RI-TRP-REHP-30, RI-TRP-WEHP-30 www.ti.com SCBS841 – JUNE 2001 LOW FREQUENCY 23mm GLASS TRANSPONDER FEATURES APPLICATIONS • • • • • • • • • Best in Class Cerformance Through Patented HDX Technology Patented Transponder Tuning Provides Stable and High Read/Write Performance 64 Bit Read Only, 80 Bit Read/write ISO 11784/11785 Compliant Insensitive to Almost All Non-Metallic Materials Access Control Vehicle Identification Container Tracking Asset Management DESCRIPTION Texas Instruments’ 23 mm LF transponders are providing superior performance and operate at a resonance frequency of 134.2 kHz. Specific products are compliant to ISO/IEC 11784/11785 global open standards. Texas Instruments LF transponders are manufactured with TI’s patented tuning process to provide consistent read and write performance. Prior to delivery, the transponders undergo complete functional and parametric testing, in order to provide the high quality customers have come to expect from TI. The transponders are well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) Operating Temperature (Read) Operating Temperature (Program) Storage Temperature (1) RI-TRP-REHP-30 RI-TRP-WEHP-30 UNIT –25 to +70 –25 to +70 °C — –25 to +70 °C –40 to +85 –40 to +85 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TI-RFid is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001, Texas Instruments Incorporated RI-TRP-REHP-30, RI-TRP-WEHP-30 www.ti.com SCBS841 – JUNE 2001 OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PART NUMBER PARAMETER RI-TRP-WEHP Functionality Read Only Read/Write Memory (Bits) 64 80 (1) Memory (Pages) 1 1 Operating Frequency 134.2 Modulation FSK (Frequency Shift Keying) 134.2 kHz / 123.2 kHz Transmission Principle HDX (Half Duplex) Power Source Powered from the reader signal (batteryless) Typical Reading Range ≤ 60 (2) Typical Programming Range — Typical Reading Time 70 Typical Programming Time — 309 Typical Programming Cycles — 10,000 Case Material Glass Protection Class Hermetically sealed EMC Programmed code is not affected by normal electromagnetic interference or x-rays Signal Penetration Transponder can be read through virtually all non-metallic material Mechanical Shock IEC 68-2-27, Test Ea; Vibration IEC 68-2-6, Test Fc; Dimensions Ø3.85 ± 0.05 × 23.1 ± 0.5 Weight 0.6 g (1) (2) 2 RI-TRP-REHP UNIT kHz cm 30% of specified reading range ms ms mm We recommend that you split each 80 bit page into 64 user programmable bits plus a 16 bit wide CRC CCITT Block Check Character as is done by TI-RFid™ LF readers. Depending on RF regulation in country of use, the Reader Antenna configuration used, and the environmental conditions. Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 22-May-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing RI-TRP-WEHP-30 ACTIVE RFIDT TGA Pins Package Eco Plan (2) Qty 0 2000 Pb-Free (RoHS) Lead/Ball Finish MSL Peak Temp (3) SNAG3CU0.5 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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