PulseGuard ® Suppressors Surface Mount Polymeric ESD Suppressors PGB Series SOT23 ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394 and InfiniBandSM can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E). Features • Ultra-low capacitance • Low leakage current • Fast response time • 2-lines of protection • Bi-directional • Withstands multiple ESD strikes • Standard JEDEC SOT23 outline • Compatible with pick-and-place processes • Available in 3,000 piece reels Reference Dimensions: 2.24 (.088") Typical Applications • • • • • • Reflow Solder Servers Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage Sn 1.01 (.040") 1.01 (.040")* 2.29 (.090") 1.27 (.050") 1.01 (.040") 2.032 (.080") 1.01 (.040") 1.27 (.050") 0.635 (.025") 2.032 (.080")* 0.51 (.020") Ordering Information CATALOG NUMBER PIECES PER REEL PGB002ST23WR 3,000 0.076 (.003") MIN (TYP) Note: For wave solder, increase the spacing in both the horizontal and vertical dimensions by 0.254 (.010") where denoted by an asterisk (*) Equivalent Circuit Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 3 1 210 0.762 (.030") 0.81 (.032") REF Design Consideration w w w. l i t t e l f u s e . c o m 2.997 (.118") 2 PulseGuard ® Suppressors Surface Mount Polymeric ESD Suppressors PGB Series SOT23 ESD Suppressor Electrical Characteristics Capacitance vs. Frequency ESD Capability ** Note: 1,000 fF = 1 pF 70 IEC 61000-4-2 Direct Discharge ....................................................8kV Capacitance (fF) IEC 61000-4-2 Air Discharge .......................................................15kV Trigger Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1,000V typical Clamping Voltage1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150V typical Rated Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24VDC max Capacitance2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.055pF Response Time1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <1ns 60 50 40 Leakage Current3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <1nA 4 ESD Pulse Withstand4 . . . . . . . . . . . . . . . . . . . . . . 1,000 pulses minimum 0.5 1.0 Notes: 1.5 2.0 PULSEGUARD® SUPPRESSORS Frequency (GHz) 1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct discharge method. 2. Capacitance measured at 1MHZ. 3. Leakage current measured at 6VDC. 4. Pulse Withstand- some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate. Carrier Tape Specifications Parts are delivered on 7” (178mm) reel, plastic carrier tape Environmental Specifications Tt Operating Temperature: -65°C to +125°C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85°C, 1000hrs. 1 min. cycle, 2grs each in X-Y-Z) + + + + + Tw Pd + Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, Ds Dd + Ph Ps Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer) Pw Solder leach resistance and terminal adhesion: Per EIA-576 Ct test Physical Specifications Materials: Body: Glass Epoxy Terminations: Copper/Nickel/Tin/Lead Solderability: MIL-STD-202, Method 208 (95% coverage) DESCRIPTION Soldering Parameters: Wave Solder – 260°C, 10 seconds maximum. Reflow Solder – 260°C, 30 seconds maximum. MEASUREMENT (MM) Ct - Cover tape thickness 0.06 Dd - Drive hole diameter 1.50 Packaging Specifications Ds - Drive hole spacing 4.00 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 3,000 pieces per reel, add packaging suffix, WR. Pd - Pocket depth 1.02 Ph - Pocket height 3.23 Ps - Pocket spacing 4.00 Pw - Pocket width 2.46 Tt - Carrier tape thickness 0.30 Tw - Carrier tape width 8.00 w w w. l i t t e l f u s e . c o m 211