X4 WLCUS1408 2

Package Outline Dimensions
X4-WLCUS1408-2
A1
A
Seating Plane
D
Z2
e
Pin#1 Cathode
Notch(R 0.100)
X4-WLCUS1408-2
Dim Min Max Typ
A
0.17 0.25 0.20
A1 0.006 0.01 0.008
b
0.659 0.759 0.709
D
1.35 1.45 1.40
E
0.75 0.85 0.80
e
0.855
L1 0.194 0.294 0.244
L2 0.615 0.715 0.665
Z1 0.016 0.076 0.046
Z2 0.016 0.076 0.046
All Dimensions in mm
E
b(2x)
L1
L2
Cathode
Anode
Z1
Suggested Pad Layout
X4-WLCUS1408-2
Dimensions
Y
X
X1
X2
Y
X
Value
(in mm)
0.334
0.755
1.386
0.789
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ā€˜Zā€™ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
2015-06-10
1 of 1
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Package Outline Dimensions
Suggested Pad Layout
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