Package Outline Dimensions TSSOP-16EP D TSSOP-16EP Dim Min Max Typ A 1.20 A1 0.025 0.100 A2 0.80 1.05 0.90 b 0.19 0.30 c 0.09 0.20 D 4.90 5.10 5.00 E 6.20 6.60 6.40 E1 4.30 4.50 4.40 e 0.65 BSC L 0.45 0.75 0.60 L1 1.0 REF L2 0.65 BSC X 2.997 Y 2.997 θ1 0° 8° All Dimensions in mm X e E1 E Y PIN 1 ID MARK A2 0.25 Gauge Plane A Seating Plane A1 b DETAIL L L1 Suggested Pad Layout TSSOP-16EP X2 Dimensions Y Y3 Y1 X1 X C X X1 X2 Y Y1 Y2 Y3 Y2 Value (in mm) 0.650 0.450 3.290 5.000 1.450 3.290 4.450 7.350 C ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-11 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated