Package Outline V-DFN3030-8 (Type Q) A A3 A1 Seating Plane D D2 E E2 ID #1 b e ( Pi n R0 .2 00 ) L V-DFN3030-8 (Type Q) Dim Min Max Typ A 0.77 0.83 0.80 A1 0.00 0.05 0.02 A3 --0.203 b 0.29 0.39 0.34 D 2.95 3.05 3.00 D2 2.19 2.39 2.29 E 2.95 3.05 3.00 E2 1.64 1.84 1.74 e --0.65 L 0.40 0.50 0.45 All Dimensions in mm Suggested Pad Layout V-DFN3030-8 (Type Q) C X Y Dimensions C X X1 Y Y1 Y1 X1 Value (in mm) 0.650 0.390 2.590 0.650 2.490 Rev 00 Revision History Revision History Initial Issue - (SAT’s COL0439/ CPL006) Revision Date 10/11/2014 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 59 2 of 2 www.diodes.com Suggested Pad Layout © Diodes Incorporated