iCE40 Ultra Wearable Development Platform User Guide EB100 Version 1.0, July 2015 iCE40 Ultra Wearable Development Platform Introduction The iCE40 Ultra Wearable Development Platform is an easy-to-use platform which demonstrates how the iCE40 Ultra and MachXO2 FPGAs can be utilized in wearable and mobile applications. Along with the evaluation board and accessories, there are reference designs available to demonstrate the functionality of the boards and components. The iCE40 Ultra Wearable Development Platform consists of two boards: the Main Board and the Sensor Board. The Main Board contains the iCE40 Ultra and MachXO2 FPGAs, which drive various components on the board. The iCE40 Ultra focuses on interfacing with peripheral components such as LEDs, sensors and BLE connectivity. The MachXO2 focuses on driving the MIPI DSI Display from a Quad SPI flash functioning as a frame buffer and storage device. The Sensor Board contains several sensors that are typically found in mobile and wearable devices. By separating the two boards, the interconnect headers can be used to directly interface with peripherals for testing (see the Headers section). The contents of this user guide include a description of the board features, header connection descriptions and pinouts, instructions on loading demonstration bitstreams, a complete set of schematics, and the bill of materials. Features The iCE40 Ultra Wearable Development Platform includes: • iCE40 Ultra Wearable Development Platform Main Board: — iCE40 Ultra (iCE5LP-4K-SWG36) device in a 36-ball WLCSP package — MachXO2 (LCMXO2-2000ZE-1UWG49) device in a 49-ball WLCSP package — High-current IR, White, and RGB LEDs — Stereo Microphones — Connector and driver circuitry for MIPI DSI Display — Headers for I2C, SPI, and UART — Mini-USB programming connection — Battery charger — RoHS-compliant packaging and process • iCE40 Ultra Wearable Development Platform Sensor Board: – Bluetooth Low-Energy Module – Heart-rate/SpO2 Sensor and Analog Front End – Skin temperature sensor – Pressure sensor – Accelerometer/Gyroscope – Pads for soldering on battery (charger accepts Li-Ion and Li-Po) • Syma 652030 Battery – 3.7 V, 250 mAh Lithium-Polymer Battery provides power while the USB cable is disconnected • LG LH154Q01 Display – 240x240 Single Lane MIPI DSI Display. Must be attached prior to power-up • USB Connector Cable – A mini-USB port provides power and a programming interface for the board • Watch Strap – A watch strap comes pre-attached to the Sensor Board Note: Static electricity can severely shorten the lifespan of electrical components. Use care while handling the iCE40 Ultra Wearable Development Platform to avoid ESD damage. 2 iCE40 Ultra Wearable Development Platform Figure 1 through Figure 4 show the top and bottom sides of the Main and Sensor boards, with key features highlighted. Figure 1. Main Board (Top Side) LED Select Jumper FTDI Power Jumper Reset Button User LEDs (XO2) Display Connector MachXO2 MachXO2 Config LED iCE5LP Config LED RGB LED iCE5LP High-Brightness LED IR LED Microphone (L) Battery Charger Status LEDs Figure 2. Main Board (Bottom Side) Backlight Driver Microphone (R) FTDI Programming Chip Power Switch Battery Charger Mini -USB Socket 3 iCE40 Ultra Wearable Development Platform Figure 3. Sensor Board (Top Side) Pressure Sensor Heart Rate/Oxygen Sensor Analog Front End Accelerometer/ Gyroscope Bluetooth Low Energy Module Figure 4. Sensor Board (Bottom Side) Heart Rate/Oxygen Sensor Skin Temperature Sensor 4 iCE40 Ultra Wearable Development Platform Lattice Semiconductor Devices The Main Board features an iCE5LP4K and a MachXO2-2000ZE FPGA. The iCE5LP4K has a 1.2 V core supply and is packaged in a 36-ball WLCSP package. For a complete description of this device, see DS1048, iCE40 Ultra Family Data Sheet. The MachXO2-2000ZE has a 1.2 V core supply and is packaged in a 49-ball WLCSP package. For a complete description of this device, see DS1035, MachXO2 Family Data Sheet. Software Requirements The following software must be installed before designs can be developed for this board: • iCEcube2 2014-12 (or higher) • Diamond® 3.4 (or higher) • Diamond Programmer 3.4 (or higher) This software is available at the Lattice website Design Software & IP page. Board Power The iCE40 Ultra Wearable Development Platform uses the USB connection as its primary source of power. It is also equipped with a battery and charger for use without a wired connection. A power switch (SW2) allows for the regulators to be disabled while allowing the battery to continue charging. Two status LEDs allow the battery charger to be monitored (see Table 12). The battery charger and regulators are located on the Main Board. The battery attaches to the Sensor Board. Power is transferred between the two boards using the Power Connector header. See Table 2 for connections. The VREG_ADJ I/O supply net for the iCE5LP is adjustable, but is an internal, reserved feature. Changing this net from 3.3 V (default) to 1.8 V will cause voltage-level mismatches that can permanently damage the iCE5LP. To allow current measurements to be made for specific supplies, resistors with test points have been inserted into the circuit. Refer to Table 1 to see which test points correspond to which supplies. Table 1. Supply Current Test Points TP+ TP- Resistance MachXO2 1.2 V Supply TP20 TP21 0.5 Ohms MachXO2 3.3 V TP18 TP19 0.5 Ohms iCE5LP 1.2 V TP20 TP33 0.5 Ohms iCE5LP 3.3 V TP18 TP32 0.5 Ohms 3.3 V Regulator TP16 TP17 0.5 Ohms Display 3 V TP25 TP24 0.5 Ohms Display 1.8 V TP22 TP23 0.5 Ohms 5 iCE40 Ultra Wearable Development Platform Headers Four headers are used to connect the Main Board and the Sensor Board. The signals and connections are shown in the tables below: Figure 5. Headers BLE Connector SPI Connector I2C Connector Power Connector Power Connector (Main Board J7, Sensor Board J5): Power connection between the two boards Table 2. Power Connector Pin Number Signal Description 1 3V3 Regulated 3.3 V supply 2 BT_3V7 Unregulated ~3.7 V battery voltage 3 VREG_ADJ Adjustable I/O Voltage (3.3 V default) 4 GND Ground I2C Connector (Main Board J5, Sensor Board): Interface for pressure sensor, temperature sensor, and accelerometer/gyroscope Table 3. I2C Connector Pin Number Signal iCE5LP Ball # 1 Sensor SCL C1 2 Sensor SDA E2 SPI Connector (Main Board J6, Sensor Board): Interface for the Analog Front-End of the Heart Beat/SpO2 sensor Table 4. SPI Connector Pin Number Signal iCE5LP Ball # 1 AFE SCLK D6 2 AFE MISO F6 3 AFE Ready B5 4 AFE SS D5 5 AFE MOSI E6 6 GND — 6 iCE40 Ultra Wearable Development Platform BLE Connector (Main Board J3, Sensor Board): Contains a UART connection to iCE5LP and a configuration SPI connection for the iCE5LP Table 5. BLE Connector Pin Number Signal Ball # 1 BLE Prog MachXO2 G2 2 BLE SS Config 3 BLE MISO Config 4 BLE MOSI Config 5 BLE SCLK Config 6 CRSTb — 7 CDONE MachXO2 E3 8 UART Rx (out) iCE5LP F5 9 UART Tx (in) iCE5LP E5 10 GND — Jumpers The following jumpers can be used for adjusting board functionality: • High-current LED select (J50): Controls whether the IR LED (1+2) or High-current White LED (2+3) is driven by the iCE5LP device • FTDI Power (J51): To minimize power consumption and increase battery life, the FTDI programming chip can have its power supply cut-off by removing the jumper from J51. J51 must be in place prior to powering up in order to program the devices on this board. 7 iCE40 Ultra Wearable Development Platform Test Points Several test points have been included into the design to ease debug. Descriptions of these test points can be found below: Table 6. Main Board Test Points Test Point Signal/Function 1 Configuration Signal: CResetn_FTDI 2 Configuration Signal: iCE_CDONE 3 Configuration Signal: FTDI_TCK (XO2) 4 Configuration Signal: FTDI_TDI (XO2) 5 Configuration Signal: FTDI_TDO (XO2) 6 Configuration Signal: FTDI_TMS (XO2) 11 Configuration Signal: JTAGEN (XO2) 12 Configuration Signal: PROGRAMN (XO2) 13 Configuration Signal: INITN (XO2) 16 Current Measurement (See Table 1) 17 Current Measurement (See Table 1) 18 Current Measurement (See Table 1) 19 Current Measurement (See Table 1) 20 Current Measurement (See Table 1) 21 Current Measurement (See Table 1) 22 Current Measurement (See Table 1) 23 Current Measurement (See Table 1) 24 Current Measurement (See Table 1) 25 Current Measurement (See Table 1) 28 Configuration Signal: FLASH_MISO (iCE) 29 Configuration Signal: FLASH_MOSI (iCE) 30 Configuration Signal: FLASH_CSB (iCE) 31 Configuration Signal: FLASH_SCLK (iCE) 32 Current Measurement (See Table 1) 33 Current Measurement (See Table 1) 34 3.3 V Regulator Output Control (See TPS7A7200) 35 3.3 V Regulator Output Control (See TPS7A7200) 36 3.3 V Regulator Output Control (See TPS7A7200) 8 iCE40 Ultra Wearable Development Platform Table 7. Sensor Board Testpoints Test Point Signal/Function 1 AFE4403: CLKOUT 2 BLE Config: SWCLK 3 LPS25H: INT1 4 AFE4403: TX3 5 AFE4403: INN 6 AFE4403: INP 7 AFE4403: ADC_RDY 8 AFE4403: LED_DRV_SUP 9 AFE4403: VCM 10 AFE4403: TXP 11 AFE4403: TXN 12 Battery Connector (+) 13 Battery Connector (-) 14 LSM330DLC: INT1_G 15 LSM330DLC: INT2_G 16 BLE Config: SWDIO 17 AFE4403: Manual Reset, short to TP18 18 AFE4403: Manual Reset, short to TP17 Device Interconnects Six general purpose connections have been made between Lattice MachXO2 and iCE5LP devices for communication between FPGAs. Level translators have been implemented on these lines, which limit their operation frequency. Table 8 lists connection ports and maximum operation frequencies: Table 8. MachXO2 and iCE5LP Interconnections Net Number MachXO2 Ball iCE5LP Ball Max Frequency 1 E6 C2 20 MHz 2 E5 B1 20 MHz 3 D5 D2 100 MHz 4 D4 B2 100 MHz 5 G4 B4 100 MHz 6 F4 F4 100 MHz 9 iCE40 Ultra Wearable Development Platform Display The iCE40 Ultra Wearable Development Platform includes an LG LH154Q01 Display and necessary driving circuitry. MIPI DSI clock and data signals are driven by the Lattice MachXO2 device, through a resistor network for achieving proper voltage levels. This display also provides a frame-sync signal, B_Sync, which is routed to a MachXO2 pin. Display supplies and the backlight driver are controlled by outputs from the MachXO2. Table 9. Display Signals Signal MachXO2 Ball Clock HS+ C4 I/O Type LVDS25 Clock HS- D3 (Auto) LVDS25 (Auto) Clock LP+ C7 LVCMOS12 Clock LP- C6 LVCMOS12 Data HS+ C1 LVDS25 LVDS25 (Auto) Data HS- D2 (Auto) Data LP+ A7 LVCMOS12 Data LP- B6 LVCMOS12 Reset B2 LVCMOS33 B_Sync A3 LVCMOS33 Backlight PWM C3 LVCMOS33 3 V Enable C2 LVCMOS33 1.8 V Enable E2 LVCMOS33 Note: For the high-speed differential signals (Clock HS, Data HS) only the positive channel must be assigned, the negative channel will be automatically placed. Clock Sources The Main Board has a single 27 MHz clock source that connects to the Lattice MachXO2 device. To use this external clock with the iCE5LP device, the 27 MHz clock can be routed from the MachXO2 via one of the six general purpose interconnects. These connections can be found in Table 8. Table 10. Clock Sources Source Frequency XO2 Ball iCE Ball Oscillator 27 MHz E4 — Reset Button A button (SW1) is included for performing resets of systems on board the iCE40 Ultra Wearable Development Platform. By default, this button will perform a configuration reset of the iCE5LP, MachXO2, and the Bluetooth module. Table 11. Reset Resistors and Pins Device Resistor FPGA Ball MachXO2 R110 B3 iCE5LP R62 Seeed BLE R63 — — Note: If VREG_ADJ (see the Board Power section) is changed, these resistors must be removed to prevent voltage level mismatches. 10 iCE40 Ultra Wearable Development Platform LEDs The Main Board has four system status LEDs, two user LEDs, an RGB LED, an IR LED, and a High-current White LED. The iCE40 Ultra has I/O ports specially built for sinking current from high-power LEDs. The RGB LED ports (A6, B6, and C6) are able to sink 24 mA each, while the high-current LED port (A2) is able to sink up to 500 mA. Please note that the IR LED is only rated for 100 mA and can be damaged by incorrectly configuring the port in custom designs. This is not a problem for the RGB LED and High-current White LED, since they are rated for more current than the ports can sink. The LED functions and FPGA connections are detailed below: Table 12. Main Board LEDs LED Number MachXO2 Ball iCE40 Ball D1 D2 — — D3 Config D4 E7 D5 F7 — — — — — D8 — — — — — — D9 (R) D9 (G) D9 (B) D10 D11 Function Power Source Connected Battery Charging MachXO2 CDONE User LED User LED Config iCE40 CDONE C6 RGB LED (Red) B6 RGB LED (Green) A6 RGB LED (Blue) A2* IR LED (see the Jumpers section) A2* High-current White LED (see the Jumpers section) Sensors and Peripherals The iCE40 Ultra Wearable Development Platform utilizes several third-party devices. Links for more information can be found below: Table 13. Main Board Sensors and Peripherals Name Microphone Reference Number Interface U6, U7 I2S FPGA Connections iCE5LP: Clock (F3), Data (E3) 11 Part Number Link MP34DB01 http://www.st.com/web/ en/catalog/sense_power/ FM125/SC1564/ PF250941 iCE40 Ultra Wearable Development Platform Table 14. Sensor Board Sensors and Peripherals Reference Number Interface FPGA Connections Part Number Temperature Sensor U7 I2C See Table 3 TMP112 http://www.ti.com/product/tmp112 Pressure Sensor U3 I2C See Table 3 LPS25H http://www.st.com/web/ catalog/sense_power/ FM89/SC1316/PF255230 Accelerometer/ Gyroscope U4 I2C See Table 3 LSM330DLC http://www.st.com/web/ en/catalog/sense_power/ FM89/SC1448/PF252427 Heart Rate & Oxygen Sensor U6 — — SFH7050 http://www.osramos.com/osram_os/en/ products/product-promotions/infrared-products/ sensor-family/biomonsensor-sfh-7050/index.jsp Analog Front End U2 SPI See Table 4 AFE4403 http://www.ti.com/product/afe4403 BLE Module U5 UART See Table 5 Seeed 113050012 http://www.seeedstudio.com/wiki/BLE_Micro Name Link Flash Memory Devices The Lattice MachXO2 and iCE5LP are each equipped with an external SPI Flash memory device. Table 15. Flash Devices Master Device Reference Number Part Number MachXO2 U5 Micron N25Q032A13ESC40G iCE5LP U10 Micron M25P80-VMN6TP The iCE5LP external Flash memory is intended for holding configuration data, while the MachXO2 external Flash memory is intended for storing data, such as images for the included display. Because of the target application, the Flash device connected to the MachXO2 is capable of using the higher-bandwidth Quad-SPI protocol. Table 16. Flash Connections Master Device Reference Number Signal FPGA Ball MachXO2 U5 DQ0 G1 DQ1 F5 DQ2 F3 iCE5LP U10 12 DQ3 G3 SCLK F6 CS G7 MISO F2 MOSI D1 SCLK E1 CS F1 iCE40 Ultra Wearable Development Platform Board Configuration and Programming Lattice MachXO2 The Lattice MachXO2 features internal configuration Flash. This allows configuration data to be stored internally while the external Flash memory device is used for auxiliary functions. 1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position. 2. Plug in the mini-USB cable (J1). 3. Launch Diamond Programmer. 4. Select Create a new project from a scan and click Detect Cable. 5. Select the FTUSB-1 Port. 6. Select MachXO2 and LCMXO2-2000ZE in the Device Family and Device columns. 7. Double click on the Operation column and select the appropriate operation. a. Internal Flash: Flash Programming Mode: SPI Flash Erase, Program, Verify b. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify 8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 6. 9. Select the programming bitstream in the “File Name” column. 10. Click the Program Icon or select Program from the Design dropdown menu. 13 iCE40 Ultra Wearable Development Platform Figure 6. MachXO2 External Flash Lattice iCE5LP The Lattice iCE5LP can be directly programmed, however, unless single-time programmable NVCM is used, the configuration data will be lost when the device is powered down. 1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position. 2. Plug in the mini-USB cable (J1). 3. Launch Diamond Programmer. 4. Select Create a new project from a scan and click Detect Cable. 5. Select the FTUSB-0 Port. 6. Select iCE5LP and iCE5LP4K in the Device Family and Device columns. 14 iCE40 Ultra Wearable Development Platform 7. Double click on the Operation column and select the appropriate operation a. Direct Program: CRAM Programming: Fast Program (Volatile) b. NVCM (Single-use): NVCM Programming Mode: NVCM Program, Verify, Secure c. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify 8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 7. 9. Select the programming bitstream in the File Name column 10. Click the Program Icon or select Program from the Design dropdown menu Figure 7. iCE5LP External Flash 15 iCE40 Ultra Wearable Development Platform Pre-Loaded Demonstration Design The iCE40 Ultra Wearable Development Platform comes pre-loaded with the Parallel-to-MIPI DSI demo. In order to run the demo, follow these steps: 1. Ensure that the display is attached in the proper orientation, with the connector ribbon extending toward the right edge of the device (see Figure 8). Figure 8. Display Connector 2. Plug a mini-USB cable into the mini-USB port (J1) to supply power to the device. 3. Switch power switch to the on position. 4. The screen should alternate between two images, with the User LEDs (D4, D5) indicating the demo mode. For more detailed operation instructions, please refer to the Quick Start User Guide included with the demo design. This demo design can be reprogrammed onto the board by downloading the project (see the Additional Demonstration Designs section) and following the documented instructions. Please note that in this demo, the MachXO2 uses its internal Flash to store configuration data and the external Flash to store image data, so two programming procedures must be performed. 16 iCE40 Ultra Wearable Development Platform Additional Demonstration Designs Several additional demonstration designs have been developed for the iCE40 Ultra Wearable Development Platform. These designs can be found under the Design File Tab of the Documentation section of the board web page here: http://www.latticesemi.com/ultrawearable. Ordering Information Description China RoHS Environment-Friendly Use Period (EFUP) Ordering Part Number iCE40 Ultra Wearable Development Platform ICE5LP4K-WDEV-EVN Technical Support Assistance Submit a technical support case through www.latticesemi.com/techsupport. Revision History Date Version July 2015 1.0 Change Summary Initial release. © 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 17 18 A B C D 5 J2 5035481220 2X6 MIPI DSI Display Connector U7 MP34DB01 Right Microphone U6 MP34DB01 Left Microphone Y2 ASCSM-27.000MHZ 27Mhz Oscillator Bank 5 LEDs D4-D5 iCE40 Ultra SWG36 Bank 0 IR LED 4 U9 U4 SPI Config Bank 2 LED D11 U5 N25Q032A NOR FLASH Video Frame Buffer Bank 2 XO2-2000ZE WLCS49 Bank 0 SW1 Reset Push Button Bank 1 RGB LED 4 D10 3 3 JTAG Config U10 M25P80 CFG SPI Flash 1 Port 1 Port 0 FT2232H FTDI USB 2 U2 Tuesday, June 02, 2015 Document Number <Doc> 1 Sheet WEARABLE SOLUTION - MAIN BOARD J1 Mini USB Connector 1 BQ24232 U1 Battery Charger Regulators of 7 Connect to Wearable (Bottom) Sensor Board Date: Size B Title Connect to Wearable (Bottom) Sensor Board U13,U14,U16 SW2 ON/OFF Switch Connect to Wearable (Bottom) Sensor Board Connect to Wearable (Bottom) Sensor Board Rev B Wearable (Top) Main Board 2 Voltage Header J7 2X2 D9 2X5 SPI UART CFG Header J3 SPI Header J6 2X3 I2C Header J5 1X2 5 A B C D iCE40 Ultra Wearable Development Platform Appendix A. Main Board Schematic Diagrams Figure 9. Block Diagram 19 A B C 5 i2c J4 Main Board IR LED iCE VLED RGB LED X02 Flash Button 4 LED Selector Sensor Board Osc Mag Mag J2 Cutout A. Front End SPI 4 Top Top Mag Mic Osc EEPROM Osc Level Shifter Flash 3 Cutout Mic Voltage 1.2 Reg Bottom Cutout Bottom USB FDTI J3 J7 SPI+ UART Switch Boost Regulator Battery Conn. Pads Acc/ Gyro Display Conn. Mag 3 Pressure Voltage J5 FTDI Power Cutout BLE J3 SPI+ UART Cutout D 5 2 Date: Size B Title 3.3 Reg Tuesday, June 02, 2015 Document Number <Doc> 1 1 Sheet WEARABLE SOLUTION - MAIN BOARD Battery Chg 3, 1.8 Reg i2c J5 Temp PPG LED Driver SPI Cutout J6 2 2 of 7 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 10. Mechanical Design A B C 5 C1 4.7uF 10V C0402 BT_3V7 D1 YELLOW R1 1K 5% R0402 VOUT_BT C2 0.1uF 16V C0402 1 2 4 C3 0.1uF 16V C0402 C4 1uF 16V C0402 D2 GREEN R2 2K 5% R0402 VOUT_BT +5V_USB 3 2 7 9 1 2 3 13 R3 10K 5% R0402 BT_3V7 VSS EPAD CE_L TMR ITERM ILIM ISET EN1 EN2 OUT1 OUT2 3 BQ24232 Manufacturer = TI PART_NUMBER = BQ24232RGTT PGOOD_L CHG_L TS BAT1 BAT2 IN U1 8 17 4 14 15 12 16 6 5 10 11 R4 4.32K 1% R0402 C5 4.7uF 10V C0402 R5 2.94K 1% R0402 C6 0.1uF 16V C0402 R6 3.57K 1% R0402 VOUT_BT Input Current Limit is set to be 500 mA Fast-charge current is set to be 200 mA R7 DNL R0402 2 Iterm is set to be 25 mA. Default timings are used for timer programming. 5-hour fast charge and 30-minute precharge +5V_USB 2 4 1 2 20 1 D 5 1 Date: Size B Title Tuesday, June 02, 2015 Document Number <Doc> 1 Sheet WEARABLE SOLUTION - MAIN BOARD Battery Charger Connections 3 of 7 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 11. Battery Charger Connections Manufacturer = Osram PART_NUMBER = LG L29K-G2J1-24-Z Manufacturer = Lite-On Inc PART_NUMBER = LTST-C193KSKT-5A A B C 600ohm, 500mA L0603 5 S4 S2 ID 4 G 5 C17 0.1uF C0402 16V D+ 3 1 V3P3_FTDI 5V D- 2 J1 USB PWR 1 L3 S1 S3 2 2 6 U3 CS CLK DIN DOUT 5 4 3 1 4 C13 10uF 10V C0402 R17 10K 5% R0402 V3P3_FTDI 93LC56BT PART_NUMBER = 93LC56BT-I/OT Manufacturer = Microchip Technology VSS VCC L2 600ohm, 500mA L0603 +5V_USB 2 1 USB-B MINI 2 C14 0.1uF 50V C0402 R18 10K 5% R0402 1 R20 R0402 1 J51 1X2 HEADER_RT_ANGLE PART_NUMBER = M22-5330205 Manufacturer = Harwin Inc 2 2 2.2K 5% 1 V3P3_FTDI R19 10K 5% R0402 EECS EESK EEDATA VCC18FT C15 27pF 50V C0402 C11 10uF 10V C0402 V3P3_FTDI 1 150mA 3 C16 27pF 50V C0402 12k R0402 R8 1% Y1 12MHz 2.2k R0402 R68 5% 3 600ohm, 500mA L0603 L1 V3P3_FTDI C12 0.1uF 16V C0402 2 V3P3_REG 13 63 62 61 3 2 8 7 6 14 50 49 60mA TEST EECS EECLK EEDATA OSCO OSCI DP DM REF RESET# VREGIN VREGOUT U2 C7 4.7uF 16V C0402 C8 0.1uF 16V C0402 FT2232H C9 0.1uF 16V C0402 V3P3_FTDI FTDI High-Speed USB AGND 3 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 4 4 4 9 VPHY VPLL 20 31 42 56 VCCIO1 VCCIO2 VCCIO3 VCCIO4 12 37 64 VCORE1 VCORE2 VCORE3 10 21 1 5 11 15 25 35 47 51 D 5 36 60 48 52 53 54 55 57 58 59 38 39 40 41 43 44 45 46 26 27 28 29 30 32 33 34 16 17 18 19 21 22 23 24 C10 0.1uF 16V C0402 R12 R13 R14 R15 2 Date: Size B Title FT2232HQ PART_NUMBER = FT2232HQ Manufacturer = FTDI SUSPEND# PWREN# BCBUS0 BCBUS1 BCBUS2 BCBUS3 BCBUS4 BCBUS5 BCBUS6 BCBUS7 BDBUS0 BDBUS1 BDBUS2 BDBUS3 BDBUS4 BDBUS5 BDBUS6 BDBUS7 ACBUS0 ACBUS1 ACBUS2 ACBUS3 ACBUS4 ACBUS5 ACBUS6 ACBUS7 ADBUS0 ADBUS1 ADBUS2 ADBUS3 ADBUS4 ADBUS5 ADBUS6 ADBUS7 2 R16 1K 5% R0402 R10 4.7K 5% R0402 R11 4.7K 5% R0402 Tuesday, June 02, 2015 Document Number <Doc> 1 Sheet WEARABLE SOLUTION - MAIN BOARD 0 0 0 0 R9 4.7K 5% R0402 V3P3_REG [6] [6] [6] [6] TP3 TP4 TP5 TP6 4 of FTDI_TCK [5] FTDI_TDI [5] FTDI_TDO [5] FTDI_TMS [5] TP1 TP2 7 iCE_CDONE [6] CRESETn_FTDI [6] FTDI_SSB FTDI_SCLK FTDI_DO FTDI_DI USB-FTDI Connections 1 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 12. USB-FTDI Connections 22 R34 330 R35 330 R36 30 MIPI_Clock_out_HS_P MIPI_Clock_out_HS_N MIPI_Clock_out_LN PWM_CTRL R67 5% 33 XO2_CLK R0402 R0402 0 R40 10k 5% R0402 5 SEC 3/4 LCMXO2-2000ZE 2 3 8 EN ILED VIN U8 SW PGND GND VOUT FB LED DRIVER LCMXO2-2000ZE-1UWG49 PL5A PL5B PL3A PL3B PL2A || GPLLT_IN PL2B || GPLLC_IN VCCIO5 U4C TPS61061 Manufacturer = TI PART_NUMBER = TPS61061 R41 E6 E5 XO2_iCE1_LT XO2_iCE2_LT V3P3_REG C7 C6 B7 MIPI_Clock_out_LP MIPI_Clock_out_LN C34 1uF 16V C0402 3 LED+ LED- 7 4 5 1 L4 6 BANK5 A B OUT VCC V3P3_REG MIPI_Clock_out_N MIPI_Clock_out_P MIPI_Data_0_out_N 27.000MHz PART_NUMBER = ASCSM-27.000MHZ-LR-T Manufacturer = Abracon GND TS Y2 A7 B6 C22 0.1uF 16V C0201 2 1 4 R0201 5% R0201 5% R0201 5% R0201 5% R0201 5% 27MHZ Clock MIPI_Data_0_out_LP MIPI_Data_0_out_LN C21 1uF 16V C0402 V1P2_XO2 TS_CLK R33 30 MIPI_Clock_out_LP V3P3_REG R32 30 MIPI_Data_0_out_LN R0201 5% R0201 5% 0201 R31 330 MIPI_Data_0_out_HS_N C6273 C 0.1uF 16V C0402 D R30 330 MIPI_Data_0_out_HS_P MIPI_Data_0_out_P R42 12 5% R0402 C20 0.1uF 16V C0201 B1 A1 INITN CDONE 4 C35 1uF 35V C1206 22uH L0805 C29 0.1uF 16V C0402 V3P3_REG V3P3_REG Duty Cycle is = 80% C1 6 1 8 C2 D1 D2 GND B2 B1 VCCB B2 B1 A1 A2 VSS DQ0 DQ1 DQ2 DQ3 4 5 2 3 7 NOR Flash Manufacturer = Micron PART_NUMBER = N25Q032A13ESC40G SCLK CS_L VCC U5 NOR Flash XO2_DQ0 XO2_DQ1 XO2_DQ2 XO2_DQ3 XO2_iCE2 XO2_iCE1 2-BIT_TRANSLATOR Manufacturer = Texas Instruments PART_NUMBER = TXB0102YZPR OE A2 A1 VCCA C6272 0.1uF 16V C0402 3 Place Flash part as close to XO2 as possible XO2_SCLK XO2_CS XO2_iCE2_LT XO2_iCE1_LT VREG_ADJ PT24C || INITN PT24D || DONE PT24A PT24B PT23A PT23B PT20C || JTAGEN PT20D || PROGRAMN PT20A PT20B PT18C PT18D || SDA PT17A || PCLKT PT17B || PCLKC PT16C || TCK PT16D || TMS PT12C || TDO PT12D || TDI PT10A PT10B SEC 1/4 LCMXO2-2000ZE VCCIO0_1 VCCIO0_2 U4A DONE U12 C1 D2 MIPI_Data_0_out_HS_P MIPI_Data_0_out_HS_N C6271 0.1uF 16V C0402 E2 C2 Enable_LED_1V8 Enable_LED_3V0 V1P2_REG F2 F1 A3 B2 B_Sync Display_reset_LT JTAGEN PROGRAMN B3 C3 RESET_XO2 PWM_CTRL B4 B5 C4 D3 FTDI_TCK FTDI_TMS [4] [4] A6 C5 D5 D4 A2 A5 MIPI_Clock_out_HS_P MIPI_Clock_out_HS_N FTDI_TDO FTDI_TDI [4] [4] XO2_iCE3_LT XO2_iCE4_LT C19 0.1uF 16V C0201 3 LCMXO2-2000ZE-1UWG49 TP13 Enable_LED_1V8 Enable_LED_3V0 TP11 TP12 RESET_XO2 C18 1uF 16V C0402 V3P3_XO2 D3 GREEN R24 2k2 [7] 5% [7] R0402 V3P3_XO2 [6] 4 R117 1K 5% R0402 V3P3_REG XO2_iCE2 XO2_iCE1 [6] [6] C27 0.1uF 16V C0201 V1P2_XO2 [6] [6] SEC 4/4 3 2 1 NC B VCCB GND GND GND GND 4 5 VEE_V1P8 XO2_iCE3 XO2_iCE4 XO2_iCE5 XO2_iCE6 6 R111 C6265 0.1uF C0201 2 Date: Size B Title C2 C3 D3 2 4 6 8 10 12 GND B3 B4 B1 B2 VCCB A2 D2 C1 D1 A1 B1 1 3 5 7 9 11 1 Sheet C6269 0.1uF 16V C0402 XO2_iCE3_LT XO2_iCE4_LT XO2_iCE5_LT XO2_iCE6_LT V3P3_REG LCMXO2-2000ZE-1UWG49 PB25A || SN PB25B || SI PB16A || PCLKT PB16B || PCLKC PB12A PB12B PB11A || PCLKT PB11B || PCLKC PB8A || MCLK PB8B || SO 5 of 7 MIPI_Data_0_out_P MIPI_Data_0_out_N MIPI_Clock_out_P MIPI_Clock_out_N 503548-1220 Manufacturer = Molex Inc PART_NUMBER = 5035481220 J2 Tuesday, June 02, 2015 Document Number <Doc> SEC 2/4 LCMXO2-2000ZE PB5A || CSSPIN PB3A PB3B VCCIO2 WEARABLE SOLUTION - MAIN BOARD B_Sync Display_reset LED+ LED- G2 G1 G4 G3 F4 F3 E4 E3 F6 F5 G7 E7 F7 G6 U4B 4-BIT_TRANSLATOR Manufacturer = Texas Instruments PART_NUMBER = TXB0104YZTR OE A3 A4 A1 A2 VCCA U11 VDD_V3P0 VEE_V1P8 XO2_iCE3 XO2_iCE4 A3 B3 B2 VREG_ADJ BLE_MOD_prog XO2_DQ0 XO2_iCE5_LT XO2_DQ3 XO2_iCE6_LT XO2_DQ2 XO2_CLK BLE_MOD_CDONE XO2_SCLK XO2_DQ1 XO2_CS XO2_iCE5 XO2_iCE6 C6270 0.1uF 16V C0402 A4 D6 E1 G5 BLE_MOD_prog DNL R0402 C24 0.1uF 16V C0201 XO2_LED1 XO2_LED2 C23 1uF 16V C0402 V3P3_XO2 1-BIT_TRANSLATOR Manufacturer = Texas Instruments PART_NUMBER = SN74AUP1T34DSFR GND A VCCA U15 [6] [6] [6] [6] 1 XO2-2000ZE Connections BLE_MOD_CDONE TS_CLK D4 Red R26 1K 5% R0402 V3P3_XO2 LCMXO2-2000ZE 2 LCMXO2-2000ZE-1UWG49 VCC VCC V3P3_REG D1 D7 Display_reset_LT C6266 0.1uF C0201 C28 0.1uF 16V C0201 U4D D5 Red R27 1K 5% R0402 1 2 R0201 5% 1 2 5 1 R25 30 EP BANK0 9 BANK2 2 MIPI_Data_0_out_LP Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 13. MachXO2-2000ZE Connections A B C BLUE R97 R0201 R95 R0201 R94 R0201 0 0 0 5 6 1 3 5 FLASH_SCLK CS WP SCK SDI R45 10k 5% R0402 U10 FLASH_MOSI R44 1K 5% R0402 V3P3_REG R110 R63 R62 HOLD SDO [6] FLASH_MISO R46 10k 5% R0402 V3P3_REG CRESETn_FTDI J50 3 2 1 D10 IR_LED V3P3_REG C30 10uF 10V C0402 [4] 4 R39 DNL C31 0.1uF 16V C0402 VDD_MIC1 CRESETn_FTDI [5] iCE_CDONE RESET_XO2 [4] 2 LR VDD U6 GND CLK DOUT 5 MIC_CLK MIC_DATA 0 R0402 0 R0402 VREG_ADJ 1 4 C1 E2 D3 E4 F2 D1 E1 F1 Sensor_SCL Sensor_SDA CRESET_iCE iCE_CDONE SPI_MISO SPI_MOSI SPI_SCLK SPI_CS BANK0 BANK1 iCE5LP4K CRESET_B IOB_12A_G4_CDONE IOB_32A_SO_MISO_SPI1 IOB_33B_SI_MOSI_SPI1 IOB_34A_SCK_SCK_SPI1 IOB_35B_SS_MCSNO_SPI1 IOB_30A IOB_29B IOB_16A IOB_20A IOB_25B_G3 IOB_26A IOB_27B IOB_31B IOB_10A IOB_11B_G5 IOT_46B_G0 RGB2 RGB1 RGB0 IRLED VCCIO_0 VCC U9 R113 R112 3 C32 10uF 10V C0402 R43 0 R0402 C33 0.1uF 16V C0402 VDD_MIC2 VDD_MIC2 VDD_MIC1 2 LR VDD U7 GND CLK DOUT RIGHT MIC 5 1 4 2 2 1 A3 C5 A1 F6 E6 D6 D5 F5 E5 C44 0.1uF 16V C0201 [5] VREG_ADJ 2 1 R106 10k 5% R0201 Date: Size B Title TP31 SPI_SCLK FTDI_SCLK TP30 FTDI_SSB SPI_CS TP29 FTDI_DO SPI_MISO TP28 FTDI_DI SPI_MOSI Tuesday, June 02, 2015 1 Sheet 6 of 7 MODULE BLE_MOD_prog BLE_MOD_FLASH_CSB BLE_MOD_iCE40_MISO BLE_MOD_iCE40_MOSI BLE_MOD_FLASH_SCLK 2x5 HEADER BLE Manufacturer = Molex Inc PART_NUMBER = 0015910100 1 2 3 4 5 WEARABLE SOLUTION - MAIN BOARD Document Number <Doc> AFE_RDY Rev B [5] AFE_SPI_MISO AFE_SPI_SCLK 2X3 HEADER Manufacturer = Molex Inc PART_NUMBER = 0015910100 3 1 6 J6 SPI SENSOR 2 J3 [4] R52 BLE_MOD_iCE40_MOSI R0402 R51 R0402 R49 R0402 5 10 9 8 7 6 [4] R59 BLE_MOD_iCE40_MISO R0402 R57 R0402 R54 R0402 4 Sensor_SDA [4] R60 BLE_MOD_FLASH_CSB R0402 R58 R0402 R55 R0402 AFE_SPI_MOSI Sensor_SCL [4] R53 BLE_MOD_FLASH_SCLK R0402 R50 R0402 R48 R0402 AFE_SPI_STE R107 10k 5% R0201 UART_TX UART_RX BLE_MOD_CDONE BLE_MOD_CRSTb I2C SENSOR 0 0 0 0 0 0 0 0 0 0 0 0 Place 0 ohm resistors for SPI flash as close to the iCE part as possible FLASH_MISO FLASH_MOSI FLASH_CSB FLASH_SCLK 1X2 SOCKET Manufacturer = Sullins PART_NUMBER = NPPC021KFXC-RC J5 AFE_SPI_MISO AFE_SPI_MOSI AFE_SPI_SCLK AFE_SPI_STE UART_RX UART_TX C46 1uF 16V C0402 V3P3_iCE V1P2_iCE Place Near FPGA Pin R47 C38 C45 0 0.1uF 1% 10nF 16V 16V R0402 C0201 C0201 CDBU0520 2 D12 1 iCE5LP4K Connections V3P3_iCE C4 Place Near FPGA Pin C48 C47 10nF 0.1uF 16V 16V C0201 C0201 B3 D4 MIC_CLK MIC_DATA GND1 GND2 VSSIO_LED MIC_RIGHT Manufacturer = STMicroelectronics PART_NUMBER = MP34DB01TR R38 DNL 3 VCCIO_2 VCCPLL VPP_2V5 IOB_2A_MISO_SPI2 IOB_3B_G6_MOSI_SPI2 IOB_4A_SCK_SPI2 IOB_5B_MCSN0_SPI2 IOB_6A IOB_7B BANK2 Place Near FPGA Pin C3 SPI_VCCIO1 C51 C49 C50 0.1uF 1uF 10nF 16V 16V 16V C0201 C0402 C0201 iCE5LP4K Manufacturer = Lattice PART_NUMBER = iCE5LP-4K-SWG36 VREG_ADJ XO2_iCE1 XO2_iCE2 XO2_iCE3 XO2_iCE4 XO2_iCE5 XO2_iCE6 F3 E3 C2 B1 D2 B2 B4 F4 B5 A6 B6 C6 A2 MIC_CLK MIC_DATA 500mA traces iCE40_IRLED AFE_RDY Place Near FPGA Pin A4 C41 C39 C40 10nF 0.1uF 1uF 16V 16V 16V C0201 C0402 C0201 V3P3_iCE MIC_LEFT Manufacturer = STMicroelectronics PART_NUMBER = MP34DB01TR R37 0 R0402 3 LEFT MIC DONE D8 GREEN R56 1K 5% R0201 [5] [5] [5] [5] [5] [5] 3 Place Near FPGA Pin A5 C43 C37 C42 10nF 1uF 0.1uF 16V 16V 16V C0201 C0402 C0201 V1P2_iCE [6] iCE40_BLUE [6] iCE40_GREEN [6] iCE40_RED D11 LED V3P3_REG VREG_ADJ 1X3 R/A HEADER Manufacturer = Harwin Inc PART_NUMBER = M22-5330305 [6] [6] BLE_MOD_CRSTb RESET_XO2 iCE40_RED iCE40_GREEN iCE40_BLUE Manufacturer = OSRAM PART_NUMBER = SFH 4645 NOR-FLASH Manufacturer = Micron PART_NUMBER = M25P80-VMN6TP 7 2 C36 0.1uF 16V C0402 V3P3_REG 0 R0402 0 R0402 0 R0402 Push Button CRESET_iCE C53 0.1uF 16V C0402 R61 10k 5% R0402 NOR Flash FLASH_CSB 2 3 4 TRICOLOUR_LED Manufacturer = Kingbright PART_NUMBER = APTF1616SEEZGQBDC RED GREEN Manufacturer = E-Switch PART_NUMBER = TL1015AF160QG CRST PB SW1 1 VREG_ADJ V3P3_REG 1 2 D D9 1 2 100mA trace 4 PART_NUMBER = XBDAWT-00-0000-00000LCE3 Manufacturer = Cree Inc 1 Tri Colour 8 VCC GND 4 23 2 5 A B C D iCE40 Ultra Wearable Development Platform Figure 14. iCE5LP4K Connections A B C D C63 1uF C0402 16V 0.5 C55 4.7uF 10V C0402 2 5 4 U14 3 4 1 J7 2 400mV 800mV 1.6V GND EPAD1 FB SNS OUT1 OUT2 8 9 10 7 17 2 1 15 16 1.2EN 3 1 REG_ENABLE V1P2_REG R115 R102 TP20 TPS7A7200 Manufacturer = Texas Instruments PART_NUMBER = TPS7A7200RGTT 50mV 100mV 200mV SS PG EN IN1 IN2 1.2VO 4 5 6 11 3 12 13 14 MIC5504 Manufacturer = Micrel Inc PART_NUMBER = MIC5504-1.2YMT TZ GND EP VIN U16 TP34 TP35 TP36 REG_ENABLE TP17 V3P3_REG 2X2 HEADER Manufacturer = Molex Inc PART_NUMBER = 0015910100 BT_3V7 POWER CONNECTOR 0.5 0.5 C56 220pF 25V C0402 VREG_ADJ 5 4 Input / Output capacitor's requirement - ESR < 1 ohms, X7R / X5R type is recommended C60 1uF C0402 16V R116 10K 5% R0402 V3P3_REG VOUT_BT C70 100uF 10V C1206 R100 TP16 VOUT_BT 2 1 C67 1uF C0402 16V V1P2_XO2 C6276 22uF 10V C0603 TP33 TP21 C6275 1uF 16V C0402 V1P2_iCE R109 VEE_V1P8 R108 V3P3_REG R114 1.2 V @ 3.0 mA C71 4.7uF 10V C0402 R101 V3P3_REG TP18 0.5 0.5 0 DNI 0 DI TP32 3 SW2 4 5 6 7 4 5 6 7 R104 TP24 0.5 Enable_LED_3V0 TP25 2 1 6 4 3.0EN 3.0VO U13 1.8EN 1.8VO C62 0.1uF C0402 16V VOUT_BT 2 0.5 Date: Size B Title Tuesday, June 02, 2015 Document Number <Doc> C69 1uF C0402 16V 1 Sheet WEARABLE SOLUTION - MAIN BOARD [5] VEE_V1P8 1.8 V @ 1.5 mA Enable_LED_1V8 TP23 MIC5320 Manufacturer = Micrel Inc PART_NUMBER = MIC5320-PGYMT TR R103 Enable_LED_1V8 5 3 TP22 C61 1uF C0402 16V 7 Regulator Connections Danger: This resistor option supports 1.8V for bank 1 of the iCE5LP4K. The SEEED BLE, FTDI, FLASH and XO2, still are powered by a 3.3V rail. It is required to also pull all 0 ohm resistors related to the BLE, FTDI and FLASH that are connected to the SPI bus. It is also required that the XO2 be un-programmed or have signals connected between the XO2 and iCE part set to high impedance. If this action is not performed the iCE5LP4K could become permanently damaged ON/OFF SWITCH Manufacturer = C&K PART_NUMBER = PCM12SMTR 1 2 3 [5] Enable_LED_3V0 C68 1uF C0402 16V VDD_V3P0 3.0 V @ 1.5 mA VREG_ADJ C6274 1uF 16V C0402 V3P3_iCE C54 1uF 16V C0402 V3P3_XO2 3.3 V @ 2 A TP19 1 2 3 ON/OFF SWITCH VOUT_BT REG_ENABLE 3 1 VIN 4 GND 2 EP 24 7 5 of 7 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 15. Regulator Connections A B C D 5 From MAIN Board 1.8V or 3.3V Solderable Battery Contact VREG_ADJ GND 4 Solderable Battery Contact LSM330DLC Accel. & Gyro LPS25H Pressure Sensor TMP112 Temperature Sensor BT_3V3 3.3V I2C I2C I2C Wearable (Bottom) Sensor Board 4 U4 U3 U7 3 3 U6 SFH7050 Heart Rate & Oxygen Sensor 2 BLE Module AFE4403 Analog Front End 2 Date: Size B Title SPI SPI Tuesday, June 02, 2015 Document Number <Doc> Wearable _Sensor_Board U5 U2 2X3 SPI Header J2 2X5 1X2 I2C Header J4 2X2 Voltage Header J5 25 SPI/UART CFG Header J3 5 1 Sheet 1 1 of 5 Rev B A B C D iCE40 Ultra Wearable Development Platform Appendix B. Sensor Board Schematic Diagrams Figure 16. Block Diagram 26 A B C 5 Main Board IR LED iCE VLED RGB LED X02 Flash Button 4 i2c LED Selector Sensor Board Osc J2 J4 Cutout A. Front End SPI 4 Mag Mag Top Voltage Mag Osc EEPROM Osc Level Shifter Flash Mic 3 3 Boost Regulator Battery Conn. Pads Acc/ Gyro Pressure Display Conn. J5 Mag FTDI Power Top Cutout BLE J3 SPI+ UART Cutout D 5 Bottom USB FDTI J3 J7 Voltage 1.2 Reg Switch Mic Cutout SPI+ UART Bottom Cutout 2 2 J5 J6 Cutout i2c SPI 3.3 Reg Date: Size B Title Battery Chg 3, 1.8 Reg LED Driver Temp PPG Tuesday, June 02, 2015 Document Number <Doc> Wearable _Sensor_Board 1 Sheet 1 2 of 5 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 17. Mechanical Design 27 Sensor_SCL R13 Sensor_SDA R14 5 C6 0.1uF X5R 16V C0402 7 8 9 21 25 GND ADD0 2 4 1 6 2 3 4 5 10 11 12 13 14 15 23 19 20 TMP112 Manufacturer = TI PART_NUMBER = TMP112AIDRLT ALERT SCL SDA V+ 4 Place temperature sensor far away from battery and charging circuit I2C Address: 1001000b 3 1 6 5 U7 Temperature Sensor R15 R0402 10K GND1 GND2 RES1 RES2 RES3 RES4 RES5 RES6 RES7 RES8 RES9 CAP CS_A INT2_A INT1_A LSM330DLC PART_NUMBER = LSM330DLCTR Manufacturer = STMicroelectronics SCL_A/G SDA_A/G SDO_G SDO_A CS_G DRDY_G/INT2_G INT1_G DEN_G VDD_IO1 VDD_IO2 VDD1 VDD2 VDD3 I2C Address: 0011001b 24 28 26 27 22 17 18 16 R1 10K R0402 VREG_ADJ 0 R0402 0 R0402 0 R0402 0 R0402 Sensor_SCL R3 Sensor_SDA R2 1 1 C4 0.1uF C0402 16V VREG_ADJ TP15 TP14 C2 VREG_ADJ 0.1uF C0402 16V C3 0.1uF C0402 16V U4 Accelerometer A B C C1 10uF C0805 16V 3V3 3V3 C5 0.01uF C0402 16V VREG_ADJ UART_TX UART_RX BLE_MOD_CDONE BLE_MOD_CRSTb 1 2 3 4 5 R4 R5 R6 R7 R8 R0402 R0402 R0402 R0402 R0402 3 C8 4.7uF C0603 16V VREG_ADJ C9 0.1uF C0402 16V TP3 1 GND SWCLK SWDIO VCC BLE Micro p13 p12 p11 p10 p9 R9 0 R0402 UART_RX UART_TX 27 26 25 24 23 22 21 20 19 U5 R10 0 R0402 SCL_SPC GND1 GND2 Reserved SDO_SA0 SDA_SDI_SDI/SDO LPS25H LPS25H PART_NUMBER = LPS25HTR Manufacturer = STMicroelectronics INT1 CS VDD_IO VDD U3 2 I2C Address: 1011100b 7 6 1 10 GND p18 p17 p23 p24 p25 p28 p29 p30 SeeedBLE Manufacturer = Seeed PART_NUMBER = 113050012 Pressure Sensor VREG_ADJ C10 0.1uF C0402 16V 2 Seeed BLE Module BLE_MOD_prog BLE_MOD_FLASH_CSB BLE_MOD_iCE40_MISO BLE_MOD_iCE40_MOSI BLE_MOD_FLASH_SCLK 0 0 0 0 0 2X5 SOCKET Manufacturer = Sullins PART_NUMBER = NPPC052KFMS-RC 10 9 8 7 6 J3 BLE MODULE BLE_MOD_CRSTb BLE_MOD_FLASH_CSB BLE_MOD_iCE40_MISO BLE_MOD_iCE40_MOSI BLE_MOD_FLASH_SCLK C7 0.1uF C0402 16V 3V3 TP2 TP16 1 3 1 D 4 p8 p7 p6 p5 p4 p3 p2 p1 p0 18 17 16 15 14 13 12 11 10 5 8 9 3 5 4 2 1 2 3 4 5 6 7 8 9 R17 R16 Date: Size B Title R11 Tuesday, June 02, 2015 Document Number <Doc> Wearable _Sensor_Board Sensor_SDA J4 1 Sheet 3 of 1X2 Header Manufacturer = Molex Inc PART_NUMBER = 0015910100 2 1 I2C Socket Sensor_SCL Sensor_SDA Sensor_SCL BLE_MOD_prog 0 BLE_MOD_CDONE R0402 R12 10K R0402 0 R0402 0 R0402 3V3 Sensor Connections - 1 1 5 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 18. Sensor Connections - 1 28 5 4 INP INN SFH7050 Red LED Infrared LED 5 SFH7050 Manufacturer = OSRAM PART_NUMBER = SFH7050 PA PC U6 Green LED A B C Photodiode D 5 IC IA RC RA GC GA 0 8 0 R20 R21 R0402 R18 R0402 TX_LED_N R19 R0402 DNL R0402 TX_LED_P 7 DNL 3 6 TX_LED_3 LED_DRV_SUP 1 2 4 4 TP9 0.001 V5P0_AFE TP4 TP11 TP10 TP5 0 1 1 1 1 1 1 VCM_OUT C12 0.01uF C0402 16V TP6 1 3V3 R22 R1206 TP8 R24 R0402 3 C17 0.1uF C0402 16V 3V3 C16 0.1uF C0402 16V RX_ANA_SUP ADC_RDY DIAG_END SCLK SPISIMO SPISOMI SPISTE CLKOUT RESET_L AFE_PDN_L C18 0.1uF C0402 16V A1 B5 B6 C1 D3 E3 F5 D2 E2 B2 F6 A3 C3 D5 B4 3V3 C19 0.1uF C0402 16V 1 R26 R0402 TP73V3 2 C20 0.1uF C0402 16V V5P0_AFE 5 J2 3 2 1 AFE_RDY AFE_SPI_MISO AFE_SPI_SCLK Tuesday, June 02, 2015 Document Number <Doc> Wearable _Sensor_Board 1 Sheet 4 of SPI pins will go to GPIO pins on main boards iCE device 2X3 SOCKET PART_NUMBER = NPPC032KFMS-RC Manufacturer = Sullins 6 4 AFE_SPI_MOSI SPI SENSOR TP17 T POINT R TP18 T POINT R AFE_SPI_STE C15 8pF C0402 Date: Size B Title C23 1uF C0402 16V 8MHz Y1 TX_CTRL_SUP 10K AFE_RDY AFE_SPI_SCLK AFE_SPI_MOSI AFE_SPI_MISO AFE_SPI_STE C6 C4 C5 D6 TP1 R25 10K R0402 1 3V3 1 Sensor Connections - 2 C14 8pF C0402 2 E6 D4 F4 F3 RX_DIG_SUP DNC_A1 DNC_B5 DNC_B6 DNC_C1 DNC_D3 DNC_E3 DNC_F5 VSS RX_ANA_GND RX_DIG_GND_B2 RX_DIG_GND_F6 AFE4403 Manufacturer = TI PART_NUMBER = AFE4403YZPT BG TX3 TXN TXP INN INP VCM TX_REF TX_CTRL_SUP RX_DIG_SUP XIN XOUT LED_DRV_GND AFE4403 RX_ANA_SUP_E4 RX_ANA_SUP_F2 LED_DRV_SUP U2 V5P0_AFE C2 B3 A4 A5 F1 E1 D1 B1 A2 E5 E4 F2 A6 LED_DRV_SUP C13 2.2uF 16V C0402 TX_LED_3 TX_LED_N TX_LED_P INN INP 1K C11 2.2uF C0402 16V R23 R0402 LED_DRV_SUP 3 5 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 19. Sensor Connections - 2 29 A B C D 5 5 4 4 C21 10uF 6.3V C0603 3V3 R27 10K R0402 BT_3V3 4 2 L1 0.47uH L2016 B3 B1 B2 AGND PGND1 PGND2 VOUT1 VOUT2 C3 C1 C2 A1 A2 3 C22 22uF 6.3V C0603 V5P0_AFE Through hole test pads for battery soldering FAN48610 Manufacturer = Fairchild PART_NUMBER = FAN48610UC50X EN SW1 SW2 VIN TP13 80_MIL_PAD U1 TP12 80_MIL_PAD A3 VREG_ADJ 2X2 SOCKET Manufacturer = Harwin Inc PART_NUMBER = M20-7870246 3 J5 1 1 3V3 1 BT_3V3 Power Connector 3 2 2 Date: Size B Title Tuesday, June 02, 2015 Document Number <Doc> Wearable _Sensor_Board 1 Sheet Regulator Connections 1 5 of 5 Rev B A B C D iCE40 Ultra Wearable Development Platform Figure 20. Boost Regulator iCE40 Ultra Wearable Development Platform Appendix C. Main Board Bill of Materials Figure 21. Main Board Bill of Materials Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description 1 C1,C5,C55,C71 4 4.7uF C0402 — C1005X5R1A475K050BC TDK CAP CER 4.7 µF 10 V 10% X5R 0402 2 C2,C3,C6,C6269, C6270,C6271,C6272 7 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402 3 C4 1 1uF C0402 — GRM155R61C105KE01D Murata CAP CER 1 µF 16 V 10% X5R 0402 4 C7 1 4.7uF C0402 — C1005X5R1A475K050BC TDK CAP CER 4.7 µF 10 V 10% X5R 0402 5 C8,C9,C10,C12,C14, C17,C29,C31,C33, C36,C53,C62,C6273 13 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402 6 C11,C13,C30,C32 4 10uF C0402 — CL05A106MP5NUNC Samsung CAP CER 10 µF 10 V 20% X5R 0402 7 C15,C16 2 27pF C0402 — CL05C270JB5NNNC Samsung CAP CER 27 pF 50 V 5% NP0 0402 8 C18,C21,C23,C34, C41,C43,C46,C51, C54,C60,C61,C63, C67,C68,C69,C6274, C6275 17 1uF C0402 — GRM155R61C105KE01D Murata CAP CER 1 µF 16 V 10% X5R 0402 9 C19,C20,C22,C24, C27,C28,C40,C42, C44,C45,C47,C50 12 0.1uF C0201 — C0603X5R1C104K030BC TDK CAP CER 0.1 µF 16 V 10% X5R 0201 10 C35 1 1uF C1206 — GMK316BJ105KLHT CAP CER 1 µF 35 V 10% X5R 1206 11 C37,C38,C39,C48,C 49 5 10nF C0201 — GRM033R61C103KA12D Murata CAP CER 10000 pF 16 V 10% X5R 0201 12 C56 1 220pF C0402 — GRM1555C1E221JA01D Murata CAP CER 220 pF 25 V 5% NP0 0402 13 C70 1 100uF C1206 — F951A107KAAAQ2 AVX CAP TANT 100 µF 10 V 10% 1206 14 C6265,C6266 2 0.1uF C0201 — C0603X5R1E104M030BB TDK Corporation CAP CER 0.1 µF 25 V 20% X5R 0201 15 C6276 1 22uF C0603 — C1608X5R1A226M080A C TDK CAP CER 22 µF 10 V 20% X5R 0603 16 D1 1 YELLOW LED0603 — LTST-C193KSKT-5A Lite-On Inc LED YELLOW RECT CLEAR 0603 17 D2 1 GREEN LED0603 — LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603 18 D3,D8 2 GREEN LED0603 — LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603 19 D4,D5 2 Red LED0603 — LTST-C190KRKT LITE-On INC LED SUPER RED CLEAR 0603 SMD 20 D9 1 TRICOLOUR_LED APTF1616SE_RGB — APTF1616SEEZGQBDC Kingbright LED RED/GREEN/ BLUE WTR CLEAR SMD 21 D10 1 IR_LED SFH4645_2SMD — SFH 4645 OSRAM EMITTER 950NM MIDLED SIDELK SMD 22 D11 1 LED XBDAWT_2SMD — XBDAWT-00-000000000LCE3 Cree Inc LED HIGH BRIGHTNESS 23 D12 1 CDBU0520 DIODE_SOD523F — CDBU0520 Comchip DIODE SCHOTTKY 20 V 500 mA 0603 24 J1 1 USB PWR CONN_S5P1RMINIUS BB_MOLEX — 67503-1020 Molex CONN RECEPT MINIUSB R/A 5POS SMD 25 J2 1 503548-1220 2X6HDR_5035481220 — 5035481220 Molex Inc CONN RCPT BTB 12POS DL VERT SMD 26 J3 1 2x5 HEADER 2X5_HDR_SMD 15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU 27 J5 1 1X2 SOCKET 1X2_SOCKET_SMD NPPC021KFXC-RC Sullins CONN FEMALE 2POS .1" SMD GOLD 28 J6 1 2X3 HEADER 2X3_HDR_SMD BREAKAWAY PART 15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU 29 J7 1 2X2 HEADER 2X2_HDR_SMD BREAKAWAY PART 15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU 30 J50 1 1X3 R/A HEADER 1X3_HDRRAM22_SM D — M22-5330305 Harwin Inc 3 WAY SIL HORIZ SMT PIN HDR 31 J51 1 1X2 HEADER_RT_ANGL E 1X2_HDRM22_SMD — M22-5330205 Harwin Inc 2POS SIL HORIZ SMT PIN HEADER BREAKAWAY PART 30 — Taiyo Yuden iCE40 Ultra Wearable Development Platform Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description 32 L1,L2,L3 3 600ohm, 500mA L0603 — MMZ1608R601A TDK Corp FERRITE CHIP 600 Ohm 500 mA 0603 33 L4 1 22uH L0805 — AIML-0805HC-220M-T Abracon Corporation HIGH CURRENT CHIP IND 22.0UH 20% 34 R1 1 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402 35 R2 1 2K R0402 — ERJ-2GEJ202X Panasonic RES SMD 2K Ohm 5% 1/10W 0402 36 R3,R116 2 10K R0402 — ERJ-2GEJ103X Panasonic RES SMD 10K Ohm 5% 1/10W 0402 37 R4 1 4.32K R0402 — ERJ-2RKF4321X Panasonic RES SMD 4.32K Ohm 1% 1/10W 0402 38 R5 1 2.94K R0402 — ERJ-2RKF2941X Panasonic RES SMD 2.94K Ohm 1% 1/10W 0402 39 R6 1 3.57K R0402 — ERJ-2RKF3571X Panasonic RES SMD 3.57K Ohm 1% 1/10W 0402 40 R7 1 DNL R0402 DNL 41 R8 1 12k R0402 — ERJ-2RKF1202X — Panasonic — RES SMD 12K Ohm 1% 1/10W 0402 42 R9,R10,R11 3 4.7K R0402 — ERJ-2GEJ472X Panasonic RES SMD 4.7K Ohm 5% 1/10W 0402 43 R12,R13,R14,R15, R37,R43,R48,R49, R50,R51,R52,R53, R54,R55,R57,R58, R59,R60,R62,R63, R112,R113 22 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402 44 R16,R26,R27,R44 4 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402 45 R17,R18,R19,R40, R45,R46,R61 7 10k R0402 — ERJ-2GEJ103X Panasonic RES SMD 10K Ohm 5% 1/10W 0402 46 R20,R68 2 2.2k R0402 — ERJ-2GEJ222X Panasonic RES SMD 2.2K Ohm 5% 1/10W 0402 47 R24 1 2k2 R0402 — ERJ-2GEJ222X Panasonic RES SMD 2.2K Ohm 5% 1/10W 0402 48 R25,R32,R33,R36 4 30 R0201 — ERJ-1GEJ300C Panasonic RES 30 Ohm 1/20W 5% 0201 SMD 49 R30,R31,R34,R35 4 330 R0201 — CRCW0201330RJNED Vishay RES 330 Ohm 1/20W 5% 0201 SMD — — — 50 R38,R39 2 DNL R0402 DNL 51 R41 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402 52 R42 1 12 R0402 — ERJ-2GEJ120X Panasonic RES SMD 12 Ohm 5% 1/10W 0402 53 R47 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402 54 R56 1 1K R0201 — ERJ-1GEJ102C Panasonic RES SMD 1K Ohm 5% 1/20W 0201 55 R67 1 33 R0402 — ERJ-2GEJ330X Panasonic RES SMD 33 Ohm 5% 1/10W 0402 56 R94,R95,R97 3 0 R0201 — ERJ-1GN0R00C Panasonic RES SMD 0.0 Ohm JUMPER 1/20W 0201 57 R100,R101,R102, R103,R104,R114, R115 7 0.5 Current_Sens_Res_06 03 — RL0603FR-070R5L Yageo RES SMD 0.5 Ohm 1% 1/10W 0603 58 R106,R107 2 10k R0201 — ERJ-1GEJ103C Panasonic RES SMD 10K Ohm 5% 1/20W 0201 59 R108 1 0 R0603 — ERJ-3GEY0R00V Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0603 60 R109 1 0 R0603 DNL ERJ-3GEY0R00V Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0603 61 R110 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402 62 R111 1 DNL R0402 DNL 63 R117 1 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402 64 SW1 1 PB 2psmd_eswitch — TL1015AF160QG E-Switch SWITCH TACTILE SPST-NO 0.05A 12 V 65 SW2 1 ON/OFF SWITCH PCM12SMTR — PCM12SMTR C&K SWITCH SLIDE SPDT 300 mA 6 V 31 — — — — iCE40 Ultra Wearable Development Platform Item Reference Qty Comments Part Number Manufacturer Description 66 TP1,TP2,TP3,TP4, TP5,TP6,TP11,TP12, TP13,TP16,TP17, TP18,TP19,TP20, TP21,TP22,TP23, TP24,TP25,TP32, TP33,TP34,TP35, TP36 24 T POINT R Part TEST_POINT PCB Footprint DNL — — — 67 TP28,TP29,TP30,TP 31 4 T POINT R TEST_POINT DNL — — — 68 U1 1 BQ24232 BQ24232_16VQFN — BQ24232RGTT TI IC LI+ CHARGER PWR MGMT 16QFN 69 U2 1 FT2232HQ FT2232HQ_64QFN — FT2232HQ FTDI IC USB HS DUAL UART/FIFO 64-QFN 70 U3 1 93LC56BT 93LC56BT_6SOT23 — 93LC56BT-I/OT Microchip Technology IC EEPROM 2KBIT 2MHZ SOT23-6 71 U4 1 LCMXO2-2000ZE1UWG49 XO2_2000ZE_49CSP LCMXO2-2000ZE1UWG49 Lattice LCMXO2-2000ZE1UWG49 72 U5 1 NOR Flash N25Q032A_8SOIC — N25Q032A13ESC40G Micron IC FLASH 32MBIT 108MHZ 8SO 73 U6 1 MIC_LEFT MP34DB01_RHLGA — MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB 74 U7 1 MIC_RIGHT MP34DB01_RHLGA — MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB 75 U8 1 TPS61061 TPS61061_8QFN — TPS61061DRBR TI IC LED DRIVER WHITE BCKLGT 8SON 76 U9 1 iCE5LP4K iCE5LP4K_SWG36 iCE5LP-4K-SWG36 Lattice iCE40 Ultra family is an ultra-low power FPGA and sensor manager 77 U10 1 NOR-FLASH M25P80_SO8N — M25P80-VMN6TP Micron IC FLASH 8MBIT 75MHZ 8SO 78 U11 1 4-BIT_TRANSLATOR 12DSBGA_TXB0104 — TXB0104YZTR Texas Instruments IC XLATR VOLT-LVL 4B ESD 12DSBGA 79 U12 1 2-BIT_TRANSLATOR 8DSBGA_TXB0102 — TXB0102YZPR Texas Instruments IC 2BIT V-TRANSLATR W/ESD 8DSBGA 80 U13 1 MIC5320 MIC5320_6MLF — MIC5320-PGYMT TR Micrel Inc 81 U14 1 TPS7A7200 TPS7A7200_16QFN — TPS7A7200RGTT Texas Instruments IC REG LDO FIX/ADJ 2A 16QFN 82 U15 1 1-BIT_TRANSLATOR 6SON_SN74AUP1T34 — SN74AUP1T34DSFR Texas Instruments IC V-LEVEL XLATR UNIDIR 6SON 83 U16 1 MIC5504 MIC5504_4TDFN — MIC5504-1.2YMT TZ Micrel Inc IC REG LDO 1.2 V 0.3A 4TDFN 84 Y1 1 12MHz 403C35D12M00000_4 SMD — 403C35D12M00000 Abracon Corp CRYSTAL 12MHZ 18 pF SMD 85 Y2 1 27.000MHz OSC_ASCSM — ASCSM-27.000MHZ-LRT Abracon OSC XO 27.000MHZ CMOS SMD 86 WEARABLE SOLUTION MAIN BOARD PCB 1 — 305-PD-15-0069 PACTRON 87 LCD Display 1 www.vcdisplays.com - LH154Q01-TD01 David Fontano / [email protected] LG http://vcdisplays.com 88 Battery 1 http://www.ebay.com S107-19 or 652030 89 Magnet 8 http://www.amazon.com ??? — — CUSTOMER SUPPLIED CUSTOMER SUPPLIED Syma IC REG LDO 3 V/1.8 V 0.15A 6TMLF — 3.7 V 240mAh Li-Po Battery for SYMA S026 RC Remote Quadcopter bag & tag item MyMagnetMan MyMagnetMan® 1/4" x 1/16" (6.35 x 1.58mm) 3M-467 Adhesive Rare Earth Neodymium Disc Magnets for Crafts 32 iCE40 Ultra Wearable Development Platform Appendix D. Sensor Board Bill of Materials Figure 22. Sensor Board Bill of Materials Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description 1 C1 1 10uF C0805 — C2012X5R1C106K085AC TDK CAP CER 10 µF 16 V 10% X5R 0805 2 C2,C3,C4,C6,C7,C9, C10,C16,C17,C18, C19,C20 12 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402 3 C5,C12 2 0.01uF C0402 — GRM155R61C103KA01D Murata CAP CER 10000 pF 16 V 10% X5R 0402 4 C8 1 4.7uF C0603 — EMK107ABJ475KA-T CAP CER 4.7 µF 16 V 10% X5R 0603 5 C11,C13 2 2.2uF C0402 — C1005X5R1C225K050BC TDK CAP CER 2.2 µF 16 V 10% X5R 0402 6 C14,C15 2 8pF C0402 — GRM1555C1E8R0CA01D Murata CAP CER 8 pF 25 V NP0 0402 7 C21 1 10uF C0603 — C1608X5R0J106K080AB TDK CAP CER 10 µF 6.3 V 10% X5R 0603 8 C22 1 22uF C0603 — C1608X5R0J226M080AC TDK CAP CER 22 µF 6.3 V 20% X5R 0603 9 C23 1 1uF C0402 — C1005X5R1C105K050BC TDK CAP CER 1 µF 16 V 10% X5R 0402 10 J2 1 2X3 SOCKET 2X3_SOCKET_SMD — NPPC032KFMS-RC Sullins CONN FEMALE 6POS DL .1" GOLD SMD 11 J3 1 2X5 SOCKET 2X5_SOCKET_SMD — NPPC052KFMS-RC Sullins CONN FMALE 10POS DL .1" GOLD SMD 12 J4 1 1X2 Header 1X2_HDR_SMD 15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU 13 J5 1 2X2 SOCKET 2X2_SOCKET_SMD — M20-7870246 Harwin Inc 02+02 DIL SMT SKT 14 L1 1 0.47uH L2016 — 1286AS-H-R47M Toko Inductor 0.47uH DFE201612C series 15 R1,R12,R15,R25, R26,R27 6 10K R0402 — ERJ-2RKF1002X Panasonic RES 10K Ohm 1/10W 1% 0402 SMD 16 R2,R3,R4,R5,R6,R7, R8,R9,R10,R11,R13, R14,R16,R17,R19, R21,R23 17 0 R0402 — ERJ-2GE0R00X Panasonic RES 0.0 Ohm 1/10W 0402 SMD BREAKAWAY PART Taiyo Yuden 17 R18,R20 2 DNL R0402 DNL 18 R22 1 0.001 R1206 — CSNL1206FT1L00 Stackpole RES SMD 0.001 Ohm 1% 1W 1206 19 R24 1 1K R0402 — ERJ-2RKF1001X Panasonic RES 1K Ohm 1/10W 1% 0402 SMD 20 TP1,TP2,TP3,TP4, TP5,TP6,TP7,TP8, TP9,TP10,TP11, TP14,TP15,TP16 14 TEST POINT TEST_POINT 21 TP12,TP13 2 80_MIL_PAD TP_80MIL DNL — — — 22 TP17,TP18 2 T POINT R 30_mil_pad DNL — — — 23 U1 1 FAN48610 FAN48610 — FAN48610UC50X Fairchild IC REG BOOST SYNC 5 V 1A 9WLCSP 24 U2 1 AFE4403 AFE4403_36DSBGA — AFE4403YZPT TI IC AFE FRONT END 36DSBGA 25 U3 1 LPS25H LPS25H_10HCLGA — LPS25HTR STMicroelectronics IC MEMS PRESSURE SENSOR 10HCLGA 26 U4 1 LSM330DLC LSM330DLC_28LGA — LSM330DLCTR STMicroelectronics ACCELEROMETER/ GYROSCOPE 28LGA 27 U5 1 SeeedBLE SeeedBLE 28 U6 1 SFH7050 SFH7050 — 29 U7 1 TMP112 TMP112_SOT563 30 Y1 1 8MHz NX3225GD_8MHZ 31 WEARABLE SOLUTION SENSOR BOARD PCB 1 — — DNL — http:// 113050012 www.seeedstudio.com — 33 — — — — Seeed Low cost ARM cortexm0 based module for Bluetooth module SFH7050 OSRAM Biomonitoring Sensor for heart rate monitoring, Pulse oximetry and proximity — TMP112AIDRLT TI IC TEMP SENSOR DGTL 5 V SOT563 — NX3225GD-8MHZ-STDCRA-3 NDK CRYSTAL 8MHZ 8 pF SMD — 305-PD-15-0028 PACTRON —