ZXCT1030EV2 User Guide Issue 2

ZXCT1030EV2
Evaluation Board
User Guide
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Figure 1 Evaluation board components' layout
DESCRIPTION
The ZXCT1030EV2 is intended for the evaluation of the ZXCT1030 device. The
ZXCT1030 is a high side current sense monitor containing an internal reference and
comparator with a non-latching output. Using this device eliminates the need to disrupt
the ground plane when sensing a load current. The wide input voltage range of 20V
down to as low as 2.2V makes it suitable for a range of applications. Dynamics and
supply current are optimized for the processing of fast pulses associated with switch
mode applications.
The evaluation board is delivered with the values shown in Figure 2 below. As can be
seen, RS consists of two resistors (R1 and R2) which are configured in parallel such that
either one or both resistors could be connected by completing the solder-bridge link
next to each one. R2 (0.5R) is connected by default.
R3 consists of two pads with a hole in each pad and provides means for connecting an
external RS.
With the values shown, the board produces an output of 5V/A
The printed circuit board contains redundant component positions which are provided
for (but not fitted) to enable the user to experiment if needed.
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Supply
V1
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ILOAD
RS (R1//R2//R3)
V2
0R5
R7
10k V
CC
R8
o/c
(150k)
3
VCC 1
VCC
R4
10k
2
S+
S-
ZXCT1030
GND OUT
VREF 6
7 VOUT
VOUT
8 Flag
Flag
VCC
+
VTRP 5
4 GND
R5
10k
R6
o/c
o/c = Open Circuit
GND
GND
Figure 2 Equivalent circuit diagram for evaluation board ZXCT1030EV2
VCC range 2.2V to 20V
Supply Range 2.2V to 20V
V
Flag
VFLG
VILH = VTRP = 10 ⋅ RS ⋅ I LOAD( HIGH )
VILH
VOUT
VS+
VSL
Figure 3 Device' response versus varying supply
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ORDERING INFORMATION
ORDER NUMBER
ZXCT1030EV2
Please note evaluation boards are subject to availability and qualified leads.
PAD NAMES AND DEFINITIONS
NAME
DESCRIPTION
V1
V2
VOUT
FLAG
Supply Voltage
Connection to Load
Output Voltage
Tripped flag (low when tripped)
GND
0V / Ground
SL1 – SL5
Optional Solder Links
VCC
Device supply
Both the input voltage (voltage on V1) and VCC range for the ZXCT1030EV2 is from
2.2V to 20V.
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ZXCT1030EV2 Summary
R3
R1 0.05R
V1
SL1
ILOAD
Supply
V2
SL2
R2 0.5R
R7
10k V
CC
R8
150k
3
VCC 1
VCC
2
S+
S-
ZXCT1030
GND OUT
7 VOUT
VREF 6
SL3
SL4
SL5
VCC
+
VTRP 5
8 Flag
-
R4
10k
VOUT
Flag
4 GND
R5
10k
R6
UDF
UDF = User DeFined
GND
GND
Figure 4 Actual circuit diagram for ZXCT1030EV2
Sense resistor
The board has been designed with two selectable values of sense resistor. The value
of the sense resistor can be chosen by using the solder links SL1 and SL2.
The board is also tracked for a user-defined through-hole resistor (R3).
The 50mΩ resistor (R1) is selected by shorting SL1 and opening SL2. This results in an
output of 0.5 V/A.
The 500mΩ resistor (R2) is selected by shorting SL2 and opening SL1, resulting in an
output of 5V/A.
If both links are shorted the effective resistance is 45.45 mΩ giving an output of 454.5
mV/A.
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If both links are open, the optional leaded resistor R3 can be exclusively used as the
sense resistor. The maximum power dissipation rating of the resistor must be
appropriate to the load current level.
For further information on choosing a value of sense resistor please refer to the
ZXCT1030 datasheet.
Trip current sensitivity and its adjustment
The current at which the ZXCT1030EV2 trips (FLAG goes low) is changed by changing
the reference voltage that is fed into the VCOMP pin. A resistor position, R6, is available
to enable this. Adding R6 to form a potential divider with R5 causes the on-chip
reference to be attenuated allowing the ZXCT1030 to trip at a lower current.
This trip current is given by,
ITRIP =
VREF ⋅ R 6
10 ⋅ RS (R 5 + R 6)
It can be seen from above that the term,
VREF ⋅ R 6
= VTRP
(R 5 + R 6 )
Therefore,
ITRIP =
VTRP
10 ⋅ RS
Equation 1
All the values above, with the exception of R6, are either known or can be determined
by the user. Therefore determine R6 as follows,
1.
2.
3.
Choose the trip current, ITRIP.
Compute VTRP (Volts) from Equation 1
Compute R6 (kΩ) from,
R5
10k
=
R6 =
 VREF
  1.24 

− 1 
− 1
 VTRP
  VTRP

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Configuration table for ZXCT1030EV2
LOAD
CURRENT
(A)
1.0
1.0
1.0
RSENSE
(mΩ)
VOUT
(V)
SOLDER LINK
CONFIGURATION
50
500
45.45
0.5
5
0.454
Short SL2
Short SL1
Short SL1 & SL2
Configuration for different LOAD currents.
The board can be configured for different load currents by changing the SMD resistors
or fitting a suitable wire ended resistor and opening both solder links. It is important to
ensure an appropriate value of RS is selected to obtain the desired accuracy for a given
output current.
The value of VOUT is the voltage dropped across the sensing resistor multiplied by 10.
Choosing a larger value for RS gives a higher output voltage for a given current resulting
in better resolution but at the expense of increased voltage drop and higher dissipation
in RS.
The ZXCT1030 is optimized for values of VSENSE around 100mV.
Accuracy
The ZXCT1030 has a typical 3% accuracy for a VSENSE of 100mV. The accuracy of the
output voltage will be influenced by the tolerance of the external sense used. The
ZXCT1030EV2 utilizes 1% sense resistors.
COMPONENTS LIST
Ref
Value
Package
Part Number
R1
R2
R4,5,7
R8
ZXCT
I/O’s
50mΩ
500mΩ
10k
150k
2512
2512
0805
0805
SO-8
Test loops
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LR2512-R050FW
LR2512-R500FW
Manufacturer
Welwyn
Welwyn
Notes
SMD Sense Resistor 1%
SMD Sense Resistor 1%
ZXCT1030N8
100-108
Zetex
Hughes
Rapid 17-1835
ZXCT1030EV2
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Required Equipment
1.
2.
3.
1 x 20R 5W resistor (load).
2 x voltage adjustable bench PSUs with voltage and current monitoring and current
limiting.
2 x DVMs (DVM1 to read up to 15V, resolution 10mV, and DVM2 to read up to
300mA, resolution 1mA)
SET-UP AND TEST
The board is preset to give an output Voltage of 1V for a load current of 200mA (SL2 is shorted
to connect in R2, a 500mΩ, sense resistor).
The board will fail if any of the tests below do not meet the specification indicated, at any stage.
Set-up
1.
2.
3.
4.
5.
6.
7.
8.
Ensure SL2 and SL4 are shorted.
Switch the outputs of PSU1 and PSU2 to ‘OFF’
Set PSU1 to 15V ±0.1V and limit its current to any value between 10mA and 40mA.
Set PSU2 to 0v and limit it’s current to 300mA.
Connect PSU1 +ve to VCC and -ve to GND.
Connect PSU2 +ve to V1 and -ve to GND.
Connect DVM1 +ve to FLAG and -ve to GND.
Connect one end of a 20R 5W resistor to GND. Connect the other end to the –ve of DVM2
and connect the +ve (current range terminal) of DVM2 to V2. (See diagram).
9. Switch on PSU1, followed by PSU2.
Test Procedure
1. Measure the FLAG voltage indicated on DVM1. It must be <500mV.
2. Increase the PSU2 voltage slowly and monitor the FLAG voltage until the point at which the
FLAG voltage goes ‘HIGH’. The FLAG voltage should measure >14V.
3. Read the PSU2 voltage. It must be 2.6V +100mV, -300mV.
4. Increase the PSU2 voltage slowly and monitor the FLAG voltage until the point at which the
FLAG voltage goes ‘LOW’. The FLAG voltage must measure <500mV.
5. Read the PSU2 voltage. It must be 5.15V ± 200mV.
6. Measure the current through the load, on DVM2. It must be 248mA ± 8mA.
7. Remove the +ve terminal of DVM1 from the FLAG pin and connect it to the Vout pin. Vout
must measure 1.24V ± 40mV.
8. Decrease the PSU2 voltage until DVM2 reads a current of 200mA ± 1mA through the load.
Vout must then read 1.0v ± 40mV.
END OF TEST
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ZXCT1030EV2
V1
20R 5W
V2
A
VOUT
PSU2
VCC
FLAG
GND
GND
PSU1
Figure 5 Test diagram for ZXCT1030EV2
EVALUATION BOARD
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DVM
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Definitions
Product change
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service.
Customers are solely responsible for obtaining the latest relevant information before placing orders.
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The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s
application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with
respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise.
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duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit
applications, under any circumstances.
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the Chief Executive Officer of Zetex Semiconductors plc. As used herein:
A.
Life support devices or systems are devices or systems which:
1. are intended to implant into the body
or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions
for use provided in the labelling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
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Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The
possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can
vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being
affected should be replaced.
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requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of
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All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV
directives.
Product status key:
“Preview”
“Active”
“Last time buy (LTB)”
“Not recommended for new designs”
“Obsolete”
Datasheet status key:
“Draft version”
“Provisional version”
“Issue”
Future device intended for production at some point. Samples may be available
Product status recommended for new designs
Device will be discontinued and last time buy period and delivery is in effect
Device is still in production to support existing designs and production
Production has been discontinued
This term denotes a very early datasheet version and contains highly provisional
information, which may change in any manner without notice.
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However,
changes to the test conditions and specifications may occur, at any time and without notice.
This term denotes an issued datasheet containing finalized specifications. However, changes to specifications
may occur, at any time and without notice.
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