Package Outline Dimensions T-MiniDIP b E E1 L L1 D1 e c D T-MiniDIP Dim Min Max A 1.15 1.27 b 0.60 0.70 c 0.15 0.25 D 4.90 5.10 D1 3.20 3.50 E 5.30 5.50 E1 6.00 6.40 e 3.90 4.10 L 0.25 0.80 L1 0.25 0.55 All Dimensions in mm A Suggested Pad Layout T-MiniDIP X Dimensions C C1 X Y C1 Value(in mm) 4.00 5.60 0.750 0.450 Y C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-08-04 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated