TH71111 Product Information DownloadLink 5018

Automotive ICs
TH71111
868/915MHz Receiver
Silicon MEMS
Single-conversion superhet architecture for low external component count
FSK for digital data and FM reception for analog signal transmission
FSK/FM demodulation with phase-coincidence demodulator
Low current consumption in active mode and very low standby current
Switchable LNA gain for improved dynamic range
RSSI allows signal strength indication and ASK detection
32-pin Low profile Quad Flat Package (LQFP32)
RF&RFID
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Intelligent Drivers
and Actuators
Features
Hall ICs
The TH71111 FSK/FM/ASK single-conversion superheterodyne receiver IC is designed for applications in the
European 868 MHz industrial-scientific-medical (ISM)
band, according to the EN 300 220 telecommunications
standard. It can also be used for any other system with
carrier frequencies ranging from 800 MHz to 930 MHz
(e.g. for applications according to FCC part 15).
Technical Data Overview
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IR Temperature
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Bus ICs
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Input frequency range: 800 MHz to 930 MHz
Power supply range: 2.3 V to 5.5 V @ ASK
Temperature range: -40 °C to +85 °C
Standby current: 50 nA
Operating current: 7.5 mA at low gain mode
9.2 mA at high gain mode
Sensitivity: -112 dBm @ ASK, 180 kHz IF filter BW
-106 dBm @ FSK, 180 kHz IF filter BW
Range of IF: 400 kHz to 22 MHz
Maximum data rate: 260 kbps NRZ @ ASK
180 kbps NRZ @ FSK
Image rejection: > 45 dB (e.g. with SAW front-end filter and at 10.7 MHz IF)
Maximum input level: -10 dBm at ASK
0 dBm at FSK
Spurious emission: < -70 dB
Input frequency acceptance: up to ±100 kHz
RSSI range: 70 dBm
FM/FSK deviation range: ±2.5 kHz to ±80 kHz
Maximum analog modulation frequency: 15 kHz
CMOS Imaging
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IN_LNA
31
15
16
IN_DEM
14
VCC_IF
21
OUT_IFA
13
RSSI
FBC1
12
FBC2
11
IN_IFA
10
VEE_IF
9
OUT_MIX2
8
VCC_MIX
7
IF1N
6
IF1P
5
VEE_MIX
4
IN_MIX1
3
OUT_LNA
2
GAIN_LNA
1
VEE_LNAC
Automotive ICs
Block Diagram
DEMOD
MIX1
IF
LNA
IF
MIX2
OUTP
MIX3
IFA
23
OUTN
24
LO1
OAP
RO
28
22
17
VCC_BIAS
ENRX
27
VCC_PLL
25
VEE_RO
VEE_LNA
VCC_LNA
26 RO
29 LF
18
BIAS
Applications
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General digital and analog data receiving
Tire Pressure Monitoring Systems (TPMS)
Remote Keyless Entry (RKE)
Wireless access control
Low-power telemetry systems
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Home and building automation
Alarm and security systems
Garage door openers
Remote controls
Evaluation Board
C16
C17
R5
FSK output
R4
VCC
VCC
28 ENRX
C3
Bus ICs
OAP 20
OAN 19
VCC 17
C9
C10
VEE
IF1P
IF1N
VCC
VEE 10
IN_MIX1
4
VCC
VCC
C11
IN_IFA 11
30 VEE
OUT_LNA
3
L2
FBC1 12
VEE
RF input
50Ω
6
FBC2 13
TH71111
29 LF
31 IN_LNA
1
C12
VCC 14
27 VCC
R1
L1
RSSI 21
OUT_IFA 15
1
2
3
4
5
6
7
8
32 VCC
SAWFIL
OUT_MIX2
9
CERFIL
CB
VCC
C7
FSK Application Circuit
L3
C6
RL2
ENRX
CERDIS
16
26 RO
RL1
CMOS Imaging
C1
OUT_OA 18
25 VEE
VEE 22
24
XTAL
OUTP 23
C15
GAIN_LNA
Intelligent Drivers
and Actuators
RF&RFID
Silicon MEMS
19
OUT_OA
CP
VCO1
30
OAN
PFD
DIV_32
32
20
OA
VEE_BIAS
Hall ICs
PLL SYNTH
Email Europe and rest of the world:
[email protected]
Email USA :
[email protected]
For additional information go to our website at:
Email Asia:
[email protected]
Feb 2007
IR Temperature
Disclaimer:
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by
description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and
prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use
in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be
correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss
of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services.
© 2006 Melexis NV. All rights reserved.