Time Code Reception IC

Ordering number : ENA0205A
LA1654C
Monolithic Linear IC
Time Code Reception IC
http://onsemi.com
Overview
The LA1654C time code reception IC receives long-wave time standard broadcasts (such as the Japanese JJY and
German DCF77 standards) and detects and outputs the time code superposed on the long-wave signal.
Applications can automatically correct their clock's time setting by using the time code received by the LA1654C.
Note that the LA1654C is a bare chip product that is not packaged.
Function
• RF amplifier, rectifier, detector, time code output, and standby circuit.
Features
• Low-voltage operation (operating VCC as low as 1.5V).
• Standby mode current drain less than or equal to 0.05μA.
Japan : JJY 40/60kHz
Germany : DCF77 77.5kHz
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Maximum supply voltage
Allowable power dissipation
Symbol
Conditions
Ratings
Unit
VCC max
Pd max
Ta ≤ 70°C
5.0
V
10
mW
Operating temperature
Topr
-20 to +70
°C
Storage temperature
Tstg
-40 to +125
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Recommended Operating Conditions at Ta = 25°C
Parameter
Symbol
Conditions
Ratings
min
typ
max
Unit
Recommended supply voltage
VCC
1.5
3.0
V
Operating supply voltage range
VCC op
1.1
3.6
V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of this data sheet.
Semiconductor Components Industries, LLC, 2014
April, 2014
42114NK/92706/12506MSOT B8-7046 No.A0205-1/5
LA1654C
Operating Characteristics at Ta = 25°C, VCC = 3.0V
* : Packaged in a VSON16 package and measured using the SON11T016-001-MF socket (Yamaichi Electronics Co., Ltd.)
Overall Characteristics
Parameter
Symbol
Conditions
Quiescent current
ICCO
No input, PAD15 = 0V, PAD10 = 3V
Standby mode current drain
ISTB
PAD15 = 3.0V
Ratings
min
typ
30
37
max
Unit
50
μA
0.05
μA
AGC Amplifier Input Characteristics
Parameter
Symbol
Input impedance
Conditions
ZI
PAD1
Input frequency range
FIN
PAD1
Minimum input voltage
VMIN
PAD1 input level
Maximum input voltage
VMAX
PAD1 input level
Ratings
min
typ
max
800
37.5
Unit
kΩ
80.0
1
100
kHz
μVrms
mVrms
TCO Output Characteristics - Input signal = PAD1, fin = 40kHz, PAD10 = 3V, PAD15 = 0V
Parameter
Symbol
High-level output voltage
Conditions
Ratings
min
typ
PAD11 output level
Low-level output voltage
VOL
PAD11 output level
0.1
V
Output pulse width
T500
VIN = 0 to 100dBμV, AM modulation
(1Hz square wave, duty = 50%, 10:1 modulation)
400
520
600
ms
T800
VIN = 0 to 100dBμV, AM modulation
(1Hz square wave, duty = 80%, 10:1 modulation)
600
730
800
ms
T200
VIN = 0 to 100dBμV, AM modulation
(1Hz square wave, duty = 20%, 10:1 modulation)
200
300
400
ms
Output pulse width
(800 ms input)
Output pulse width
(200 ms input)
3.0
Unit
VOH
(500 ms input)
2.9
max
0
V
STB Control Characteristics
Parameter
Symbol
Conditions
Ratings
min
typ
max
Unit
Standby on voltage
VSH
PAD15 DC voltage
2.9
3.0
Standby off voltage
VSL
PAD15 DC voltage
0
0.1
V
V
High-level pin input current
ISH
PAD15 = 3V
0.1
μA
Low-level pin input current
ISL
PAD15 = 0V
0.3
μA
HOLD Control Characteristics - PAD15 = 0V
Parameter
Symbol
Conditions
Ratings
min
typ
max
Unit
Hold on voltage
VHL
PAD10 DC voltage
0
0.1
V
Hold off voltage
VHH
PAD10 DC voltage
2.9
3.0
V
High-level pin input current
IHH
PAD10 = 3V
0.1
μA
Low-level pin input current
IHL
PAD10 = 0V
0.3
μA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
No.A0205-2/5
LA1654C
Chip Specifications
Parameter
Conditions
Ratings
Chip size
Unit
mm2
1.26×2.00
330(±20)
μm
127.5×127.5
μm2
105×105
μm2
Chip thickness
Pad size
Pad opening
PAD Coordinates
PAD
X-Axis
Y-Axis
PAD
P1
902
151
P2
1109
P3A
P3B
P4
X-Axis
Y-Axis
TEST PAD
776.5
1849
299.5
P9
368.5
1849
1109
717.5
P10
151
1747
1109
508.5
P11
151
1600
1109
926.5
P12
151
1453
P5
1109
1073.5
P13
151
547
P6A
1109
1282.5
P14
151
400
P6B
1109
1491.5
P15
151
253
P7
1109
1700.5
P16
368.5
151
P8
926
1849
Notes
1. The left upper corner of the Pad Layout Diagram on the following page is the origin, the X axis increases to the right
and the Y axis increases in the downward direction.
2. Units : μm
3. The pad coordinates give the coordinate values of the center of the pads.
4. Both of each of the pairs P3A/P3B (VCC) and P6A/P6B (ground) must be bonded.
5. The test pads must not be connected (NC).
No.A0205-3/5
LA1654C
Pad Layout Diagram
PCA00620
Block Diagram
NFB Cap.
Stand-by Switch
AGC Cap.
(Filter Cap.)
REC Cap.
TCO
Hold Switch
Filter Output
16
15
14
13
12
11
10
9
VCC
RECTIFIER
AMP
AGC-AMP
DECODER
FILTER
AGC
REGULATOR
VCC
VCC
GND
VCC
2
3
4
5
6
7
8
AGC Amp-Input 1
AGC Amp-Input 2
VCC
AGC Amp-Output 1
AGC Amp-Output 2
GND
REC.-Input
(Filter Cap.)
PCA00621
1
No.A0205-4/5
LA1654C
Test Circuit Diagram
0.22μF
AGC HOLD
0.01μF
NORMAL
NORMAL
STANDBY
TCO
0.47μF
0.22μF
750kΩ
16
15
REGULATOR
14
13
AGC
FILTER
VCC
AGCAMP
AMP
2
3
10
4.8MΩ
VCC
9
VCC
55kΩ
55kΩ
RECTIFIER
GND
4
5
6
7
8
A
ICC
50Ω
0.47μF
11
DECODER
VCC
6.6MΩ
1
12
0.1μF
VCC
3.0V
0.47μF
47kΩ 40kHz crystal
Signal Generator :
Zo=50Ω
PCA00622
ORDERING INFORMATION
Device
LA1654C-X1
Package
Chip
(Pb-Free)
Shipping (Qty / Packing)
2250 / Waffle Pack
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PS No.A0205-5/5