X2 DFN2015 3

Package Outline Dimensions
X2-DFN2015-3
A3
A
X2-DFN2015-3
Dim Min Max
Typ
A
-
0.40
-
A1
0
0.05
0.02
A3
0.13
b
0.20 0.30
0.25
D
1.45 1.575
1.5
D2 1.00 1.20
1.10
e
0.50
E
1.95 2.075 2.00
E2 0.70 0.90
0.80
L
0.25 0.35
0.30
z
0.125
All Dimensions in mm
SEATING PLANE
A1
D
z
L
e
E2
E
D2
b
Suggested Pad Layout
X2-DFN2015-3
X
Y1
Y2
X1
Y(2x)
G
X2-DFN2015-3
Value
Dimensions
(in mm)
C
1.000
G
0.150
X
0.310
X1
1.300
Y
0.500
Y1
0.650
Y2
1.000
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-06-08
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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