Universal Programming Module 2 Information Sheet

Universal Programming Module 2
OVERVIEW
The Universal Programming Module (UPM) 2 is a handy, low-cost board that supports
the programming of Microchip devices using MPLAB® in-circuit emulators and debuggers. The UPM can also be used with the MPLAB PM3 to ICD Adapter (AC164111) for
in-circuit programming with the MPLAB PM3. The Zero Insertion Force (ZIF) socket in
the UPM supports the programming of devices in DIP packages up to 40 pins with the
aforementioned development tools.
FIGURE 1:
 2010-2011 Microchip Technology Inc.
BOARD CONFIGURATION
DS51921B-page 1
Universal Programming Module 2
CONFIGURATION
1. Debugger/Programmer Connectors: The debugger/programmer input connectors are located at J1, J6, J22 and J23 (all signals are mapped to J2).
• J1 (ICD): RJ-11 connector used with the MPLAB ICD 3 in-circuit debugger,
the MPLAB REAL ICE™ in-circuit emulator (using the standard driver board)
and the MPLAB PM3 programmer
• J6 (LVDS): Used with MPLAB REAL ICE Performance Pak (AC244002)
• J22 (PICkit): Used with PICkit™ series programmers/debuggers
• J23 (Tag Connect): Used with tag-connect in-circuit programming cables
(TC2030-MCP)
2. J2 Connector: The J2 connector contains all of the signals for programming
and/or debugging. These lines must be connected to pins marked 1 through 40
on the two 20-pin headers (J3 and J4) using the supplied jumper wires. The following are the required connections needed for programming and/or debugging
(see the device data sheet or programming specification for specific pinouts).
• PGC: Programming clock from debugger
• PGD: Programming data from debugger
• VDD: Device VDD from debugger or on-board voltage regulator
• VPP: Programming voltage/master clear input (from debugger/board)
• GND: Device VSS pin
Optional signals needed for programming and/or debugging (see device data
sheet or programming specification for specific requirements):
• PGM: Low voltage programming pin (from debugger)
• VDDC: Voltage for VCAP/VDDCORE pin (from on-board CORE VDD regulator)
• VCAP: Capacitor for VCAP/VDDCORE pin
• CLK: Clock oscillator input (from Y1)
• LED0-LED3 (connected to on-board LEDs)
3. J3 and J4 Connectors: These header pins map directly to the 40 pins of the
device ZIF socket. For devices with less than 40 pins, J5 numbering will not
match the device numbering, e.g., for a 20-pin device, J4 pin 40 will be device
pin 20, J4 pin 39 will be device pin 19, etc. Consult the device data sheet for the
proper jumper configuration. Further, the release notes for the tool in use may
also offer other detailed information about programming the device. Release
notes for MPLAB IDE v8 and earlier may be found under the Help menu. Release
notes for MPLAB X IDE may be found on the Start Page under “Release Notes
and Support Documentation”.
4. Power Supply: Power is supplied to the UPM 2 by either the development tool
in use, or the on-board adjustable VDD regulator, but not both. The selection is
made by setting Jumper J7 to select either ICSP™ VDD (supplied by debugger)
or Board VDD (supplied by on-board regulator). The UPM 2 contains rudimentary
on-board debugging resources. The UPM2 has two on board adjustable regulators that each require an optional separate 9V power supply (AC162039).
• BOARD VDD: Adjusts from 1.2V-5.5V (J7 needs to be in the BOARD VDD
position)
• CORE VDD: Adjusts from 1.2V-2.7V. Used to supply the VDDCORE/VCAP pin
voltage
DS51921B-page 2
 2010-2011 Microchip Technology Inc.
Universal Programming Module 2
5. Debugging Resources: The UPM 2 contains rudimentary on-board debugging
resources:
• Clock oscillator Y1 (connected directly to the CLK pin at J2)
• HS/XT/LP crystal/capacitor sockets (Y2, C6 and C7), to be connected to the
appropriate pins at J3-J4
• Master Clear pull-up at J10 (47 k resistor connected to VDD)
• Master Clear reset button (S15)
• LED0-LED3 (connected to the LEDx pins at J2 (LED0 and LED1 are active
high, LED2 and LED3 are active low)
LOADING/PROGRAMMING A DEVICE
The ZIF socket (SKT1) will support up to 40-pin DIP packaged devices. Verify that
power is removed prior to inserting the device into the ZIF socket. Also, the handle for
the ZIF socket should be in the unlocked position. The device should drop in with zero
force. Insert the device so that the top is aligned with the top of the ZIF socket (i.e., pin
1 to pin 1). Once the device is inserted, set the handle on the socket to the fully locked
position.
REMOVING A DEVICE
When programming a device, wait until MPLAB IDE or MPLAB PM3 in Stand-Alone
mode acknowledge that programming is complete. When debugging a device, ensure
the device is halted. Then remove power from the module by either unplugging the
power cord (if powered by power supply) or the tool connection (if powered by tool).
Unlock the ZIF socket to lift out the device, which should be able to be removed without
any resistance.
DO NOT remove the device while any debugging or programming operation is occurring or while power is applied.
RESOLVING PROGRAMMING/CONNECTION ISSUES
A capacitor (0.1 uF to 10 uF) may need to be placed between VDD and VSS.
 2010-2011 Microchip Technology Inc.
DS51921B-page 3
Universal Programming Module 2
BOARD SCHEMATICS, PART 1
SKT1
HDR_1X20
J3
J4
Pin1
Pin2
Pin3
Pin4
Pin5
Pin6
Pin7
Pin8
Pin9
Pin10
Pin11
Pin12
Pin13
Pin14
Pin15
Pin16
Pin17
Pin18
Pin19
Pin20
Pin40
Pin39
Pin38
Pin37
Pin36
Pin35
Pin34
Pin33
Pin32
Pin31
Pin30
Pin29
Pin28
Pin27
Pin26
Pin25
Pin24
Pin23
Pin22
Pin21
HDR_1X20
FIGURE 2:
ZIFSocket_40P
HDR_1X15
J2
Vdd
Vdd
Vpp/MCLR
PGD
PGC
PGM
CLK
J8
Vdd_Core
LED0
LED1
LED2
LED3
C1
10
J9
Notes:
Unless otherwise specified, resistance values are in Ohms, 5%,
1/10 W, and capacitance values are in microfarads.
Device names/numbers shown here are for reference only and
may differ from actual names/numbers. Actual names/numbers
are found in the BOM from this assembly.
All components are RoHS compliant.
DS51921B-page 4
 2010-2011 Microchip Technology Inc.
Universal Programming Module 2
BOARD SCHEMATICS, PART 2
D1
1
3
2
3
U1
In
C2
0.1
DJ005B
Out
Out
ICSP_Vdd
J7
TP1
LM317_SOT-223
1 ADJ
J5
+9V
1
2
Vdd
3
2
C3
1.0
4
Board_Vdd
R1
261 1%
R2
1K
3
9 Volts In
CW
2
1
FIGURE 3:
CCW
Adjustable Vdd Supply
1.2V - 5.5V @ 1.5A
TP2
LM317_SOT-223
U2
Out
In
1 ADJ
3
C4
0.1
Out
2
Vdd_Core
C5
1.0
4
3
R4
1K
CW
2
1
R3
732 1%
CCW
Adjustable Core
Vdd Supply
1.2V - 2.75V @ 1.5A
Active Hi
LED0
LED0
Red
R5
470
Active Lo
Vdd
LED1
LED1
Red
R6
470
R7
470
LED2
Red
LED2
 2010-2011 Microchip Technology Inc.
Vdd
R8
470
LED3
Red
LED3
DS51921B-page 5
Universal Programming Module 2
FIGURE 4:
BOARD SCHEMATICS, PART 3
MCLR pull-up
Vdd
MCLR Reset
R9
47k
J10
S15
1
1
2
2
3
REAL ICE
LVDS Interface
4
3
J6
J1
1
2
3
4
5
6
Modular Jack
From ICD
PGD
PGC
PGM
PGD
PGC
SDO
SCK
Tag-Connect Interface
PICkit Interface
PGD
PGC
PGM
J23
HDR_1X6_RA
J22
1
2
3
4
5
6
Vpp/MCLR
Vdd
Y1
1
NC
2
GND
NC
SDO_LVDS
SCK_LVDS
4
Vdd
3
OUT
TP3
Vpp/MCLR
Vdd
PGD
PGC
PGM
1
2
3
4
5
6
TAG-CONN_TC2030-MCP
Vpp/MCLR
Vdd
1
2
3
4
5
6
7
8
Vpp/MCLR
Vdd
Vdd
X1
X2
X3
CLK
TP4
Y2
TP5
C6
DS51921B-page 6
C7
 2010-2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010-2011, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2010-2011 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51921B-page 7
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DS51291B-page 8
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11/29/11
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