Datasheet Small-sized Class-D Speaker Amplifiers Filter-Less Class-D Monaural Speaker Amplifier BD27400GUL General Description Key Specifications BD27400GUL is a low voltage drive class-D monaural speaker amplifier that was developed for cellular telephones, mobile audio products and the others. The LC filter of the speaker output is unnecessary and the external part can compose a speaker amplifier at three. Because the efficiency is high and is low consumption power with the class-D operation, it is the optimal for the application of the battery drive. Also Current consumption of 0μA when standby and fast transitions from standby to active with little pop noise make it is suitable for applications that switch repeatedly between suspended and active. Operating voltage Range: Circuit current(No signal): Circuit current(Stand by): Output Power(RL=8Ω): Output Power(RL=4Ω): Start-up time: Operating Temperature Range: Package(s) 2.5V to 5.5V 2.9mA(Typ) 0.1μA(Typ) 0.85W(Typ) 2.5W(Typ) 3.0msec(Typ) -40°C to +85°C W(Typ) x D(Typ) x H(Max) 1.50mm x 1.50mm x 0.55mm VCSP50L1 Features High output power 2.5W typ.(VDD=5V, RL=4Ω, THD+N=10%, BTL） Very small package 9-Pin WL-CSP Gain selectable by external resistor LC Filter less Protection circuitry (Short protection, Thermal shutdown, Under voltage lockout) Analogue differential input / PWM digital output Pop noise suppression circuitry VCSP50L1 Applications Mobile phone, Smart phone, Digital video camera +VBAT Typical Application Circuit(s) CS VDD B1 STBY C2 Ri IN+ A1 Ri INC1 Bias B2 PVDD OSC OUTA3 PWM GND A2 HBridge OUT+ C3 B3 PGND Figure 1. Application circuit 〇Product structure : Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 14 • 001 〇This product has no designed protection against radioactive rays 1/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Pin Configuration(s) Bottom View C IN- STBY OUT+ B VDD PVDD PGND A IN+ GND OUT- 1 2 3 Figure.2 Pin configuration Pin Description(s) No. Name I/O Function A1 IN+ I Positive input terminal A2 GND P GND terminal (Connect to PGND terminal) A3 OUT- O Negative output terminal B1 VDD P B2 PVDD P B3 PGND P C1 IN- I Negative input terminal C2 STBY I Stand by control terminal C3 OUT+ O Positive output terminal Power supply terminal (Connect to PVDD terminal) Power supply terminal (Connect to VDD terminal) Power GND terminal (Connect to GND terminal) ※Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply. VDD B1 Block Diagram(s) B2 PVDD STBY C2 Bias OSC OUTA3 IN+ A1 PWM INC1 GND A2 HBridge OUT+ C3 B3 PGND Figure.3 Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 2/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Absolute Maximum Ratings(Ta = 25°C) Parameter Power Supply Voltage Power Dissipation Symbol Rating Unit VDDmax 7.0 V Pd 0.69 (Note 1) W Vstby -0.3 to VDD+0.3 V IN+, IN- Terminal Voltage Range Vin -0.3 to VDD+0.3 V Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C Operating Temperature Range Topr -40 to +85 °C STBY Terminal Input Voltage Range (Note 1) Derating in done 5.52 mW/°C for operating above Ta≧25°C (Mount on 1-layer 50.0mm x 58.0mm x 1.6mm board) Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions(Ta= -40°C to +85°C) Parameter Symbol Min Typ Max Unit Power Supply Voltage VDD 2.5 3.6 5.5 V Common Mode Input Voltage Range VIC +0.5 - VDD-0.8 V Electrical Characteristics(Unless otherwise specified Ta=25°C.VDD=3.6V.RL=8Ω.BTL Connection) Parameter Symbol Min Typ Max Unit Conditions Circuit current (No signal) ICC - 2.9 5.4 mA Active mode, No load Circuit current (Standby) ISTBY - 0.1 - µA Standby mode Output power 1 PO1 450 680 - mW 8 Ω, f=1kHz, THD+N=1% *1 Output power 2 PO2 550 850 - mW 8 Ω, f=1kHz, THD+N=10% *1 Output power 3 PO3 Gain THD+N 2.5 300kΩ Ri 0.18 315kΩ Ri - W V V % 4 Ω, f=1kHz, THD+N=10% *1 Voltage gain 285kΩ Ri - Total harmonic distortion Output noise voltage BTL, RL=100kΩ 8 Ω, f=1kHz,0.4W Vno - 40 - µVrms Power supply ripple rejection ratio PSRR - 64 - dB A-weighting 0.1Vp-p, f=217Hz Common mode rejection ratio CMRR - 55 - dB 0.1Vp-p, f=217Hz Input impedance Zin - 150 - kΩ Switching Frequency fOSC 200 250 300 kHz － － Start-up time STBY High level threshold Low level voltage STBY input impedance Ton 1 3 5 msec VSTBYH 1.4 - VDD V Active mode VSTBYL 0 - 0.4 V Stand by mode RSTBY 210 300 390 kΩ *1: Band-width = 400～30kHz, BTL=Bridge Tied Load (Voltage between A3-C3.) ≪Gain adjustment≫ Please use a gain adjustment below 26dB (Input Resistor Ri≥15kΩ) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 3/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves Figure.5 Figure.4 Figure.7 Figure.6 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 4/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.9 Figure.8 Figure.10 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure.11 5/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.12 Figure.13 Figure.14 Figure.15 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 6/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.16 Figure.17 Figure.19 Figure.18 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 7/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.20 Figure.21 Figure.22 Figure.23 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 8/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.25 Figure.24 Figure.27 Figure.26 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 9/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.28 Figure.29 Figure.30 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Figure.31 10/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Typical Performance Curves - continued Figure.32 Figure.33 Figure.34 Figure.35 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 11/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Application Example(s) Connect VDD(B1) and PVDD(B2) on PCB board, and use a single power supply. (1)Differential input +VBAT CS VDD B1 H：Active L：STBY STBY C2 STBY control + Ri IN+ A1 Ri INC1 Bias B2 PVDD OSC OUTA3 - HBridge PWM Differential Input + OUT+ C3 - GND A2 Figure.36 B3 PGND Differential input for mobile phone +VBAT CS VDD B1 H：Active STBY C2 STBY control L：STBY + Ci Ri Bias OSC OUTA3 IN+ A1 Differential Input PWM + Ci Ri B2 PVDD INC1 HBridge OUT+ C3 - GND A2 Figure.37 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 B3 PGND Differential input with coupling input capacitors 12/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL (2)Single-Ended input +VBAT CS VDD B1 H：Active L：STBY Single End Input STBY C2 STBY control Ci Ri Bias OSC OUTA3 IN+ A1 PWM Ci Ri B2 PVDD INC1 GND A2 HBridge OUT+ C3 B3 PGND Figure.38 Single-Ended input ・It is possible to input audio signal from IN+ terminal, or IN- terminal when single-end mode. ・Don't make the input terminal (no input terminal, C1 terminal in above figure) open. Pop noise may be caused when the power supply starts up or the standby is released, if input terminal is opened. ・Connect non signal input side(C1 in above figure)to GND through Ci, and make the value of Ri, Ci of non signal input side same as the value of signal input side (A1 in above figure). Pop noise may be caused if each values of Ci, Ri are different, because the values of Ci, Ri decide the rise of Input terminal DC voltage when start-up. Difference of input terminal DC voltages may make pop noise. ・Make the value of Ri, Ci of non signal input side same as the value of signal input side when making LPF(Low Pass Filter) at previous stage of Ci. ・Put external input resistor Ri as close as possible to this IC. Selection of Components Externally Connected ・Description of External components ① Input coupling capacitor (Ci) and input resistor (Ri). It makes an Input coupling capacitor 0.1uF. Input impedance is 150kΩ. It sets cutoff frequency fc by the following formula by input coupling capacitor Ci and input impedance Ri. fc 1 [Hz] 2π Ri Ci In case of Ri=150kΩ, Ci=0.1uF, it becomes fc = about 10 Hz. ② Power decoupling capacitor (CS) It makes a power decoupling capacitor 10 μF. When making capacitance of the power decoupling capacitor, there is an influence in the Audio characteristic. When making small, careful for the Audio characteristic at the actual application. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 13/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Power Dissipation Power dissipation Pd(mW) 690 (*1) ROHM standard board mounted. Board size 50mm×58mm,1layer Material: FR4 glass-epoxy (copper foil area: not more than 3%) derating in done at 5.52mW/°C above Ta=+25°C. 0 25 50 75 100 125 150 Ambient Temperature [°C] I/O equivalence circuits Pin name IN+ IN- Pin No. A1 C1 VDD 150k IN+ IN- + GND OUT+ OUT- C3 A3 VDD OUT+ OUT- GND STBY C2 VDD STBY 300k GND www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 14/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 50mm×58mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 15/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Operational Notes – continued 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 39. Example of monolithic IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 16/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Ordering Information B D 2 7 4 0 0 G Part Number U L Package GUL:VCSP50L1 (WL-CSP) - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams Vcsp50L1(TOP VIEW) Part Number Marking 2 7 0 0 LOT Number 1PIN MARK Part Number Marking 2700 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 Package VCSP50L1 Orderable Part Number BD27400GUL-E2 17/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Physical Dimension Tape and Reel Information Package Name VCSP50L1(BD27400GUL) < Tape and Reel Information > Tape Embossed carrier tape Quantity 3000pcs Direction of feed E2 The direction is the pin 1 of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 18/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet BD27400GUL Revision History Date Revision 05.Apr.2012 05.Nov.2012 001 002 23.Apr.2014 003 Changes New Release All. Change to a new format p.3. Change unit of a Output Power3 mW -> W Change the value of PSRR 56dB->64dB p.17 Change Part Number Marking p.18 Change to a new format at Physical Dimension Tape and Reel Information www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111 • 15 • 001 19/19 TSZ02201-0C1C0E754430-1-2 23.Apr.2014 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice – GE © 2013 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001