Data Sheet

Freescale Semiconductor
Technical Data
Document Number: MC1322x
Rev. 1.3 10/2010
MC1322x
Package Information
Case 1901-01
99-Pin [9.5X9.5X1.2mm]
MC1322x
Advanced ZigBee™- Compliant
Platform-in-Package (PiP) for the
2.4 GHz IEEE® 802.15.4
Standard
Ordering Information
Device
MC13224V1
MC13224VR2
MC13226V
1
MC13226VR2
1
1
Introduction
1
1
Device Marking
Package
MC13224V
LGA
MC13224V
LGA
MC13226V
LGA
MC13226V
LGA
See Table 1 for more details.
Contents
The MC1322x family is Freescale’s third-generation
ZigBee platform which incorporates a complete, low
power, 2.4 GHz radio frequency transceiver, 32-bit
ARM7 core based MCU, hardware acceleration for both
the IEEE 802.15.4 MAC and AES security, and a full set
of MCU peripherals into a 99-pin LGA
Platform-in-Package (PiP).
The MC1322x solution can be used for wireless
applications ranging from simple proprietary
point-to-point connectivity to complete ZigBee mesh
networking. The MC1322x is designed to provide a
highly integrated, total solution, with premier processing
capabilities and very low power consumption.
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 High Density, Low Component Count, Integrated
IEEE 802.15.4 Solution
10
4 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 MCU Peripherals . . . . . . . . . . . . . . . . . . . . . . 19
6 Pin Assignments and Connections . . . . . . 28
7 System Electrical Specification . . . . . . . . . 36
8 Developer Environment . . . . . . . . . . . . . . . . 48
9 Mechanical Diagrams
(Case 1901-01, non-JEDEC)
51
The MC1322x MCU resources offer superior processing
power for ZigBee applications. A full 32-bit
ARM7TDMI-S core operates up to 26 MHz. A 128
Kbyte FLASH memory is mirrored into a 96 Kbyte
RAM for upper stack and applications software. In
addition, an 80 Kbyte ROM is available for boot
software, standardized IEEE 802.15.4 MAC and
Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its
products.
© Freescale Semiconductor, Inc., 2005, 2006, 2007, 2008, 2009, 2010. All rights reserved.
communications stack software. A full set of peripherals and Direct Memory Access (DMA) capability for
transceiver packet data complement the processor core.
The RF radio interface provides for low cost and the high density as shown in Figure 1. An onboard balun
along with a TX/RX switch allows direct connection to a single-ended 50-Ω antenna. The integrated PA
provides programmable output power typically from -30 dBm to +4 dBm, and the RX LNA provides
-96 dBm sensitivity. In addition, separate complementary PA outputs allow use of an external PA and/or
an external LNA for extended range applications. The device also has onboard bypass capacitors and
crystal load capacitors for the smallest footprint in the industry. All components are integrated into the
package except the crystal and antenna.
PA
BALUN
ANALOG
TRANSMITTER
RF
TX/RX
SWITCH
LNA
ANALOG
RECEIVER
Figure 1. MC1322x RF Radio Interface
In addition to the best-in-class MCU performance and power, the MC1322x also provides best-in-class
power savings. Typical transmit current is 29 mA and typical receive current is 22 mA with the CPU at 2
MHz operation and even lower with the bus stealing enabled. Onboard power supply regulation is
provided for source voltages from 2.0 Vdc to 3.6 Vdc. Numerous low current modes are available to
maximize battery life including sleep or restricted performance operation.
Applications include, but are not limited to, the following:
• Residential and commercial automation
— Lighting control
— Security
— Access control
— Heating, ventilation, air-conditioning (HVAC)
— Automated meter reading (AMR)
• Industrial Control
MC1322x Technical Data, Rev. 1.3
2
Freescale Semiconductor
•
•
1.1
— Asset tracking and monitoring
— Homeland security
— Process management
— Environmental monitoring and control
— HVAC
— Automated meter reading
Health Care
— Patient monitoring
— Fitness monitoring
Consumer
— Remote control
— Entertainment systems
— Cellular phone attach
Available Devices
The MC1322x family is available as two part numbers. These device types differ only in their ROM
contents, all other device hardware, performance, and specifications are identical:
• MC13224V - this is the original version and is the generic part type.
— The MC13224V is intended for most IEEE 802.15.4 applications including MAC-based,
ZigBee-2007 Profile 1, and ZigBee RF4CE targets.
— It has a more complete set of peripheral drivers in ROM.
• MC13226V - this is a more recent version and is provided specifically for ZigBee-2007 Profile 2
(Pro) applications. Only the onboard ROM image has been changed to optimize ROM usage for
the ZigBee Pro profile and maximize the amount of available RAM for application use.
— The IEEE MAC/PHY functionality has been streamlined to include only that functionality
required by the ZigBee specification. The MAC functionality is 802.15.4 compatible.
— For a typical application, up to 20 kbytes more of RAM is available versus the M13224V
— Some drivers present in the MC13224 ROM have been removed and these include the ADC,
LCDfont, and SSI drivers. These drivers are still available as library functions, but now
compile into the RAM space.
— The Low Level Component (LLC) functionality has also been streamlined for the ZigBee
specification
•
•
NOTE
When running the Freescale IEEE 802.15.4 MAC (or a related stack) on
the MC1322x platform, neither beaconing or GTS are supported.
See the MC1322x Reference Manual (Document No MC1322xRM), for
information on using applications on these devices.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
3
1.2
Ordering Information
Table 1 provides additional details about the MC1322x
Table 1. Orderable Parts Details
Device
Operating
Temp Range
(TA.)
Memory
Options
Package
MC13224V
-40° to 105° C LGA
MC13224VR2
-40° to 105° C LGA Tape and Reel
MC13226V
-40° to 105° C LGA
MC13226VR2
-40° to 105° C LGA Tape and Reel
2
Description
96KB RAM, Intended for 802.15.4 Standard compliant applications,
128KB Flash Freescale 802.15.4 MAC, and Freescale BeeStack™.
96KB RAM, Intended specifically for Freescale BeeStack™ Pro
128KB Flash applications.
Features
This section provides a simplified block diagram and highlights MC1322x features.
2.1
Block Diagram
Figure 2 shows a simplified block diagram of the MC1322x.
24 MHz (typ)
32.768 KHz (optional)
BATTERY
DETECT
CLOCK &
RESET
MODULE
(CRM)
DUAL
12-BIT
ADC
MODULE
RADIO
INTERFACE
MODULE
(RIF)
ANALOG
TRANSMITTER
BALUN
RF
TX/RX
SWITCH
ANALOG
RECEIVER
JTAG/
Nexus
DEBUG
DIGITAL
MODEM
TX
MODEM
RX
MODEM
802.15.4
MAC
ACCELERATOR
(MACA)
IEEE 802.15.4 TRANSCEIVER
ADVANCED
SECURITY
MODULE
(ASM)
MC1322x
SPI
FLASH
MODULE
(SPIF)
Buck
Regulator
ANALOG
POWER
MANAGEMENT
&
VOLTAGE
REGULATION
128KBYTE
NON-VOLATILE
MEMORY
(SERIAL
FLASH)
ARM7
TDMI-S
32-BIT
CPU
BUS
INTERFACE
& MEMORY
ARBITRATOR
ARM
INTERRUPT
CONTROLLER
(AITC)
96KBYTE
SRAM
(24K WORDS x
32 BITS)
80KBYTE
ROM
(20KWORDS x
32 BITS)
TIMER
MODULE
(TMR)
(4 Tmr Blocks)
UART
MODULE
(UART0)
UART
MODULE
(UART1)
SYNC SERIAL
INTERFACE
(SSI/i2S)
KEYBOARD
INTERFACE
(KBI)
UP TO 64 IO PINS
RF
OSCILLATOR
&
CLOCK GENERATION
INTER-IC BUS
MODULE
(I2C)
SERIAL
PERIPHERAL
INTERFACE
(SPI)
GPIO and IO
CONTROL
Figure 2. MC1322x Simplified Block Diagram
MC1322x Technical Data, Rev. 1.3
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Freescale Semiconductor
2.2
•
•
•
•
•
•
•
•
Features Summary
IEEE 802.15.4 standard compliant on-chip transceiver/modem
— 2.4 GHz ISM Band operation
— 16 selectable channels
— Programmable transmitter output power (-30 dBm to +4 dBm typical)
— World-class receiver sensitivity
– < -96 dBm typical receiver sensitivity using DCD mode (<1% PER, 20-byte packets)
– < -100 dBm typical receiver sensitivity using NCD mode (<1% PER, 20-byte packets)
Hardware acceleration for IEEE 802.15.4 applications
— MAC accelerator (sequencer and DMA interface)
— Advanced encryption/decryption hardware engine (AES 128-bit)
Supports standard IEEE 802.15.4 signaling with 250 kbps data rate
32-bit ARM7TDMI-S CPU core with programmable performance up to 26 MHz (24 MHz typical)
Extensive on-board memory resources
— 128 Kbyte serial FLASH memory (will be mirrored into RAM)
— 96 Kbyte SRAM
— 80 Kbyte ROM
Best-in-class power dissipation
— 22 mA typical RX current draw (DCD mode) with radio and MCU active
— 29 mA typical TX current draw with radio and MCU active (coin cell capable)
— 3.3 mA typical current draw with MCU active (radio off)
— 0.8 mA typical current with MCU idle (radio off)
— 0.85 μA typical Hibernate current (retain 8 Kbyte SRAM contents)
— 0.4 μA maximum Off current (device in reset)
Extensive sleep mode control and variation
— Hibernate and Doze low power modes
— Programmable degree of power down
— Clock management
— Onboard 2 kHz oscillator for wake-up timer.
— Optional 32.768 kHz crystal oscillator for accurate real-time sleep mode timing and wake-up
with a possible sleep period greater than 36.4 hours
— Wake-up through programmable timer, external real-time interrupts, or ADC timer
Extensive MCU peripherals set
— Dedicated 802.15.4 modem/radio interface module (RIF)
— Dedicated NVM SPI interface for managing FLASH memory
— Two dedicated UART modules capable of 2 Mbps with CTS/RTS support
— SPI port with programmable master and slave operation
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
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•
•
•
•
•
•
•
•
— 8-pin keyboard interface (KBI) supports up to a 4x4 matrix. Also, provides up to four
asynchronous interrupt inputs for wake-up
— Two 12-bit analog-to-digital converters (ADCs) share 8 input channels
— Four independent 16-bit timers with PWM capability. These can cascade in combinations up
to 64-bit operation
— Inter-integrated circuit (I2C) interface
— Synchronous Serial Interface (SSI) with I2S and SPI capability and FIFO data buffering
— Up to 64 programmable I/O shared by peripherals and GPIO
Powerful In-circuit debug and FLASH programming available via on-chip debug ports
— JTAG debug port
— Nexus extended feature debug port
System protection features
— Low battery detect
— Watchdog timer (COP)
— Sleep mode timer
Low external component count
— Only antenna needed for single-ended 50-Ω RF interface (balun in package)
— Only a single crystal is required for the main oscillator; programmable crystal load capacitors
are on-chip
— All bypass capacitors in package
Supports single crystal reference clock source (typical 24 MHz crystal with 13 - 26 MHz usable)
with on-chip programmable crystal load capacitance or external frequency source. Also provides
onboard 2 kHz oscillator for wake-up timing or an optional 32.768 kHz crystal for accurate low
power timing.
2.0 V to 3.6 V operating voltage with on-chip voltage regulators.
Optional buck converter for better battery life.
-40 °C to +105 °C temperature range
RoHS-compliant 9.5mm x 9.5mm x 1.2mm 99-pin LGA package
MC1322x Technical Data, Rev. 1.3
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Freescale Semiconductor
2.3
Software Solutions
Freescale provides a powerful software environment called the Freescale BeeKit Wireless Connectivity
Toolkit. BeeKit is a comprehensive codebase of wireless networking libraries, application templates, and
sample applications. The BeeKit Graphical User Interface (GUI), part of the BeeKit Wireless Connectivity
Toolkit, allows users to create, modify, and update various wireless networking implementations. A wide
range of software functionality is available to complement the MC1322x and these are provided as
codebases within BeeKit. The following sections describe the available tools.
NOTE
The MC13226V is intend specifically for use with the BeeStack codebase,
see Section 2.3.4.2, “Using BeeStack on the MC1322x Platform”.
2.3.1
Simple Media Access Controller (22xSMAC)
The Freescale Simple Media Access Controller (22xSMAC) is a simple ANSI C based code stack
available as sample source code. The SMAC can be used for developing proprietary RF transceiver
applications using the MC1322x.
• Supports point-to-point and star network configurations
• Proprietary networks
• Source code and application examples provided
2.3.2
IEEE 802.15.4 2006 Standard-Compatible MAC
The Freescale 802.15.4 Standard MAC is a code stack available as object code. The 802.15.4 MAC is used
in two ways:
• The 802.15.4 MAC is the heart of all Freescale non-SMAC codebases. All higher level stacks are
built on the MAC services
• Customers also use the MAC for developing networking applications based on the full IEEE®
802.15.4 Standard but having custom Network Layer and application services.
NOTE
The basic MAC is fully 802.15.4 compliant on the HCS08 platform;
however, on the MC1322x ARM platform, beaconing and GTS are not
supported. This has no impact on ZigBee stacks as these do not utilize these
features.
Features of the 22x MAC include
• Supports star, mesh and cluster tree topologies
• Does not support beaconed networks
• Does not supports GTS
• Multiple power saving modes
• AES-128 Security module
• 802.15.4 Sequence support
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
7
•
•
802.15.4 Receiver Frame filtering.
Binaries and application examples provided
2.3.3
SynkroRF Platform
The SynkroRF Network is a general purpose, proprietary networking layer that sits on top of the IEEE®
802.15.4 MAC and PHY layers. It is designed for Wireless Personal Area Networks (WPANs) and
conveys information over short distances among the participants in the network. It enables small, power
efficient, inexpensive solutions to be implemented for a wide range of applications. Some key
characteristics of an SynkroRF Network are:
• An over-the-air data rate of 250 kbit/s in the 2.4 GHz band.
• 3 independent communication channels in the 2.4 GHz band (15, 20, and 25).
• 2 network node types, controller and controlled nodes.
• Channel Agility mechanism.
• Low Latency Tx mode automatically enabled in conditions of radio interference.
• Fragmented mode transmission and reception, automatically enabled in conditions of radio
interference.
• Robustness and ease of use.
• Essential functionality to build and support a CE network.
The SynkroRF Network layer uses components from the standard HC(S)08 Freescale platform, which is
also used by the Freescale’s implementations of 802.15.4. MAC and ZigBee™ layers. For more details
about the platform components, see the Freescale Platform Reference Manual.
2.3.4
ZigBee-Based Stacks
Freescale has two independent codebases to support the two ZigBee standard specifications:
• BeeStack™ - supports ZigBee-2007 and ZigBee Pro extensions
• BeeStack Consumer - supports ZigBee RF4CE
2.3.4.1
BeeStack
Freescale’s BeeStack architecture implements the ZigBee-2007 protocol stack including both
Stack Profile 1 and Stack Profile 2 (Pro). Based on the OSI Seven-Layer model, the ZigBee stack ensures
inter-operability among networked devices. The physical (PHY), media access control (MAC), and
network (NWK) layers create the foundation for the application (APL) layers. BeeStack defines additional
services to improve the communication between layers of the protocol stack.
At the Application Layer, the application support layer (ASL) facilitates information exchange between
the Application Support Sub-Layer (APS) and application objects. Finally, ZigBee Device Objects (ZDO),
in addition to other manufacturer-designed applications, allow for a wide range of useful tasks applicable
to home and industrial automation.
MC1322x Technical Data, Rev. 1.3
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Freescale Semiconductor
BeeStack uses the IEEE 802.15.4-compatible MAC/PHY layer that is not part of ZigBee itself. The NWK
layer defines routing, network creation and configuration, and device synchronization. The application
framework (AF) supports a rich array of services that define ZigBee functionality. ZigBee Device Objects
(ZDO) implement application-level services in all nodes via profiles. A security service provider (SSP) is
available to the layers that use encryption (NWK and APS), i.e., Advanced Encryption Standard (AES)
128-bit security.
The complete Freescale BeeStack protocol stack includes the following components:
• ZigBee Device Objects (ZDO) and ZigBee Device Profile (ZDP)
• Application Support Sub-Layer (APS)
• Application Framework (AF)
• Network (NWK) Layer
• Security Service Provider (SSP)
• IEEE 802.15.4-compatible MAC and Physical (PHY) Layer
NOTE
For more details on the ZigBee model and protocol, the user is directed to
the ZigBee Specification at www.zigbee.org.
In addition to the use of two Stack Profiles, ZigBee also embraces the concept of application profiles. The
profiles are intended to assure interoperability between like devices for a specific application from
different vendors. The application profile specifies a device description and its messaging protocol such
that it defines the type, shape, and features of the network. The ZigBee Alliance defines each profile and
targets a specific market. Examples include Smart Energy, Home Automation, Health Care, and Remote
Control.
Freescale’s BeeStack supports a number of these application profiles through demonstration software
projects. These projects can be used as a starting point for the user to develop their specific application.
For more information on Freescale supported application profiles see AN3403, Freescale IEEE
802.15.4/ZigBee Software Selector Guide.
2.3.4.2
Using BeeStack on the MC1322x Platform
When using the BeeStack codebases on the MC1322x platform, the application should be targeted to the
proper part number:
• MC13224V should be used for ZigBee Profile 1 applications
• MC13226V should be used for ZigBee Profile 2 (Pro) applications
BeeStack for the MC1322x platform is a single codebase, device selection is determined by a
configuration wizard when the BeeKit project is first developed.
2.3.4.3
BeeStack Consumer
In response to significant market opportunity in the consumer electronics remote control market, the
ZigBee Alliance adapted the ZigBee RF4CE Specification in 2009. Freescale’s BeeStack Consumer stack
implements the ZigBee RF4CE protocol. It is also a networking layer that sits on top of the IEEE®
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
9
802.15.4 MAC. It is designed for standards-based Wireless Personal Area Networks (WPANs) of home
entertainment products and conveys information over short distances among the participants in the
network. It enables small, power efficient, inexpensive solutions to be implemented for a wide range of
applications. Targeted applications include DTV, set top box, A/V receivers, DVD players, security, and
other consumer products.
Some key characteristics of a BeeStack Consumer network are:
•
•
•
•
•
•
•
3
Based on IEEE 802.15.4 Standard
Use 3 of the standard 802.15.4 communication channels in the 2.4 GHz band, namely, Channels
15, 20, and 25
2 network node types, controller node and target node
Channel Agility mechanism
Provides robustness and ease of use
Includes essential functionality to build and support a CE network
Binaries, and application examples provided
High Density, Low Component Count, Integrated IEEE
802.15.4 Solution
The MC1322x is more than a high performance, low power platform-in-a-package IEEE 802.15.4
solution. Not only are the transceiver (radio) and MCU on an SoC, the packaged solution contains a 128
Kbyte serial FLASH memory, onboard bypass capacitors for critical nodes, and RF components that
present a single-ended 50-Ω interface for an external antenna. The radio is a full differential design with
an on-chip transmit/receive (TX/RX) switch, and the PiP also has an onboard balun for differential to
singled-ended conversion. On-chip RF matching is also provided to present the proper impedance to the
antenna.
To further simplify the application, single crystal operation (optimized for 24 MHz) is supported for full
radio and MCU operation. If the default 24 MHz crystal is not used, the device supports 13-26 MHz
crystals also. The load capacitance to the crystal oscillator is supplied on-chip to eliminate the need for the
otherwise required external capacitors.
3.1
Integrated IEEE 802.15.4 Transceiver (Radio and Modem)
The MC1322x IEEE 802.15.4 fully-compliant transceiver provides a complete 2.4 GHz radio with 250
kbps Offset-Quadrature Phase Shift Keying (O-QPSK) data in 5.0 MHz channels and full spread-spectrum
encode and decode. The modem supports transmit, receive, clear channel assessment (CCA), Energy
Detect (ED), and Link Quality Indication (LQI) as required by the 802.15.4 Standard.
3.1.1
RF Interface and Usage
The MC1322x RF interface provides for a single-ended, 50-Ω port that connects directly to an antenna.
There is an onboard balun that converts the single-ended interface to a full differential, bi-directional,
on-chip interface with transmit/receive switch, LNA, and complementary PA outputs. The required port
MC1322x Technical Data, Rev. 1.3
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Freescale Semiconductor
impedance matching is also onboard. This combination allows for a very small footprint and a very low
cost RF solution.
The MC1322x also provides a secondary set of complementary PA outputs that can be used with external
RF circuitry such as a additional PA for higher TX power to the antenna. The single-ended port continues
as the receive input for this circuit configuration.
The receiver demodulator includes a module called the Differential Chip Detector which has two modes
of operation:
• Non-coherent Detection (NCD) with automatic frequency control (AFC)
• Non-coherent Differential Chip Detection (DCD) without AFC
The IEEE 802.15.4 standard allows a maximum clock drift of ±40 ppm (which equals ±80 ppm
station-to-station). The MC1322x 802.15.4 demodulator includes two different methods of operating in
the presence of such large frequency errors:
NCD Mode
Provides an increased ~3.5 dB of sensitivity. However, the addition of the AFC
increases the demodulator current drain about 3 mA.
Default receive mode at lower current.
DCD Mode
For longer range applications where external amplification may be desired (LNA and/or PA), additional
ports are provided for secondary complementary PA outputs. These can be used as a separate PA interface
while the single-ended port through the balun is used as an input only. Also, four control pins and a
regulated 20mA voltage source are provided to control external components and supply power to the PA
outputs.
The RF Interface functionality can be summarized as follows:
• Programmable output power — 0 dBm nominal output power, programmable from -30 to +4 dBm
• Receive sensitivity (at 1% PER, 20-byte packet) — < -96 dBm (typical) DCD receive (well above IEEE 802.15.4 specification of -85 dBm)
— < -100 dBm (typical) NCD receive (higher current)
• Single-ended 50-Ω antenna port — Uses integrated transmit/receive (T/R) switch, LNA, and
onboard balun. Impedance matching onboard.
• Maximum flexibility — The optional single-ended port becomes RF input only and a separate set
of full differential PA outputs are provided. Separate input and outputs allow for a variety of RF
configurations including external LNA and PA for increased range
• Four control signals for external RF components such as a LNA or PA
• Regulated voltage source for PA biasing and powering external components
3.1.2
Modem
The modem supports the full requirement of the IEEE 802.15.4 Standard to transmit and receive data
packets. In additional, the mechanism is present to measure received signal level to provide CCA, ED, and
LQI as required by the 802.15.4 Standard.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
11
3.2
•
•
•
•
High Performance, Low Power 32-Bit ARM7 Processor
The ARM7TDMI-S processor is a member of the 32-bit ARM family of general-purpose 32-bit
microprocessors that offers high performance with very low-power consumption
A three stage instruction pipeline (fetch, decode, execute) increases the speed of the flow of
instructions to the processor
Data access can be 8-bit bytes, 16-bit half words, or 32-bit words. Words must be aligned to 4-byte
boundaries. Half words must be aligned to 2-byte boundaries
The ARM7TDMI-S processor supports two instruction sets, the 32-bit ARM instruction set and the
16-bit Thumb instruction set. The Thumb mode incorporates 16-bit instructions for higher code
density while retaining all the benefits of a 32-bit architecture, such as the full 32-bit registers,
32-bit operations, and 32-bit memory transfer. The use of the instruction sets can be intermixed for
maximizing performance while retaining higher code density
Address
Incrementer
Register Bank
31 x 32-Bit Registers
(6 Status Registers)
32 x 8
Multiplier
Barrel
Shifter
32-Bit Alu
Write Data Register
WDATA[31:0]
B Bus
A Bus
ALU Bus
PC Bus
Address Register
Incrementer Bus
ADDR[31:0]
Scan
Debug
Control
Instruction
Decoder
and
Control
Logic
Instruction Pipeline
Read Data Register
Thumb Instruction Decoder
RDATA[31:0]
Figure 3. ARM7TDMI-S 32-Bit CPU Core
MC1322x Technical Data, Rev. 1.3
12
Freescale Semiconductor
3.3
Low Power Operation and Power Management
The MC1322x is inherently a very low power device, but it also has extensive power management and an
onboard buck regulator option to maximize battery life.
3.3.1
Operating Current
The MC1322x operating currents are a function of operating mode. There are two basic low power modes
of Hibernate and Doze, and both have options of how much RAM contents are retained. The difference
between Hibernate and Doze is that Doze mode keeps the primary reference oscillator running.
Highest operating current is when the radio is active for transmit or receive. Refer to Section 7.4, “Supply
Current Characteristics” for more details and specifications.
3.3.2
Power Management
The MC1322x power management is controlled through the Clock and Reset Module (CRM). The CRM
is a dedicated module to handle MCU clock, reset, and power management functions which includes
control of the power regulators. All these functions have impact on attaining lowest power.
3.3.2.1
CRM Features
The CRM features include:
• Control of system reset
• Control clock gating for power savings
• Sleep mode (Hibernate and Doze) management
— Degree of chip power down
— Retention of programmed parameters
— Programmable retention of RAM contents
— Clock management
• Wake-up management
— Graceful power-up
— Clock management
— Wake-up via programmable timer or external interrupts.
• Wake-up timer
— Hibernate mode - based on onboard 2 kHz oscillator or optional 32.768 kHz crystal oscillator
— Doze mode - based on main reference oscillator, typically 24 MHz
• Controls reference clocks based on default 24 MHz crystal oscillator or optional 13-26 MHz
oscillator with PLL (external filter) for 24 MHz frequency synthesis.
• MCU watchdog timer (COP)
• Software initiated reset
• Management control of onboard linear regulators and optional buck regulator
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
13
3.3.2.2
CRM Operation
The CRM has primary control of the entire system:
• Reset and power up — After release of the hardware RESETB signal, the CRM will perform a
power up sequence of the MCU. The linear regulators and clock sources are managed for a graceful
start-up of the MCU and its resources. The radio is not powered until needed
• Normal operation of MCU — The clock management of the MCU and its resources are controlled
by the CRM. The processor clock is programmable from low frequencies up to the maximum
reference frequency (13-26 MHz optional w/24 MHz standard) to allow the application to trade-off
processing speed versus power savings
• Sleep modes and recovery — There are two sleep modes of Hibernate and Doze. The primary
difference is that Doze mode keeps the reference oscillator running. Both modes can retain critical
programmed parameters and have selectable sizes of RAM retention. Hibernate has lowest power,
but Doze allows high accuracy sleep timing. The CRM manages the recovery from low power,
similar to power-up from reset, providing regulator and clock management.
— Wake-up can be based on external interrupts through 4 KBI inputs
— Wake-up can be from internal interrupts
— Wake-up can be based on an RTI (wake-up) timer.
• The RTI timer has two possible frequency sources that provide a very low power wake-up option
from sleep
— One option is an onboard, low accuracy 2 kHz oscillator
— A second option is to add an external 32.768 kHz crystal for the RTI clock source
— A 32-bit timer allows greater than a 36.4 hour wake-up delay with the 32.768 crystal oscillator
• Other features of the CRM:
— An optional COP watchdog timer to monitor CPU program activity
— A programmable software reset
3.3.3
Optional Buck Regulator
For battery based applications, an optional buck regulator is provided to maximize battery life. Figure 4
shows the configuration of the buck regulator versus the normal connection. An onboard MOSFET is used
as a switch with an external 100μH inductor and 10μF capacitor when the buck regulator is enabled.
The buck regulator drops the higher battery voltage to 1.8 - 2.0 Vdc that is applied to the onboard linear
regulators. This allows lower net current from the battery to maximize the life of the battery.
MC1322x Technical Data, Rev. 1.3
14
Freescale Semiconductor
VDD
VDD
VBATT
VBATT
COIL_BK
D1
DIODE SCHOTTKY
L2
NC
COIL_BK
100uH
LREG_BK_F B
LR EG_BK_F B
C2
10uF
Normal Operation
Buck Regulator Enabled
Figure 4. Optional Buck Regulator
3.3.4
Battery Voltage Monitor
An optional feature of the ADC module is a battery voltage monitor capability. An onboard 1.2 Vdc
reference voltage can be sampled by the ADC module. The battery-sourced supply voltage is used as the
high reference voltage for the ADC and as the supply voltage lowers due to battery usage, the onboard
reference voltage reading will become greater because this fixed voltage is a higher percentage of the
reduced supply voltage.
Programmable high and low thresholds are provided for an ADC analog sample channel to monitor the
reference voltage. This feature can be used as a trigger to provide low battery indication, protection for
data that may be lost due to end-of-life for the battery, monitoring charging, and controlling buck regulator
operation.
3.4
IEEE 802.15.4 Acceleration Hardware
The MC1322x provides acceleration hardware for IEEE 802.15.4 applications and this hardware includes
802.15.4 MAC acceleration and AES encryption/decryption.
3.4.1
802.15.4 MAC Accelerator (MACA) Overview
The MC1322x contains a hardware block that provides a low-level MAC and PHY link controller, which
together with software running on the ARM core, implements the baseband protocols and other low-level
link routine control and link control. Components of the MACA include a sequencer/controller (with
timers), TX and RX packet buffers, DMA block, frame check sequence (FCS) generator/checker, and
control registers. Figure 5 shows a MACA simplified block diagram.
As part of the 802.15.4 protocol, packets are generated and transmitted, packets are received and verified,
and channel energy is measured via a clear channel assessment (CCA). Also, combinations or sequences
of events are required as part of the protocol such as an ACK response following a received packet. The
MACA facilitates these activities via control of the transceiver and off loads the functions from the CPU.
A dedicated DMA function moves data between the MACA buffers and RAM on a cycle steal basis and
does not require intervention from the CPU.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
15
The MACA is responsible for construction of packets for TX including FCS, and for parsing the received
packets. The MACA will also handle ACKs and TxPoll sequences independent of the ARM processor.
During TX the MACA will construct the entire packet. This includes preamble and SFD (start of frame
delimiter). During receive, the modem will recognize preamble and SFD, then the MACA will begin
receiving the packet with the first bit of frame length, and finally, will check the FCS.
Sequencer
Timers
To
Transceiver
Modem
TX Packet
Buffer
Control
Registers
DMA
To
MCU
Bus
RX Packet
Buffer
MACA
FCS Generator/
Checker
Figure 5. MAC Accelerator Simplified Block Diagram
3.4.1.1
MACA Features
In order to reduce CPU load, the MACA module has embedded features for controlling parts of the IEEE
802.15.4 PHY and MAC layer requirements. The MACA core features include:
• Sequence Manager sequences / auto sequences
— RX only
— TX only
— Automatic acknowledgment frame reception on transmitted packets
— Automatic acknowledgment frame transmission on received packets
— Auto-RX for continuous reception as coordinator
— Auto sequence for transmitted MAC data.request
— Assist for efficient response to MAC data.request
— Embedded channel assessment in sequence
— Support for sequences with slotted mode access
— Timer triggered and immediately executed actions
— Support for extended RX for reception in random backoff and battery life extension
— Support for promiscuous mode
• Programmable auto sequence timing - Each CCA, RX, or TX event is an independent operation.
The radio gets through a power-up or “warm-up” sequence for each operation (including VCO),
and there is also a power-down or “warm-down” time. Sequences are combinations of radio
operations and are highly configurable.
— RX warm-up is 72 µs
MC1322x Technical Data, Rev. 1.3
16
Freescale Semiconductor
•
•
•
•
•
•
3.4.2
— TX warm-up is 92 µs
— Turnaround times
– The IEEE 802.15.4 Standard requires a TX-to-RX or a RX-to-TX turnaround time to be less
than or equal to 12 symbols times (192 µs).
– Best practice for maximum station-to-station performance is to minimize TX-to-RX
turnaround time and to maximize (within spec) RX-to-TX turnaround time.
– Auto sequences should use recommended turnaround times of:
a) 11 symbols times (176 µs) RX-to-TX
b) 96 µs TX-to-RX.
Dedicated DMA for transfer of TX/RX data from/to RAM (minimum bus clock of 2 MHz for
802.15.4 modem operation)
Maskable, event-driven interrupt generation
Address header filtering for received packets. A promiscuous mode allows bypass of the filtering
for monitoring network traffic
Packet manager
— Handles preamble data
— Handles frame check sequence (FCS) a.k.a CRC
— Embedded header filter for received packets
Control/status registers mapped into CPU memory map
32-Bit random number generator — Runs at the bus clock rate, a 32-bit Linear Feedback Shift
Register (LFSR) can be set with a seed value and uses a 32-bit primitive polynomial. A 32-bit
random number is fetched with every read of the proper control register
Advanced Security Module (ASM)
The IEEE 802.15.4 Standard and the ZigBee Standard both provide for optional use of data encryption.The
ASM engine is a hardware block that accelerates encryption/decryption using the Advanced Encryption
Standard (AES). The engine can perform “Counter” (CTR) and Cipher Block Chaining (CBC) encryption.
The combination of these two modes of encryption are known as CCM mode encryption. CCM is short for
Counter with CBC-MAC. CCM is a generic authenticate and encrypt block cipher mode. CCM is only
defined for use with 128 bit block ciphers, such as AES. The definition of CCM mode encryption is
documented in the NIST publication SP800-38C.
The ASM has the following features:
• 32-Bit wide bus interface
• CTR encryption in 13 clock cycles
• CBC encryption in 13 clock cycles
• Encrypts 128 bits as a unit
• The 128-bit registers are aligned on quad word boundaries (16 byte)
• Self-test mode
• Maskable “action complete” interrupt
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
17
4
Memory
The MC1322x memory resources consist of RAM, ROM, and serial FLASH.
4.1
RAM and ROM
The RAM and ROM features include:
• 96 Kbytes RAM.
— RAM0: 8 Kbytes, 2 Kwords (2048 x 32 bits)
— RAM1: 24 Kbytes, 6 Kwords (6144 x 32 bits)
— RAM2: 32 Kbytes, 8 Kwords (8192 x 32 bits)
— RAM3: 32 Kbytes, 8 Kwords (8192 x 32 bits)
• All read or write accesses require a minimum of two system clock cycles
• Stall signal generated for read after write cycles
• Clock is enabled only on the accessed memory device for low power consumption
• RAMs have been divided to allow for power savings. While sleeping, the above RAM blocks can
be turned off (combinations include 8, 32, 64, and 96 Kbytes active) and the RAM remainder can
be placed in a low voltage mode for data retention. If more RAMs are turned on, then less battery
life will be achieved. Depending on the amount of RAM powered during sleep, the boot time may
be longer with less RAM as the non-powered RAM must be reloaded from FLASH.
• 80 Kbytes ROM
— 20 Kwords (20480 x 32 bits)
— Initially contains bootstrap code, 802.15.4 MAC and drivers. The MAC software builds on the
lower level hardware capability of the transceiver and MACA. All code except the bootstrap is
“patchable”.
4.2
Serial FLASH (NVM)
The MC1322x also contains a 128 Kbyte serial FLASH memory that can be mirrored into the 96 Kbyte
RAM. The serial FLASH is accessed via an internal dedicated SPI module (SPIF). The FLASH erase,
program, and read capability are programmed through the SPIF port. The FLASH is accessed at boot time
to load/initialize RAM. All actual CPU program and data access is from RAM or ROM.
MC1322x Technical Data, Rev. 1.3
18
Freescale Semiconductor
5
MCU Peripherals
The MC1322x has a rich set of MCU peripherals. Figure 6 shows the peripheral modules.
BATTERY
DETECT
DUAL
1 2 -B IT
ADC
M O DULE
T IM E R
M O DULE
(T M R )
(4 T m r B lo c k s )
UART
M O DULE
(U A R T 0 )
JTAG /
N e xu s
DEBUG
UART
M O DULE
(U A R T 1 )
ARM7
T D M I-S
3 2 -B IT
CPU
S Y N C S E R IA L
IN T E R F A C E
(S S I/i2 S )
BUS
IN T E R F A C E
& MEMORY
A R B IT R A T O R
ARM
IN T E R R U P T
CO NTRO LLER
(A IT C )
KEYBOARD
IN T E R F A C E
(K B I)
UP TO 64 IO PINS
F ro m
CRM
IN T E R -IC B U S
M O DULE
(I2 C )
S E R IA L
P E R IP H E R A L
IN T E R F A C E
(S P I)
G P IO a n d IO
CO NTRO L
SPI
FLASH
M O DULE
(S P IF )
Figure 6. MCU Peripherals
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
19
5.1
Parallel IO (GPIO)
The parallel I/O features include:
• A total of 64 general-purpose I/O pins
• Individual control (direction and output state) for each pin when in GPIO mode
• Pad hysteresis enables
• Software-controlled pull-ups/pull-downs on each input pin
• When not used as GPIO, the IO provide alternative functions
— Debug ports for JTAG (four signals) and Nexus (fourteen signals) modules
— Four control signals for external RF components such as an LNA, PA, and antenna switch
— Eight analog inputs for ADC input channels
— Four signals for ADC reference voltages
— Eight signals for UART1 and UART2
— Two I2C signals
— Four timer block signals
— Four SPI block signals
— Four SSI block signals
— Eight KBI signals
• Eight KBI pins are kept alive during Hibernate or Doze. Four KBI are output and four are inputs.
The input can be used as wake-up interrupts
5.2
Keyboard Interface (KBI)
The MC1322x designates 8 pins (KBI_0 to KBI_7) as a keyboard interface, where four of these signals
typically are outputs and four are inputs (KBI_4 to KBI_7) that support interrupts. These 8 pins could
typically be used as a matrix interface to support up to 16 switches or buttons, such as a keypad. These
signals can also be used as general purpose IO if a keyboard is not present.
During Hibernate or Doze, the KBI are unique in that they are kept alive. Four KBI are outputs and four
KBI are inputs. The inputs can be enabled as asynchronous interrupts to wake-up the MC1322x from the
sleep mode.
MC1322x Technical Data, Rev. 1.3
20
Freescale Semiconductor
5.3
Timer (TMR) Module
The MC1322x provides a timer module (TMR) that contains four identical counter/timer groups. Each
group is capable of many variants of input capture, output compare and pulse-width modulation. The wide
range of operational modes is useful for many control and sensor applications.
Figure 7 shows a block diagram of an individual timer group.
CMPLD1
COMP1
Comparator
M
U
X
CMPLD2
COMP2
MCU
DATA
BUS
LOAD
COUNTER
OFLAG
Output
Comparator
HOLD
CAPTURE
Other
Counter
Reference
Peripheral
Reference
Clock
External
M
U
X
Prescaler
STATUS AND
CONTROL
Figure 7. Timer Group Block Diagram
Each 16-bit counter/timer group contains a prescaler, a counter, a load register, a hold register, a capture
register, two compare registers, and status and control registers.
• Load Register — Provides the initialization value to the counter when the counter’s terminal value
has been reached
• Hold Register — Captures the counter’s value when other counters are being read. This feature
supports the reading of cascaded counters
• Capture Register — Enables an external signal to take a snap shot of the counter’s current value
• COMP1 and COMP2 Registers — Provides the values to which the counter is compared. If a match
occurs, the OFLAG signal can be set, cleared, or toggled. At match time, an interrupt is generated
(if enabled), and the new compare value is loaded into the COMP1 or COMP2 registers from
CMPLD1 and CMPLD2 if enabled
• The Prescaler provides different time bases useful for clocking the counter/timer
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
21
•
•
The Counter provides the ability to count internal or external events
Control and Status Registers — Provides operational mode control of the counter, status, clock
source control, interrupt control, and external interface control
Four GPIO pins (TMR0 -TMR3) are programmable and can be used with any counter/timer group.
The TMR module feature include:
• Four 16-bit counters/timers groups
• Up/down count
• Counters are cascadable for up to 64-bit delay counter
• Programmable count modulo.
• Peripheral reference clock is same as bus clock
• External clock max count rate equals peripheral clock divided by 2
• Internal clock max count rate equals peripheral clock.
• Count once or repeatedly
• Counters are preloadable
• Compare registers are preloadable
• Counters share available four GPIO pins (programmable as inputs or outputs and programmable
for falling or rising edge)
• Separate prescaler for each counter
• Each counter has capture and compare capability
• Optional input glitch filter
• Functional modes include stop, count, edge-count, gated-count, quadrature-count, signed-count,
triggered-count, one-shot, cascade-count, pulse-output, fixed frequency PWM, and
variable-frequency PWM
5.4
UART Modules
The MC1322x has two universal asynchronous receiver/transmitter (UART) modules. Each UART has an
independent fractional divider, baud rate generator that is clocked by the peripheral bus clock (typically
24 MHz) which enables a broad range of baud rates up to 1,843.2 kbaud. Transmit and receive use a
common baud rate for each module.
Each UART provides the following features:
• 8-bit only data
• One or two stop bits
• Programmable parity (even, odd, and none)
• Full duplex four-wire serial interface (RXD, TXD, RTS, and CTS)
• Hardware flow control support for RTS and CTS signals
• 32-byte receive FIFO and 32-byte transmit FIFO
• Programmable sense for RTS/CTS pins (high true/low true)
MC1322x Technical Data, Rev. 1.3
22
Freescale Semiconductor
•
•
•
•
•
•
•
•
5.5
Status flags for various flow control and FIFO states
Receiver detects framing errors, start bit error, break characters, parity errors, and overrun errors.
Voting logic for improved noise immunity (16X/8X oversampling)
Maskable interrupt request
Time-out counter, which times out after eight non-present characters
Receiver and transmitter enable/disable
Low-power modes
Baud rate generator to provide any multiple-of-2 baud rate between 1.2 kbaud and 1,843.2 kbaud
Inter-Integrated Circuit (I2C) Module
The MC1322x provides an Inter-Integrated Circuit (I2C) module for the I2C which is a two-wire, serial
data (SDA) and serial clock (SCL), bidirectional serial bus. The I2C allows for data exchange between the
MC1322x and other devices such as MCUs, serial EEPROM, serial ADC and DAC devices, and LCDs.
The I2C minimizes interconnections between devices and is a synchronous, multi-master bus that allows
additional devices to be connected and still handle system expansion and development. The bus includes
collision detection and arbitration to prevent data corruption if two or more masters attempt to
simultaneously control the I2C.
The I2C module is driven by the peripheral bus clock (typically 24 MHz) and the SCL bit clock is
generated from a prescaler. The prescaler divide ratio can be programmed from 61,440 to 160 (decimal)
which gives a maximum bit clock of 150 kbps.
The I2C module supports the following features:
•
•
•
•
•
•
•
•
•
•
•
Two-wire (SDA and SCL) interface
Multi-master operation
Master or slave mode
Arbitration lost interrupt with automatic mode switching from master to slave
Calling address identification interrupt
START and STOP signal generation/detection
Acknowledge bit generation/detection
Bus busy detection
Software-programmable bit clock frequency up to 150 kbps
Software-selectable acknowledge bit
On-chip filtering for spikes on the bus
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
23
5.6
Serial Peripheral Interface (SPI) Modules
The MC1322x has two SPI modules that use a common architecture
5.6.1
External SPI Module
The MC1322x offers a dedicated Serial Peripheral Interface (SPI) module for external use. The SPI is a
high-speed synchronous serial data input/output port used for interfacing with serial memories, peripheral
devices, or other processors. The SPI allows a serial bit stream of a programmed length (1 to 32 bits) to be
shifted simultaneously into and out of the device at a programmed bit-transfer rate (called 4-wire mode).
There are four pins associated with the SPI port (SPI_SCK, SPI_MOSI, SPI_MISO, and SPI_SS).
The SPI module can be programmed for master or slave operation. It also supports a 3-wire mode where
for master mode the MOSI becomes MOMI, a bidirectional data pin, and for slave mode the MISO
becomes SISO, a bidirectional data pin. In 3-wire mode, data is only transferred in one direction at a time.
The SPI bit clock is derived from the peripheral reference clock (typically 24 MHz with a maximum of 26
MHz). A prescaler divides the peripheral reference clock with a programmed divide ratio from 2 to 256.
Typical bit clock range will be from 12 MHz to 93.75 kHz.
The SPI has the following features:
• Master or slave mode operation
• Data buffer is 4 bytes (32 bits) in length
• SPI transfer length programmable from 1 to 32 bits
• MSB-first shifting
• Programmable transmit bit rate (typically 12 MHz max)
• Serial clock phase and polarity options
• Full-duplex (4-wire) or bidirectional data (3-wire) operation
• SPI transaction can be polled or interrupt driven
• Slave select signal
• Low Power (SPI Master uses gated clocks. SPI Slave clock derived completely from SPI_SCK.)
5.6.2
SPI FLASH Module (SPIF)
The SPIF is an internal SPI block dedicated to control, reading, and writing of the serial FLASH memory
(NVM). It uses the same architecture as the general SPI block, but is limited by the characteristics of the
FLASH SPI interface.
MC1322x Technical Data, Rev. 1.3
24
Freescale Semiconductor
5.7
Synchronous Serial Interface (SSI) Module
The MC1322x provides a versatile Synchronous Serial Interface (SSI) which is a full-duplex, serial port
that allows communication with a variety of serial devices. These serial devices can be digital signal
processors (DSPs), MCUs, peripherals, popular industry audio CODECs, and devices that implement the
Inter-Integrated Circuit sound bus standard (I2S).
The SSI typically transfers samples in a periodic manner and it consists of independent transmitter and
receiver sections with common clock generation and frame synchronization. The external signals include
the bit clock (SSI_BITCK), frame sync (SSI_FSYN), RX data (SSI_RX), and TX data (SSI_TX). The SSI
has the following basic operating modes all with synchronous protocol:
• Normal mode — The simplest SSI mode transfers data in one time slot per frame
• Network mode — Creates a Time Division Multiplexed (TDM) network, such as a TDM CODEC
network or a network of DSPs
• Gated Clock mode — Connects to SPI-type interfaces on MCUs or external peripheral chips
With its multi-modes, the SSI can be programmed for two very useful functions:
• A second SPI port augmenting the MC1322x SPI module
• I2S interface - the SSI is capable of generating the required clock frequencies and data format to
drive a serial stereo audio DAC
The SSI includes the following features:
• Synchronous transmit and receive sections with shared internal/external clocks and frame syncs,
operating in Master or Slave mode.
• Normal mode operation using frame sync
• Network mode operation allowing multiple devices to share the port with as many as thirty-two
time slots
• Gated Clock mode operation requiring no frame sync
• SSI clock source is Peripheral Clock (typically 24 MHz); maximum SSI transfer rate is 6.0 MHz
• Separate Transmit and Receive FIFOs. Each of which is 8x24 bits
• Programmable data interface modes including I2S, LSB, MSB aligned
• Programmable word length (8, 10, 12, 16, 18, 20, 22 or 24 bits)
• Program options for frame sync and clock generation
• Programmable I2S modes (Master, Slave)
• Programmable internal clock divider
• Time Slot Mask Registers for reduced CPU overhead (for Tx and Rx both)
• SSI power-down feature
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
25
5.8
Analog-to-Digital Converter (ADC) Module
The MC1322x ADC module provides two 12-bit analog-to-digital converters (ADC_1 and ADC_2) with
eight external channels (ADC7 - ADC0) that can be multiplexed to either ADC. ADC_1 can also sample
a battery reference voltage for monitoring purposes. External pins (ADC2_VREFH, ADC2_VREFL,
ADC1_VREFH, and ADC1_VREFL) are provided for independent ADC reference voltages. The
minimum sample time is 20 µs. Figure 8 shows a block diagram of the ADC module.
Each ADC can be programmed to scan multiple selected channels on a timed basis. The primary clock to
the ADC module is the peripheral reference clock (typically 24 MHz). For the time period between scan
sequences, the primary clock is first divided by an 8-bit prescale (1-255), and the derived clock drives both
the 32-bit delay timer and the ADC sequencer. Each ADC has its own delay timer and sequencer.
Once a scan sequence has been initiated, all selected channels can be sampled. Registers are provided to
define thresholds that can be enabled for the sampled channels. A threshold can be assigned to a specific
channel and can be programmed to be a less-than or greater-than threshold. Multiple thresholds can be
assigned to a single channel. Warm-up of the analog portion of the ADC circuitry is provided for power
management, and a separate 300 kHz ADC clock must be programmed via its own divider.
The battery monitor has two (2) dedicated threshold registers to set the high and low limits of the battery
sample channel.
Sample values are stored in a 8x16-bit FIFO. The FIFO accumulates samples from both ADCs, and the
12-bit sample value and a 4-bit channel tag are saved for each sample. The FIFO is read by the CPU from
a register address.
The module can be programmed to interrupt the processor based on the timed sample activity. Sample
activity, sequencer activity, or FIFO “fullness” can all be enabled to generate an interrupt.
The ADCs can also be overridden to sample on command as opposed to sequencer, time-based activity.
C o ntrol
O verride
M o de
32-B it
T im er
S equ encer
1
M
U
X
A D C 1 M ux S el
A D C 1 E nable
M
U
X
A D C _1
C om pare
MCU
D A TA
BUS
F IFO
(8 x 16-B it,
12-bit
valu e + 4b it channel
Tag)
ADC Clock
C ontro l
R eg isters
B attery
M
U
X
A D C _2
P rescaler
32-B it
Tim er
D ivider
P eripheral
R eference C lock
S equ encer
2
M
U
X
A D C 2 E nable
A D C 2 M ux S el
ADC Clock
C o ntrol
O verride
M o de
A n alog C h ann els
ADC0 - ADC7
A nalog
300 kH z
Figure 8. ADC Module Block Diagram
MC1322x Technical Data, Rev. 1.3
26
Freescale Semiconductor
The ADC module has the following features:
• 12 bit resolution. Effective number of bits 8-9
• Valid usable input voltage range: [Vref_high-0.2V] to [Vref_low+0.2V]
• Maximum input range: VBATT to VSS
• Minimum sample time 20 µs
• Peripheral Clock (set by CRM) uses an 8-bit prescaler to provide the time base for the module
• Two independent channels, each with a 32-bit timer
• ADC_1 has 9 channels: 8 external analog inputs plus battery reference voltage
• ADC_2 has 8 channels: 8 external analog inputs
• Active channels for each ADC are programmable
• Eight active monitors plus battery reference monitors can generate a IRQ
• An 8-deep FIFO for recording data
• IRQs can be generated by the channel compare values, FIFO status, and sequencers
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
27
Pin Assignments and Connections
ADC2_VREFH
ADC1_VREFH
ADC1_VREFL
ADC2_VERFL
RF_RX_TX
RX_ON
RF_GND
ANT_2
ANT_1
RF_BIAS
PA_POS
PA_NEG
TX_ON
RESETB
XTAL_24_IN
XTAL_24_OUT
6
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
Substrate GND Pads
49
48
47
2
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
98
100
101
102
103
104
105
106
107
108
109
46
3
4
45
5
44
6
43
7
42
8
41
40
9
10
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
39
11
38
37
12
13
36
35
14
34
15
16
17
Active Signal Pads
18
19
20
21
22
23
24
25
26
27
28
29
30
31
33
32
UART1_RTS
UART1_CTS
UART1_RX
UART1_TX
I2C_SDA
I2C_SCL
TMR3
TMR2
TMR1
TMR0
SPI_SCK
SPI_MOSI
SPI_MISO
SPI_SS
SSI_BITCK
SSI_FSYN
ADC0
ADC1
ADC2
ADC3
ADC4
ADC5
ADC6
ADC7_RTCK
TDO
TDI
TCK
TMS
UART2_RTS
UART2_CTS
UART2_RX
UART2_TX
1
XTAL_32_OUT
XTAL_32_IN
RF_PLL_FLT
VBATT
LREG_BK_FB
COIL_BK
KBI_0_HST_WK
KBI_1
KBI_2
KBI_3
KBI_4
KBI_5
KBI_6
KBI_7
SSI_TX
SSI_RX
MC1322x
Notes:
1. Bottom pads 75-79, 84-88, 93-97, 104-106, and 115 are Substrate Ground.
2. Bottom pads 102-103, 111-114, 120-124, and 129-133 are active pads.
3. All remaining bottom pads are isolated from ground (NC), and are provided here for mechanical strength.
4. Figure 15 (Mechanical Diagram), is the bottom view, not the top view as shown here.
Figure 9. MC1322x Pinout (Top View: Bottom Pads Shown)
MC1322x Technical Data, Rev. 1.3
28
Freescale Semiconductor
6.1
Pin Definitions
Table 2 details the MC1322x pinout and functionality.
Table 2. Pin Function Description
Pin #
Pin Name
Type
Description1
Functionality
1
ADC0
Analog Input
or Digital
Input/Output
ADC analog input Channel 0 /
GPIO30
ADC sample channel can be used by either
ADC_1 or ADC_2.
2
ADC1
Analog Input
or Digital
Input/Output
ADC analog input Channel 1/
GPIO31
ADC sample channel can be used by either
ADC_1 or ADC_2.
3
ADC2
Analog Input
or Digital
Input/Output
ADC analog input Channel 2/
GPIO32
ADC sample channel can be used by either
ADC_1 or ADC_2.
4
ADC3
Analog Input
or Digital
Input/Output
ADC analog input Channel 3/
GPIO33
ADC sample channel can be used by either
ADC_1 or ADC_2.
5
ADC4
Analog Input
or Digital
Input/Output
ADC analog input Channel 4/
GPIO34
ADC sample channel can be used by either
ADC_1 or ADC_2.
6
ADC5
Analog Input
or Digital
Input/Output
ADC analog input Channel 5/
GPIO35
ADC sample channel can be used by either
ADC_1 or ADC_2.
7
ADC6
Analog Input
or Digital
Input/Output
ADC analog input Channel 6/
GPIO36
ADC sample channel can be used by either
ADC_1 or ADC_2.
8
ADC7_RTCK
Analog Input
or Digital
Input/Output
ADC analog input Channel 7 /
ReTurn ClocK / GPIO37
ADC sample channel can be used by either
ADC_1 or ADC_2. Alternately, the signal
returns TCK for JTAG to support adaptive
clocking.
9
TDO
Digital
Input/Output
JTAG Test Data Output /
GPIO49
JTAG debug port serial data output.
10
TDI
Digital
Input/Output
JTAG Test Data Input / GPIO48 JTAG debug port serial data input.
11
TCK
Digital
Input/Output
JTAG Test Clock Input / GPIO47 JTAG debug port clock input.
12
TMS
Digital
Input/Output
JTAG Test Mode Select Input /
GPIO46
13
UART2_RTS
Digital
Input/Output
UART2 Request to Send input / UART2 RTS control input.
GPIO21
14
UART2_CTS
Digital
Input/Output
UART2 Clear to Send output /
GPIO20
15
UART2_RX
Digital
Input/Output
UART2 RX data input / GPIO19 UART2 receive data input.
JTAG debug port test mode select input.
UART2 CTS control output.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
29
Table 2. Pin Function Description (continued)
Pin #
Pin Name
Type
Description1
Functionality
16
UART2_TX
Digital
Input/Output
UART2 TX data output /
GPIO18
UART2 transmit data output.
17
UART1_RTS
Digital
Input/Output
UART1 Request to Send input / UART1 RTS control input.
GPIO17
18
UART1_CTS
Digital
Input/Output
UART1 Clear to Send output /
GPIO16
19
UART1_RX
Digital
Input/Output
UART1 RX data input / GPIO15 UART1 receive data input.
20
UART1_TX
Digital
Input/Output
UART1 TX data output /
GPIO14
UART1 transmit data output.
21
I2C_SDA
Digital
Input/Output
I2C Bus data / GPIO13
I2C bus signal SDA
22
I2C_SCL
Digital
Input/Output
I2C Bus clock / GPIO12
I2C bus signal SCL
23
TMR3
Digital
Input/Output
Timer 3 IO signal / GPIO11
Pin is used as counter output or counter input
clock.
24
TMR2
Digital
Input/Output
Timer 2 IO signal / GPIO10
Pin is used as counter output or counter input
clock.
25
TMR1
Digital
Input/Output
Timer 1 IO signal / GPIO9
Pin is used as counter output or counter input
clock.
26
TMR0
Digital
Input/Output
Timer 0 IO signal / GPIO8
Pin is used as counter output or counter input
clock.
27
SPI_SCK
Digital
Input/Output
SPI Port clock / GPIO7
SPI port clock.
28
SPI_MOSI
Digital
Input/Output
SPI Port MOSI/ GPIO6
SPI Port Master Out Slave In (MOSI) data
signal.
29
SPI_MISO
Digital
Input/Output
SPI Port MISO / GPIO5
SPI Port Master In Slave Out (MISO) data
signal.
30
SPI_SS
Digital
Input/Output
SPI Port SS / GPIO4
SPI Port Slave Select (SS) signal.
31
SSI_BITCK
Digital
Input/Output
SSI Bit Clock / GPIO3
SSI serial TX/RX clock and is bi-directional.
32
SSI_FSYN
Digital
Input/Output
SSI Frame Sync / GPIO2
SSI frame sync for data (RX or TX) and is
bi-directional.
33
SSI_RX
Digital
Input/Output
SSI RX data input / GPIO1
SSI serial RX data input.
34
SSI_TX
Digital
Input/Output
SSI TX data output / GPIO0
SSI serial TX data output.
35
KBI_7
Digital
Input/Output
Keyboard Interface Bit 7 /
GPIO29
Asynchronous interrupt input.
UART1 CTS control output.
MC1322x Technical Data, Rev. 1.3
30
Freescale Semiconductor
Table 2. Pin Function Description (continued)
Pin #
Pin Name
Type
Description1
Functionality
36
KBI_6
Digital
Input/Output
Keyboard Interface Bit 6 /
GPIO28
Asynchronous interrupt input.
37
KBI_5
Digital
Input/Output
Keyboard Interface Bit 5 /
GPIO27
Asynchronous interrupt input.
38
KBI_4
Digital
Input/Output
Keyboard Interface Bit 4 /
GPIO26
Asynchronous interrupt input.
39
KBI_3
Digital
Input/Output
Keyboard Interface Bit 3 /
GPIO25
Used as output for keyboard interface.
40
KBI_2
Digital
Input/Output
Keyboard Interface Bit 2 /
GPIO24
Used as output for keyboard interface.
41
KBI_1
Digital
Input/Output
Keyboard Interface Bit 1 /
GPIO23
Used as output for keyboard interface.
42
KBI_0_HST_WK Digital
Input/Output
Keyboard Interface Bit 0 / HoST Used as output for keyboard interface /
Walk-up output / GPIO22
Alternative function as a wake-up output
(based on a timer) to external device.
43
COIL_BK
Power Switch
Output
Buck converter coil drive output Onboard buck converter connection to external
coil, driven by onboard MOSFET.
44
LREG_BK_FB
Power Input
Voltage input to onboard
regulators, buck regulator
feedback voltage
45
VBATT
Power Input
High side supply voltage to buck Connect to battery.
regulator switching MOSFET
and IO buffers
46
RF_PLL_FLT
Analog
Voltage
PLL filter connection
• Connection for PLL filter (Type 2, 2nd Order)
when using primary crystal with frequency
other than 24 MHz (13-26 MHz).
• No Connect for 24 MHz crystal.
47
XTAL_32_IN
Analog Input
Optional 32.768 kHz crystal
oscillator input
Connect to 32.768 kHz crystal
48
XTAL_32_OUT
Analog Output Optional 32.768 kHz crystal
oscillator output
Connect to 32.768 kHz crystal
49
XTAL_24_OUT
Analog Output Primary 24 MHz crystal
oscillator output
• Connect to 13-26 MHz crystal (24 MHz
default).
• No load capacitor required
• Do not load with any capacitance.
50
XTAL_24_IN
Analog Input
Primary 24 MHz crystal
oscillator input
• Connect to 13-26 MHz crystal (24 MHz
default).
• No load capacitor required
• Do not load with any capacitance.
51
RESETB
Digital Input
System reset input
Active low, asynchronous reset
52
TX_ON
Digital
Input/Output
Control output for external RF
component / GPIO44
Programmable control pin
• When using onboard buck converter,
connect to load side of coil.
• When not using buck converter, connect to
VBATT.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
31
Table 2. Pin Function Description (continued)
Pin #
Pin Name
Type
Description1
Functionality
53
PA_NEG
RF Output
RF power amplifier (PA) ouput
negative
• Open drain. Must be connected to RF_BIAS
through a bias network.
• Only used for external dual port operation.
• Do not use for single port operation. No
Connect.
54
PA_POS
RF Output
RF power amplifier (PA) ouput
positive
• Open drain. Must be connected to RF_BIAS
through a bias network.
• Only used for external dual port operation.
• Do not use for single port operation. No
Connect.
55
RF_BIAS
Analog Power Analog VDD regulator output
Output
1.5 Vdc voltage regulated output used to
supply differential PA output port. When using
dual port operation, tie to PA_POS and
PA_NEG through bias networks.
56
ANT_1
Digital input /
Output
Control output for external RF
component / GPIO42
Programmable control pin.
57
ANT_2
Digital input /
Output
Control output for external RF
component / GPIO43
Programmable control pin.
58
RF_GND
Power Input
RF ground.
Connect to ground VSS.
59
RX_ON
Digital input /
Output
Control output for external RF
component / GPIO45
Programmable control pin.
60
RF_RX_TX
RF
Input/Output
RF single-ended, single port
input and ouput
• Interfaces to onboard balun. 50 Ω
impedance
• Full bidirectional port with onboard T/R
switch.
• Used as single-ended RF input port for dual
port operation with PA_NEG and PA_POS
PA outputs.
61
ADC2_VREFL
Analog Input
Low reference voltage for
or Digital Input ADC_2 / GPIO39
/ Output
VREFL for ADC_2.
62
ADC1_VREFL
Analog Input
Low reference voltage for
or Digital Input ADC_1 / GPIO41
/ Output
VREFL for ADC_1.
63
ADC1_VREFH
Analog Input
High reference voltage for
or Digital Input ADC_1 / GPIO40
/ Output
VREFH for ADC_1.
64
ADC2_VREFH
Analog Input
Low reference voltage for
or Digital Input ADC_2 / GPIO38
/ Output
VREFH for ADC_2.
75-79
VSS
Power input
External package GND pads.
Common VSS.
Connect to ground.
84-88
VSS
Power input
External package GND pads.
Common VSS.
Connect to ground.
MC1322x Technical Data, Rev. 1.3
32
Freescale Semiconductor
Table 2. Pin Function Description (continued)
Pin #
93-97
Pin Name
Type
Description1
Functionality
VSS
Power input
External package GND pads.
Common VSS.
Connect to ground.
102
MDO01
Digital
Input/Output
Message Data Out Bit 1 output / Nexus debug port message data output Bit 1.
GPIO52
103
MDO00
Digital
Input/Output
Message Data Out Bit 0 output / Nexus debug port message data output Bit 0.
GPIO51
104106
VSS
Power input
External package GND pads.
Common VSS.
111
MDO03
Digital
Input/Output
Message Data Out Bit 3 output / Nexus debug port message data output Bit 3.
GPIO54
112
MDO02
Digital
Input/Output
Message Data Out Bit 2 output / Nexus debug port message data output Bit 2.
GPIO53
113
MSEO1_B
Digital
Input/Output
Message Start / End Out Bit 1
output / GPIO60
Nexus debug port message start / end output
Bit 1. Signal is active low.
114
MSEO0_B
Digital
Input/Output
Message Start / End Out Bit 0
output / GPIO59
Nexus debug port message start / end output
Bit 0. Signal is active low.
115
VSS
Power input
External package GND pads.
Common VSS.
Connect to ground.
120
MDO05
Digital
Input/Output
Message Data Out Bit 5 output / Nexus debug port message data output Bit 5.
GPIO56
121
MDO04
Digital
Input/Output
Message Data Out Bit 4 output / Nexus debug port message data output Bit 4.
GPIO55
122
RDY_B
Digital
Input/Output
Ready output / GPIO61
Nexus debug port ready output. Signal is active
low.
123
EVTO_B
Digital
Input/Output
Event Out output / GPIO62
Nexus debug port event out output. Signal is
active low.
124
DIG_REG
Digital Power
Output
Digital core logic VDD supply.
1.2 Vdc internally regulated VDD supply to
digital logic core. No Connect,. For test only
129
MDO07
Digital
Input/Output
Message Data Out Bit 7 output / Nexus debug port message data output Bit 7.
GPIO58
130
MDO06
Digital
Input/Output
Message Data Out Bit 6 output / Nexus debug port message data output Bit 6.
GPIO57
131
MCKO
Digital
Input/Output
Message Clock Out output /
GPIO50
Nexus debug port message clock output.
132
EVTI_B
Digital
Input/Output
Event In input / GPIO63
Nexus debug port event in input. Signal is
active low.
Connect to ground.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
33
Table 2. Pin Function Description (continued)
Pin #
133
Pin Name
NVM_REG
NVM Power
Output
65-74 NC
80-83
89-92
98-101
107-110
116-119
125-128
134-145
1
Description1
Type
Functionality
FLASH (NVM) VDD supply.
VDD supply to FLASH. Typically No Connect.
Can be connected to VDD when regulated
1.8Vdc mode is used.
No Connect
These pads are provided for extra mechanical
attach strength to meet demanding
requirements of drop tests.
Pins described as GPIO have an alternative general purpose I/O function.
6.2
Hardware Development Interface Interconnects
The MC1322x supports two development hardware interfaces.
6.2.1
ARM JTAG Interface Connector
The MC1322x supports connection to a subset of the defined ARM JTAG connector. The JTAG hardware
interface uses a 20-pin header with a standard 0.1 inch spacing. Table 3 shows how the MC1322x pins are
connected to the associated JTAG header pinouts if the JTAG connector is provided on the application.
Table 3. ARM JTAG 20-Pin Connector Assignments
Name1
Pin #
Pin #
Name
VBATT
1
2
VBATT
NC2
3
4
GND
TDI
5
6
GND
TMS
7
8
GND
TCK
9
10
GND
RTCK
11
12
GND
TDO
13
14
GND
RESET3
15
16
GND
NC
17
18
GND
NC
19
20
GND
1
NC = No Connect.
MC1322x does not support separate JTAG reset TRST.
3 VBATT through a 100k-Ω pullup.
2
MC1322x Technical Data, Rev. 1.3
34
Freescale Semiconductor
6.2.2
Nexus Mictor Interface Connector
The MC1322x also supports connection to a subset of the defined Nexus Mictor connector. The hardware
interface is a 38-pin Mictor target connector. Table 4 shows the device pins that are connected to the
associated Mictor pin outs if the Mictor connector is used.
Table 4. Nexus 38-Pin Mictor Connector Assignments
Name1
Pin #
Pin #
Name
NC
1
2
NC
NC
3
4
NC
NC
5
6
RTCK
NC
7
8
NC
VBATT(pullup)2
9
10
EVTI_B
TDO
11
12
VBATT3
NC
13
14
RDY_B
TCK
15
16
MDO07
TMS
17
18
MDO06
TDI
19
20
MDO05
RESET4
21
22
MDO04
NC
23
24
MDO03
NC
25
26
MDO02
NC
27
28
MDO01
NC
29
30
MDO00
NC
31
32
EVTO_B
NC
33
34
MCKO
NC
35
36
MSEO1_B
NC
37
38
MSEO0_B
1
NC means No Connect.
VBATT through a 100k-Ω pullup.
3 VBATT isolated by a 1k-Ω resistor.
4 VBATT through a 100k-Ω pullup.
2
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
35
7
System Electrical Specification
This section details maximum ratings for the 99-pin LGA package and recommended operating
conditions, DC characteristics, and AC characteristics.
7.1
LGA Package Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maximum rating is not
guaranteed. Stress beyond the limits specified in Table 5 may affect device reliability or cause permanent
damage to the device. For functional operating conditions, refer to the remaining tables in this section.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either VSS or VBATT) or the
programmable pull-up resistor associated with the pin is enabled.
Table 5 shows the maximum ratings for the 99-Pin LGA package.
Table 5. LGA Package Maximum Ratings
Rating
Symbol
Value
Unit
Maximum Junction Temperature
TJ
125
°C
Storage Temperature Range
Tstg
-55 to 125
°C
Moisture Sensitivity Level
MSL3-260
260
°C
VBATT, VDDINT
-0.3 to 3.7
Vdc
Vin
-0.3 to (VDDINT + 0.2)
Vdc
Pmax
10
dBm
Reflow Soldering Temperature (for reflow soldering profile and other LGA
module reference information, see Freescale Application Note, AN3311)
Power Supply Voltage
Digital Input Voltage
RF Input Power
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics
or Recommended Operating Conditions tables.
Note: Meets Human Body Model (HBM) = 2 kV. RF input/output pins have no ESD protection.
MC1322x Technical Data, Rev. 1.3
36
Freescale Semiconductor
7.2
Recommended Operating Conditions
Table 6. Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
VDD
2.0
-
3.6
Vdc
2.1
-
3.6
Vdc
Power Supply Operating Voltage
Single un-regulated source (VBATT and LREG_BK_FB tied
common to VDD)
Onboard buck with un-regulated source (VBATT tied to VDD)
Input Frequency
fin
2.405
-
2.480
GHz
Operating Temperature Range
TA
-40
25
+105
°C
Logic Input Voltage Low
VIL
0
-
30%
VBATT
V
Logic Input Voltage High
VIH
70%
VBATT
-
VBATT
V
Pmax
-
-
10
dBm
fref
13
24
26
MHz
RF Input Power
Crystal Reference Oscillator Frequency (±40 ppm over operating conditions
to meet the 802.15.4 standard.)
7.3
DC Electrical Characteristics
Table 7. DC Electrical Characteristics
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Power Supply Voltage1 (voltage applied to power input pins; VBATT (pin 45),
LREG_BK_FB (pin 44))
VDD
2.0
2.7
3.6
Vdc
High impedance (off-state) leakage current (per pin)
(VIn = VDD or VSS, all input/outputs, device must not be in low power
mode)
|IOZ|
-
-
1.0
Input Current (VIN = 0 V or VDDINT) (VIn = VDD or VSS, all input/outputs, device
must not be in low power mode)
IIN
-
-
±1.0
µA
Input Low Voltage (All digital inputs)
VIL
0
-
30%
VBATT
V
Input High Voltage (all digital inputs)
VIH
70%
VBATT
-
VBATT
V
Input hysteresis (all digital inputs)
Vhys
0.06 ×
VDD
Internal pullup and pulldown resistors2
(all port pins and IRQ)
RPU
-
70
-
Output High Voltage (IOH = -5 mA) (All digital outputs)
VOH
80%
VBATT
-
VBATT
μA
—
V
kohm
V
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
37
Table 7. DC Electrical Characteristics (continued)
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, unless otherwise noted)
Characteristic
Output Low Voltage (IOL = 5 mA) (All digital outputs)
Symbol
Min
Typ
Max
Unit
VOL
0
-
20%
VBATT
V
—
TBD
mA
TBD
mA
—
pF
Maximum current in/out per IO pin
Maximum total IOL for all IO pins
IOLT
—
Input capacitance (all non-supply pins)
CIn
—
3
1
Maximum usable range of the reference voltage supply pin. This range may be modified because of the power supply
configuration used in an application. See Table 6, “Power Supply Voltage”.
2 Measurement condition for pull resistors: V = V
IN
SS for pullup and VIN = VDD for pulldown.
7.4
Supply Current Characteristics
Table 8. Supply Current Characteristics
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, unless otherwise noted)
Characteristics
Symbol
Typ
Max
Unit
Off current Device is in reset condition (held in reset) and all GPIO at ground.
0.4
0.6
μA
Hibernate current RAM retained (8k, 32k, 64k, or 96k)
2KHz onboard oscillator or 32 kHz crystal oscillator
CPU off (stop mode)
wake-up from RTI timer, or external request
Radio off
ADCs not available
8 Kbyte RAM retention
32 Kbyte RAM retention
64 Kbyte RAM retention
96 Kbyte RAM retention
0.9
2.3
3.7
5.1
2.2
4.9
-
μA
μA
μA
μA
Doze current RAM retained (8k, 32k, 64k, or 96k)
Onboard 24 MHz oscillator on (high frequency accuracy)
CPU off (stop mode)
Radio off
ADCs available, but inactive
8 Kbyte RAM retention
32 Kbyte RAM retention
64 Kbyte RAM retention
96 Kbyte RAM retention
55
57
58
60
70
-
μA
μA
μA
μA
0.85
.95
mA
Idle current All RAM active
Reference oscillator on (24 MHz) at 1.2 VDC
CPU on at 1 MHz
Reference clock available to all peripherals
Radio off
ADCs available, but inactive
Min
MC1322x Technical Data, Rev. 1.3
38
Freescale Semiconductor
Table 8. Supply Current Characteristics (continued)
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, unless otherwise noted)
Characteristics
Typ
Max
Unit
Run current All RAM active
Reference oscillator on (24 MHz) at 1.2 VDC
CPU on at reference frequency
Radio off
Reference clock available to all peripherals
ADCs available, but inactive
3.3
7.3
mA
Receive current All RAM active
Reference oscillator on (24MHZ) at 1.2 VDC
Radio RX on (receiving data)
Reference clock available to all peripherals
ADC_1 available, but inactive
CPU on at 2 MHz (DCD)
CPU on at 2 MHz (NCD)
22
24
25
-
mA
Transmit current All RAM active
Reference oscillator on (24MHZ) at 1.2 VDC
Radio TX on (sending data @ 0 dBm)
Reference clock available to all peripherals
ADCs available, but inactive
CPU clock at 2 MHz
29
31
mA
7.5
Symbol
Min
RF AC Electrical Characteristics
Table 9. Receiver AC Electrical Characteristics for 802.15.4 Modulation Mode
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, fref = 24 MHz, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
-
-96
-100
-91
-
dBm
-
10
-
dBm
-
38
38
57
57
65
35
35
50
50
60
dB
Frequency Error Tolerance2
200
300
-
kHz
Symbol Rate Error Tolerance2
80
120
-
ppm
Sensitivity for 1% Packet Error Rate (PER)1 (+25 °C, @ package interface;
die sensitivity is ~1dB greater)
Non-coherent Differential Chip Detection (DCD)
Non-coherent Detection (NCD)
Saturation (maximum input level)
SENSmax
Channel Rejection for 1% PER (desired signal -82 dBm)
+5 MHz (adjacent channel)
-5 MHz (adjacent channel)
+10 MHz (alternate channel)
-10 MHz (alternate channel)
>= 15 MHz
1
The digital modem contains a block designated as the RX Modem. The Rx Modem can operate in: 1) Non-coherent Differential
Chip Detection (DCD) mode which has 3-4dBm less sensitivity but requires 3-4mA less receiver current, and 2) Non-coherent
Detection (NCD) mode which has 3-4dBm greater sensitivity but requires 3-4mA greater receiver current.
2 Minimum set by IEEE 802.15.4 Standard
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
39
Table 10. Transmitter AC Electrical Characteristics for 802.15.4 Modulation Mode
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, fref = 24 MHz, unless otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pout
-2
1.5
4.5
dBm
-
+4
-
dBm
-
13
11
9
20
20
%
Output Power Control Range
-
35
-
dB
Over the Air Data Rate
-
250
-
kbps
2nd Harmonic3
-
-55
-
dBm/M
Hz
3rd Harmonic3
-
-64
-
dBm/M
Hz
Nominal Output Power1
Maximum Output
Power2
Error Vector Magnitude
Pout @ -30 dBm
Pout @ 0 dBm
Pout @ +4 dBm
EVM
Spurious Emissions
30-1000 MHz
1-12.75GHz
Nominal Impedance (RF_RX_TX)
-
dB
dB
50
ohm
1
Register sets output power to nominal (0 dBm).
Register sets output power to maximum.
3 Measurements taken at output of evaluation circuit set for maximum power out and averaged over 100ms.
2
Table 11. RF Port Impedance for Dual Port PA Output Pins
Frequency
Symbol
PA_POS (Typ)
PA_NEG (Typ)
Unit
2.405 GHz
2.442 GHz
2.480 GHz
Zout
64.7 - j43.9
64.5 - j42.9
64.3 - j42.0
61.0 - j31.9
60.7 - j30.7
60.4 - j29.5
Ω
MC1322x Technical Data, Rev. 1.3
40
Freescale Semiconductor
7.6
Crystal Reference Clock Oscillator Characteristics
The reference oscillator model including external crystal in shown in Figure 10. The IEEE 802.15.4
Standard requires a frequency tolerance less than or equal to +/- 40 ppm as shown in the oscillator
specification Table 12. With a suitable crystal (refer to Table 13 and Freescale Application Note AN3251),
the device frequency tolerance can typically trimmed to be held to +/- 30 ppm over all conditions.
REFERENCE
OSCILLATOR
MC13224V
Course Tune[4]
Course Tune[4]
4pF
4pF
Course Tune[3:0]
8pF
4pF
Course Tune[3:0]
1 MEG (nom)
2pF
1pF
8pF
4pF
Fine Tune[4:0]
2pF
1pF
Fine Tune[4:0]
0-5pF
with steps of 160 fF.
0-5pF
with steps of 160 fF.
OSC_IN
OSC_OUT
Y1
CRYSTAL
Cstray
Cstray
Figure 10. Reference Oscillator Model
Table 12. Reference Oscillator Specifications
Characteristic
Symbol
Frequency
Oscillator frequency tolerance over temperature range.
External load capacitance
CLext
Internal Osc startup time (13 MHz - 26 MHz)1
1
Min
Typ
Max
Unit
13
24
26
MHz
+/- 30
+/- 40
ppm
None required (onboard)
pF
0.8
ms
1.2
This is part of device wake-up time.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
41
Table 13. Recommended 24 MHz Crystal Specifications
Parameter
Value
Unit
24.000000
MHz
Frequency tolerance (cut tolerance)1
± 10
ppm
at 25 °C
Frequency stability (temperature drift)
± 15
ppm
Over desired temperature range
Aging
±2
ppm
max
Equivalent series resistance2
40-50
Ω
max
Load capacitance
5-9
pF
Shunt capacitance
<2
pF
Frequency
Mode of oscillation
1
2
7.7
Condition
max
fundamental
A wider frequency tolerance may acceptable if application uses trimming at production final test.
The higher ESR may be acceptable with lower load capacitance.
Optional 32.768 KHz Crystal Oscillator Specifications
MC13224V
32.768 kHz
OSCILLATOR
Feedback
OSC_IN
OSC_OUT
Y1
CRYSTAL
Cstray1
CL1
CL2
Cstray2
Figure 11. 32.768 KHz Oscillator Mode
l
Table 14. 32.768 Oscillator Specifications
Characteristic
Symbol
Min
Crystal frequency1
Max
32.768
Frequency tolerance @ 25 °C
Frequency tolerance over
Typ
KHz
± 20
temperature2
-0.034 ±0.006ppm /
Unit
ppm
(25-T)2
ppm
MC1322x Technical Data, Rev. 1.3
42
Freescale Semiconductor
Table 14. 32.768 Oscillator Specifications (continued)
Characteristic
Symbol
Load capacitance
Min
Typ
Max
Unit
11
12.5
13
pF
60
kΩ
1.35
pF
1
μW
Equivalent series resistance (ESR)
Shunt capacitance
Tolerated drive level
1
2
7.8
Recommended crystal Abracom Corporation crystal part number
Example; Stability at -20×C is: -0.034 x (25-[-20])2= -68.8ppm.
ABS25-32.768-12.5-B
Internal Low Speed Reference Oscillator Specifications
Table 15. Internal 2 KHz Oscillator Specifications
Characteristic
Symbol
Min
Typ
Max
Unit
2.5
1.7
3.5
KHz
Oscillator frequency variation over full temperature range
-
+/- 13
-
%
Calibration time (in terms of 2KHz osc clocks)
-
-
216-1
osc clks
Default Frequency @ 25 °C
7.9
Control Timing and CPU Bus Specifications
Table 16. MCU Control Timing
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, fref = 24 MHz, unless otherwise noted.)
Parameter
CPU Bus frequency (tcyc = 1/fBus)
Symbol
Min
Typical
Max
Unit
fBus
fref/64 1
—
fref 1
MHz
CPU Bus frequency with active TX or RX
2
Real-time interrupt internal oscillator frequency
External reset pulse
width2
External minimum interrupt pulse width (KBI[7:4])
1
2
MHz
2
KHz
-
4
—
osc clks
-
4
—
osc clks
Normal operation uses a 24 MHz reference. The MC1322x allows up to a 26 MHz max reference oscillator.
This is the shortest pulse that is guaranteed to be recognized as a reset pin request. There always must be 3 clocks of the
operating oscillator; this can vary from the low power oscillators to the reference oscillator.
7.9.1
Timer Module Input Characteristics
Four-bit synchronizer circuits determine the shortest input pulses that can be recognized or the fastest
clock that can be used as the optional external source to the timer counter. These synchronizers operate
from the peripheral clock rate. Table 17 shows timer input timing values.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
43
Table 17. Timer Input Timing
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, fref = 24 MHz, unless otherwise noted.)
Parameter
7.10
Symbol
Min
Max
Unit
External clock frequency
dc
peripheral_bus_clk/3
MHz
External clock period
>3
—
tcyc
Input capture pulse width
>3
—
tcyc
SPI Timing
tCYC
SPI_SCK
tSS_H
tSS_SU
SPI_SS (slave in)
tXX_SU
tXX_H
SPI_MOSI (slave in)
SPI_MISO (master in)
tMO,tSO
SPI_MOSI (master out)
SPI_MISO (slave out)
Figure 12. SPI Timing Diagram
Table 18 describes the timing requirements for the SPI system.
Table 18. SPI Timing
Parameter
Symbol
Min
Master SPI_SCK Period
tCYC
peripheral_
Clk*2
Slave SPI_SCK Period
tCYC
tSS_SU
tSS_H
tSI_SU
tSI_H
tMI_SU
tMI_H
tMO
tSO
10
ns
10
ns
10
ns
10
ns
10
ns
20
ns
0
ns
Slave SPI_SS Setup Time
Slave SPI_SS Hold Time
Slave SPI_MOSI Setup Time
Slave SPI_MOSI Hold Time
Master SPI_MISO Setup Time
Master SPI_MISO Hold Time
Master SPI_MOSI Output Time
Slave SPI_MISO Output Time (with 15 pf load)
Typical
38
Max
Unit
peripheral_
Clk *256
ns
5
ns
20
ns
MC1322x Technical Data, Rev. 1.3
44
Freescale Semiconductor
7.11
I2C Specifications
Table 19 describes the timing requirements for the I2C system.
The I2C module is driven by the peripheral bus clock (typically max 24 MHz) and the SCL bit clock is
generated from a prescaler. The prescaler divide ratio can be programmed from 61,440 to 160 (decimal)
which gives a maximum bit clock of 150 kbps.
Table 19. I2C Signal DC Specifications (I2C_SDA and I2C_SCL)
Parameter
Symbol
Min
Typical
Max
Unit
Input Low Voltage
VIL
-0.3
-
0.3 VDDINT
V
Input High Voltage
VIH
0.7 VBATT
-
VBATT + 0.3
V
Input hysteresis
Vhys
0.06 × VBATT
—
V
Output Low Voltage1 (IOL = 5 mA)
VOL
0
-
0.2 VBATT
V
Input Current (VIN = 0 V or VDDINT)
IIN
-
-
±1
µA
Pin capacitance
Cin
<10
pF
1
SDA and SCL are open drain outputs
SDA
tf
tSU;DAT
tr
tLOW
tHD:STA
tBUF
tr
SCL
tf
tHD
tSU;STA
tHD;DAT
tSU;STO
tHIGH
S
Sr
P
S
2
Figure 13. I C Timing Diagram
NOTE
The C timing limits reflect values that are necessary meet to the I2C Bus
specification.
I2
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
45
Table 20. I2C Signal AC Specifications1
Parameter
Symbol
Standard-Mode
Fast-Mode
Unit
Min
Max
Min
Max
fSCL
0
100
0
150
kHz
tHD;STA
4.0
-
0.6
-
μs
LOW period of the SCL clock
tLOW
4.7
-
1.3
-
μs
HIGH period of the SCL clock
tHIGH
4.0
-
0.6
-
μs
tSU;STA
4.7
-
0.6
-
μs
tSHD;DAT
02
3.453
02
0.93
μs
-
ns
SCL clock frequency (when source)
Hold time (repeated) START condition.
After this period, the first clock pulse is generated
Set-up time for a repeated START condition
Data hold time
tSU:DAT
250
-
1004
Rise time for both SDA and SCL signals
tr
-
1000
20 +
0.1Cb5
300
ns
Fall time for both SDA and SCL signals
tf
-
300
20 +
0.1Cb5
300
ns
tBUF
4.7
-
1.3
-
μs
Cb
-
400
-
400
pF
Data setup time
Bus free time between a STOP and START condition
Capacitive load for each bus line
1
All values referred to VIHmin and VILmax levels
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL
signal) to bridge the undefined region of the falling edge of SCL.
3 The maximum t
HD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of the SCL signal.
4 A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement t
SU;DAT >= 250 ns
must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal.
If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max
+ tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification) before the SCL line is
released.
5 C = total capacitance of one bus line in pF. If mixed with Hs-mode devices, the faster fall-times are allowed.
b
2
MC1322x Technical Data, Rev. 1.3
46
Freescale Semiconductor
7.12
FLASH Specifications
Table 21. FLASH Characteristics
(TA = 25 °C, fref = 24 MHz, unless otherwise noted.)
Characteristic
Symbol
Min
Supply voltage for program/erase/read (with directly regulated supply)
Vprog/erase
1.70
SPI clock frequency
Typical
fFCLK
Max
Unit
1.90
V
13
MHz
Read current (13 MHz)
9
15
mA
Program and erase current
10
15
mA
Standby current
2
10
μA
Sector erase duration
75
ms
Block erase duration
75
ms
Chip erase duration
150
ms
Byte program duration
60
μs
Program/erase endurance
100,000
Data retention
7.13
tD_ret
cycles
100
—
years
ADC Characteristics
Table 22. ADC Electrical Characteristics (Operating)
(VBATT, LREG_BK_FB = 3.3 V, TA = 25 °C, fref = 24 MHz, unless otherwise noted.)
Characteristic
ADC supply current (per ADC)
Condition
Symbol
Min
Typical
Max
Unit
Enabled
—
2.9
6
mA
Disabled
—
5
-
μA
Reference potential, low
VREFL
VSS
—
VREFH
V
Reference potential, high
VREFH
VREFL
—
VBATT
V
Analog input voltage1
VINDC
VSS – 0.2
—
VDD +0.2
V
“Battery” input channel
reference voltage
1
1.2
V
Maximum electrical operating range, not valid conversion range.
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
47
Table 23. ADC Timing/Performance Characteristics
Characteristic
Symbol
Condition
Min
Typ
Max
Unit
Resolution
-
12
Bits
Effective Resolution
8
Bits
Number of input channels
ADC conversion clock frequency
8
-
fADCCLK
Conversion cycles (continuous convert)
CCP
Conversion time
Tconv
Analog Input
1
VAIN
300
6
Input Leakage Current
Voltage1
-
VDD
KHz
ADCCLK
cycles
20
—
-
μs
—
—
-
nA
VREFH
V
VREFL
Analog input must be between VREFL + 0.2 and VREFH - 0.2 for valid conversion.
8
Developer Environment
The MC1322x family is supported by a full set of hardware/software evaluation and development tools.
8.1
Hardware Development Interfaces
The ARM debug environment supports both a JTAG debug interface and an extended capability Nexus
interface.
8.1.1
JTAG Hardware Debug Port
The JTAG port is the simpler and more common debug port for the ARM core. A standard 20-pin
connector as described in Section 6.2.1, “ARM JTAG Interface Connector””, is connected to the TDI,
TMS, TCK, TDO, and RTCK signals of the MC1322x. Through the JTAG serial interface, standard debug
and development activities such as accessing memory and registers, control of the CPU, download of
FLASH memory, and software debug can be accomplished.
8.1.2
A7S Nexus3 (NEX) ARM7 Core Development Interface
The development and debug environment of the ARM7TDMI-S core is based on the A7S Nexus3 interface
(compliant with a Class 3 device of the IEEE-ISTO 5001 standard for real-time embedded system design).
This interface allows expansion of the development features of the JTAG port (through the addition of
auxiliary signals, see Section 6.2.2, “Nexus Mictor Interface Connector”). Development features include:
• Program Trace via Branch Trace Messaging (BTM). Branch trace messaging displays program
flow discontinuities (direct and indirect branches, exceptions, etc.), allowing the development tool
to interpolate what transpires between the discontinuities. Thus static code may be traced.
MC1322x Technical Data, Rev. 1.3
48
Freescale Semiconductor
•
•
•
•
•
•
•
•
•
8.2
Data Trace via Data Write Messaging (DWM) and Data Read Messaging (DRM). This provides
the capability for the development tool to trace reads and/or writes to (selected) internal memory
resources.
Ownership Trace via Ownership Trace Messaging (OTM). OTM facilitates ownership trace by
providing visibility of which process ID or operating system task is activated. An Ownership Trace
Message is transmitted when a new process/task is activated, allowing the development tool to
trace ownership flow.
Run-time access to the memory map via the JTAG port. This allows for enhanced download/upload
capabilities
Watchpoint Messaging (WPM) via the auxiliary pins
Watchpoint Trigger enable of Program and/or Data Trace Messaging
Auxiliary interface for higher data input/output
Registers for Program Trace, Ownership Trace, Watchpoint Trigger, and Read/Write Access
Programmable processor stall function to mitigate message queue overrun risk
All features controllable and configurable via the JTAG port
Software Development Tools
An Integrated Development Environment (IDE) is available to facilitate the development of embedded
applications targeting the MC1322x platform. Features of the IDE include:
• Project management tools and code editor
• Highly optimizing ARM compiler supporting C and C++
• Extensive JTAG and RDI debugger support
• Run-time libraries including source code
• Relocating ARM assembler
• Linker and librarian tools
• Debugger with ARM simulator, JTAG support and support for RTOS-aware debugging on
hardware
• RTOS plug-ins available
• Code templates for commonly used code constructs
• Sample projects for evaluation boards
• User and reference guides, both printed and in PDF format
• Context-sensitive online help
The IDE is complemented by the BeeKit™ Wireless Connectivity Toolkit. BeeKit is a stand alone software
application targeting Windows® operating systems. BeeKit provides a graphical user interface (GUI) in
which users can create, modify, save, and update wireless networking solutions. With the solution explorer
property list windows, users can set configuration parameters to control the setup and execution behavior
of the wireless link within their application. The configuration parameters can be validated inside BeeKit
to ensure all values provided are within acceptable ranges prior to generation of a workspace. All this
functionality provides a mechanism for developers to configure and validate their network parameters
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
49
without having to navigate through multiple source files to configure the same parameters. BeeKit
supports Freescale’s Simple MAC (SMAC), IEEE 802.15.4-compliant MAC, and the Freescale
BeeStack™.
8.3
Development Hardware
Several different development modules and kits will be available to allow evaluation of ZigBee and IEEE
802.15.4 applications. The modules will provide capabilities for Coordinator, Router, and End Device
nodes. Reference designs will be available for RF design and low power applications including 2-layer and
4-layer PCBs.
MC1322x Technical Data, Rev. 1.3
50
Freescale Semiconductor
9
Mechanical Diagrams
(Case 1901-01, non-JEDEC)
Figure 14. Mechanical Diagram (1 of 2)
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
51
Figure 15. Mechanical Diagram Bottom View (2 of 2)
MC1322x Technical Data, Rev. 1.3
52
Freescale Semiconductor
NOTES
MC1322x Technical Data, Rev. 1.3
Freescale Semiconductor
53
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Document Number: MC1322x
Rev. 1.3
10/2010
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