Package Outline Dimensions PowerDI5060-8 (SWP) (Type Q) D D1 8 PowerDI5060-8 (SWP) (Type Q) Dim Min Max Typ A 0.90 1.10 1.00 A1 0 0.05 -b 0.30 0.50 0.41 b2 0.20 0.35 0.25 b4 0.25REF c 0.230 0.330 0.277 D 5.15 BSC D1 4.70 5.10 4.90 D2 3.56 3.96 3.76 D2a 3.78 4.18 3.98 E 6.40 BSC E1 5.60 6.00 5.80 E2 3.46 3.86 3.66 E2a 4.195 4.595 4.395 e 1.27BSC k 1.05 --L 0.635 0.835 0.735 La 0.635 0.835 0.735 L1 0.200 0.400 0.300 L1a 0.050REF L4 0.025 0.225 0.125 M 3.205 4.005 3.605 θ 10° 12° 11° θ1 6° 8° 7° All Dimensions in mm 0(4x ) E1 E 1.400 1.900 A1 c Seating Plane e 01( 4x) 1 Ø0.986 Depth 0.07±0.030 DETAIL A b(8x) e/2 1 L k D2a b2(2x) A E2a E2 L4 D2 M L1 DETAIL A La 8 L1a(8x) b4(8x) Suggested Pad Layout PowerDI5060-8 (SWP) (Type Q) X2 Y1 Dimensions Y2 Y3 X1 G1 Y C C G G1 X X1 X2 Y Y1 Y2 Y3 Value (in mm) 1.270 0.660 0.820 0.610 4.100 4.420 1.270 1.020 3.810 6.610 X (8x) G ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2016-03-25 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated