LFPAK33— Shrinking the power footprint The LFPAK33 brings NXP’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint COMPACT FOOTPRINT DPAK LFPAK33 6.7 mm DPAK ULTRA-LOW ON-RESISTANCE 3.3 mm 10.4 mm 3.3 mm `` Ultra-compact footprint - 10.9 mm2 `` 6.3 mΩ @ 40 V `` Ultra-low height <1 mm `` Copper clip technology `` Footprint >80 % smaller than DPAK `` Ultra-low package resistance RELIABLE & MANUFACTURABLE `` High board-level reliability `` Easy optical inspection `` Robust solder joints HIGH CURRENT RATING `` Best-in-class current rating `` Up to 70 A per device `` High transient robustness LFPAK33 PRODUCT RANGE Product Name RDSon [max] @ 5 V [mΩ] ID [max] @ 25°C [A] Rth(j-mb) [max] [K/W] LL 5.2 70 1.89 30 LL 6.6 70 2 30 LL 10 59 2.75 17 39 3.4 70 1.89 70 1.89 70 2 66 2 60 2.43 56 2.43 52 2.75 48 2.75 35 3.4 31 3.4 21 4.8 RDSon [max] @ 10 V [mΩ] VDS [max] (V) Gate Level BUK9M5R2-30E 30 BUK9M6R6-30E BUK9M10-30E BUK9M17-30E 30 LL BUK7M6R3-40E 40 SL BUK9M7R2-40E 40 LL BUK7M8R0-40E 40 SL BUK9M9R1-40E 40 LL BUK7M10-40E 40 SL BUK9M11-40E 40 LL BUK7M12-40E 40 SL BUK9M14-40E 40 LL BUK7M21-40E 40 SL BUK9M24-40E 40 LL BUK7M45-40E 40 SL BUK9M52-40E 40 LL BUK7M9R9-60E 60 SL BUK9M12-60E 60 LL BUK7M12-60E 60 SL BUK9M15-60E 60 LL BUK7M15-60E 60 SL BUK9M19-60E 60 LL BUK7M19-60E 60 SL BUK9M24-60E 60 LL BUK7M33-60E 60 SL BUK9M42-60E 60 LL BUK7M42-60E 60 SL BUK9M53-60E 60 LL BUK7M67-60E 60 SL BUK9M85-60E 60 LL BUK7M17-80E 80 SL 17 BUK7M22-80E 80 SL 22 BUK9M23-80E 80 LL BUK7M27-80E 80 SL BUK9M28-80E 80 LL 28 BUK9M35-80E 80 LL BUK9M34-100E 100 LL BUK9M43-100E 100 BUK9M120-100E BUK9M156-100E 6.3 7.2 8 9.1 10 11 12 14 21 24 45 52 9.9 12 12 15 15 19 19 24 33 42 42 53 67 85 19 4.8 60 1.89 54 1.89 54 2 49 2 46 2.43 40 2.43 39 2.75 34 2.75 26 3.4 23 3.4 21 4.17 19 4.17 16 4.8 14 4.8 43 1.89 38 2 37 1.89 32 2.43 34 2 35 28 2.43 34 28 1.89 LL 43 26 2 100 LL 120 12 3.4 100 LL 156 10 4.17 23 27 www.nxp.com NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2016 NXP B.V. Date of release: March 2016 Document order number: 9397 750 17711 Printed in the Netherlands