W
Typical thermal resistance of the board is 35°C/W. At an
ambient temperature of 65°C,
Tj = 65 + 40 (0.4) + 35 (0.39) = 95°C
14
If a true die temperature is required, a measurement of the
SYNC to GND pin resistance can be used. The SYNC pin
resistance across temperature must first be calibrated, with
no device power, in an oven. The same measurement can
then be used in operation to indicate the die temperature.
Before starting on the theoretical analysis of frequency
response, the following should be remembered – the worse
the board layout, the more difficult the circuit will be to
stabilize. This is true of almost all high frequency analog
circuits, read the Layout Considerations section first.
Common layout errors that appear as stability problems
are distant placement of input decoupling capacitor and/
or catch diode, and connecting the VC compensation to a
ground track carrying significant switch current. In addition,
the theoretical analysis considers only first order non-ideal
component behavior. For these reasons, it is important
that a final stability check is made with production layout
and components.
The LT1767 uses current mode control to regulate the
output. This simplifies loop compensation. In particular,
the LT1767 does not require the ESR (equivalent series
resistance) of the output capacitor for stability, so you
are free to use ceramic capacitors to achieve low output
ripple and small circuit size. Frequency compensation is
provided by the components tied to the VC pin, as shown
in Figure 7. Generally a capacitor (CC) and a resistor (RC)
in series to ground are used. In addition, there may be
lower value capacitor (CF) in parallel.
Figure 7 also shows an equivalent circuit for the LT1767
control loop. The error amplifier is a transconductance
amplifier with finite output impedance. The power section,
consisting of the modulator, power switch and inductor,
is modeled as a transconductance amplifier generating an
output current proportional to the voltage at the VC pin.
Note that the output capacitor integrates this current, and
that the capacitor on the VC pin (CC) integrates the error
amplifier output current, resulting in two poles in the loop.
In most cases a zero is required and comes from either
the output capacitor ESR or from a resistor RC in series
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LT1767
CURRENT MODE
POWER STAGE
gm = 2.5mho
–
GND
R1
VOUT
100mV/DIV
TANTALUM CERAMIC
1.2V
ESR
VC
RC
CPL
FB
gm =
850µmho
+
500k
OUTPUT
ERROR
AMPLIFIER
+
R2
C1
C1
10µs/DIV
1767 F08
Figure 8. Oscillograph Shows the Output Voltage
Response to a Load Current Transient from 0.3A to 1A.
The Compensation Network Results in Fast, Damped
Response. (Front Page Schematic, 12V in to 3.3V out)
CF
CC
1767 F07
Figure 7. Model for Loop Response
with CC. This simple model works well as long as the value of the inductor is not too high and the loop crossover
frequency is much lower than the switching frequency.
A phase lead capacitor (CPL) across the feedback divider
may improve the transient response. An optional capacitor
(CF) in parallel with the compensation may be included.
This capacitor is not part of the loop compensation, but
instead filters noise at the switching frequency, and is
required only if a phase-lead capacitor is used or if the
output capacitor has high ESR.
For output capacitors with specified ESR greater than
~50mΩ, a single capacitor can be used for compensation.
For ceramic output capacitor, include a zero resistor in
the compensation network. Figure 8 shows the transient
response of the circuit on the front page of the data sheet.
When checking loop stability, the circuit should be operated
over the application’s full voltage, current and temperature range. Any transient loads should be applied and the
output voltage monitored for a well-damped behavior. See
Application Note 76 for more details.
converter with backup output regulator
In systems with a primary and backup supply, for example, a battery powered device with a wall adapter input,
the output of the LT1767 can be held up by the backup
supply with its input disconnected. In this condition, the
SW pin will source current into the VIN pin. If the SHDN
pin is held at ground, only the shut down current of 6µA
will be pulled via the SW pin from the second supply.
With the SHDN pin floating, the LT1767 will consume its
quiescent operating current of 1mA. The VIN pin will also
source current to any other components connected to the
input line. If this load is greater than 10mA or the input
could be shorted to ground, a series Schottky diode must
be added, as shown in Figure 9. With these safeguards,
the output can be held at voltages up to the VIN absolute
maximum rating.
Buck Converter with Adjustable Soft-Start
Large capacitive loads or high input voltages can cause
high input currents at start-up. Figure 10 shows a circuit
that limits the dv/dt of the output at start-up, controlling
the capacitor charge rate. The buck converter is a typical
configuration with the addition of R3, R4, CSS and Q1. As
the output starts to rise, Q1 turns on, regulating switch
current via the VC pin to maintain a constant dv/dt at the
output. Output rise time is controlled by the current through
CSS defined by R4 and Q1’s VBE. Once the output is in
regulation, Q1 turns off and the circuit operates normally.
R3 is transient protection for the base of Q1.
(R4)(CSS )(VOUT )
RiseTime =
(VBE )
Using the values shown in Figure 10,
RiseTime =
(47 • 103 )(15 • 10 –9 )(5)
= 5ms
0.7
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The ramp is linear and rise times in the order of 100ms are
possible. Since the circuit is voltage controlled, the ramp
rate is unaffected by load characteristics and maximum
output current is unchanged. Variants of this circuit can
be used for sequencing multiple regulator outputs.
regulation and reduces ripple current in L1. Without C4,
the voltage swing on L1B compared to L1A would vary
due to relative loading and coupling losses. C4 provides a
low impedance path to maintain an equal voltage swing in
L1B, improving regulation. In a flyback converter, during
switch on time, all the converter’s energy is stored in L1A
only, since no current flows in L1B. At switch off, energy
is transferred by magnetic coupling into L1B, powering
the –5V rail. C4 pulls L1B positive during switch on time,
causing current to flow, and energy to build in L1B and
C4. At switch off, the energy stored in both L1B and C4
supply the –5V rail. This reduces the current in L1A and
changes L1B current waveform from square to triangular.
For details on this circuit, including maximum output
currents, see Design Note 100.
Dual Output SEPIC Converter
The circuit in Figure 11 generates both positive and negative
5V outputs with a single piece of magnetics. The two inductors shown are actually just two windings on a standard
B H Electronics inductor. The topology for the 5V output
is a standard buck converter. The – 5V topology would be
a simple flyback winding coupled to the buck converter
if C4 were not present. C4 creates a SEPIC (single-ended
primary inductance converter) topology which improves
CMDSH-3
0.1µF
UPS120*
REMOVABLE
INPUT
VIN
83k
BOOST
5µH
VSW
3.3V, 1A
LT1767-3.3
SHDN
SYNC GND
28.5k
FB
VC
UPS120
1.5nF
2.2µF
ALTERNATE
SUPPLY
10µF
4.7k
1767 F09
* ONLY REQUIRED IF INPUT CAN SINK >10mA
Figure 9. Dual Source Supply with 6µA Reverse Leakage
C2
0.1µF
D2
CMDSH-3
C2
0.1µF
VIN
12V
C3
2.2µF
VIN
BOOST
VSW
D1
LT1767-5
SHDN
SYNC
FB
GND
VC
CC
330pF Q1
D1: UPS120
Q1: 2N3904
VIN
6V TO 15V
L1
5µH
C1
100µF
OUTPUT
5V
1A
+
GND
CSS
R3 15nF
2k
R4
47k
1767 F10
Figure 10. Buck Converter with Adjustable Soft-Start
16
D2
CMDSH-3
VIN
BOOST
L1A*
9µH
OUTPUT
5V
VSW
LT1767-5
SHDN
SYNC GND
C3
2.2µF
16V
CERAMIC
FB
+
VC
CC
330pF
C4
2.2µF
* L1 IS A SINGLE CORE WITH TWO WINDINGS
16V
BH ELECTRONICS #511-1013
† IF LOAD CAN GO TO ZERO,
CERAMIC
AN OPTIONAL PRELOAD OF 1k TO 5k
MAY BE USED TO IMPROVE LOAD REGULATION
D1, D3: UPS120
C1
100µF
10V TANT
D1
C5
L1B* 100µF
10V TANT
D3
+
OUTPUT
–5V†
1767 F11
Figure 11. Dual Output SEPIC Converter
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Package description
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev G)
0.889 ±0.127
(.035 ±.005)
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
0.65
(.0256)
BSC
0.42 ± 0.038
(.0165 ±.0015)
TYP
8
7 6 5
0.52
(.0205)
REF
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
4.90 ±0.152
(.193 ±.006)
DETAIL “A”
0° – 6° TYP
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1
2 3
4
1.10
(.043)
MAX
0.86
(.034)
REF
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS8) 0213 REV G
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
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LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MS8E Package
8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev K)
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.88
(.074)
1
1.88 ±0.102
(.074 ±.004)
0.29
REF
1.68
(.066)
0.889 ±0.127
(.035 ±.005)
0.05 REF
5.10
(.201)
MIN
DETAIL “B”
CORNER TAIL IS PART OF
DETAIL “B” THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
1.68 ±0.102 3.20 – 3.45
(.066 ±.004) (.126 – .136)
8
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
0.65
(.0256)
BSC
0.42 ±0.038
(.0165 ±.0015)
TYP
8
7 6 5
0.52
(.0205)
REF
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
4.90 ±0.152
(.193 ±.006)
DETAIL “A”
0° – 6° TYP
GAUGE PLANE
0.53 ±0.152
(.021 ±.006)
DETAIL “A”
1
2 3
4
1.10
(.043)
MAX
0.86
(.034)
REF
0.18
(.007)
SEATING
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.65
(.0256)
BSC
0.1016 ±0.0508
(.004 ±.002)
MSOP (MS8E) 0213 REV K
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD
SHALL NOT EXCEED 0.254mm (.010") PER SIDE.
18
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LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
Revision History
(Revision history begins at Rev B)
REV
DATE
DESCRIPTION
B
11/14
Clarified Schematic and Graph
PAGE NUMBER
1
Clarified Ordering Information
2
Clarified Note 1
3
Clarified Minimum Input Voltage for 3.3VOUT Graph
5
Added Input Voltage Range Section
8
Clarified Figure 5
12
Clarified Frequency Compensation Description
14
Clarified Related Parts Section
20
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
that the interconnectionFor
of its
circuits
as described
herein will not infringe on existing patent rights.
more
information
www.linear.com/LT1767
19
LT1767/LT1767-1.8/
LT1767-2.5/LT1767-3.3/LT1767-5
Typical Application
12V to 3.3V Step-Down Converter
D2
CMDSH-3
C2
0.1µF
VIN
12V
C3
2.2µF
CERAMIC
BOOST
VIN
OPEN
OR
HIGH
= ON
L1
5µH
VSW
LT1767-3.3
SHDN
SYNC
OUTPUT
3.3V
1.2A*
FB
GND
VC
CC
1.5nF
RC
4.7k
D1
UPS120
*MAXIMUM OUTPUT CURRENT IS SUBJECT TO THERMAL DERATING.
C1
10µF
CERAMIC
1767 TA01
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1936
36V, 1.5A, 500kHz, Step-Down Regulator
90% Efficiency, VIN = 3.6V to 36V, VOUT(MIN) = 1.2V, IQ = 1.8mA,
ISC < 1µA, MSOP-8E
LT3505
36V, 1.2A, 3MHz, Step-Down Regulator
90% Efficiency, VIN = 3.6V to 36V, VOUT(MIN) = 0.78V, IQ = 2mA,
ISC < 2µA, 3mm × 3mm DFN-8, MSOP-8E
LTC3600
15V, 1.5A, 4MHz, Synchronous Rail-to-Rail Single Resistor
Step-Down Regulator
95% Efficiency, VIN = 4V to 15V, VOUT(MIN) = 0V, IQ = 700µA,
ISC < 1µA, 3mm × 3mm DFN-12, MSOP-12E
LTC3621/
LTC3621-2
17V, 1.5A, 1/2.25MHz, Synchronous Step-Down Regulator
95% Efficiency, VIN = 2.7V to 17V, VOUT(MIN) = 0.6V, IQ = 3.5µA,
ISC < 1µA, 2mm × 3mm DFN-6, MSOP-8E
LTC3624/
LTC3624-2
17V, 2A, 1/2.25MHz, Synchronous Step-Down Regulator
95% Efficiency, VIN = 2.7V to 17V, VOUT(MIN) = 0.6V, IQ = 3.5µA,
ISC < 1µA, 3mm × 3mm DFN-8
LTC3622/
LTC3622-2
17V, Dual 1A (IOUT ), 1/2.25MHz, Synchronous Step-Down
DC/DC Converter
95% Efficiency, VIN = 2.7V to 17V, VOUT(MIN) = 0.6V, IQ = 5µA,
ISC < 1µA, 3mm × 4mm DFN-14
LTC3646/
LTC3646-1
340V, 1A (IOUT ), 4MHz, Synchronous
Step-Down DC/DC Converter
95% Efficiency, VIN = 4V to 40V, VOUT(MIN) = 0.6V, IQ = 140µA,
ISC < 8µA, 3mm × 4mm DFN-14, MSOP16E
LT3685
36V (60V Transients), 2A (IOUT ), 2.44MHz,
Step-Down DC/DC Converter
90% Efficiency, VIN = 3.6V to 36V, VOUT(MIN) = 0.79V, IQ = 0.9mA,
ISC < 14µA, 3mm × 3mm DFN-10, MSOP-10E
LT3508
36V, Dual 1.4A, 2.5MHz, Step-Down Regulator
90% Efficiency, VIN = 3.7V to 36V, VOUT(MIN) = 0.8V, IQ = 2mA,
ISC < 1µA, 4mm × 4mm QFN-24, TSSOP-16E
20 Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
For more information www.linear.com/LT1767
(408) 432-1900 ●● FAX:
FAX: (408)
(408)434-0507
434-0507 ●●www.linear.com/LT1767
www.linear.com
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LT 1114 REV B • PRINTED IN USA
 LINEAR TECHNOLOGY CORPORATION 1999