Design Support Document RECOMMENDABLE CONDITION OF SOLDERING SURFACE MOUNTED DEVICE CONDITION OF SOLDERING FOR SURFACE MOUNTED DEVICE (DISCRETE DIODES) LEAD FREE (Sn-3Ag-0.5Cu) VERSION CONTENTS RECOMMENDABLE CONDITION OF REFLOW SOLDERING 2/4 RECOMMENDABLE CONDITION OF FLOW SOLDERING 2/4 RECOMMENDABLE CONDITION OF HAND SOLDERING 2/4 CONDITION OF HEAT-RESISTANT 3/4 RECOMMENDABLE CONDITION OF WASHING 3/4 REFERENCE COPPER PLATE AREA DIMENSION ON PRINTED CIRCUIT BOARD www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 1/4 4/4 2013.07 - Rev. E RECOMMENDABLE CONDITION OF SOLDERING Design Support Document Recommended condition of reflow soldering (°C) Peak temperature 1 to 5°C / s 130 to 170°C, 50 to 120s 1 to 5°C / s 230°C, 20 to 30s 245 to 260°C, 10s max. 60s min. 250 Reflow heating rate 200 temperature 150 100 50 Pre heating rate Preliminary heating Soldering Cooling 0 Time 2Times max. Recommended peak temperature is over 245 C. If peak temperature is below 245 C, you may adjust the following parameters ; Time length of peak temperature (longer), Time length of soldering (longer), Thickness of solder paste (thicker). Flow soldering (°C) Condition of hand soldering Preliminary heating Soldering Temperature Time Times Cooling(in air) 300 refer to right table less than 3s one time 265°C 250 245°C 200 Temperature of soldering Temperature differ from PKG 150 PKG less than 400°C SMD3, SMD4, SMD5, SMD6, SSD3, UMD2(expect for 1SS355, 1SS380, 1SS376, UDZ S series) UMD3, UMD3F, UMD4, UMD5, UMD6, EMD2, EMD3, EMD3F, EMD4, EMD5, EMD6, VMN2, VMD2, VMD3, GMD2 HMD8, HMD12, LLDS, LLDL 120°C 100 100°C 50 25 more than 2min less than 10s more than 1min PKG less than 350°C UMD2(1SS355, 1SS380, 1SS376, UDZ S series) KMD2, TUMD2, TUMD5, TSMD5, TSMD6 TSMD8, PMDU, PMDS, PMDT, MPD, CPD3, LPDS less than 5min www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 2/4 2013.07 - Rev. E RECOMMENDABLE CONDITION OF SOLDERING Design Support Document Condition of heat-resistant (°C) Peak temperature 250 1 to 5°C / s 150 to 180°C, 60 to 120s 1 to 5°C / s 230°C, 20 to 40s 260°C max, 10s max. 60s min. 230 heating rate 200 temperature 150 100 50 Soldering Preliminary heating Pre heating rate Cooling 0 Time 2Times max. Recommended condition of washing 1. Washing liquid washing liquid manufacturers water − ethanol − − methanol pine alpha ST-100S ARAKAWA CHEMICAL clean through 750H KAO technocare FRW-1 TOSHIBA TECHNOCARE mighty solve AH-V ASAHI GLASS 2. Condition of washing washing bath time temperature remarks first bath ultrasonic bath less than 60s room temperature 25 to 28kHz, 15W / L second bath immersion bath less than 60s room temperature third bath vaper bath less than 60s less than 44.7°C ∗ boiling points differ to washing liquid ∗ In vaper bath,you can not use ethanol ,methanol and water due to their high boiling points. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 3/4 2013.07 - Rev. E RECOMMENDABLE CONDITION OF SOLDERING Design Support Document unit : mm 0.7 0.9min. 1.3 0.35 0.9min. 1.0 2.4 0.6 1.0min. SMD6 0.95 0.95 0.15 0.15 0.25 0.3 1.55 0.25 1.55 1.55 2.4 1.15 0.45 0.45 0.8 0.35 0.7 1.0min. 0.95 0.95 0.5 0.5 0.5 1.0min. 0.7 1.0min. 0.8 0.45 0.4 EMD6 0.35 2.4 0.45 0.5 EMD5 0.45 0.4 VMD3 0.4 0.5 0.5 2.4 EMD4 1.0 1.0min. 0.4 0.4 0.45 0.3 0.45 0.8 0.5 SMD3,SSD3 4.4 0.25 0.8min. 1.0min. 1.2 0.8min. VMN2 0.15 0.15 0.45 0.25 1.0min. 2.0 0.5 1.4 0.8min. 0.5 0.55 PMDT 0.6 0.8min. SMD5 0.95 0.95 TUMD2 2.0 0.35 0.95 0.95 SMD4 1.1 VMD2 0.45 1.0min. 2.4 3.05 UMD3 0.5 UMD6 1.0 1.0min. 0.45 1.6 0.85 PMDU 0.35 UMD5 1.9 EMD2 0.65 0.8 0.8min. 1.7 0.6 0.35 UMD4 0.65 0.65 6pin 0.65 0.9 0.7 1.3 EMD3 1.2 0.8 Terminal 0.9 4.2 2.1 0.6 PMDS 5pin 0.65 0.6 0.05 0.5 0.5 UMD2 Terminal 0.65 0.7 2.0 0.8min. 4pin 1.6 2.0 0.9min. Terminal 3pin 0.7 1.6 Terminal 2.4 2pin 1.6 Terminal 0.95 0.95 TSMD5 TSMD6 1.3 0.65 0.65 0.6min. 0.38 0.4 1.9 0.23 0.31 0.45 GMD2 TUMD5 Terminal 8pin 12pin Terminal 0.4 0.45 0.4 0.65 2.4 0.5 0.5 0.3 0.3 0.25 HSMD8 8pin 0.8 0.25 Terminal HSMD12 TSMD8 2.2 6.0 0.9 PCB Solder paste Paste thickness Reflow soldering 6.0 3.0 2.5 1.5 0.9 2.5 ∗Copper plate area dimensions above are reference dimensions with being soldered with conditions bellow. 2.0 45° 45° 2.2 9.9 8.5 14 2.5 11 1.6 2.54 LPDS 2.54 1.0 MPD 1.0 1.5 1.5 2.3 2.3 CPD3 FR-4,t=1.6mm M705-GRN360-K2V 150mm *GMD2, HMD12 only 80μm max. 250°C,10s Solderbility will depend on the soldering conditions,solder paste,paste thickness,soldering pad size, mount layout and so on. So, it is difficult for ROHM to refer to customer's soldering conditions. Optomize footprint dimensions to the board design and soldering conditions. www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. 4/4 2013.07 - Rev. E Notice Notes 1) The information contained herein is subject to change without notice. 2) Before you use our Products, please contact our sales representative and verify the latest specifications : 3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM. 4) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 5) The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. 6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. 7) The Products specified in this document are not designed to be radiation tolerant. 8) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 9) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. 11) ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. 12) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 13) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM. 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