PCF85132
LCD driver for low multiplex rates
Rev. 4 — 24 April 2015
Product data sheet
1. General description
The PCF85132 is a peripheral device which interfaces to almost any Liquid Crystal
Display (LCD)1 with low multiplex rates. It generates the drive signals for any static or
multiplexed LCD containing up to four backplanes and up to 160 segments. It can easily
be cascaded for larger LCD applications. The PCF85132 is compatible with most
microcontrollers and communicates via the two-line bidirectional I2C-bus. Communication
overheads are minimized by a display RAM with auto-incremental addressing, by
hardware subaddressing, and by display memory switching (static and duplex drive
modes).
For a selection of NXP LCD segment drivers, see Table 29 on page 56.
2. Features and benefits
Single-chip LCD controller and driver for up to 640 elements
Selectable backplane drive configuration: static, 2, 3, or 4 backplane multiplexing
160 segment drives:
Up to 80 7-segment numeric characters
Up to 40 14-segment alphanumeric characters
Any graphics of up to 640 elements
May be cascaded for large LCD applications (up to 5120 elements possible)
160 4-bit RAM for display data storage
Software programmable frame frequency in steps of 5 Hz in the range of 60 Hz to
90 Hz; factory calibrated
Wide LCD supply range: from 1.8 V for low threshold LCDs and up to 8.0 V for
guest-host LCDs and high threshold (automobile) twisted nematic LCDs
Internal LCD bias generation with voltage-follower buffers
Selectable display bias configuration: static, 1⁄2, or 1⁄3
Wide power supply range: from 1.8 V to 5.5 V
LCD and logic supplies may be separated
Low power consumption, typical: IDD = 4 A, IDD(LCD) = 30 A
400 kHz I2C-bus interface
Auto-incremental display data loading across device subaddress boundaries
Versatile blinking modes
Compatible with Chip-On-Glass (COG) technology
No external components required
Two sets of backplane outputs for optimal COG configurations of the application
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 18 on page 58.
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
3. Ordering information
Table 1.
Ordering information
Type number
Package
PCF85132U
Name
Description
Version
bare die
197 bumps; 6.5 1.16 0.40 mm
PCF85132U
3.1 Ordering options
Table 2.
Ordering options
Product type number
Orderable part number Sales item
(12NC)
Delivery form
IC
revision
PCF85132U/2DA/1
PCF85132U/2DA/1,02
chips with bumps in tray
1
935293465026
4. Marking
Table 3.
PCF85132
Product data sheet
Marking codes
Product type number
Marking code
PCF85132U/2DA/1
PC85132/232-1
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
5. Block diagram
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Block diagram of PCF85132
PCF85132
Product data sheet
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NXP Semiconductors
PCF85132
6.1 Pinning
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Pinning diagram of PCF85132
[
LCD driver for low multiplex rates
4 of 65
© NXP Semiconductors N.V. 2015. All rights reserved.
Viewed from active side. For mechanical details, see Figure 37 on page 49.
Fig 2.
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Rev. 4 — 24 April 2015
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Product data sheet
6. Pinning information
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
6.2 Pin description
Table 4.
Pin description
Input or input/output pins must always be at a defined level (VSS or VDD) unless otherwise specified.
PCF85132
Product data sheet
Symbol
Pin
Description
SDAACK[1]
1 to 3
I2C-bus acknowledge output
SDA[1]
4 to 6
I2C-bus serial data input
SCL
7 to 9
I2C-bus serial clock input
CLK
10
clock input and output
VDD
11 to 13
supply voltage
SYNC
14
cascade synchronization input and output
OSC
15
selection of internal or external clock
T1, T2, and T3
16, 17, and 18 to 20
dedicated testing pins; to be tied to VSS in
application mode
A0 and A1
21, 22
subaddress inputs
SA0
23
I2C-bus slave address input
VSS[2]
24 to 26
ground supply voltage
VLCD
27 to 29
LCD supply voltage
BP2 and BP0
30, 31
LCD backplane outputs
S0 to S79
32 to 111
LCD segment outputs
BP0, BP2, BP1, and BP3
112 to 115
LCD backplane outputs
S80 to S159
116 to 195
LCD segment outputs
BP3 and BP1
196, 197
LCD backplane outputs
[1]
For most applications SDA and SDAACK are shorted together (see Section 14.3 on page 44).
[2]
The substrate (rear side of the die) is connected to VSS and should be electrically isolated.
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7. Functional description
The PCF85132 is a versatile peripheral device designed to interface between any
microcontroller to a wide variety of LCD segment or dot matrix displays. It can directly
drive any static or multiplexed LCD containing up to four backplanes and up to
160 segments.
7.1 Commands of PCF85132
The commands available to the PCF85132 are defined in Table 5.
Table 5.
Definition of PCF85132 commands
Command
Operation code
Reference
Bit
7
6
5
4
3
2
1
B
M[1:0]
0
mode-set
1
1
0
0
E
load-data-pointer-MSB
0
0
0
0
P[7:4]
Table 7
load-data-pointer-LSB
0
1
0
0
P[3:0]
Table 8
device-select
1
1
1
0
0
0
Table 6
A[1:0]
Table 9
bank-select
1
1
1
1
1
0
I
blink-select
1
1
1
1
0
AB
BF[1:0]
O
frequency-ctrl
1
1
1
0
1
F[2:0]
Table 10
Table 11
Table 12
7.1.1 Command: mode-set
The mode-set command allows configuring the multiplex mode, the bias levels and
enabling or disabling the display.
Table 6.
Mode-set - command bit description
Bit
Symbol
Value
Description
7 to 4
-
1100
fixed value
3
E
2
display status[1]
0[2]
disabled (blank)[3]
1
enabled
LCD bias configuration[4]
B
1 to 0
0[2]
1⁄ bias
3
1
1⁄
2
M[1:0]
LCD drive mode selection
01
PCF85132
Product data sheet
bias
static; BP0
10
1:2 multiplex; BP0, BP1
11
1:3 multiplex; BP0, BP1, BP2
00[2]
1:4 multiplex; BP0, BP1, BP2, BP3
[1]
The possibility to disable the display allows implementation of blinking under external control. The enable
bit determines also whether the internal clock signal is available at the CLK pin (see Section 7.1.6.2 on
page 9).
[2]
Default value.
[3]
The display is disabled by setting all backplane and segment outputs to VLCD.
[4]
Not applicable for static drive mode.
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.1.2 Command: load-data-pointer
The load-data-pointer command defines the display RAM address where the following
display data will be sent to.
Table 7.
Load-data-pointer-MSB - command bit description
See Section 7.5.1 on page 24.
Bit
Symbol
Value
Description
7 to 4
-
0000
fixed value
P[7:4]
0000[1]
3 to 0
to
1001
[1]
defines the first 4 (most significant) bits of the
data-pointer
the data-pointer indicates one of the 160 display RAM
addresses
Default value.
Table 8.
Load-data-pointer-LSB - command bit description
See Section 7.5.1 on page 24.
Bit
Symbol
Value
Description
7 to 4
-
0100
fixed value
P[3:0]
0000[1]
3 to 0
to
1111
[1]
defines the last 4 (least significant) bits of the
data-pointer
the data-pointer indicates one of the 160 display RAM
addresses
Default value.
7.1.3 Command: device-select
The device-select command allows defining the subaddress counter value.
Table 9.
Device-select - command bit description
See Section 7.5.2 on page 24.
Bit
Symbol
Value
Description
7 to 2
-
111000
fixed value
1 to 0
A[1:0]
00[1] to 11
defines one of four hardware subaddresses
(see Table 23 on page 44)
[1]
PCF85132
Product data sheet
Default value.
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.1.4 Command: bank-select
The bank-select command controls where data is written to RAM and where it is displayed
from.
Table 10. Bank-select - command bit description
See Section 7.5.4 on page 26.
Bit
Symbol
Value
Description
Static
7 to 2
-
1
I
0
111110
1:2 multiplex[1]
fixed value
input bank selection; storage of arriving display data
0[2]
RAM row 0
RAM rows 0 and 1
1
RAM row 2
RAM rows 2 and 3
O
output bank selection; retrieval of LCD display data
0[2]
RAM row 0
RAM rows 0 and 1
1
RAM row 2
RAM rows 2 and 3
[1]
The bank-select command has no effect in 1:3 and 1:4 multiplex drive modes.
[2]
Default value.
7.1.5 Command: blink-select
The blink-select command allows configuring the blink mode and the blink frequency.
Table 11. Blink-select - command bit description
See Section 7.1.6.6 on page 10.
Bit
Symbol
Value
Description
7 to 3
-
11110
fixed value
2
AB
1 to 0
blink mode selection
0[1]
normal blinking[2]
1
alternate RAM bank blinking[3]
BF[1:0]
blink frequency selection
00[1]
off
01
1
10
2
11
3
[1]
Default value.
[2]
Normal blinking is assumed when the LCD multiplex drive modes 1:3 or 1:4 are selected.
[3]
Alternate RAM bank blinking does not apply in 1:3 and 1:4 multiplex drive modes.
7.1.6 Clock frequency and timing
The timing of the PCF85132 organizes the internal data flow of the device. The timing
includes the transfer of display data from the display RAM to the display segment outputs
and therefore the frame frequency.
7.1.6.1
Clock source selection
The PCF85132 can be configured to use either the built-in oscillator or an external clock
as clock source:
PCF85132
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Internal clock — To enable the internal oscillator, pin OSC has to be connected to VSS.
Pin CLK then becomes an output. For further information on the internal clock, see
Section 7.1.6.2.
External clock — To enable the use of an external clock, pin OSC has to be connected to
VDD. Pin CLK then becomes an input for the external clock frequency fclk(ext). For further
information on the external clock, see Section 7.1.6.3.
Figure 3 illustrates the frequency generation of the PCF85132.
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Frequency generation of the PCF85132
Remark: A clock signal must always be supplied to the device. Removing the clock may
freeze the LCD in a DC state, which is not suitable for the liquid crystal.
7.1.6.2
Internal clock
If the internal oscillator is used, the timing of the PCF85132 is derived from the built-in
oscillator by a pre-scaler which can be configured with the frequency-ctrl command (see
Table 12).
The internal oscillator is calibrated within an accuracy of ±3.9 % (at VDD = 5.0 V;
Tamb = 30 °C).
The frequency-ctrl command determines the division factor between the oscillator
frequency fosc and the internal clock frequency fclk(int). If the internal oscillator is used, the
frame frequency is derived from the internal clock frequency fclk(int) by the fixed division
shown in Equation 1 on page 10.
If the display is enabled (see bit E in Table 6), fclk(int) on pin CLK provides the clock signal
for cascaded LCD drivers in the system. For further information about cascading, see
Section 14.4 on page 44. The value range of fosc is specified in Table 22 on page 38.
7.1.6.3
External clock
If the external clock source is selected, the timing frequency of the PCF85132 is the
external clock frequency. In this case, the frequency-ctrl command has no influence on
the clock frequency nor the frame frequency. The frame frequency is derived from the
external clock frequency fclk(ext) by the fixed division as shown in Equation 1.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.1.6.4
Frame frequency
Sourced by the internal oscillator or an external clock, the frame frequency is derived from
the clock frequency fclk by Equation 1.
f clk
f fr = ------24
7.1.6.5
(1)
Command: frequency-ctrl
Table 12.
Bit
Frequency-ctrl - command bit description
Symbol
Value
Description
Equation
7.1.6.6
7 to 4
-
3 to 0
F[2:0]
11101
Nominal
Nominal
clock
frame
frequency[1] frequency[1]
fixed value
defines the division factor
000
1440 Hz
64
f clk int = ------ f osc
80
60 Hz
001
1557 Hz
64
f clk int = ------ f osc
74
65 Hz
010
1694 Hz
64
f clk int = ------ f osc
68
70 Hz
011[2], 111
f clk int = f osc
1800 Hz
75 Hz
100
1920 Hz
64
f clk int = ------ f osc
60
80 Hz
101
2057 Hz
64
f clk int = ------ f osc
56
85 Hz
110
2174 Hz
64
f clk int = ------ f osc
53
90 Hz
[1]
Calculated with the oscillator frequency of fosc = 1.800 Hz. The frame frequency is derived from the internal
clock frequency by Equation 1.
[2]
Default value.
Blinking
The display blinking capabilities of the PCF85132 are very versatile. The whole display
can blink at frequencies selected by the blink-select command (see Table 11). The blink
frequencies are derived from the clock frequency (fclk). The ratios between the clock and
blink frequencies depend on the blink mode in which the device is operating (see
Table 13).
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Table 13. Blink frequencies
Assuming that fclk = 1.800 kHz.
Blink mode
Operating mode ratio
off
Blink frequency
-
blinking off
1
f clk
f blink = -------768
~2.34 Hz
2
f clk
f blink = ----------1536
~1.17 Hz
3
f clk
f blink = ----------3072
~0.59 Hz
An additional feature is for an arbitrary selection of LCD elements to blink. This applies to
the static and 1:2 multiplex drive modes and can be implemented without any
communication overheads: With the output bank selector, the displayed RAM banks are
exchanged (see Section 7.5.4 on page 26) with alternate RAM banks at the blink
frequency. This mode can also be specified by the blink-select command (see Table 11 on
page 8).
In the 1:3 and 1:4 multiplex modes, where no alternate RAM bank is available, groups of
LCD elements can blink selectively by changing the display RAM data at fixed time
intervals.
The entire display can blink at a frequency other than the nominal blinking frequency. This
can be effectively performed by resetting and setting the display enable bit E at the
required rate using the mode-set command (see Table 6).
7.2 Power-On Reset (POR)
At power-on, the PCF85132 resets to the following starting conditions:
•
•
•
•
•
•
•
•
All backplane and segment outputs are set to VLCD
The selected drive mode is 1:4 multiplex with 1⁄3 bias
Blinking is switched off
Input and output bank selectors are reset
The I2C-bus interface is initialized
The data pointer and the subaddress counter are cleared (set to logic 0)
The display is disabled (bit E = 0, see Table 6 on page 6)
If internal oscillator is selected (pin OSC connected to VSS), then there is no clock
signal on pin CLK
Remark: Do not transfer data on the I2C-bus for at least 1 ms after a power-on to allow
the reset action to complete.
7.3 Possible display configurations
The display configurations possible with the PCF85132 depend on the required number of
active backplane outputs. A selection of display configurations is given in Table 14.
All of the display configurations given in Table 14 can be implemented in a typical system
as shown in Figure 5.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Example of displays suitable for PCF85132
Table 14.
Selection of possible display configurations
Number of
Backplanes
4
Icons
640
Digits/Characters
7-segment
14-segment
Dot matrix/
Elements
80
40
640 dots (4 160)
3
480
60
30
480 dots (3 160)
2
320
40
20
320 dots (2 160)
1
160
20
10
160 dots (1 160)
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The host microcontroller maintains the 2-line I2C-bus communication channel with the
PCF85132.
Biasing voltages for the multiplexed LCD waveforms are generated internally, removing
the need for an external bias generator. The internal oscillator is selected by connecting
pin OSC to VSS. The only other connections required to complete the system are the
power supplies (VDD, VSS, and VLCD) and the LCD panel selected for the application.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.3.1 LCD bias generator
Fractional LCD biasing voltages are obtained from an internal voltage divider of three
impedances connected between pins VLCD and VSS. The center impedance is bypassed
by switch if the 1⁄2 bias voltage level for the 1:2 multiplex drive mode configuration is
selected.
7.3.2 Display register
The display register holds the display data while the corresponding multiplex signals are
generated.
7.3.3 LCD voltage selector
The LCD voltage selector coordinates the multiplexing of the LCD in accordance with the
selected LCD drive configuration. The operation of the voltage selector is controlled by the
mode-set command. The biasing configurations that apply to the preferred modes of
operation, together with the biasing characteristics as functions of VLCD and the resulting
discrimination ratios (D) are given in Table 15.
Discrimination is a term which is defined as the ratio of the on and off RMS voltage across
a segment. It can be thought of as a measurement of contrast.
Table 15.
Biasing characteristics
LCD drive
mode
Number of:
LCD bias
Backplanes Levels configuration
V off RMS
------------------------V LCD
V on RMS
-----------------------V LCD
V on RMS
D = -----------------------V off RMS
static
1
2
static
0
1
3
1⁄
2
0.354
0.791
2.236
1:2 multiplex 2
4
1⁄
3
0.333
0.745
2.236
1:3 multiplex 3
4
1⁄
3
0.333
0.638
1.915
1:4 multiplex 4
4
1⁄
3
0.333
0.577
1.732
1:2 multiplex 2
A practical value for VLCD is determined by equating Voff(RMS) with a defined LCD
threshold voltage (Vth(off)), typically when the LCD exhibits approximately 10 % contrast. In
the static drive mode, a suitable choice is VLCD > 3Vth(off).
Multiplex drive modes of 1:3 and 1:4 with 1⁄2 bias are possible but the discrimination and
hence the contrast ratios are smaller.
1
Bias is calculated by ------------- , where the values for a are
1+a
a = 1 for 1⁄2 bias
a = 2 for 1⁄3 bias
The RMS on-state voltage (Von(RMS)) for the LCD is calculated with Equation 2:
V on RMS =
V LCD
a 2 + 2a + n
-----------------------------2
n 1 + a
(2)
where the values for n are
n = 1 for static drive mode
n = 2 for 1:2 multiplex drive mode
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
n = 3 for 1:3 multiplex drive mode
n = 4 for 1:4 multiplex drive mode
The RMS off-state voltage (Voff(RMS)) for the LCD is calculated with Equation 3:
V off RMS =
V LCD
a 2 – 2a + n
-----------------------------2
n 1 + a
(3)
Discrimination is the ratio of Von(RMS) to Voff(RMS) and is determined from Equation 4:
V on RMS
D = ---------------------- =
V off RMS
2
a + 2a + n
--------------------------2
a – 2a + n
(4)
Using Equation 4, the discrimination for an LCD drive mode of 1:3 multiplex with
1⁄
2
bias is
1⁄
2
21
bias is ---------- = 1.528 .
3
3 = 1.732 and the discrimination for an LCD drive mode of 1:4 multiplex with
The advantage of these LCD drive modes is a reduction of the LCD full scale voltage VLCD
as follows:
• 1:3 multiplex (1⁄2 bias): V LCD =
6 V off RMS = 2.449V off RMS
4 3
- = 2.309V off RMS
• 1:4 multiplex (1⁄2 bias): V LCD = --------------------3
These compare with V LCD = 3V off RMS when 1⁄3 bias is used.
VLCD is sometimes referred as the LCD operating voltage.
7.3.3.1
Electro-optical performance
Suitable values for Von(RMS) and Voff(RMS) are dependent on the LCD liquid used. The
RMS voltages, at which a pixel is switched on or off, determine the transmissibility of the
pixel.
For any given liquid, there are two threshold values defined. One point is at 10 % relative
transmission (at Vth(off)) and the other at 90 % relative transmission (at Vth(on)), see
Figure 6. For a good contrast performance, the following rules should be followed:
V on RMS V th on
(5)
V off RMS V th off
(6)
Von(RMS) and Voff(RMS) are properties of the display driver and are affected by the selection
of a (see Equation 2), n (see Equation 4), and the VLCD voltage.
Vth(off) and Vth(on) are properties of the LCD liquid and can be provided by the module
manufacturer. Vth(off) is sometimes named Vth. Vth(on) is sometimes named saturation
voltage Vsat.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
It is important to match the module properties to those of the driver in order to achieve
optimum performance.
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Fig 6.
PCF85132
Product data sheet
Electro-optical characteristic: relative transmission curve of the liquid
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LCD driver for low multiplex rates
7.3.4 LCD drive mode waveforms
7.3.4.1
Static drive mode
The static LCD drive mode is used when a single backplane is provided in the LCD.
Backplane and segment drive waveforms for this mode are shown in Figure 7.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = VLCD.
Vstate2(t) = V(Sn+1)(t) VBP0(t).
Voff(RMS) = 0 V.
Fig 7.
PCF85132
Product data sheet
Static drive mode waveforms
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LCD driver for low multiplex rates
7.3.4.2
1:2 multiplex drive mode
When two backplanes are provided in the LCD, the 1:2 multiplex mode applies. The
PCF85132 allows the use of 1⁄2 bias or 1⁄3 bias in this mode as shown in Figure 8 and
Figure 9.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.791VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.354VLCD.
Fig 8.
PCF85132
Product data sheet
Waveforms for the 1:2 multiplex drive mode with 1⁄2 bias
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PCF85132
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LCD driver for low multiplex rates
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.745VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.333VLCD.
Fig 9.
PCF85132
Product data sheet
Waveforms for the 1:2 multiplex drive mode with 1⁄3 bias
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.3.4.3
1:3 multiplex drive mode
When three backplanes are provided in the LCD, the 1:3 multiplex drive mode applies as
shown in Figure 10.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.638VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.333VLCD.
Fig 10. Waveforms for the 1:3 multiplex drive mode with 1⁄3 bias
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.3.4.4
1:4 multiplex drive mode
When four backplanes are provided in the LCD, the 1:4 multiplex drive mode applies as
shown in Figure 11.
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Vstate1(t) = VSn(t) VBP0(t).
Von(RMS) = 0.577VLCD.
Vstate2(t) = VSn(t) VBP1(t).
Voff(RMS) = 0.333VLCD.
Fig 11. Waveforms for the 1:4 multiplex drive mode with 1⁄3 bias
PCF85132
Product data sheet
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PCF85132
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LCD driver for low multiplex rates
7.4 Backplane and segment outputs
7.4.1 Backplane outputs
The LCD drive section includes four backplane outputs: BP0 to BP3. The backplane
output signals are generated in accordance with the selected LCD drive mode.
• In the 1:4 multiplex drive mode BP0 to BP3 must be connected directly to the LCD.
If less than four backplane outputs are required, the unused outputs can be left
open-circuit.
• In 1:3 multiplex drive mode BP3 carries the same signal as BP1, therefore these two
adjacent outputs can be tied together to give enhanced drive capabilities.
• In 1:2 multiplex drive mode BP0 and BP2, BP1 and BP3 respectively carry the same
signals and may also be paired to increase the drive capabilities.
• In static drive mode, the same signal is carried by all four backplane outputs and they
can be connected in parallel for very high drive requirements.
The pins for the four backplanes BP0 to BP3 are available on both pin bars of the chip. In
applications, it is possible to use either the pins for the backplanes
• on the top pin bar
• on the bottom pin bar
• or both of them to increase the driving strength of the device.
When using all backplanes available they may be connected to the respective sibling
(BP0 on the top pin bar with BP0 on the bottom pin bar, and so on).
7.4.2 Segment outputs
The LCD drive section includes 160 segment outputs (S0 to S159) which must be
connected directly to the LCD. The segment output signals are generated in accordance
with the multiplexed backplane signals and with data resident in the display register.
When less than 160 segment outputs are required, the unused segment outputs must be
left open-circuit.
7.5 Display RAM
The display RAM is a static 160 4 bit RAM which stores LCD data. There is a one-to-one
correspondence between
• the bits in the RAM bitmap and the LCD elements
• the RAM columns and the segment outputs
• the RAM rows and the backplane outputs.
A logic 1 in the RAM bitmap indicates the on-state of the corresponding LCD element;
similarly, a logic 0 indicates the off-state.
PCF85132
Product data sheet
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PCF85132
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LCD driver for low multiplex rates
The display RAM bitmap, Figure 12, shows the rows 0 to 3 which correspond with the
backplane outputs BP0 to BP3, and the columns 0 to 159 which correspond with the
segment outputs S0 to S159. In multiplexed LCD applications the segment data of the
first, second, third, and fourth row of the display RAM are time-multiplexed with BP0,
BP1, BP2, and BP3 respectively.
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The display RAM bitmap shows the direct relationship between the display RAM addresses and
the segment outputs; and between the bits in a RAM word and the backplane outputs.
Fig 12. Display RAM bitmap
When display data is transmitted to the PCF85132, the received display bytes are stored
in the display RAM in accordance with the selected LCD drive mode. The data is stored as
it arrives and does not wait for the acknowledge cycle as with the commands. Depending
on the current multiplex drive mode, data is stored singularly, in pairs, triples, or
quadruples. To illustrate the filling order, an example of a 7-segment numeric display
showing all drive modes is given in Figure 13. The RAM filling organization depicted
applies equally to other LCD types.
The following applies to Figure 13:
• In static drive mode the eight transmitted data bits are placed in row 0 as 1 byte.
• In 1:2 multiplex drive mode the eight transmitted data bits are placed in pairs into
row 0 and 1 as four successive 2-bit RAM words.
• In 1:3 multiplex drive mode the 8 bits are placed in triples into row 0, 1, and 2 as 3
successive 3-bit RAM words, with bit 3 of the third address left unchanged. It is not
recommended to use this bit in a display because of the difficult addressing. This last
bit may, if necessary, be controlled by an additional transfer to this address but care
should be taken to avoid overwriting adjacent data because always full bytes are
transmitted (see Section 7.5.3 on page 25).
• In 1:4 multiplex drive mode, the eight transmitted data bits are placed in quadruples
into row 0, 1, 2, and 3 as 2 successive 4-bit RAM words.
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
22 of 65
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PCF85132
23 of 65
© NXP Semiconductors N.V. 2015. All rights reserved.
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PCF85132
Product data sheet
GULYHPRGH
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7.5.1 Data pointer
The addressing mechanism for the display RAM is realized using the data pointer. This
allows the loading of an individual display data byte, or a series of display data bytes, into
any location of the display RAM. The sequence commences with the initialization of the
data pointer by the load-data-pointer command (see 7 on page 7 and Table 8 on page 7).
Following this command, an arriving data byte is stored at the display RAM address
indicated by the data pointer. The filling order is shown in Figure 13.
After each byte is stored, the content of the data pointer is automatically incremented by a
value dependent on the selected LCD drive mode:
•
•
•
•
In static drive mode by eight
In 1:2 multiplex drive mode by four
In 1:3 multiplex drive mode by three
In 1:4 multiplex drive mode by two
If an I2C-bus data access is terminated early, then the state of the data pointer is
unknown. The data pointer should be re-written before further RAM accesses.
7.5.2 Subaddress counter
The storage of display data is conditioned by the content of the subaddress counter.
Storage is allowed only when the content of the subaddress counter matches with the
hardware subaddress applied to A0 and A1. The subaddress counter value is defined by
the device-select command (see Table 9 on page 7). If the content of the subaddress
counter and the hardware subaddress do not match then data storage is inhibited but the
data pointer is incremented as if data storage had taken place. The subaddress counter is
also incremented when the data pointer overflows.
The storage arrangements described lead to extremely efficient data loading in cascaded
applications. When a series of display bytes are sent to the display RAM, automatic
wrap-over to the next PCF85132 occurs when the last RAM address is exceeded.
Subaddressing across device boundaries is successful even if the change to the next
device in the cascade occurs within a transmitted character.
The hardware subaddress must not be changed while the device is being accessed on the
I2C-bus interface.
PCF85132
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LCD driver for low multiplex rates
7.5.3 RAM writing in 1:3 multiplex drive mode
In 1:3 multiplex drive mode, the RAM is written as shown in Table 16 (see Figure 13 as
well).
Table 16. Standard RAM filling in 1:3 multiplex drive mode
Assumption: BP2/S2, BP2/S5, BP2/S8 etc. are not connected to any elements on the display.
Display RAM
bits (rows)/
backplane
outputs (BPn)
Display RAM addresses (columns)/segment outputs (Sn)
0
1
2
3
4
5
6
7
8
9
:
0
a7
a4
a1
b7
b4
b1
c7
c4
c1
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:
1
a6
a3
a0
b6
b3
b0
c6
c3
c0
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:
2
a5
a2
-
b5
b2
-
c5
c2
-
d5
:
3
-
-
-
-
-
-
-
-
-
-
:
If the bit at position BP2/S2 would be written by a second byte transmitted, then the
mapping of the segment bits would change as illustrated in Table 17.
Table 17. Entire RAM filling by rewriting in 1:3 multiplex drive mode
Assumption: BP2/S2, BP2/S5, BP2/S8 etc. are connected to elements on the display.
Display RAM
bits (rows)/
backplane
outputs (BPn)
Display RAM addresses (columns)/segment outputs (Sn)
0
1
2
0
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a4
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:
1
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a3
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:
2
a5
a2
b5
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e2
:
3
-
-
-
-
-
-
-
-
-
-
:
3
4
5
6
7
8
9
:
In the case described in Table 17 the RAM has to be written entirely and BP2/S2, BP2/S5,
BP2/S8, and so on, have to be connected to elements on the display. This can be
achieved by a combination of writing and rewriting the RAM like follows:
• In the first write to the RAM, bits a7 to a0 are written
• The data-pointer (see Section 7.1.2 on page 7) has to be set to the address of bit a1
• In the second write, bits b7 to b0 are written, overwriting bits a1 and a0 with bits b7
and b6
• The data-pointer has to be set to the address of bit b1
• In the third write, bits c7 to c0 are written, overwriting bits b1 and b0 with bits c7 and
c6
Depending on the method of writing to the RAM (standard or entire filling by rewriting),
some elements remain unused or can be used, but it has to be considered in the module
layout process as well as in the driver software design.
7.5.4 Bank selection
7.5.4.1
Output bank selector
The output bank selector (see Table 10 on page 8) selects one of the four rows per display
RAM address for transfer to the display register. The actual row selected depends on the
particular LCD drive mode in operation and on the instant in the multiplex sequence.
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LCD driver for low multiplex rates
• In 1:4 multiplex mode, all RAM addresses of row 0 are selected, followed by the
contents of row 1, row 2, and then row 3
• In 1:3 multiplex mode, rows 0, 1, and 2 are selected sequentially
• In 1:2 multiplex mode, rows 0 and 1 are selected
• In static mode, row 0 is selected
7.5.4.2
Input bank selector
The input bank selector loads display data into the display RAM in accordance with the
selected LCD drive configuration. Display data can be loaded by using the bank-select
command (see Table 10). The input bank selector functions independently to the output
bank selector.
7.5.4.3
RAM bank switching
The PCF85132 includes a RAM bank switching feature in the static and 1:2 multiplex drive
modes. A bank can be thought of as one RAM row or a collection of RAM rows (see
Figure 14). The RAM bank switching gives the provision for preparing display information
in an alternative bank and to be able to switch to it once it is complete.
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There are two banks; bank 0 and bank 1. Figure 14 shows the location of these banks
relative to the RAM map. Input and output banks can be set independently from one
another with the Bank-select command (see Table 10 on page 8). Figure 15 shows the
concept.
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NXP Semiconductors
LCD driver for low multiplex rates
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In the static drive mode, the bank-select command may request the contents of row 2 to
be selected for display instead of the contents of row 0. In the 1:2 multiplex mode, the
contents of rows 2 and 3 may be selected instead of rows 0 and 1. This gives the
provision for preparing display information in an alternative bank and to be able to switch
to it once it is assembled.
In Figure 16 an example is shown for 1:2 multiplex drive mode where the displayed data is
read from the first two rows of the memory (bank 0), while the transmitted data is stored in
the second two rows of the memory (bank 1).
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Fig 16. Example of the Bank-select command with multiplex drive mode 1:2
PCF85132
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Rev. 4 — 24 April 2015
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PCF85132
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LCD driver for low multiplex rates
8. Characteristics of the I2C-bus
The I2C-bus is for bidirectional, two-line communication between different ICs or modules.
The two lines are a Serial DAta line (SDA) and a Serial CLock line (SCL). Both lines must
be connected to a positive supply via a pull-up resistor when connected to the output
stages of a device. Data transfer may be initiated only when the bus is not busy.
By connecting pin SDAACK to pin SDA on the PCF85132, the SDA line becomes fully
I2C-bus compatible. In COG applications where the track resistance from the SDAACK
pin to the system SDA line can be significant, possibly a voltage divider is generated by
the bus pull-up resistor and the Indium Tin Oxide (ITO) track resistance. As a
consequence, it may be possible that the acknowledge generated by the PCF85132
cannot be interpreted as logic 0 by the master. In COG applications where the
acknowledge cycle is required, it is therefore necessary to minimize the track resistance
from the SDAACK pin to the system SDA line to guarantee a valid LOW level (see
Section 14.2 on page 42).
By separating the acknowledge output from the serial data line (having the SDAACK open
circuit) design efforts to generate a valid acknowledge level can be avoided. However, in
that case the I2C-bus master has to be set up in such a way that it ignores the
acknowledge cycle.2
The following definition assumes that SDA and SDAACK are connected and refers to the
pair as SDA.
8.1 Bit transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the HIGH period of the clock pulse as changes in the data line at this time
are interpreted as a control signal (see Figure 17).
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8.1.1 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW change
of the data line, while the clock is HIGH is defined as the START condition (S).
A LOW-to-HIGH change of the data line while the clock is HIGH is defined as the STOP
condition (P). The START and STOP conditions are shown in Figure 18.
2.
For further information, please consider the NXP application note: Ref. 1 “AN10170”.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Fig 18. Definition of START and STOP conditions
8.2 System configuration
A device generating a message is a transmitter; a device receiving a message is the
receiver. The device that controls the message is the master and the devices which are
controlled by the master are the slaves. The system configuration is shown in Figure 19.
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Fig 19. System configuration
8.3 Acknowledge
The number of data bytes transferred between the START and STOP conditions from
transmitter to receiver is unlimited. Each byte of 8 bits is followed by an acknowledge
cycle.
• A slave receiver which is addressed must generate an acknowledge after the
reception of each byte.
• Also a master receiver must generate an acknowledge after the reception of each
byte that has been clocked out of the slave transmitter.
• The device that acknowledges must pull-down the SDA line during the acknowledge
clock pulse, so that the SDA line is stable LOW during the HIGH period of the
acknowledge related clock pulse (set-up and hold times must be considered).
• A master receiver must signal an end of data to the transmitter by not generating an
acknowledge on the last byte that has been clocked out of the slave. In this event, the
transmitter must leave the data line HIGH to enable the master to generate a STOP
condition.
Acknowledgement on the I2C-bus is shown in Figure 20.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Fig 20. Acknowledgement on the I2C-bus
8.4 I2C-bus controller
The PCF85132 acts as an I2C-bus slave receiver. It does not initiate I2C-bus transfers or
transmit data to an I2C-bus master receiver. The only data output from the PCF85132 is
the acknowledge signal. Device selection depends on the I2C-bus slave address, on the
transferred command data, and on the hardware subaddress.
In single device applications, the hardware subaddress inputs A0 and A1 are normally tied
to VSS which defines the hardware subaddress 0. In multiple device applications
A0 and A1 are tied to VSS or VDD in accordance with a binary coding scheme. No two
devices with a common I2C-bus slave address must have the same hardware
subaddress.
8.5 Input filters
To enhance noise immunity in electrical adverse environments, RC low-pass filters are
provided on the SDA and SCL lines.
8.6 I2C-bus protocol
Two I2C-bus slave addresses (0111 000 and 0111 001) are reserved for the PCF85132.
The entire I2C-bus slave address byte is shown in Table 18.
Table 18.
I2C slave address byte
Slave address
Bit
7
6
5
4
3
2
1
MSB
0
0
LSB
1
1
1
0
0
SA0
R/W
The PCF85132 is a write-only device and does not respond to a read access, therefore
bit 0 should always be logic 0. Bit 1 of the slave address byte, that a PCF85132 responds
to, is defined by the level tied to its SA0 input (VSS for logic 0 and VDD for logic 1).
Having two reserved slave addresses allows the following on the same I2C-bus:
• Up to 8 PCF85132 on the same I2C-bus for very large LCD applications
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LCD driver for low multiplex rates
• The use of two types of LCD multiplex drive modes on the same I2C-bus
The I2C-bus protocol is shown in Figure 21. The sequence is initiated with a START
condition (S) from the I2C-bus master which is followed by one of two possible PCF85132
slave addresses available. All PCF85132 with the corresponding SA0 level acknowledge
in parallel to the slave address, but all PCF85132 with the alternative SA0 level ignore the
whole I2C-bus transfer.
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Fig 21. I2C-bus protocol
After acknowledgement, a control byte follows which defines if the next byte is RAM or
command information.
Table 19.
Control byte description
Bit
Symbol
7
CO
Value
Description
continue bit
0
last control byte
1
6
5 to 0
control bytes continue
RS
-
register selection
0
command register
1
data register
-
not relevant
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Fig 22. Control byte format
PCF85132
Product data sheet
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LCD driver for low multiplex rates
In this way, it is possible to configure the device and then fill the display RAM with little
overhead.
The command bytes and control bytes are also acknowledged by all addressed
PCF85132 connected to the bus.
The display bytes are stored in the display RAM at the address specified by the data
pointer and the subaddress counter; see Section 7.5.1 and Section 7.5.2.
The acknowledgement after each byte is made only by the (A0 and A1) addressed
PCF85132. After the last (display) byte, the I2C-bus master issues a STOP condition (P).
Alternatively a repeated START may be asserted to restart an I2C-bus access.
PCF85132
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LCD driver for low multiplex rates
9. Internal circuitry
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Fig 23. Device protection diagram
10. Safety notes
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
CAUTION
Static voltages across the liquid crystal display can build up when the LCD supply voltage
(VLCD) is on while the IC supply voltage (VDD) is off, or vice versa. This may cause unwanted
display artifacts. To avoid such artifacts, VLCD and VDD must be applied or removed together.
CAUTION
Semiconductors are light sensitive. Exposure to light sources can cause the IC to
malfunction. The IC must be protected against light. The protection must be applied to all
sides of the IC.
PCF85132
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LCD driver for low multiplex rates
11. Limiting values
Table 20. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol Parameter
Max
Unit
supply voltage
0.5
+6.5
V
IDD
supply current
50
+50
mA
VLCD
LCD supply voltage
0.5
+9.0
V
IDD(LCD) LCD supply current
50
+50
mA
0.5
+6.5
V
10
+10
mA
on pins S0 to S159 and
BP0 to BP3
0.5
+9.0
V
on pins SDAACK,
CLK, SYNC
0.5
+6.5
V
10
+10
mA
Vi
input voltage
II
input current
VO
output voltage
on pins CLK, SYNC,
SA0, OSC, SDA, SCL,
A0, A1, T1, T2, and T3
IO
output current
ISS
ground supply current
50
+50
mA
Ptot
total power dissipation
-
400
mW
P/out
power dissipation per output
-
100
mW
HBM
[2]
-
4500
V
MM
[3]
-
300
V
latch-up current
[4]
-
200
mA
Tstg
storage temperature
[5]
65
+150
C
Tamb
ambient temperature
40
+85
C
Ilu
[1]
Product data sheet
Min
VDD
VESD
PCF85132
Conditions
electrostatic discharge
voltage
operating device
Stresses above these values listed may cause permanent damage to the device.
[2]
Pass level; Human Body Model (HBM) according to Ref. 6 “JESD22-A114”.
[3]
Pass level; Machine Model (MM), according to Ref. 7 “JESD22-A115”.
[4]
Pass level; latch-up testing, according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)).
[5]
According to the store and transport requirements (see Ref. 11 “UM10569”) the devices have to be stored
at a temperature of +8 C to +45 C and a humidity of 25 % to 75 %.
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LCD driver for low multiplex rates
12. Static characteristics
Table 21. Static characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 1.8 V to 8.0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
1.8
-
5.5
V
VLCD
LCD supply voltage
1.8
-
8.0
V
IDD
supply current
[1][2][3]
-
-
20
A
[1][3]
-
-
60
A
[1][2][4]
-
-
70
A
[1][4]
-
-
70
A
0.5
-
+5.5
V
fclk(ext) = 1.800 kHz
with internal oscillator running
IDD(LCD)
LCD supply current
fclk(ext) = 1.800 kHz
with internal oscillator running
Logic[5]
VI
input voltage
on pins SDA and SCL
all other input pins
0.5
-
VDD + 0.5 V
VIH
HIGH-level input voltage
on pins CLK, SYNC, OSC, A0, A1,
SA0, SCL, and SDA
0.7VDD
-
-
V
VIL
LOW-level input voltage
on pins CLK, SYNC, OSC, A0, A1,
SA0, SCL, and SDA
-
-
0.3VDD
V
VO
output voltage
on pins CLK and SYNC
0.5
-
VDD + 0.5 V
on pin SDAACK
0.5
-
+5.5
V
0.8VDD
-
VDD
V
VOH
HIGH-level output voltage on pin SYNC, CLK
VOL
LOW-level output voltage
on pin SYNC, CLK, SDAACK
VSS
-
0.2VDD
V
IOH
HIGH-level output current
output source current;
VOH = 4.6 V;
VDD = 5 V;
on pin CLK
1.5
-
-
mA
IOL
LOW-level output current
output sink current;
on pins CLK and SYNC
1.5
-
-
mA
VDD 2 V;
VOL = 0.2VDD
3
-
-
mA
2 V < VDD < 3 V;
VOL = 0.4 V
3
-
-
mA
VDD 3 V;
VOL = 0.4 V
6
-
-
mA
VOL = 0.4 V;
VDD = 5 V
on pin SDAACK
VPOR
power-on reset voltage
IL
leakage current
PCF85132
Product data sheet
VI = VDD or VSS;
on pin OSC, CLK, A0, A1, SA0,
SDA, and SCL
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1.0
1.3
1.6
V
1
-
+1
A
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Table 21. Static characteristics …continued
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 1.8 V to 8.0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
30
-
+30
mV
on pins BP0 to BP3
-
1.5
5
k
on pins S0 to S159
-
2.0
5
k
LCD outputs
VO
output voltage variation
on pins BP0 to BP3 and S0 to S159
RO
output resistance
VLCD = 5 V
[6][7]
[1]
LCD outputs are open-circuit; inputs at VSS or VDD; I2C-bus inactive; VLCD = 8.0 V, VDD = 5.0 V and RAM written with all logic 1.
[2]
External clock with 50 % duty factor.
[3]
For typical values, see Figure 24.
[4]
For typical values, see Figure 25.
[5]
The I2C-bus interface of PCF85132 is 5 V tolerant.
[6]
Variation between any 2 backplanes on a given voltage level; static measured.
[7]
Variation between any 2 segments on a given voltage level; static measured.
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IDD internal is measured with the internal oscillator.
IDD external is measured with an external clock.
Tamb = 30 C; 1:4 multiplex; VLCD = 8 V; all RAM written with logic 1; no display connected.
Fig 24. IDD with respect to VDD
PCF85132
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Tamb = 30 C; 1:4 multiplex; all RAM written with logic 1; no display connected; external clock with
fclk = 1.800 Hz or fclk(ext) = 1.800 Hz.
Fig 25. IDD(LCD) with respect to VLCD
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PCF85132
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LCD driver for low multiplex rates
13. Dynamic characteristics
Table 22. Dynamic characteristics
VDD = 1.8 V to 5.5 V; VSS = 0 V; VLCD = 1.8 V to 8.0 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
fclk(int)
internal clock frequency
fclk(ext)
external clock frequency
tclk(H)
HIGH-level clock time
tclk(L)
ffr
on pin CLK;
display enabled;
VDD = 5 V 0.5 V
Min
[1][2][3]
[4]
Typ
Max
Unit
1600 1800 2060 Hz
700
-
5000 Hz
external clock source used
100
-
-
s
LOW-level clock time
external clock source used
100
-
-
s
frame frequency variation
VDD = 5 V 0.5 V
ffr = 75 Hz;
Tamb = 30 C
10
-
+10
%
ffr = 71 Hz;
Tamb = 85 C
15
-
+15
%
ffr = 80 Hz;
Tamb = 40 C
15
-
+15
%
tPD(SYNC_N) SYNC propagation delay
tSYNC_NL
SYNC LOW time
tPD(drv)
driver propagation delay
Timing characteristics:
VLCD = 5 V
-
30
-
ns
100
-
-
s
-
10
-
s
I2C-bus[5]
fSCL
SCL clock frequency
-
-
400
kHz
tBUF
bus free time between a STOP and START
condition
1.3
-
-
s
tHD;STA
hold time (repeated) START condition
0.6
-
-
s
tSU;STA
set-up time for a repeated START condition
0.6
-
-
s
tVD;ACK
data valid acknowledge time
-
-
0.9
s
tLOW
LOW period of the SCL clock
1.3
-
-
s
tHIGH
HIGH period of the SCL clock
0.6
-
-
s
tf
fall time
of both SDA and SCL signals
-
-
0.3
s
tr
rise time
of both SDA and SCL signals
-
-
0.3
s
Cb
capacitive load for each bus line
-
-
400
pF
tSU;DAT
data set-up time
200
-
-
ns
tHD;DAT
data hold time
0
-
-
ns
tSU;STO
set-up time for STOP condition
0.6
-
-
s
tSP
pulse width of spikes that must be
suppressed by the input filter
-
-
50
ns
[1]
Typical output duty factor: 50 % measured at the CLK output pin.
[2]
For the respective frame frequency ffr, see Table 12.
[3]
For the characteristics of VDD at a fixed temperature or of the temperature at a fixed VDD, see Figure 26 and Figure 27.
[4]
For fclk(ext) > 4 kHz, it is recommended to use an external pull-up resistor between pin SYNC and pin VDD. The value of the resistor
should be between 100 k and 1 M.
[5]
All timing values are valid within the operating supply voltage and ambient temperature range and are referenced to VIL and VIH with an
input voltage swing of VSS to VDD.
PCF85132
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Tamb = 30 C.
Fig 26. Typical clock frequency (fclk) with respect to VDD
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The frame frequency is derived from the internal or external clock frequency by Equation 1.
Fig 27. Frame frequency variation
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Fig 29. I2C-bus timing waveforms when SDA and SDAACK are connected
PCF85132
Product data sheet
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PCF85132
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LCD driver for low multiplex rates
14. Application information
14.1 Pull-up resistor sizing on I2C-bus
14.1.1 Max value of pull-up resistor
The bus capacitance (Cb) is the total capacitance of wire, connections, and pins. This
capacitance on pin SDA limits the maximum value of the pull-up resistor (RPU) due to the
specified rise time.
According to the I2C-bus specification the rise time (tr) is defined between the VDD-related
input threshold of VIL = 0.3VDD and VIH = 0.7VDD. The value for tr(max) is 300 ns.
tr is calculated with Equation 7:
(7)
t r = t2 – t1
whereas t1 and t2 are the time since the charging started. The values for t1 and t2 are
derivatives of the functions V(t1) and V(t2):
V t1 = 0.3V DD = V DD 1 – e
V t2 = 0.7V DD = V DD 1 – e
-t1 R PU C b
-t2 R PU C b
(8)
(9)
with the results of
t1 = – R PU C b ln(0.7)
(10)
t2 = – R PU C b ln(0.3)
(11)
t r = – R PU C b ln(0.3) + R PU C b ln(0.7)
(12)
RPU(max) is a function of the rise time (tr) and the bus capacitance (Cb) and is calculated
with Equation 13:
tr
300 10 –9
R PU max = ----------------------- = ------------------------0.8473C b 0.8473C b
(13)
14.1.2 Min value of pull-up resistor
The supply voltage limits the minimum value of resistor RPU due to the specified minimum
sink current (see value of IOL on pin SDAACK in Table 21 on page 35). RPU(min) as a
function of VDD is calculated with Equation 14:
V DD – V OL
R PU min = ------------------------I OL
(14)
The designer now has the minimum and maximum value of RPU. The values for RPU(max)
and RPU(min) are shown in Figure 30 and Figure 31.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Fig 30. Values for RPU(max)
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Fig 31. Values for RPU(min)
14.2 ITO track resistance
If an application requires to have a low VDD supply voltage compared to the VLCD supply
voltage, it is recommended to increase the ITO resistance on the VLCD supply track in
order to reduce the noise induced on the VSS line when display is enabled. A low VDD
voltage supply and noise peaks on VSS induced by display activities may introduce
disturbances into the I2C communication with the microcontroller.
Figure 32 shows that, when the ITO resistance of the VSS pin has a certain value, it is
indicated to have a higher ITO resistance on the VLCD track, especially if VLCD (for
example, 9 V) is sharply higher than VDD (for example, 1.8 V). With a higher ITO
resistance on the VLCD track, the noise spikes induced to the VSS of the PCF85132 are
getting smaller and the functionality is less affected.
PCF85132
Product data sheet
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PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
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Tamb = 25 C; RITO(VSS) = 25 ; RITO(VDD) = 50 .
(1) RITO(VLCD) = 50 .
(2) RITO(VLCD) = 100 .
(3) RITO(VLCD) = 150 .
a. Operating range of the PCF85132 with RITO(VSS) = 25
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Tamb = 25 C; RITO(VSS) = 50 ; RITO(VDD) = 50 .
(1) RITO(VLCD) = 50 .
(2) RITO(VLCD) = 75 .
(3) RITO(VLCD) = 100 .
(4) RITO(VLCD) = 150 .
(5) RITO(VLCD) = 200 .
(6) RITO(VLCD) = 300 .
b. Operating range of the PCF85132 with RITO(VSS) = 50
Fig 32. Operating range of the PCF85132 with respect to the ITO track resistance
PCF85132
Product data sheet
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PCF85132
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LCD driver for low multiplex rates
14.3 SDA and SDAACK configuration
The Serial DAta line (SDA) and the I2C-bus acknowledge line (SDAACK) are split. Both
lines can be connected together to facilitate a single-line SDA.
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Fig 33. SDA, SDAACK configurations
14.4 Cascaded operation
In large display configurations, up to 8 PCF85132 can be distinguished on the same
I2C-bus by using the 2-bit hardware subaddress (A0 and A1) and the programmable
I2C-bus slave address (SA0).
Table 23.
Addressing cascaded PCF85132
Cluster
Bit SA0
Pin A1
Pin A0
Device
1
0
0
0
0
0
1
1
1
0
2
1
1
3
0
0
4
0
1
5
1
0
6
1
1
7
2
1
When cascaded PCF85132 are synchronized, they can share the backplane signals from
one of the devices in the cascade. Such an arrangement is cost-effective in large LCD
applications since the backplane outputs of only one device need to be through-plated to
the backplane electrodes of the display. The other PCF85132 of the cascade contribute
additional segment outputs. The backplanes can either be connected together to enhance
the drive capability or some can be left open-circuit (such as the ones from the slave in
Figure 34 and Figure 35) or just some of the master and some of the slave will be taken to
facilitate the layout of the display.
For display sizes that are not multiple of 640 elements, a mixed cascaded system can be
considered containing only devices like PCF85132 and PCA85133. Depending on the
application, one must take care of the software commands compatibility and pin
connection compatibility.
The SYNC line is provided to maintain the correct synchronization between all cascaded
PCF85132. This synchronization is guaranteed after the Power-On Reset (POR). The
only time that SYNC is likely to be needed is if synchronization is accidentally lost (for
example, by noise in adverse electrical environments, or by the definition of a multiplex
mode when PCF85132 with different SA0 levels are cascaded). SYNC is organized as an
input/output pin; the output selection being realized as an open-drain driver with an
PCF85132
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PCF85132
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LCD driver for low multiplex rates
internal pull-up resistor. A PCF85132 asserts the SYNC line at the onset of its last active
backplane signal and monitors the SYNC line at all other times. Should synchronization in
the cascade be lost, it is restored by the first PCF85132 to assert SYNC. The timing
relationship between the backplane waveforms and the SYNC signal for the various drive
modes of the PCF85132 are shown in Figure 36 on page 48.
When using an external clock signal with high frequencies (fclk(ext) > 4 kHz), it is
recommended to have an external pull-up resistor between pin SYNC and pin VDD (see
Table 22 on page 38). This resistor should be present even when no cascading
configuration is used! When using it in a cascaded configuration, care must be taken not
to route the SYNC signal to close to noisy signals.
The contact resistance between the SYNC pads of cascaded devices must be controlled.
If the resistance is too high, the device is not able to synchronize properly. This is
particularly applicable to COG applications. Table 24 shows the limiting values for contact
resistance.
Table 24.
SYNC contact resistance
Number of devices
Maximum contact resistance
2
6000
3 to 5
2200
6 to 8
1200
In the cascaded applications, the OSC pin of the PCF85132 with subaddress 0 is
connected to VSS so that this device uses its internal clock to generate a clock signal at
the CLK pin. The other PCF85132 devices are having the OSC pin connected to VDD,
meaning that these devices are ready to receive external clock, the signal being provided
by the device with subaddress 0.
If the master is providing the clock signal to the slave devices, care must be taken that the
sending of display enable or disable is received by both, the master and the slaves at the
same time. When the display is disabled, the output from pin CLK is disabled too. The
disconnection of the clock may result in a DC component for the display.
Alternatively, the schematic can be also constructed such that all the devices have OSC
pin connected to VDD and thus an external CLK being provided for the system (all devices
connected to the same external CLK).
A configuration where SYNC is connected but all PCF85132 are using their internal clock
(OSC pin tied to VSS) should not be used and may lead to display artifacts!
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
45 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
9''
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(1) Is master (OSC connected to VSS).
(2) Is slave (OSC connected to VDD).
Fig 34. Cascaded configuration with two PCF85132 using the internal clock of the master
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
46 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
9''
9/&'
6'$
VHJPHQWV
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(1) Is master (OSC connected to VSS).
(2) Is slave (OSC connected to VDD).
Fig 35. Cascaded configuration with one PCF85132 and one PCF85133 using the internal
clock of the master
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
47 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
7IU IIU
%3
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Fig 36. Synchronization of the cascade for the various PCF85132 drive modes
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
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48 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
15. Bare die outline
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Fig 37. Bare die outline of PCF85132
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
49 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Table 25. Bump locations
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 37.
PCF85132
Product data sheet
Symbol
Bump
X (m)
Y (m)
Symbol
Bump
X (m)
Y (m)
SDAACK
1
1165.3
481.5
S68
100
750.2
481.5
SDAACK
2
1111.3
481.5
S69
101
696.2
481.5
SDAACK
3
1057.3
481.5
S70
102
642.2
481.5
SDA
4
854.8
481.5
S71
103
588.2
481.5
SDA
5
800.8
481.5
S72
104
534.2
481.5
SDA
6
746.8
481.5
S73
105
480.2
481.5
SCL
7
575.8
481.5
S74
106
426.2
481.5
SCL
8
521.8
481.5
S75
107
372.2
481.5
SCL
9
467.8
481.5
S76
108
318.2
481.5
CLK
10
316.2
481.5
S77
109
264.2
481.5
VDD
11
204.1
481.5
S78
110
210.2
481.5
VDD
12
150.1
481.5
S79
111
156.2
481.5
VDD
13
96.1
481.5
BP0
112
86.8
481.5
SYNC
14
6.9
481.5
BP2
113
32.8
481.5
OSC
15
119.4
481.5
BP1
114
21.2
481.5
T1
16
203.1
481.5
BP3
115
75.2
481.5
T2
17
286.8
481.5
S80
116
190.7
481.5
T3
18
389.9
481.5
S81
117
244.7
481.5
T3
19
443.9
481.5
S82
118
298.7
481.5
T3
20
497.9
481.5
S83
119
352.7
481.5
A0
21
640.5
481.5
S84
120
406.7
481.5
A1
22
724.2
481.5
S85
121
460.7
481.5
SA0
23
807.9
481.5
S86
122
514.7
481.5
VSS
24
893.0
481.5
S87
123
568.7
481.5
VSS
25
947.0
481.5
S88
124
622.7
481.5
VSS
26
1001.0
481.5
S89
125
676.7
481.5
VLCD
27
1107.2
481.5
S90
126
730.7
481.5
VLCD
28
1161.2
481.5
S91
127
784.7
481.5
VLCD
29
1215.2
481.5
S92
128
838.7
481.5
BP2
30
1303.4
481.5
S93
129
892.7
481.5
BP0
31
1357.4
481.5
S94
130
946.7
481.5
S0
32
1411.4
481.5
S95
131
1000.7
481.5
S1
33
1465.4
481.5
S96
132
1054.7
481.5
S2
34
1519.4
481.5
S97
133
1108.7
481.5
S3
35
1573.4
481.5
S98
134
1224.2
481.5
S4
36
1627.4
481.5
S99
135
1278.2
481.5
S5
37
1681.4
481.5
S100
136
1332.2
481.5
S6
38
1735.4
481.5
S101
137
1386.2
481.5
S7
39
1789.4
481.5
S102
138
1440.2
481.5
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Rev. 4 — 24 April 2015
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50 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Table 25. Bump locations …continued
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 37.
PCF85132
Product data sheet
Symbol
Bump
X (m)
Y (m)
Symbol
Bump
X (m)
Y (m)
S8
40
1843.4
481.5
S103
139
1494.2
481.5
S9
41
1897.4
481.5
S104
140
1548.2
481.5
S10
42
1951.4
481.5
S105
141
1602.2
481.5
S11
43
2005.4
481.5
S106
142
1656.2
481.5
S12
44
2059.4
481.5
S107
143
1710.2
481.5
S13
45
2113.4
481.5
S108
144
1764.2
481.5
S14
46
2167.4
481.5
S109
145
1818.2
481.5
S15
47
2221.4
481.5
S110
146
1872.2
481.5
S16
48
2363.9
481.5
S111
147
1926.2
481.5
S17
49
2417.9
481.5
S112
148
1980.2
481.5
S18
50
2471.9
481.5
S113
149
2034.2
481.5
S19
51
2525.9
481.5
S114
150
2088.2
481.5
S20
52
2579.9
481.5
S115
151
2142.2
481.5
S21
53
2633.9
481.5
S116
152
2284.7
481.5
S22
54
2687.9
481.5
S117
153
2338.7
481.5
S23
55
2741.9
481.5
S118
154
2392.7
481.5
S24
56
2795.9
481.5
S119
155
2446.7
481.5
S25
57
2849.9
481.5
S120
156
2500.7
481.5
S26
58
2903.9
481.5
S121
157
2554.7
481.5
S27
59
2957.9
481.5
S122
158
2608.7
481.5
S28
60
3011.9
481.5
S123
159
2662.7
481.5
S29
61
3067.7
481.5
S124
160
2716.7
481.5
S30
62
3013.7
481.5
S125
161
2770.7
481.5
S31
63
2959.7
481.5
S126
162
2824.7
481.5
S32
64
2905.7
481.5
S127
163
2878.7
481.5
S33
65
2851.7
481.5
S128
164
2932.7
481.5
S34
66
2797.7
481.5
S129
165
2986.7
481.5
S35
67
2743.7
481.5
S130
166
3040.7
481.5
S36
68
2689.7
481.5
S131
167
3025.2
481.5
S37
69
2635.7
481.5
S132
168
2971.2
481.5
S38
70
2520.2
481.5
S133
169
2917.2
481.5
S39
71
2466.2
481.5
S134
170
2863.2
481.5
S40
72
2412.2
481.5
S135
171
2809.2
481.5
S41
73
2358.2
481.5
S136
172
2755.2
481.5
S42
74
2304.2
481.5
S137
173
2701.2
481.5
S43
75
2250.2
481.5
S138
174
2647.2
481.5
S44
76
2196.2
481.5
S139
175
2593.2
481.5
S45
77
2142.2
481.5
S140
176
2539.2
481.5
S46
78
2088.2
481.5
S141
177
2485.2
481.5
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
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51 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Table 25. Bump locations …continued
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 37.
Symbol
Bump
X (m)
Y (m)
Symbol
Bump
X (m)
Y (m)
S47
79
2034.2
481.5
S142
178
2431.2
481.5
S48
80
1891.7
481.5
S143
179
2377.2
481.5
S49
81
1837.7
481.5
S144
180
2234.7
481.5
S50
82
1783.7
481.5
S145
181
2180.7
481.5
S51
83
1729.7
481.5
S146
182
2126.7
481.5
S52
84
1675.7
481.5
S147
183
2072.7
481.5
S53
85
1621.7
481.5
S148
184
2018.7
481.5
S54
86
1567.7
481.5
S149
185
1964.7
481.5
S55
87
1513.7
481.5
S150
186
1910.7
481.5
S56
88
1459.7
481.5
S151
187
1856.7
481.5
S57
89
1405.7
481.5
S152
188
1802.7
481.5
S58
90
1351.7
481.5
S153
189
1748.7
481.5
S59
91
1297.7
481.5
S154
190
1694.7
481.5
S60
92
1243.7
481.5
S155
191
1640.7
481.5
S61
93
1189.7
481.5
S156
192
1586.7
481.5
S62
94
1135.7
481.5
S157
193
1532.7
481.5
S63
95
1081.7
481.5
S158
194
1478.7
481.5
S64
96
1027.7
481.5
S159
195
1424.7
481.5
S65
97
973.7
481.5
BP3
196
1370.7
481.5
S66
98
858.2
481.5
BP1
197
1316.7
481.5
S67
99
804.2
481.5
The dummy pins are connected to the pins shown (see Table 26) but are not tested.
Table 26. Dummy bumps
All x/y coordinates represent the position of the center of each bump with respect to the center
(x/y = 0) of the chip; see Figure 37 on page 49.
Symbol
Connected to pin
X (m)
Y (m)
D1
S131
3079.2
481.5
D2
S28
3065.9
481.5
D3
S29
3121.7
481.5
D4
S130
3094.7
481.5
The alignment marks are shown in Table 27.
PCF85132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
52 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
D
D
D
D
D
E
E E
E
E
5()
5()
6
&
DDD
Fig 38. Alignment marks
Table 27. Alignment marks
All x/y coordinates represent the position of the REF point (see Figure 38) with respect to the center
(x/y = 0) of the chip; see Figure 37 on page 49.
a
a1
a2
a3
b
b1
b2
b3
Coordinates
X
Y
Unit
Alignment mark S1
121.5
-
-
-
121.5
-
-
-
2733.75
47.25
m
36.45
121.5
36.45
48.6
36.45
2603.7
47.25
m
Alignment mark C1
121.5
PCF85132
Product data sheet
36.45
48.6
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
53 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
16. Packing information
16.1 Tray information
-
$
+
%
$
$
[
;
.
)
GLH
(
GHWDLO;
'
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(
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2
1
/
0
6(&7,21$$
<
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DDD
Fig 39. Tray details
Table 28. Description of tray details
Tray details are shown in Figure 39.
Tray details
Dimensions
A
B
C
D
E
F
G
H
J
K
L
M
N
O
Unit
8.50
2.40
6.596
1.259
50.8
45.72
34.0
5.0
8.40
40.80
3.96
2.18
2.49
0.5
mm
Number of pockets
x direction
y direction
5
18
PCF85132
Product data sheet
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Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
54 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
PDUNLQJFRGH
DDM
Fig 40. Tray alignment
PCF85132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
55 of 65
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
NXP Semiconductors
PCF85132
Product data sheet
17. Appendix
17.1 LCD segment driver selection
Table 29.
Selection of LCD segment drivers
Type name
Number of elements at MUX
ffr (Hz)
Interface Package
AECQ100
PCA8553DTT
40
80
120 160 -
-
-
1.8 to 5.5 1.8 to 5.5 32 to 256[1]
N
N
40 to 105 I2C / SPI
TSSOP56 Y
PCA8546ATT
-
-
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
I2C
TSSOP56 Y
PCA8546BTT
-
-
-
176 -
-
-
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
SPI
TSSOP56 Y
1.8 to 5.5 2.5 to 9
60 to
300[1]
Y
40 to 95
I2C
TQFP64
Y
60 to
300[1]
Y
Y
40 to 95
SPI
TQFP64
Y
N
N
40 to 85
I2C
LQFP80
N
N
40 to 95
I2C
LQFP80
Y
Y
40 to 105
I2C
LQFP80
Y
TSSOP56 N
88
-
-
-
Rev. 4 — 24 April 2015
All information provided in this document is subject to legal disclaimers.
PCA8547BHT
44
88
176 -
-
-
1.8 to 5.5 2.5 to 9
PCF85134HL
60
120 180 240 -
-
-
1.8 to 5.5 2.5 to 6.5 82
PCA85134H
PCA8543AHL
60
60
-
176 -
1:9
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
1:2 1:3
44
1:6 1:8
VLCD (V)
1:1
PCA8547AHT
1:4
VDD (V)
120 180 240 120 -
240 -
-
-
1.8 to 5.5 2.5 to 8
2.5 to 5.5 2.5 to 9
82
Y
N
60 to
300[1]
300[1]
Y
PCF8545ATT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to
N
N
40 to 85
I2C
PCF8545BTT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 5.5 60 to 300[1]
N
N
40 to 85
SPI
TSSOP56 N
PCF8536AT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 85
I2C
TSSOP56 N
1.8 to 5.5 2.5 to 9
60 to
300[1]
N
N
40 to 85
SPI
TSSOP56 N
300[1]
TSSOP56 Y
PCF8536BT
-
-
-
176 252 320 -
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to
N
N
40 to 95
PCA8536BT
-
-
-
176 252 320 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
N
N
40 to 95
SPI
TSSOP56 Y
PCF8537AH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y
40 to 85
I2C
TQFP64
N
1.8 to 5.5 2.5 to 9
60 to
300[1]
Y
Y
40 to 85
SPI
TQFP64
N
300[1]
PCF8537BH
44
88
-
176 276 352 -
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to
Y
Y
40 to 95
TQFP64
Y
PCA8537BH
44
88
-
176 276 352 -
1.8 to 5.5 2.5 to 9
60 to 300[1]
Y
Y
40 to 95
SPI
TQFP64
Y
PCA9620H
60
120 -
240 320 480 -
2.5 to 5.5 2.5 to 9
60 to 300[1]
Y
Y
40 to 105 I2C
LQFP80
Y
2.5 to 5.5 2.5 to 9
300[1]
Y
40 to 105
I2C
Bare die
Y
PCA9620U
60
120 -
240 320 480 -
60 to
Y
PCF8576DU
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 77
N
N
40 to 85
I2C
Bare die
N
PCF8576EUG
40
80
120 160 -
-
-
1.8 to 5.5 2.5 to 6.5 77
N
N
40 to 85
I2C
Bare die
N
N
40 to 105
I2C
Bare die
Y
N
40 to 85
I2C
Bare die
N
N
40 to 95
I2C
Bare die
Y
PCA8576FUG
PCF85133U
PCA85133U
40
80
80
80
120 160 -
160 240 320 160 240 320 -
-
-
1.8 to 5.5 2.5 to 8
200
N
1.8 to 5.5 2.5 to 6.5 82,
110[2]
1.8 to 5.5 2.5 to 8
110[2]
82,
N
N
PCF85132
56 of 65
© NXP Semiconductors N.V. 2015. All rights reserved.
PCA8537AH
I2C
LCD driver for low multiplex rates
PCA8536AT
I2C
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Selection of LCD segment drivers …continued
Type name
Number of elements at MUX
ffr (Hz)
VLCD (V) VLCD (V)
Tamb (C)
charge temperature
pump
compensat.
AECQ100
PCA85233UG
80
160 240 320 -
-
-
1.8 to 5.5 2.5 to 8
150, 220[2]
N
N
40 to 105 I2C
Bare die
Y
PCF85132U
160 320 480 640 -
-
-
1.8 to 5.5 1.8 to 8
60 to 90[1]
N
N
40 to 85
I2C
Bare die
N
Y
40 to 105
I2C
Bare die
Y
N
40 to 95
I2C
Bare die
Y
N
N
40 to 95
I2C
Bare die
Y
Y
Y
40 to 85
I2C / SPI
Bare die
N
Y
40 to 105
I2C
Bare die
Y
PCA85132U
408 -
160 320 480 640 -
PCA85232U
160 320 480 640 -
PCF8538UG
102 204 -
PCA8538UG
102 204 -
Rev. 4 — 24 April 2015
All information provided in this document is subject to legal disclaimers.
[1]
Software programmable.
[2]
Hardware selectable.
-
1:9
Interface Package
1:2 1:3
102 204 -
1:6 1:8
VLCD (V)
1:1
PCA8530DUG
1:4
VDD (V)
-
2.5 to 5.5 4 to 12
1.8 to 5.5 1.8 to 8
1.8 to 5.5 1.8 to 8
45 to
300[1]
60 to
90[1]
117 to
176[1]
408 612 816 918 2.5 to 5.5 4 to 12
45 to 300[1]
408 612 816 918 2.5 to 5.5 4 to 12
300[1]
45 to
Y
N
Y
/ SPI
/ SPI
NXP Semiconductors
PCF85132
Product data sheet
Table 29.
PCF85132
LCD driver for low multiplex rates
57 of 65
© NXP Semiconductors N.V. 2015. All rights reserved.
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
18. Abbreviations
Table 30.
PCF85132
Product data sheet
Abbreviations
Acronym
Description
COG
Chip-On-Glass
DC
Direct Current
HBM
Human Body Model
IC
Integrated Circuit
I2C
Inter-Integrated Circuit
ITO
Indium Tin Oxide
LCD
Liquid Crystal Display
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
POR
Power-On Reset
RC
Resistance and Capacitance
RAM
Random Access Memory
RMS
Root Mean Square
SCL
Serial CLock line
SDA
Serial DAta line
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
58 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
19. References
[1]
AN10170 — Design guidelines for COG modules with NXP monochrome LCD
drivers
[2]
AN10706 — Handling bare die
[3]
AN11267 — EMC and system level ESD design guidelines for LCD drivers
[4]
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[5]
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[6]
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[7]
JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[8]
JESD78 — IC Latch-Up Test
[9]
JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[10] UM10204 — I2C-bus specification and user manual
[11] UM10569 — Store and transport requirements
PCF85132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
59 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
20. Revision history
Table 31.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PCF85132 v.4
20150424
Product data sheet
-
PCF85132 v.3
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Changed description of backplane connections when cascading
Fixed typos
PCF85132 v.3
20130715
PCF85132 v.2
PCF85132 v.1
PCF85132
Product data sheet
Product data sheet
-
PCF85132 v.2
20120905
Product data sheet
-
PCF85132 v.1
20101123
Product data sheet
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
60 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
21. Legal information
21.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
21.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
21.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PCF85132
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
61 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
21.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP Semiconductors N.V.
22. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PCF85132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
62 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
23. Tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . .2
Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5
Definition of PCF85132 commands . . . . . . . . . .6
Mode-set - command bit description . . . . . . . . .6
Load-data-pointer-MSB - command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Load-data-pointer-LSB - command bit
description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Device-select - command bit description . . . . . .7
Bank-select - command bit description . . . . . . .8
Blink-select - command bit description . . . . . . .8
Frequency-ctrl - command bit description . . . .10
Blink frequencies . . . . . . . . . . . . . . . . . . . . . . . 11
Selection of possible display configurations . . .12
Biasing characteristics . . . . . . . . . . . . . . . . . . .13
Standard RAM filling in 1:3 multiplex drive
mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Entire RAM filling by rewriting in 1:3 multiplex
drive mode . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
I2C slave address byte . . . . . . . . . . . . . . . . . . .30
Control byte description . . . . . . . . . . . . . . . . . .31
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .34
Static characteristics . . . . . . . . . . . . . . . . . . . .35
Dynamic characteristics . . . . . . . . . . . . . . . . . .38
Addressing cascaded PCF85132 . . . . . . . . . .44
SYNC contact resistance . . . . . . . . . . . . . . . . .45
Bump locations . . . . . . . . . . . . . . . . . . . . . . . .50
Dummy bumps . . . . . . . . . . . . . . . . . . . . . . . . .52
Alignment marks . . . . . . . . . . . . . . . . . . . . . . . .53
Description of tray details . . . . . . . . . . . . . . . . .54
Selection of LCD segment drivers . . . . . . . . . .56
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .58
Revision history . . . . . . . . . . . . . . . . . . . . . . . .60
PCF85132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
63 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
24. Figures
Fig 1.
Fig 2.
Fig 3.
Fig 4.
Fig 5.
Fig 6.
Fig 7.
Fig 8.
Fig 9.
Fig 10.
Fig 11.
Fig 12.
Fig 13.
Fig 14.
Fig 15.
Fig 16.
Fig 17.
Fig 18.
Fig 19.
Fig 20.
Fig 21.
Fig 22.
Fig 23.
Fig 24.
Fig 25.
Fig 26.
Fig 27.
Fig 28.
Fig 29.
Fig 30.
Fig 31.
Fig 32.
Fig 33.
Fig 34.
Fig 35.
Fig 36.
Fig 37.
Fig 38.
Fig 39.
Fig 40.
Block diagram of PCF85132 . . . . . . . . . . . . . . . . .3
Pinning diagram of PCF85132. . . . . . . . . . . . . . . .4
Frequency generation of the PCF85132 . . . . . . . .9
Example of displays suitable for PCF85132 . . . .12
Typical system configuration . . . . . . . . . . . . . . . .12
Electro-optical characteristic: relative
transmission curve of the liquid . . . . . . . . . . . . . .15
Static drive mode waveforms . . . . . . . . . . . . . . . .16
Waveforms for the 1:2 multiplex drive mode
with 1⁄2 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Waveforms for the 1:2 multiplex drive mode
with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Waveforms for the 1:3 multiplex drive mode
with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Waveforms for the 1:4 multiplex drive mode
with 1⁄3 bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Display RAM bitmap . . . . . . . . . . . . . . . . . . . . . .22
Relationships between LCD layout, drive mode,
display RAM filling order, and display data
transmitted over the I2C-bus . . . . . . . . . . . . . . . .23
RAM banks in static and multiplex driving
mode 1:2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Bank selection . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Example of the Bank-select command with
multiplex drive mode 1:2 . . . . . . . . . . . . . . . . . . .27
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Definition of START and STOP conditions. . . . . .29
System configuration . . . . . . . . . . . . . . . . . . . . . .29
Acknowledgement on the I2C-bus . . . . . . . . . . . .30
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . .31
Control byte format . . . . . . . . . . . . . . . . . . . . . . .31
Device protection diagram . . . . . . . . . . . . . . . . . .33
IDD with respect to VDD . . . . . . . . . . . . . . . . . . . .36
IDD(LCD) with respect to VLCD . . . . . . . . . . . . . . . .37
Typical clock frequency (fclk) with respect
to VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Frame frequency variation . . . . . . . . . . . . . . . . . .39
Driver timing waveforms . . . . . . . . . . . . . . . . . . .40
I2C-bus timing waveforms when SDA and
SDAACK are connected . . . . . . . . . . . . . . . . . . .40
Values for RPU(max) . . . . . . . . . . . . . . . . . . . . . . . .42
Values for RPU(min) . . . . . . . . . . . . . . . . . . . . . . . .42
Operating range of the PCF85132 with respect
to the ITO track resistance. . . . . . . . . . . . . . . . . .43
SDA, SDAACK configurations . . . . . . . . . . . . . . .44
Cascaded configuration with two PCF85132
using the internal clock of the master . . . . . . . . .46
Cascaded configuration with one PCF85132
and one PCF85133 using the internal clock of
the master . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Synchronization of the cascade for the various
PCF85132 drive modes . . . . . . . . . . . . . . . . . . . .48
Bare die outline of PCF85132 . . . . . . . . . . . . . . .49
Alignment marks . . . . . . . . . . . . . . . . . . . . . . . . .53
Tray details . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Tray alignment . . . . . . . . . . . . . . . . . . . . . . . . . . .55
PCF85132
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 24 April 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
64 of 65
PCF85132
NXP Semiconductors
LCD driver for low multiplex rates
25. Contents
1
2
3
3.1
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.6.1
7.1.6.2
7.1.6.3
7.1.6.4
7.1.6.5
7.1.6.6
7.2
7.3
7.3.1
7.3.2
7.3.3
7.3.3.1
7.3.4
7.3.4.1
7.3.4.2
7.3.4.3
7.3.4.4
7.4
7.4.1
7.4.2
7.5
7.5.1
7.5.2
7.5.3
7.5.4
7.5.4.1
7.5.4.2
7.5.4.3
8
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 6
Commands of PCF85132 . . . . . . . . . . . . . . . . . 6
Command: mode-set . . . . . . . . . . . . . . . . . . . . 6
Command: load-data-pointer . . . . . . . . . . . . . . 7
Command: device-select . . . . . . . . . . . . . . . . . 7
Command: bank-select. . . . . . . . . . . . . . . . . . . 8
Command: blink-select . . . . . . . . . . . . . . . . . . . 8
Clock frequency and timing . . . . . . . . . . . . . . . 8
Clock source selection . . . . . . . . . . . . . . . . . . . 8
Internal clock . . . . . . . . . . . . . . . . . . . . . . . . . . 9
External clock . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Frame frequency . . . . . . . . . . . . . . . . . . . . . . 10
Command: frequency-ctrl . . . . . . . . . . . . . . . . 10
Blinking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-On Reset (POR) . . . . . . . . . . . . . . . . . 11
Possible display configurations . . . . . . . . . . . 11
LCD bias generator . . . . . . . . . . . . . . . . . . . . 13
Display register . . . . . . . . . . . . . . . . . . . . . . . . 13
LCD voltage selector . . . . . . . . . . . . . . . . . . . 13
Electro-optical performance . . . . . . . . . . . . . . 14
LCD drive mode waveforms . . . . . . . . . . . . . . 16
Static drive mode . . . . . . . . . . . . . . . . . . . . . . 16
1:2 multiplex drive mode. . . . . . . . . . . . . . . . . 17
1:3 multiplex drive mode. . . . . . . . . . . . . . . . . 19
1:4 multiplex drive mode. . . . . . . . . . . . . . . . . 20
Backplane and segment outputs . . . . . . . . . . 21
Backplane outputs . . . . . . . . . . . . . . . . . . . . . 21
Segment outputs. . . . . . . . . . . . . . . . . . . . . . . 21
Display RAM . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Data pointer . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Subaddress counter . . . . . . . . . . . . . . . . . . . . 24
RAM writing in 1:3 multiplex drive mode. . . . . 25
Bank selection . . . . . . . . . . . . . . . . . . . . . . . . 26
Output bank selector . . . . . . . . . . . . . . . . . . . 26
Input bank selector . . . . . . . . . . . . . . . . . . . . . 26
RAM bank switching . . . . . . . . . . . . . . . . . . . . 26
Characteristics of the I2C-bus . . . . . . . . . . . . 28
8.1
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
8.1.1
START and STOP conditions. . . . . . . . . . . . . 28
8.2
System configuration . . . . . . . . . . . . . . . . . . . 29
8.3
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.4
I2C-bus controller . . . . . . . . . . . . . . . . . . . . . . 30
8.5
Input filters . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.6
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 30
9
Internal circuitry . . . . . . . . . . . . . . . . . . . . . . . 33
10
Safety notes. . . . . . . . . . . . . . . . . . . . . . . . . . . 33
11
Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 34
12
Static characteristics . . . . . . . . . . . . . . . . . . . 35
13
Dynamic characteristics. . . . . . . . . . . . . . . . . 38
14
Application information . . . . . . . . . . . . . . . . . 41
14.1
Pull-up resistor sizing on I2C-bus. . . . . . . . . . 41
14.1.1
Max value of pull-up resistor . . . . . . . . . . . . . 41
14.1.2
Min value of pull-up resistor . . . . . . . . . . . . . . 41
14.2
ITO track resistance . . . . . . . . . . . . . . . . . . . . 42
14.3
SDA and SDAACK configuration . . . . . . . . . . 44
14.4
Cascaded operation. . . . . . . . . . . . . . . . . . . . 44
15
Bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 49
16
Packing information . . . . . . . . . . . . . . . . . . . . 54
16.1
Tray information . . . . . . . . . . . . . . . . . . . . . . . 54
17
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
17.1
LCD segment driver selection . . . . . . . . . . . . 56
18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 58
19
References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
20
Revision history . . . . . . . . . . . . . . . . . . . . . . . 60
21
Legal information . . . . . . . . . . . . . . . . . . . . . . 61
21.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 61
21.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
21.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 61
21.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 62
22
Contact information . . . . . . . . . . . . . . . . . . . . 62
23
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
24
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
25
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 April 2015
Document identifier: PCF85132