PRODUCTS TYPE Semiconductor PAGE 1/4 Jisso Information for HTSSOP-B - Jisso Information - Package : HTSSOP-B < A tablie of contents > 1. Structure 2. Tape and Reel information 3. Storage conditions 4. Marking lot number 5. Footprint dimensions 6. Soldering conditions 1. Structure 5 6 3 1/4 page 1/4 to 3/4 page 3/4 page 3/4 page 3/4 page 3/4 to 4/4 page 2 4 Compositional element No. 1 Fig. 1 Structure 1 Lead (External lead : Pb free solder plating) 2 Die Pad 3 Die 4 Die Attach 5 Bonding Wire 6 Molding Resin 2. Tape and Reel information 2. 1. Packing specification φD0 P0 F φD0 P0 B1 W B2 B1 P1 φD1 K' K0 D K' A2 A2 Fig. 2 Typical Tape and Reel configuration T P2 E F W P1 K0 A1 C A1 HTSSOP-B30 HTSSOP-B40 P0 φD0 P2 T E F W P0 φD0 P2 T E F B1 W E W1 B1 A K' P1 φD1 Kz' P1 φD1 A2 W2 A2 K0 K0 A1 Fig. 4 Reel dimensions A1 Fig. 3 Tape dimensions REV. Q TSZ22111・05・002 2014.12. 2 SPECIFICATION No.:TSZ02201-HTSSOP-B-1-2 B φD1 HTSSOP-B20,-B28 T P2 E 1234 HTSSOP-B24 Direction of feed 1Pin Reel 1234 2. 2. Tape and Reel specification 2. 2. 1. Tape and reel dimensions ( See the table on page 4/4 ) 1234 E2 (See Fig. 2) 1234 Direction of feed 1234 See the table on page 4/4 1234 Quantity 1234 Embossed carrier tape(with dry pack) 1234 Tape PRODUCTS TYPE Semiconductor PAGE Jisso Information for HTSSOP-B 2/4 2. 3. Leader and Trailer 2. 3. 1. Leader No component pockets are 40 pockets or more. 2. 3. 2. Trailer No component pockets are 10 pockets or more. Tape is free from reel. 2. 4. Laｂel for Reel and Box Out going inspection BA1234EFV-E2 Product No. Quantity 2,000pcs．0124 A5110F Lot number K.YAMADA BA1234EFV-E2 MNo. 124 023 pcs. MNo. 124 024 pcs. Marking lot number Internal product code Pb Free Mark Fig. 5 Label example 2. 5. Packing style Label Label Aluminum-laminated envelope Unit box Reel Air cap Desiccant Label Fig. 6 Packing style 2. 6. Shipping style 5 unit boxes or less per shipping box Package Z X Y 2. 7. Packing materials Item box dimensions (all dimensions in mm) HTSSOP-B20 X 372 Y 368 Z 305 HTSSOP-B24 372 368 305 Cover tape Reel Desiccant PS PET + PE PS Silicagel HTSSOP-B28 372 368 305 HTSSOP-B30 372 368 305 Envelope HTSSOP-B40 372 368 355 Air cap Polyethylene Unit box Cardboard Shipping box Cardboard Aluminume-laminated •Please obey the indication of top side in a shipping box. Fig. 7 Shipping box dimensions and Shipping style 2. 8. Others 2. 8. 1. Peelback strength Cover tape peelback strength is 0.2 to 0.7N. Fig. 8 Test method REV. Q TSZ22111・05・002 Embossed carrier tape Material Peelback Peelback speed 300±10mm/min 165 to 180° SPECIFICATION No.:TSZ02201-HTSSOP-B-1-2 PRODUCTS TYPE Semiconductor PAGE Jisso Information for HTSSOP-B 3/4 2. 8. 2. Missing Ics (1) No consecutive dropouts. (2) A maximun 0.1% of specified number of products in each packing may be missing. 3. Storage conditions 3. 1. Storage environment Recommended storage conditions are as follows : -Temperature : 5 to 30°C -Humidity : 40 to 70% RH 3. 2. Storage period -Specified storage period : 1 year 3.3. Specified storage period until soldering After dry pack is opened , assemble package within 168hours. If the storage period has expired , the products must be baked 125°C for 24hours. Maximum 2times baking for keeping solderbility. Execute baking by 60°C/48hours while put in the embossed tape. 4. Marking lot number HTSSOP-B24,HTSSOP-B28,HTSSOP-B30,HTSSOP-B40 HTSSOP-B20 Production lot number Production lot number Production week code Production year code Production week code Production year code 5. Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) (all dimensions in mm) Package Thermal Via D3 e MIE e MIE ≧l2 b2 HTSSOP-B20 0.65 4.60 1.20 0.35 HTSSOP-B24 0.65 5.74 1.23 0.35 HTSSOP-B28 0.65 4.60 1.20 0.35 HTSSOP-B30 0.65 5.80 1.20 0.35 HTSSOP-B40 0.65 6.00 1.20 0.35 Package b2 l2 E3 6. Soldering conditions Land pitch Land space Land length Land width Radiaton land Radiaton land width length Thermal via HTSSOP-B20 D3 6.50 E3 3.60 Pitch 1.20 Diameter 0.3 HTSSOP-B24 7.80 4.74 1.20 0.3 HTSSOP-B28 9.70 3.60 1.20 0.3 HTSSOP-B30 10.00 4.80 1.20 0.3 HTSSOP-B40 13.60 5.00 1.20 0.3 Package surface temperature 6. 1. Recommended temperature profile for reflow 260°C MAX 255°C Soldering temperature 1 to 4°C/sec Soldering temperature ; 220°C to 230°C Soldering zone ; 60sec MAX (Notice) Maximum 2-times soldering Preheating temperature Preheating zone REV. Q TSZ22111・05・002 Preheating temperature ; 130°C to 190°C Preheating zone ; 120sec MAX Time 10sec MAX Soldering zone SPECIFICATION No.:TSZ02201-HTSSOP-B-1-2 PRODUCTS TYPE Semiconductor PAGE 4/4 Jisso Information for HSSOP-B 6. 2. Recommended condition for wave soldering Conditions Process Temperature Time Preheating 120°C to 150°C 60sec MAX Soldering 260°C ± 3°C 12sec MAX (Notice) Soldering time is provided for total soldering time in case of dual wave soldering. 6. 2. 1. Notes for wave soldering (1)The heatsink may not be connected using wave soldering methods. (2) Do not use other soldering methods with wave soldering. (3) Recommend to clean the board to eliminate flux, solder waste, and other impurities for reliability, after soldering. (4) Optimize soldering condition to prevent solder bridging. 6. 3. Recommended condition for solder iron Recommended condition for solder iron -Solder iron temperature : 380°C or less -Mounting time : 4sec or less (Notice) The heatsink may not be connected using solder iron. < Tape dimensions > Package Tape dimensions (all dimensions in mm) Quantity (pcs) A1 A2 B1 B2 D0 D1 E F K' K0 P1 P2 T W HTSSOP-B20 2500 6.7 (4.0) 6.9 (3.2) 1.5 1.5 1.75 5.5 1.25 1.65 8.0 2.0 0.3 12.0 4.0 HTSSOP-B24 2000 8.2 (5.5) 8.4 － 1.5 1.5 1.75 7.5 1.2 1.5 12.0 2.0 0.3 16.0 4.0 HTSSOP-B28 2500 6.8 (4.0) 10.3 (6.0) 1.5 1.5 1.75 7.5 1.15 1.65 8.0 2.0 0.3 16.0 4.0 HTSSOP-B30 2000 8.3 5.35 10.6 1.5 1.5 1.75 7.5 1.0 1.65 12.0 2.0 0.3 16.0 4.0 HTSSOP-B40 2000 8.5 (3.0) 14.2 － (6.0) 1.5 2.0 1.75 11.5 0.85 1.50 12.0 2.0 0.3 24.0 4.0 +0.1 -0 +0.1 -0 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.1 ±0.05 ±0.3 ±0.1 ±0.1 ±0.05 ±0.1 Tolerance - < Reel dimensions > Package < Dehydrated weight > Reel dimensions (all dimensions in mm) B 80 C D 13.0 21.0 2.0 13.5 17.5 0.08 HTSSOP-B24 330 80 13.0 21.0 2.0 17.5 21.5 0.12 HTSSOP-B28 330 80 13.0 21.0 2.0 17.5 21.5 0.12 HTSSOP-B30 330 80 13.0 21.0 2.0 17.5 21.5 0.15 HTSSOP-B40 330 80 13.0 21.0 2.0 25.5 29.5 0.20 Tolerance ±2.0 ±1.0 W1 W2 ±0.2 ±0.8 ±0.5 ±1.0 ±1.0 REV. Q TSZ22111・05・002 E Dehydrated weight dimensions in g A HTSSOP-B20 330 SPECIFICATION No.:TSZ02201-HTSSOP-B-1-2 P0 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001