® ® Cree XLamp XB-D White LEDs PRODUCT DESCRIPTION FEATURES TABLE OF CONTENTS The XLamp XB-D is Cree’s newest • Cree’s smallest lighting class Flux Characteristics.................... 2 LED: 2.45 X 2.45 mm Characteristics.......................... 3 Up to 136 lm/W in cool white Relative Spectral Power (@ 85 °C, 350 mA) Distribution.............................. 3 lighting class LED, bringing the next generation of performance and • price to LED lighting applications. The XLamp XB-D delivers similar Available in white, 80-min CRI Relative Flux vs. Junction performance to the XP-G LED in a white, and 70-min CRI cool Temperature (IF = 350 mA)......... 4 package that is 48% smaller than white Electrical Characteristics............. 4 • 1 A maximum drive current Thermal Design......................... 5 • Low thermal resistance: Relative Flux vs. Current............ 5 6.5 °C/W Relative Chromaticity vs. the XLamp XP footprint. • Using Cree’s newest generation of silicon carbide-based LED chips, • Wide viewing angle: 115° Temperature and Current............ 6 XB-D is optimized to dramatically • Reflow solderable - JEDEC Typical Spatial Distribution.......... 7 J-STD-020C compatible Reflow Soldering Characteristics.. 8 Unlimited floor life at Notes....................................... 9 ≤ 30 °C/85% RH Mechanical Dimensions............ 10 • Electrically neutral thermal path Tape and Reel......................... 11 • RoHS- and REACH-compliant Packaging............................... 12 lower system cost in any illumination www. cree.com/Xlamp application. • Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 CLD-DS45 Rev 1 Product family data sheet xlamp xB-D white leds Flux Characteristics (TJ = 85 °C) - White The following table provides several base order codes for XLamp XB-D LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XB-D Binning and Labeling document. Color CCT Range Min. Cool White Neutral White 80 CRI Minimum White Warm White 5,000 K 3,700 K 2,600 K 2,600 K Max. Base Order Codes Min. Luminous Flux @ 350 mA (lm) Calculated Minimum Luminous Flux (lm)* Order Code Group Flux (lm) 700 mA 1000 mA R4 130 227 287 XBDAWT-00-0000-000000G51 R3 122 213 270 XBDAWT-00-0000-000000F51 R2 114 199 252 XBDAWT-00-0000-000000E51 8,300 K 5,000 K 4,300 K 3,700 K R2 114 199 252 XBDAWT-00-0000-00000LEE4 Q5 107 187 236 XBDAWT-00-0000-00000LDE4 Q4 100 172 222 XBDAWT-00-0000-00000LCE4 Q4 100 172 222 XBDAWT-00-0000-00000HCE7 Q3 93.9 164 207 XBDAWT-00-0000-00000HBE7 Q2 87.4 153 193 XBDAWT-00-0000-00000HAE7 Q4 100 172 222 XBDAWT-00-0000-00000LCE7 Q3 93.9 164 207 XBDAWT-00-0000-00000LBE7 Q2 87.4 153 193 XBDAWT-00-0000-00000LAE7 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements and ±2 on CRI measurements. • Typical CRI for Neutral White, 3700 K - 5000K CCT is 75. • Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. • Minimum CRI for 80 CRI Minimum White is 80. * Calculated flux values are for reference only Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 2 xlamp xB-D white leds Characteristics Characteristics Unit Thermal resistance, junction to solder point - white Viewing angle (FWHM) - white Temperature coefficient of voltage - white Minimum Typical °C/W 6.5 degrees 115 mV/°C -2.5 ESD classification (HBM per Mil-Std-883D) Maximum Class 2 DC forward current - white mA 1000 Reverse voltage V -5 Forward voltage (@ 350 mA, 85 °C) - white V LED junction temperature °C 2.9 3.5 150 Relative Spectral Power Relative Spectral Power Distribution Relative Radiant Power (%) 100 80 60 5000K - 8300K CCT 2600K - 3700K CCT 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 3 xlamp xB-D white leds Relative Flux Output vs. Junction Temperature Relative Flux vs. Junction Temperature (IF = 350 mA) Relative Luminous Flux 120% 100% 80% 60% 40% 20% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Electrical Characteristics Electrical Characteristics (Tj = 85ºC)(TJ = 85 °C) 1200 Forward Current (mA) 1000 800 600 400 200 0 2.70 2.80 2.90 3.00 3.10 3.20 3.30 Forward Voltage (V) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4 xlamp xB-D white leds Thermal Design The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is Thermal Design crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optomize lamp life and optical characteristics. 1200 Maximum Current (mA) 1000 800 600 Rj-a Rj-a Rj-a Rj-a 400 = = = = 10°C/W 15°C/W 20°C/W 25°C/W 200 0 0 20 40 60 80 100 120 140 Ambient Temperature (ºC) Relative Intensity vs. Current (Tj = 85ºC) Relative Flux vs. Current (TJ = 85 °C) Relative Luminous Flux (%) 250% 200% 150% 100% 50% 0% 0 200 400 600 800 1000 Forward Current (mA) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 5 xlamp xB-D white leds Relative Chromaticity Vs. Current, WW RELATIVE CHROMATICITY VS. CURRENT AND TEMPERATURE (WARM White) 0.020 T = 85 °C J 0.015 0.010 0.005 0.000 ΔCCx ΔCCy -0.005 -0.010 -0.015 -0.020 0 100 200 300 400 500 600 Current (mA) 700 800 900 1000 Relative Chromaticity Vs. Temperature WW 0.020 I = 350 mA F 0.015 0.010 0.005 0.000 ΔCCx ΔCCy -0.005 -0.010 -0.015 -0.020 0 20 40 60 80 Tsp (°C) 100 120 140 160 Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 6 xlamp xB-D white leds Typical Spatial Radiation Pattern Typical Spatial Distribution Relative Luminous Intensity (%) 120 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 7 xlamp xB-D white leds Reflow Soldering Characteristics In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. tP TP Critical Zone TL to TP Temperature Ramp-up TL tS Tsmax Tsmin Ramp-down ts Preheat 25 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) t 25˚C to Peak Time Lead-Based Solder Lead-Free Solder 3 °C/second max. 3 °C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217 °C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 xlamp xB-D white leds Notes Lumen Maintenance Projections Please read the XLamp Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity In testing, Cree has found XLamp XB-D LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDs to the resealable moisture-barrier bag and closing the bag immediately after use. RoHS Compliance The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (POP), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006. Vision Advisory Claim WARNING: Do not look at exposed lamp in operation. Eye injury can result. See LED Eye Safety at www.cree.com/ products/pdf/XLamp_EyeSafety.pdf. Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 9 xlamp xB-D white leds 6 5 4 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. 3 2 Mechanical Dimensions REV All measurements are ±.13 mm unless otherwise indicated. 6 5 4 D 3 2 RE NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. REV 1.84 2.45 DESCRIPTION 1.633 0.355 0.76 0.817 D 1.84 2.45 1.633 0.355 0.76 0.817 2.45 2.285 2.45 2.285 C R1.086 0.462 C R1.086 0.65 0.923 0.65 0.36 0.36 0.426 0.82 0.46 B 2.34 0.36 0.426 0.852 0.852 0.426 0.46 B 0.36 0.426 0.82 0.923 0.462 0.284 0.284 2.272 2.272 2.34 1.136 1.136 A 0.28 0.36 0.28 A0.36 0.284 0.92 0.92 0.284 2.34 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) 2.34 RECOMMENDED PCB SOLDER PAD RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) RECOMMENDED PCB SOLDER PAD THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED D. CRONIN DIMENSIONS ARE IN UNLESS OTHERWISE CHECK MILLIMETERS AND AFTER FINISH. SPECIFIED DIMENSIONS ARE IN -TOLERANCE UNLESS SPECIFIED: MILLIMETERS AND AFTERAPPROVED FINISH. .XX ± .25 .XXX ± .125 TOLERANCE UNLESS SPECIFIED: X° ± .5 ° .XX 5 4 ± .25 09/19/11 DATE D. CRONIN CHECK 5 4 DAT --- TITLE APPROVED DAT -- ± .XXX ± X° ± 3 .75 .25 .5 ° 09/ -- DATE -- SIZE -- SCALE FINAL PROTECTIVE FINISH 2 -- SURFACE FINISH: 1.6 6 DAT DRAWN BY MATERIAL FOR SHEET METAL PARTS .XXX ONLY ± .125 .X ± X°1.5 ± .5 ° .XX ± .75 THIRD ANGLE PROJECTION FOR METAL PARTS ONLY MATERIAL .XXXSHEET ± .25 FINAL PROTECTIVE FINISH X° ± .X.5 ° ± 1.5 1.6 SURFACE FINISH: .XX 6 DATE DRAWN BY 2.272 3 2 Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 C 30 xlamp xB-D white leds Tape and Reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. 1.5±.1 4.0±.1 8.0±.1 1.75±.10 2.5±.1 Cathode Side +.3 12.0 .0 Anode Side (denoted by + and circle) User Feed Direction END START Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 11 xlamp xB-D white leds Dessicant Desiccant (inside bag) (inside bag) Humidity Indicator Humidity Indicator Card (inside bag)bag) (inside Packaging Vacuum-Sealed All dimensions in mm. Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label Bin with Cree Bin CREE Code & Barcode Label Code, Qty, Lot # Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO## Code, Qty, Lot Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Patent Label Patent Label Label with Customer Order Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO# Label with Cree Bin Code, Qty, Lot # Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12