Output Coupling Capacitor-less Line Amplifier BD8876FV, BD8878FV Key Specifications Description BD8876FV, BD8878FV are output coupling capacitor-less line amplifiers. These IC have a negative voltage generator built-in and generate the negative voltage from the supply voltage. It is possible to drive in a ground reference with both voltage of the supply voltage and the negative voltage. Therefore, these line amplifiers have wide output range, and they can output 2Vrms(5.65VP-P) with the single-supply 5V. Power Supply voltage: THD+N: 3V to 5.5V 0.003% (Typ) (VCC=5V, RL=10kΩ, Vo=2Vrms, 20kHz LPF) Maximum Output Voltage: 2Vrms (Min)@VCC=5V Output Noise: 10μVrms (Typ) Circuit Current (Active): 3.2mA (Typ) Operating Temperature Range: -40°C to +85°C Features Possible to output 2Vrms with single-supply 5V Output Coupling Capacitor-less Variable Gain（+6dB / +9dB Typ.） [BD8876FV] Fixed Gain（+6.7dB Typ.）[BD8878FV] Integrated Negative Power Supply Ground-Referenced Outputs Integrated Short-Circuit and Thermal Protection Package SSOP-B14 W(Typ) x D(Typ) x H(Max) 5.00mm x 6.40mm x 1.35mm Applications Video game console, Projector, Set Top Box, Blu-ray player etc. SSOP-B14 Typical Application Circuit VDD VDD SVDD PVDD INL OUTL INR OUTR Amplifier type Gain SDB CP Package GAIN (*1) PVSS BD8876FV BD8878FV Inverting amplifier +6.0dB / +9.0dB Non-inverting amplifier (Changed by GAIN pin) +6.7dB SSOP-B14 CN (*1) GAIN pin : BD8876FV Figure 1. Typical Application Circuit 〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0C1C0EZ00280-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 1/20 TSZ22111・14・001 2015.10.30 Rev.001 BD8876FV, BD8878FV Pin Configurations (TOP VIEW) 1 OUTL OUTR 14 1 O U T L BD8876FV INR 13 2 INL OUTR 14 BD8878FV INR 13 2 INL 3 SVDD SVSS 12 3 S V D D SVSS 12 4 SGND PVSS 11 4 S G N D PVSS 11 5 SDB CN 10 6 GAIN 5 S D B PGND 9 7 PVDD CN 10 6 NC CP 8 PGND 9 7 PVDD CP 8 Figure 2. Pin Configurations Pin Description/Function PIN No. Pin name 1 OUTL 2 INL Equivalence Circuit Function Line amplifier (Lch) output Line amplifier (Lch) input Line amplifier supply voltage - 4 SGND Line amplifier ground - 6 Shutdown control (H: active, L: shutdown) GAIN Gain control (BD8876FV) (H: 9.0dB, L:6.0dB) NC No Connection (BD8878FV) 7 PVDD 8 CP 9 PGND 10 CN 11 12 14 PVSS B B PVSS SVDD C1 A Charge pump ground - Flying capacitor negative terminal B PVSS Charge pump output voltage F SVSS Line amplifier negative supply input Line amplifier (Rch) output PGND PAD Flying capacitor positive terminal OUTR PAD E - Line amplifier (Rch) input PGND E Charge pump supply voltage INR PGND A A C1 SVSS SVDD SVDD PAD PAD F C2 C2 13 PGND PAD C1 (BD8876FV) C2 (BD8878FV) SVDD SDB PVDD D 3 5 PVDD Equivalence Circuit C1 (BD8876FV) C2 (BD8878FV) D SVSS SVSS D PGND PGND SVDD D PAD PAD E E www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/20 SGND FF TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Block Diagrams BD8876FV BD8878FV SHORT CIRCUIT PROTECTION SHORT CIRCUIT PROTECTION 22.5k INL 2 13 INR SVSS SVDD SVSS SVDD 22.5k 6.8k 6.8k SGND SVDD 3 SVDD 15k/19.1k 15k/19.1k SGND SGND SVSS SVDD 3 12 SVSS SGND SGND 4 SGND 11 PVSS UVLO / SHUTDOWN CONTROL SDB 5 CHARGE PUMP 15k SVDD 12 SVSS SGND 11 PVSS UVLO / SHUTDOWN CONTROL 10 CN CHARGE PUMP OPEN NC 6 9 PGND SVSS SGND SDB 5 10 CN GAIN 6 9 PGND SGND SGND PVDD 7 15k 15k SVDD SGND 4 SGND 15k SVDD 13 INR - + 42.3k/38.2k SVSS - SVDD + + SVDD 14 OUTR - SVSS + 42.3k/38.2k - INL 2 OUTL 1 14 OUTR OUTL 1 PVDD PVDD 7 8 CP PVDD 8 CP Figure 3. Block Diagrams Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Rating Unit SVDD-PVDD Voltage VDD 0 V SGND-PGND Voltage VGG 0 V SVSS-PVSS Voltage VSS 0 V SVDD, PVDD-SGND or PGND Voltage VDG -0.3～6.0 V SVSS, PVSS-SGND or PGND Voltage VSG -6.0～0.3 V IN_-SGND Voltage VIN (SVSS-0.3)～(SVDD+0.3) V OUT_-SGND Voltage VOUT (SVSS-0.3)～(SVDD+0.3) V CP-PGND Voltage VCP (PGND-0.3)～(PVDD+0.3) V CN-PGND Voltage VCN (PVSS-0.3)～(PGND+0.3) V SDB-SGND Voltage VSH (SGND-0.3)～(SVDD+0.3) V GAIN-SGND Voltage VGA (SGND-0.3)～(SVDD+0.3) V Input current IIN -10～10 mA Power Dissipation (NOTE 1) Storage Temperature Range PD 0.87 W TSTG -55～+150 °C (Note 1) Derate by 6.96mW/°C when operating above 25°C when mounted on 70mm x 70mm x 1.6mm, FR4.1-layer glass epoxy board. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Supply Voltage Range VSVDD, VPVDD Operating Temperature Range Minimum Load Impedance www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Limit Unit Min Typ Max 3.0 - 5.5 V TOPR -40 - +85 °C ZL 550 - - Ω 3/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Electrical Characteristics (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) Limit Parameter Symbol BD8876FV BD8878FV Unit Remarks Min Typ Max Min Typ Max IST - 0.1 2 - 0.1 2 µA SDB=L IDD - 3.2 8.2 - 3.2 10.5 mA SDB=H, No signal, RL=No load H Level Input Voltage VIH 0.7 x SVDD - - 0.7 x SVDD - - V L Level Input Voltage VIL - - 0.3 x SVDD - - 0.3 x SVDD V Input Leak Current ILEAK - - ±1 - - ±1 µA Circuit current Circuit Current (Shutdown) Circuit Current (Active) SDB pin/GAIN pin Line amplifier Start up time tSON - 470 - - 470 - µsec Offset Voltage VIS - ±0.5 ±5 - ±1 ±10 mV Maximum Output Voltage VOUT 2.5 3.5 - 2.05 3.0 - Vrms THD+N THD+N - 0.003 0.032 - 0.003 0.032 % f=1kHz, VOUT=2Vrms, 20kHz LPF 20 30 40 kΩ *1 GAIN=L (6dB mode) *2 GAIN=H (9dB mode) 5.7 6.7 7.7 dB *1 GAIN=L (6dB mode) *2 GAIN=H (9dB mode) Input Impedance Gain ZIN1 *1 12 19 26 ZIN2 *2 10 15 20 AV1 *1 5.0 6.0 7.0 AV2 *2 8.0 9.0 10.0 Gain mismatch ΔAV - 1 - - 1 - % Output Noise VN - 8 - - 10 - µVrms Slew Rate Maximum Capacitive Load SR - 3.0 - - 3.0 - V/µsec CL - - 250 - - 250 pF Crosstalk CT - -80 - - -65 - dB PSRR - -65 - - -65 - dB fOSC 150 300 450 150 300 450 kHz Power Supply Rejection Ratio Charge-Pump Oscillator Frequency www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/20 SDB=L→H f=1kHz , THD+N≦-40dB, 20kHz LPF 20kHz LPF+A-Weight filter, Rg=0ohm f=1kHz, VOUT=200mVP-P, 1kHz BPF f=1kHz, Vripple=100mVP-P, 1kHz BPF TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs. BD8876FV BD8878FV 1 8 0.9 7 0.8 Circuit Current (Active) [mA] Circuit Current (shutdown) [µA] BD8876FV BD8878FV 0.7 0.6 0.5 0.4 0.3 6 5 4 3 2 0.2 1 0.1 0 0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 6.0 Supply Voltage [V] 3.0 3.5 4.0 4.5 5.0 Supply Voltage [V] Figure 4. Figure 5. Circuit Current (Shutdown) vs. Supply Voltage Circuit Current (Active) vs. Supply Voltage BD8876FV VDD=5V RL=10kΩ GAIN=6dB 22kHz LPF+A-weight Filter 1m VDD=5V RL=10kΩ 22kHz LPF+A-weight Filter 1m 100u Noise [Vrms] 100u Noise [Vrms] 6.0 BD8878FV 10m 10m 5.5 10u 10u VN=10.6µVrms VN=7.8µVrms 1u 1u 0.1u 0.1u 10 100 1k 10k 100k 10 100 1k 10k Frequency [Hz] Frequency [Hz] Figure 6. Figure 7. Noise Level (BD8876FV) Noise Level (BDD8878FV) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100k 5/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs. BD8876FV BD8876FV 6 6 f=1kHz RL=10kΩ Gain=6dB 5 Output Voltage [Vrms] Output Voltage [Vrms] 5 f=1kHz RL=10kΩ Gain=9dB VDD=5.5V 4 VDD=5V 3 2 VDD=5.5V 4 VDD=5V 3 2 VDD=3V VDD=3V 1 1 0 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 3.0 1.5 2.0 2.5 Figure 8. Figure 9. Output Voltage vs. Input Voltage (BD8876FV, 6dB) Output Voltage vs. Input Voltage (BD8876FV, 9dB) BD8878FV 6 VOUT=2Vrms RL=10kΩ Gain=6dB 11 VDD=5.5V f=1kHz RL=10kΩ 3.0 BD8876FV 12 10 9 4 Gain [dB] Output Voltage [Vrms] 1.0 Input Voltage [Vrms] Input Voltage [Vrms] 5 0.5 VDD=5V 3 VDD=3V VDD=5V VDD=5.5V 8 7 6 2 5 VDD=3V 4 1 3 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 100 1k 10k Frequency [Hz] Input Voltage [Vrms] Figure 10. Figure 11. Output Voltage vs. Input Voltage (BD8878FV) Gain vs. Frequency (BD8876FV, 6dB) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100k 200k 6/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs. BD8878FV 12 11 11 10 10 9 9 Gain [dB] Gain [dB] BD8876FV 12 8 7 6 VOUT=2Vrms RL=10kΩ Gain=9dB 5 VDD=3V VDD=5V VDD=5.5V 8 7 6 VOUT=2Vrms RL=10kΩ 5 4 4 3 3 2 2 100 1k 10k Frequency [Hz] 100k 200k 10k Figure 12. Figure 13. Gain vs. Frequency (BD8878FV) BD8876FV BD8876FV 10 VDD=3V Gain=6dB RL=10kΩ 20kHz LPF 1 0.1 0.01 0.001 0.01 1k Frequency [Hz] THD+N [%] 1 100 100k 200k Gain vs. Frequency (BD8876FV, 9dB) 10 THD+N [%] VDD=3V VDD=5V VDD=5.5V VDD=5V Gain=6dB RL=10kΩ 20kHz LPF 0.1 0.01 0.1 1 Output Voltage [Vrms] 0.001 0.01 10 0.1 1 Output Voltage [Vrms] Figure 14. Figure 15. THD+N vs. Output Voltage (BD8876FV, 3V) THD+N vs. Output Voltage (BD8876FV, 5V) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/20 10 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs. BD8876FV BD8878FV 10 VDD=5.5V Gain=6dB RL=10kΩ 20kHz LPF VDD=3V RL=10kΩ 20kHz LPF 1 THD+N [%] THD +N[%] 1 10 0.1 0.01 0.01 0.001 0.01 0.1 0.1 1 0.001 0.01 10 10 Figure 16. Figure 17. THD+N vs. Output Voltage (BD8876FV, 5.5V) THD+N vs. Output Voltage (BD8878FV, 3V) BD8878FV 10 BD8878FV 10 VDD=5V RL=10kΩ 20kHz LPF VDD=5.5V RL=10kΩ 20kHz LPF 1 1 THD +N[%] THD+N [%] 1 Output Voltage [Vrms] Output Voltage [Vrms] 0.1 0.01 0.001 0.01 0.1 0.1 0.01 0.1 1 Output Voltage [Vrms] 0.001 0.01 10 0.1 1 Output Voltage [Vrms] Figure 18. Figure 19. THD+N vs. Output Voltage (BD8878FV, 5V) THD+N vs. Output Voltage (BD8878FV, 5.5V) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/20 10 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs. BD8876FV BD8878FV 10 10 VDD=5V Gain=6dB Vo=2Vrms RL=10kΩ 20kHz LPF 1 THD+N [%] THD+N [%] 1 0.1 0.01 0.1 0.01 0.001 0.001 0.0001 100 1k Frequency [Hz] 10k 20k 0.0001 100 Figure 21. THD+N vs. Frequency (BD8878FV) VDD=5V Vripple=100mVP-P RL=10kΩ Band Pass Filter -10 -20 PSRR [dB] -30 -40 20k BD8878FV 0 VDD=5V Gain=6dB Vripple=100mVP-P RL=10kΩ Band Pass Filter -20 10k Figure 20. BD8876FV -10 1k Frequency [Hz] THD+N vs. Frequency (BD8876FV) 0 PSRR [dB] VDD=5V Vo=2Vrms RL=10kΩ 20kHz LPF -30 -40 -50 -50 -60 -60 -70 -70 -80 -80 10 100 1k Frequency [Hz] 10k 20k 100k 10 100 1k 20k 100k Frequency [Hz] Figure 22. Figure 23. PSRR vs. Frequency (BD8876FV) PSRR vs. Frequency (BD8878FV) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10k 9/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV (Unless otherwise specified, Ta=25°C, SVDD=PVDD=5V, SGND=PGND=0V, SDB=H, GAIN=L [BD8876FV], C1=C2=1µF, RL=10kΩ, Input coupling capacitor=1µF) * SVDD, PVDD shows as ”VDD” in the following graphs. BD8876FV BD8876FV 0 0 VDD=5V Lch to Rch, Rch to Lch Gain=6dB Vo=200mVP-P RL=10kΩ 20kHz LPF -10 -20 -20 -30 Crosstalk [dB] Crosstalk [dB] -30 VDD=5V Lch to Rch, Rch to Lch Gain=6dB Vo=2Vrms RL=10kΩ 20kHz LPF -10 -40 -50 -60 -40 -50 -60 -70 -80 -70 -90 -80 -100 -90 -110 -100 -120 10 100 1k Frequency [Hz] 100k 20k 10 Figure 25. VDD=5V Lch to Rch, Rch to Lch Vo=2Vrms RL=10kΩ 20kHz LPF -10 -20 -30 -40 -50 -60 -40 -50 -60 -70 -70 -80 -80 -90 -90 -100 100k 20k BD8878FV 0 Crosstalk [dB] -30 10k Crosstalk vs. Frequency (BD8876FV, 2Vrms) VDD=5V Lch to Rch, Rch to Lch Vo=20mVP-P RL=10kΩ 20kHz LPF -20 1k Frequency [Hz] Figure 24. BD8878FV -10 100 Crosstalk vs. Frequency (BD8876FV, 200mVP-P) 0 Crosstalk [dB] 10k -100 10 100 1k 10k 100k 20k Frequency [Hz] 10 100 1k 10k Frequency [Hz] Figure 26. Figure 27. Crosstalk vs. Frequency (BD8878FV, 200mVP-P) Crosstalk vs. Frequency (BD8878FV, 2Vrms) www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 100k 20k 10/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Application Examples SHORT CIRCUIT PROTECTION OUTL OUTR 1 14 RL>550Ω CBPS=1.0µF SHUTDOWN CONTROL GAIN CONTROL SGND SDB GAIN 5.0V PVDD SVDD 3 SVDD 4 SGND SVDD SVSS SGND SGND INR 42.3k/38.2k 13 - SVSS + CCL=1.0µF 5.0V SVDD 2 + Lch Input RR>550Ω 42.3k/38.2k - INL 15k/19.1k 15k/19.1k SVSS 12 SVDD 11 UVLO / SHUTDOWN CONTROL 5 10 Rch Input CCR=1.0µF SVSS PVSS CN C2=1.0µF CHARGE PUMP 6 PGND 9 C1=1.0µF SGND 7 8 CP PVDD CBPP=1.0µF Figure 28. BD8876FV Application circuit example SHORT CIRCUIT PROTECTION OUTL 1 14 RL>550Ω SHUTDOWN CONTROL SGND SDB SVSS + 6.8k SVDD 22.5k SVSS 15k 15k SVDD 15k SVSS Rch Input SVSS SGND 11 UVLO / SHUTDOWN CONTROL 10 PVSS CN C2=1.0µF CHARGE PUMP OPEN NC 6 5.0V PVDD 12 SGND 5 INR CCR=1.0µF SGN D 15k SVDD 13 6.8k SGN D SGND 4 SVDD - CCL=1.0µF 5.0V SVDD 3 CBPS=1.0µF 22.5k 2 - INL RR>550Ω + Lch Input OUTR 9 PGND C1=1.0µF SGND 7 8 CP PVDD CBPP=1.0µF Figure 29. BD8878FV Application circuit example * PVSS and SVSS are connected each other inside IC. But, please connect PVSS and SVSS outside IC, also. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Timing Chart < Sequence of start-up / power-down> PVDD, SVDD SDB PVSS, SVSS INL, INR OUTL OUTR Setup (Charge pump Start-up) Shutdown VDD OFF -> ON Shutdown ON -> OFF Active -> Shutdown Active (Line Amp enable) Signal input Available Figure 30. Sequence of start-up / power-down ① The term from “PVDD, SVDD : ON” to “shutdown ON->OFF” Audio Source Vs Vin Cin Rin =7.5k 7.5k Vs [V] When power supply (PVDD, SVDD) is applied, it is started that charging input coupling capacitors. Therefore, the input terminal voltage ”Vin” is changed as following Figure 31. Time constant “τ” of charging input coupling capacitor is decided by input coupling capacitor Cin and Internal input impedance Rin (See formula (1)). Internal impedance Rin in term of shutdown is 7.5kΩ(typ) for making time constant τ shorten. If “SDB” is changed “L” to “H” (shutdown ON -> OFF) during input DC voltage (Vin) is changing, pop noise may occur. It is recommended that shutdown ON -> OFF (“SDB” : L -> H) after 5τ ~ 6τ. Vout 42.3k Bias VDD 0 time [s] Vin [V] + Bias VSS 0 time [s] Convergence [%] Figure 31. Fluctuation of input terminal voltage when charging input coupling capacitor 100 90 80 70 60 50 40 30 20 10 0 τ = Rin x Cin 0τ 1τ 2τ 3τ 4τ 5τ Wait time [s] 6τ 7τ 8τ (1) (e.g.) in case of Cin =1.0µF, τ = Rin x Cin =7.5kΩ x 1.0µF = 7.5 msec(typ) 6τ = 6 x 7.5msec = 45 msec (typ) Figure 32. Wait time vs. convergence www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV ② The term from shutdown OFF to line amplifier start-up When shutdown is ON -> OFF, charge pump starts up. Line amplifier is stopped during “tSON (start-up time of charge pump, 470µsec typ.)” for preventing irregular output. Please input audio signal after “tSON”. [V] VDD SDB 0 [time] [V] [time] 0 PVSS SVSS 470µsec(typ.) shutdown Line Amplifier active wait(=tSON) Figure 33. Wait time for Line amplifier from “shutdown ON -> OFF” Functional Descriptions / Application Information The composition of conventional line amplifier is shown in Figure 34. Output signal swings in reference to Middle DC bias (e.g. VDD/2). Therefore, Output dynamic range of line amplifier limits until “VDD”. Vout Input VDD VDD Vout [V] + GND VDD/2 0 Output range ≈ VDD time [s] Middle DC Bias (ex. VDD/2) Figure 34. The composition of conventional line amplifier The composition of BD8876FV/BD8878FV is shown to Figure 35. Output signal swings in reference to ground level. Line amplifier can output between from VSS (-VDD) to VDD. Therefore, Output dynamic range of line amplifier expands “2 x VDD”. And, it is possible to drive 2Vrms (5.65VP-P) with single supply voltage 5V. BD8876FV BD8878FV Vout VDD VDD - - Input + C1 : Flying Capacitor + VSS Charge Pump Vout VDD Vout [V] Input VSS Output range ≈ 2 x VDD 0 time [s] Charge Pump C2 : Hold Capacitor VSS Figure 35. The composition of BD8876FV/BD8878FV www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV ￭ CHARGE PUMP The negative power supply circuit is composed of the regulated charge-pump. This circuit outputs the negative voltage (PVSS) from positive power-supply voltage (PVDD). The negative power supply circuit starts when “SDB=H”, and power is downed when “SDB=L”(See Table 1). Table 1. Control of the charge pump circuit SDB Control L Power down H Power on ＜The flying capacitor and the hold capacitor＞ The flying capacitor (Figure 35. C1) and the hold capacitor (Figure 35. C2) have great influences on the characteristic of the charge pump. Please select capacitors that have low ESR characteristic and low voltage coefficient, low temperature coefficient for C1, C2. And, please connect these capacitors as near as possible to IC. ＜Over-current Protection＞ The charge pump has the over-current protection function. If the terminals of charge pump (CP, CN, PVSS, SVSS) are under the abnormal connecting conditions (e.g. shorting to ground), this function shutdown IC and protect it from the damage. ￭Line Amplifier The line amplifier is driven by power-supply voltage (SVDD) and negative voltage (SVSS) based on ground (SGND). Therefore, the amplifier can output 2Vrms for RL=10kohm with the single supply voltage 5V. And BD8876FV can change the gain 6dB and 9dB. The gain of BD8878FV is 6.7dB (fixed). The both of Lch and Rch of the line amplifier are simultaneously controlled by SDB logic (See Table 2). In addition, the over-current protection circuit is built in. The amplifier is shutdown, when the over-current occurs because of the output short-circuit etc., and IC is protected from being destroyed. Table 2. Control of the Line amplifier circuit SDB Lch/Rch amplifier control L Power down H Power on ＜Input coupling capacitor＞ Input DC voltage level of BD8876FV/BD8878FV is 0V (SGND). Therefore, input coupling capacitor is needed. Gain is decreased in low frequency because of composing the high-pass filter by input coupling capacitor Cin and internal input impedance Rin of BD8876FV/BD8878FV. Input impedance Rin of BD8876FV is 15kΩ (Typ, Gain=+9dB), and Rin of BD8878FV is 30kΩ (Typ). Cut-off frequency of the high-pass filter is shown to the following formula (2). 9.0 Rin=15kΩ 6.0 3.0 Cin=10.0μ F Gain [dB] 0.0 -3.0 fc -6.0 Cin=4.7μ F -9.0 -12.0 1 2Rin C in (2) Cin=2.2μ F -15.0 Cin=1.0μ F -18.0 -21.0 1 10 100 Frequency [Hz] Figure 36. Frequency response by the input coupling capacitor (Reference data: Calculated value) The degradation of THD happens because of the input coupling capacitor. Therefore, please consider the applied voltage dependence and the temperature characteristic of the capacitor when selecting parts. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV ￭ UVLO / SHUTDOWN CONTROL BD8876FV/BD8878FV has low voltage protection function (UVLO: Under Voltage Lock Out). UVLO function protects from abnormal operation under lower power supply voltage than the recommended supply voltage range. The detection voltage is 2.8V (Typ). It does not influence the recommended operation voltage (3.0V (Min)). The power control by UVLO works for the whole of IC, and power down the both of the negative power supply charge pump and the line amplifier. If power supply voltage recovers over recommended range (3.0V), all function also recover automatically. Power Dissipation SSOP-B14 1 0.87W Power dissipation Pd (mW) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 25 50 75 100 125 150 Ta (℃) Figure 37. Power Dissipation Curve Measurement Condition: Mounted on ROHM standard board, glass-epoxy Board size: 74.2mm×74.2mm×1.6mm (1-layer) Material: FR4 www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 38. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Ordering Information B D 8 8 7 6 F V - E 2 B D 8 8 7 8 F V - E 2 Package FV: SSOP-B14 Part Number Packaging and forming specification E2: Embossed tape and reel Line-up BD8876FV BD8878FV Amplifier type Inverting amplifier Non-inverting amplifier Gain +6dB / +9dB (Changed by Gain pin) +6.7dB Package SSOP-B14 Marking Diagram SSOP-B14 (TOP VIEW) Part Number Marking SSOP-B14 (TOP VIEW) Part Number Marking D8876 D8878 LOT Number 1PIN MARK 1PIN MARK www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 LOT Number 18/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP-B14 19/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 BD8876FV, BD8878FV Revision History Date Revision 2015/10/30 001 Changes First version www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/20 TSZ02201-0C1C0EZ00280-1-2 2015.10.30 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001