LFPAK33 quick guide

LFPAK33—
Shrinking the
power footprint
The LFPAK33 brings NXP’s robust and
reliable copper clip technology to the
Power33 (3.3 mm x 3.3 mm) footprint
COMPACT FOOTPRINT
DPAK
LFPAK33
6.7 mm
DPAK
ULTRA-LOW ON-RESISTANCE
3.3 mm
10.4 mm
3.3 mm
`` Ultra-compact footprint - 10.9 mm2
`` 6.3 mΩ @ 40 V
`` Ultra-low height <1 mm
`` Copper clip technology
`` Footprint >80 % smaller than DPAK
`` Ultra-low package resistance
RELIABLE & MANUFACTURABLE
`` High board-level reliability
`` Easy optical inspection
`` Robust solder joints
HIGH CURRENT RATING
`` Best-in-class current rating
`` Up to 70 A per device
`` High transient robustness
LFPAK33 PRODUCT RANGE
Product Name
RDSon [max]
@ 5 V [mΩ]
ID [max]
@ 25°C [A]
Rth(j-mb)
[max] [K/W]
LL
5.2
70
1.89
30
LL
6.6
70
2
30
LL
10
59
2.75
17
39
3.4
70
1.89
70
1.89
70
2
66
2
60
2.43
56
2.43
52
2.75
48
2.75
35
3.4
31
3.4
21
4.8
RDSon [max]
@ 10 V [mΩ]
VDS [max] (V)
Gate Level
BUK9M5R2-30E
30
BUK9M6R6-30E
BUK9M10-30E
BUK9M17-30E
30
LL
BUK7M6R3-40E
40
SL
BUK9M7R2-40E
40
LL
BUK7M8R0-40E
40
SL
BUK9M9R1-40E
40
LL
BUK7M10-40E
40
SL
BUK9M11-40E
40
LL
BUK7M12-40E
40
SL
BUK9M14-40E
40
LL
BUK7M21-40E
40
SL
BUK9M24-40E
40
LL
BUK7M45-40E
40
SL
BUK9M52-40E
40
LL
BUK7M9R9-60E
60
SL
BUK9M12-60E
60
LL
BUK7M12-60E
60
SL
BUK9M15-60E
60
LL
BUK7M15-60E
60
SL
BUK9M19-60E
60
LL
BUK7M19-60E
60
SL
BUK9M24-60E
60
LL
BUK7M33-60E
60
SL
BUK9M42-60E
60
LL
BUK7M42-60E
60
SL
BUK9M53-60E
60
LL
BUK7M67-60E
60
SL
BUK9M85-60E
60
LL
BUK7M17-80E
80
SL
17
BUK7M22-80E
80
SL
22
BUK9M23-80E
80
LL
BUK7M27-80E
80
SL
BUK9M28-80E
80
LL
28
BUK9M35-80E
80
LL
BUK9M34-100E
100
LL
BUK9M43-100E
100
BUK9M120-100E
BUK9M156-100E
6.3
7.2
8
9.1
10
11
12
14
21
24
45
52
9.9
12
12
15
15
19
19
24
33
42
42
53
67
85
19
4.8
60
1.89
54
1.89
54
2
49
2
46
2.43
40
2.43
39
2.75
34
2.75
26
3.4
23
3.4
21
4.17
19
4.17
16
4.8
14
4.8
43
1.89
38
2
37
1.89
32
2.43
34
2
35
28
2.43
34
28
1.89
LL
43
26
2
100
LL
120
12
3.4
100
LL
156
10
4.17
23
27
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NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners.
© 2016 NXP B.V.
Date of release: March 2016
Document order number: 9397 750 17711
Printed in the Netherlands