RI-RFM-003B www.ti.com SCBS849 – NOVEMBER 2002 SERIES 2000 MINI RADIO FREQUENCY MODULE FEATURES APPLICATIONS • • • • • • • • • • Best In Class Performance Through Patented HDX Technology Reduced Power Output For Handheld And Medium Read/Write Range Applications Proven In Harsh Industrial Environments Best Value Easy To Install And Use Access Control Vehicle Identification Container Tracking Asset Management Waste Management DESCRIPTION The Texas Instruments low-frequency (LF) reader module provides all the functionality required to communicate with Texas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. The RI-RFM-003B radio frequency power (RFM) module is capable driving a variety of antennas with inductance ranges from 115µH to 117µH including TI standard RI-ANT-P02A stick antenna. The RI-RFM-007 is designed to be connected to control module RI-CTL-MB2A (RS232 interface) or RI-CTL-MB6A (RS422/485 interface) which provides the interface to a host system, power supply connectors and additional I/O’s. The RI-RFM-003B module in combination with a control module is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. The Series 2000 Mini Radio Frequency Module is the interface between a 134.2 kHz HDX/FSK transponder and the Data Processing Unit. It sends an energizing signal to the transponder, modulates the RF signal to send data to the transponder, receives the identification signal and processes it for digital decoding. The small size and low supply voltage make the Mini RF Module well suited for portable read/ write units. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002, Texas Instruments Incorporated RI-RFM-003B www.ti.com SCBS849 – NOVEMBER 2002 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) RI-RFM-003B UNIT 0 to +50 °C –25 to +85 °C Operating Temperature Storage Temperature (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) RI-RFM-003B Power Supply Logic Part: 4.75 to 5.25 VDC, regulated; max. 80mA TX Power Stage: 4.50 to 6.00 VDC, regulated; max. 1.2A (depending on the repetition rate and antenna used) OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PART NUMBER PARAMETER 2 RI-RFM-003B Relative Humidity <97% non-condensing, IEC 68-2-30 Test Db, 21 cycles RF Transmit Frequency 134.2 Antenna Specification Inductivity: 115 to 117µH Q: min. 200 Antenna Recommended Ferrite Stick Antenna RI-ANT-P02A or Air Coil Antenna Inductivity: 115 to 117µH; Q: min. 200 Inductivity: 116.5 to 119µH; Q: min. 100 Antenna Resonance Voltage max. 240 V peak Transponder Types 134.2 kHz HDX / FSK Dimensions (60.2 × 55.1 × 11.5 ) ± 1.0 Weight approx. 40 Drop Test 1 m on concrete, 3 axes, mounted in moulded aluminum case Vibration Test 2 g, 5-500 Hz, displacement 15 mm, 1 oct / min, 3 axes, 3 hrs / axis Reference Documentation 11-06-29-030 (SCBU021) Reference S2000 Mini RF Module RI-RFM-003B Guide S2000 Antennas RI-ANT-P02A 11-08-22-003 (SCBS845) Data Sheet Approvals CE; FCC UNIT kHz Submit Documentation Feedback mm g PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2007 PACKAGING INFORMATION Orderable Device Status (1) RI-RFM-003B-00 ACTIVE Package Type Package Drawing Pins Package Eco Plan (2) Qty 1 10 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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