U-DFN2020-6 (Type P)

Package Outline Dimensions
U-DFN2020-6 (Type P)
A3
A1
A
Seating Plane
D
k1
k1
z
b
z1
E
z1
D2b
D2a
k
E2(4x)
D2
D2
R0.15
(Pin # 0
1 ID)
k
L
k2
k3
U-DFN2020-6
(Type P)
Dim
Min
Max
Typ
A
0.545 0.605 0.575
A1
0.00
0.05
0.02
A3
--0.13
b
0.20
0.30
0.25
D
1.95 2.075 2.00
D2
0.60
0.80
0.70
D2a
0.55
0.75
0.65
D2b
0.80
1.00
0.90
E
1.95 2.075 2.00
E2
0.25
0.45
0.35
e
0.65 BSC
L
0.25
0.35
0.30
k
--0.325
k1
--0.525
k2
--0.425
k3
--0.550
z
--0.225
z1
--0.125
All Dimensions in mm
e
Suggested Pad Layout
U-DFN2020-6 (Type P)
G
X1
X2
C
X
Y
X6
Y1
X7
Y6
Y3
Y5
X5
G2
X5
Y6
Y2
Y4
G3
X3
X4
G1
Dimensions
C
G
G1
G2
G3
X
X1
X2
X3
X4
X5
X6
X7
Y
Y1
Y2
Y3
Y4
Y5
Y6
Value (in mm)
0.650
0.150
0.300
0.250
0.150
0.350
0.700
0.950
0.750
0.750
0.525
0.550
0.425
0.525
0.400
0.400
0.675
0.125
2.400
0.325
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-09-25
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated