PulseGuard ® Suppressors Polymeric ESD Suppressors NEW Pb PGB1 Series Lead-Free 0603 Surface Mount ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI and DVI can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883C), while adding virtually no capacitance to the circuit. 4 PULSEGUARD® SUPPRESSORS Features • Lead-Free • Ultra-low capacitance • Low leakage current • Fast response time • Single line of protection • Bi-directional • Withstands multiple ESD strikes • Standard EIA SOCM-1608 package • Compatible with pick-and-place processes • Available in 1,000 and 5,000 piece reels (EIA-RS481) Reference Dimensions: Sn 1.60 (.063") 0.076 (.003") MIN 1.04 (.041") REF 0.787 (.031") Typical Applications • • • • • • • HDTV Hardware Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage Set-Top Boxes 0.254 (.010") MIN 0.356 (.014") Wave Solder Reflow Solder 0.508 (.020") 0.762 (.030") 3.30 (1.30") 3.05 (1.20") 1.27 (.050") 1.27 (.050") Ordering Information 0.762 (.030") CATALOG NUMBER PIECES PER REEL PGB1010603MR 1,000 PGB1010603NR 5,000 Equivalent Circuit 1 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 197 0.762 (.030") w w w. l i t t e l f u s e . c o m 2 PulseGuard ® Suppressors Polymeric ESD Suppressors Pb PGB1 Series Lead-Free 0603 Surface Mount ESD Suppressor Electrical Characteristics Capacitance vs. Frequency ESD Capability IEC 61000-4-2 Direct Discharge ....................................................8kV IEC 61000-4-2 Air Discharge .......................................................15kV Rated Voltage ........................................................................24VDC, max Capacitance2 ................................................................................0.055 pF Response Time1 ...............................................................................< 1 ns Leakage Current...............................................................................< 1nA Capacitance (fF) Trigger Voltage1 ......................................................................500V, typical Clamping Voltage1 ..................................................................150V, typical ** Note: 1,000 fF = 1 pF 70 ESD Pulse Withstand............................................1,000 pulses, minimum 60 50 40 NOTES: 1. 8 kV direct discharge method, per IEC 61000-4-2. 2. Measured at 1 MHz. 0.5 1.0 1.5 2.0 Frequency (GHz) Environmental Specifications Operating Temperature: -65°C to +125°C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85°C, 1000hrs. Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, 1 min. cycle, 2grs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer) Solder leach resistance and terminal adhesion: Per EIA-576 test Carrier Tape Specifications Parts are delivered on 7” (178mm) reel, paper carrier tape Tt Ds Dd + + + Materials: Ct Body: Glass Epoxy Terminations: Tin (Sn) DESCRIPTION MIL-STD-202, Method 208 (95% coverage) + Tw Pd + + Physical Specifications Solderability: + Ps + Pw MEASUREMENT (MM) Soldering Parameters: Ct - Cover tape thickness 0.06 Wave solder - 260°C, 10 seconds maximum Reflow solder - 260°C, 30 seconds maximum Dd - Drive hole diameter 1.50 Operating Temperature Range: Ds - Drive hole spacing 4.00 Pd - Pocket depth 0.58 Ph - Pocket height 1.85 Ps - Pocket spacing 4.00 Pw - Pocket width 1.02 Tt - Carrier tape thickness 0.65 Tw - Carrier tape width 8.00 -65°C to +125°C Packaging Specifications 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR. w w w. l i t t e l f u s e . c o m Ph 198