Package Outline Dimensions TSSOP-16 E/2 Y E E1 SEE DETAIL 'A' X PIN 1 x) b e Ø0.760Depth0.050±0.02 A2 R1 D R C A L2 L SEATING PLANE A1 GAUGE PLANE L1 DETAIL 'A' TSSOP-16 Dim Min Max Typ A 1.08 A1 0.05 0.15 A2 0.80 0.93 b 0.19 0.30 c 0.09 0.20 D 4.90 5.10 E 6.40 BSC E1 4.30 4.50 e 0.65 BSC L 0.45 0.75 L1 1.00 REF L2 0.25 BSC R / R1 0.09 X 1.350 Y 1.050 θ 0° 8° θ1 5° 15° θ2 0° All Dimensions in mm Suggested Pad Layout TSSOP-16 X1 Dimensions C X X1 Y Y1 Y1 Y Value (in mm) 0.650 0.350 4.900 1.400 6.800 1 X C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-11 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated