Package Outline Dimensions V-DFN3020-10 A3 A1 A Seating Plane D e La Lc (P R0. in 150 #1 ID ) D2a D2 E E2 E2 E2 D2c E2a D2d La E2 D2b E2 Lb L(6x) D2e Z(4x) b(10x) V-DFN3020-10 Dim Min Max Typ A 0.75 0.85 0.80 A1 0 0.05 0.02 A3 0.15 b 0.15 0.25 0.20 D 2.95 3.075 3.00 D2 1.000 D2a 0.400 D2b 0.500 D2c 0.850 D2d 0.320 D2e 0.400 E 1.95 2.075 2.00 E2 0.200 E2a 0.450 e 0.60 L 0.25 0.35 0.30 La 0.460 Lb 0.550 Lc 0.548 Z 0.175 0.225 0.20 All Dimensions in mm Suggested Pad Layout V-DFN3020-10 Dimensions Y(6x) X(10x) Y2 Y1 G G3 Y11 Y5 Y4 Y3 X2 G1 X1 X3 Y6 X5 X4 Y8 X6 Y9 G2 Y7 Y10 C C G, G2, G3 G1 X X1 X2 X3 X4 X5 X6 Y Y1 Y2 Y3 Y4, Y5, Y6 Y7 Y8, Y9 Y10 Y11 Value (in mm) 0.600 0.150 0.240 0.300 0.950 0.500 0.600 1.100 0.500 0.420 0.500 0.650 0.560 0.550 0.300 0.650 0.300 0.560 2.300 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. 2015-06-08 1 of 1 www.diodes.com Package Outline Dimensions Suggested Pad Layout © Diodes Incorporated