Automotive ICs TH71112 868/915MHz Receiver Silicon MEMS Double-conversion superhet architecture for low external component count FSK for digital data and FM reception for analog signal transmission FSK/FM demodulation with phase-coincidence demodulator Low current consumption in active mode and very low standby current Switchable LNA gain for improved dynamic range RSSI allows signal strength indication and ASK detection 32-pin Low profile Quad Flat Package (LQFP32) RF&RFID • • • • • • • Intelligent Drivers and Actuators Features Hall ICs The TH71112 FSK/FM/ASK double-conversion superheterodyne receiver IC is designed for applications in the European 868 MHz industrial-scientific-medical (ISM) band, according to the EN 300 220 telecommunications standard. It can also be used for any other system with carrier frequencies ranging from 750 MHz to 990 MHz (e.g. for applications according to FCC part 15). Technical Data Overview • • • IR Temperature • • • • • Bus ICs • • • Input frequency range: 750 MHz to 990 MHz Power supply range: 2.3 V to 5.5 V @ ASK Temperature range: -40 °C to +85 °C Standby current: 50 nA Operating current: 7.5 mA at low gain mode 9.2 mA at high gain mode Sensitivity: -112 dBm @ ASK, 180 kHz IF filter BW -106 dBm @ FSK, 180 kHz IF filter BW Range of first IF1: 10 MHz to 80 MHz Range of second IF2: 400 kHz to 22 MHz Maximum data rate: 260 kbps NRZ @ ASK 180 kbps NRZ @ FSK Image rejection: > 60 dB (e.g. with SAW front-end filter and at 10.7 MHz IF2) Maximum input level: -10 dBm at ASK 0 dBm at FSK Spurious emission: < -70 dB Input frequency acceptance: up to ±100 kHz RSSI range: 70 dBm FM/FSK deviation range: ±2.5 kHz to ±80 kHz Maximum analog modulation frequency: 15 kHz CMOS Imaging • • • • • IN_LNA 31 16 IN_DEM 15 OUT_IFA 14 VCC_IF 21 RSSI 13 FBC2 12 FBC1 11 IN_IFA 10 VEE_IF 9 OUT_MIX2 8 VCC_MIX 7 IF1N 6 IF1P 5 VEE_MIX 4 IN_MIX1 3 OUT_LNA 2 GAIN_LNA 1 VEE_LNAC Automotive ICs Block Diagram DEMOD MIX1 MIX2 LNA IF2 IF1 OUTP MIX3 IFA 23 OUTN 24 LO1 LO2 OAP RO 28 22 17 VCC_BIAS 27 ENRX 25 VCC_PLL 26 RO 29 LF VEE_RO VEE_LNA VCC_LNA 30 18 BIAS Applications • • • • • General digital and analog data receiving Tire Pressure Monitoring Systems (TPMS) Remote Keyless Entry (RKE) Wireless access control Low-power telemetry systems • • • • Home and building automation Alarm and security systems Garage door openers Remote controls Evaluation Board C16 C17 R5 FSK output R4 VCC 25 VEE VCC 28 ENRX C3 R1 Bus ICs VCC 17 OAN 19 OAP 20 RSSI 21 VEE 22 VEE IF1P IF1N VCC 4 VCC 1 2 3 4 5 6 7 8 32 VCC SAWFIL OUT_MIX2 C7 FSK Application Circuit C9 C10 VEE 10 IN_MIX1 3 L2 VCC C11 IN_IFA 11 30 VEE OUT_LNA 6 FBC1 12 GAIN_LNA RF input 50Ω 1 FBC2 13 TH71112 29 LF 31 IN_LNA L1 C12 VCC 14 27 VCC L3 C6 9 CERFIL CB VCC C8 L5 ENRX CERDIS 16 OUT_IFA 15 26 RO L4 CMOS Imaging C1 OUT_OA 18 XTAL OUTP 23 24 C15 VEE Intelligent Drivers and Actuators RF&RFID Silicon MEMS 19 OUT_OA CP VCO1 32 OAN PFD DIV2 DIV16 20 OA VEE_BIAS Hall ICs PLL SYNTH Email Europe and rest of the world: [email protected] Email USA : [email protected] For additional information go to our website at: Email Asia: [email protected] Feb 2007 IR Temperature Disclaimer: Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifesupport or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering of technical or other services. © 2006 Melexis NV. All rights reserved.