Package Outline Dimensions U-DFN2020-6/SWP A A3 A1 A Seating Plane U-DFN2020-6/SWP Dim Min Max Typ A 0.59ļ 0.65 0.62ļ A1 0 0.05 0.03 A3 0.19 b 0.28 0.38 0.33 D 1.95 2.05 2.00 D2 0.87 1.07 0.97 D2a 0.205 0.305 0.255 E 1.95 2.05 2.00 E2 1.42 1.62 1.52 E2a 0.69 0.79 0.74 e 0.65 BSC L 0.28 0.38 0.33 k 0.450 BSC k1 0.225 BSC Z 0.20 All Dimensions in mm D D2 Detail A k D2a E E2 E2a k1 L(2x) e b z Suggested Pad Layout U-DFN2020-6/SWP X1 Y1 G1 Dimensions Y3 Y2 Y G C C G G1 X X1 Y Y1 Y2 Y3 Value (in mm) 0.650 0.125 0.350 0.400 1.700 0.365 0.515 0.825 2.330 X ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the āZā dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-08 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated