C8051F300-GDI 8 kB Flash, 8-Bit ADC MCU Die in Wafer Form Analog Peripherals - 8-Bit ADC High Speed 8051 µc Core - Pipelined instruction architecture; executes 70% of Up to 500 ksps Up to 8 external inputs • Programmable amplifier gains of 4, 2, 1, & 0.5 • VREF from external pin or VDD • Built-in temperature sensor • External conversion start input Comparator • Programmable hysteresis and response time • Configurable as interrupt or reset source • Low current (0.5 µA) • • On-chip Debug - On-chip debug circuitry facilitates full speed, non- - intrusive in-system debug (no emulator required) Provides breakpoints, single stepping, inspect/modify memory and registers Superior performance to emulation systems using ICE-chips, target pods, and sockets Supply Voltage 2.7 to 3.6 V - Typical operating current: 6.6 mA @ 25 MHz; - ports Three general-purpose 16-bit counter/timers 16-bit programmable counter array (PCA) with three capture/compare modules Real time clock mode using PCA or timer and external clock source Clock Sources - Internal oscillator: 24.5 MHz with ±2% accuracy 14 µA @ 32 kHz Typical stop mode current: 0.1 µA Temperature range: –40 to +85 °C Full Technical Data Sheet - C8051F300/1/2/3/4/5 - supports UART operation External oscillator: Crystal, RC, C, or clock (1 or 2 pin modes) Can switch between clock sources on-the-fly; Useful in power saving modes ANALOG PERIPHERALS A M U X PGA 8-bit 500 ksps ADC C8051F300/2 only + TEMP SENSOR - VOLTAGE COMPARATOR DIGITAL I/O UART SMBus PCA Timer 0 Timer 1 I/O Port - devices Digital Peripherals - 8 Port I/O; All 5 V tolerant with high sink current - Hardware enhanced UART and SMBus™ serial CROSSBAR - instructions in 1 or 2 system clocks - Up to 25 MIPS throughput with 25 MHz clock - Expanded interrupt handler Memory - 256 bytes internal data RAM - 8 kB Flash; 512 bytes are reserved in the 8 kB Timer 2 PROGRAMMABLE PRECISION INTERNAL OSCILLATOR HIGH-SPEED CONTROLLER CORE 8/4/2 kBytes ISP Flash 12 INTERRUPTS Rev. 1.1 4/12 8051 CPU (25MIPS) DEBUG CIRCUITRY 256 B SRAM POR Copyright © 2012 by Silicon Laboratories WDT C8051F300-GDI 2 MIPS (Peak) Flash Memory (kB)* RAM (Bytes) SMBus/I2C UART Timers (16-bit) Programmable Counter Array Digital Port I/Os 8-bit 500 ksps ADC Programmable Current Reference Temperature Sensor Analog Comparators Lead-free (RoHS Compliant) C8051F300-GDI 25 8 256 1 1 3 8 1 *Note: 512 bytes reserved for factory use. Rev. 1.1 Package Ordering Part Number C8051F300-GDI 1. Ordering Information Table 1.1. Product Selection Guide Tested Die in Wafer Form C8051F300-GDI 2. Pin Definitions Table 2.1. Pin Definitions for the C8051F300-GDI Name Physical Pad Number Type VREF / 3 A In P0.0 D I/O or A In P0.1 4 VDD 5 XTAL1 / 6 P0.2 XTAL2 / Description External Voltage Reference Input. Port 0.0. D I/O or A Port 0.1. In Power Supply Voltage. A In Crystal Input. This pin is the external oscillator circuit return for a crystal or ceramic resonator. D I/O or A In Port 0.2. 7 P0.3 A Out Crystal Input/Output. For an external crystal or resonator, this pin is the excitation driver. This pin is the external clock input for CMOS, capacitor, or RC network configurations. D I/O Port 0.3. P0.4 13 D I/O or A Port 0.4. In P0.5 14 D I/O or A Port 0.5. In C2CK / 15 RST P0.6 / 16 CNVSTR C2D / 17 P0.7 GND D I/O Clock signal for the C2 Development Interface. D I/O Device Reset. Open-drain output of internal POR or VDD monitor. An external source can initiate a system reset by driving this pin low for at least 10 µs. D I/O or A In D I/O ADC External Convert Start Input Strobe. D I/O Data signal for the C2 Development Interface. D I/O or A In 18 Port 0.6. Port 0.7. Ground. Rev. 1.1 3 C8051F300-GDI 3. Bonding Instructions Table 3.1. C8051F300-GDI Pad Connections Physical Pad Number Example Package Pin Number (11-QFN) 1 Package Pin Name Physical Pad X (µm) Physical Pad Y (µm) Reserved* –1001.5 –575 2 Reserved* –926.5 –575 3 1 VREF/P0.0 –795.5 –575 4 2 P0.1 –615.5 –575 5 3 VDD 346.17 –575 6 4 XTAL1/P0.2 615.5 –575 7 5 XTAL2/P0.3 795.5 –575 8 Reserved* 926.5 –575 9 Reserved* 1001.5 –575 10 Reserved* 1000 –429.57 11 Reserved* 1001.5 575 12 Reserved* 926.5 575 13 6 P0.4 790.5 575 14 7 P0.5 620.5 575 15 8 /RST/C2CK 440.5 575 16 9 P0.6/CNVSTR –523.5 575 17 10 C2D/P0.7 –703.5 575 18 11 GND –834.5 575 19 Reserved* –926.5 575 20 Reserved* –1001.5 575 *Note: Pins marked “Reserved” should not be connected. 4 Rev. 1.1 C8051F300-GDI Figure 3.1. Example Die Bonding (QFN-11) Rev. 1.1 5 C8051F300-GDI Table 3.2. Wafer and Die Information C8051F300 Wafer ID 8 in Wafer Dimensions Die Dimensions 1.40 mm x 2.2 mm Wafer Thickness 12 mil ±1 mil Wafer Identification Notch Scribe Line Width 80 µm Contact Sales for info Die Per Wafer* Passivation Standard Wafer Packaging Detail Wafer Jar Bond Pad Dimensions 60 µm x 60 µm Maximum Processing Temperature 250 °C Electronic Die Map Format .txt Bond Pad Pitch Minimum 75 µm *Note: This is the Expected Known Good Die yielded per wafer and represents the batch order quantity (one wafer). 6 Rev. 1.1 C8051F300-GDI 4. Wafer Storage Guidelines It is necessary to conform to appropriate wafer storage practices to avoid product degradation or contamination. Wafers may be stored for up to 18 months in the original packaging supplied by Silicon Labs. Wafers must be stored at a temperature of 18–24 °C. Wafers must be stored in a humidity-controlled environment with a relative humidity of <30%. Wafers should be stored in a clean, dry, inert atmosphere (e.g. nitrogen or clean, dry air). Rev. 1.1 7 C8051F300-GDI DOCUMENT CHANGE LIST Revision 1.0 to Revision 1.1 8 Changed Wafer Packaging Detail to “Wafer Jar” in Table 3.2 on page 6. Rev. 1.1 Simplicity Studio One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! IoT Portfolio www.silabs.com/IoT SW/HW Quality Support and Community www.silabs.com/simplicity www.silabs.com/quality community.silabs.com Disclaimer Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Trademark Information Silicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA http://www.silabs.com