PRODUCTS TYPE Semiconductor PAGE Jisso Information for VQFN xxx V series 1/5 ― Jisso Infomation ― Package : VQFN××× V series < A table of contents > 1.Structure 2.Tape and Reel informations 3.Storage conditions 4.Marking lot number 5.Footprint dimensions 6.Recommended soldering 1 / 5 page 1 / 5 ~ 3 / 5 page 3 / 5 page 3 / 5 page 3 / 5 page 4 / 5 page 1. Structure 6 5 3 Compositional element No. 1 4 2 Fig. 1 Structure 1 Lead (External lead : Pb free solder plating) 2 Die Pad 3 Die 4 Die Attach 5 Bonding Wire 6 Molding Resin 2. Tape and Reel information 2. 1. Packing specification 2. 2. Tape and Reel specification 2. 2. 1. Tape and reel dimensions ( See the table on page 5/5 ) VQFN020V4040 , VQFN024V4040 VQFN028V5050 , VQFN032V5050 Reel 1Pin 1234 E2(See Fig. 2) 1234 Direction of feed 1234 See the table on page 5/5 1234 Quantity 1234 Embossed carrier tape 1234 Tape Direction of feed Fig. 2 Typical Tape and Reel configuration VQFN20PV3535 D φD0 T P2 E F T E W F B1 W B1 E φD1 P1 φD1 P1 K' W1 A1 A1 Fig. 3 Tape dimensions REV. V TSZ22111・05・002 K' 2015. 5.18 A Fig. 4 Reel dimensions SPECIFICATION No.TSZ02201-VQFN×××V-1-2 W2 B P0 P2 C φD0 P0 PRODUCTS TYPE Semiconductor PAGE Jisso Information for VQFN xxx V series 2/5 2. 3. Leader and Trailer 2. 3. 1. Leader No component pockets are 25 pockets or more. 2. 3. 2. Trailer No component pockets are 10 pockets or more. Tape is free from reel. Out going inspection stamp 2. 4. Laｂel for Reel and Box Product No. BA1234MUV-E2 Quantity 3,000pcs．0124 A5110F Lot number BA1234MUV-E2 K.YAMADA MNo. 124 023 pcs. MNo. 124 024 pcs. Internal product code Marking lot number Pb Free Mark Fig. 5 Label example 2. 5. Packing style Unit box Label Reel tape Label Fig. 6 Packing style 2. 6. Shipping style 5 unit boxes or less per shipping box 2. 7. Packing materials Item Material Embossed carrier tape PS Cover tape 287 Reel PET + PE PS Unit box Cardboard Shipping box Cardboard 353 347 ( all dimensions in mm) Fig. 7 Shipping box dimensions and Shipping style 2. 8. Others 2. 8. 1. Peelback strength Cover tape peelback strength is 0.2 to 0.7N. Peelback Peelback speed 300±10mm/min 165 to 180° Fig. 8 Test method REV. V TSZ22111・05・002 SPECIFICATION No.TSZ02201-VQFN×××V-1-2 PRODUCTS TYPE Semiconductor PAGE Jisso Information for VQFN xxx V series 3/5 2. 8. 2. Missing Ics (1) No consecutive dropouts. (2) A maximun 0.1% of specified number of products in each packing may be missing. 3. Storage conditions 3. 1. Storage environment Recommended storage conditions are as follows : -Temperature : 5 to 30°C -Humidity : 40 to 70% RH 3. 2. Storage period -Specified storage period : 1 year 4. Marking lot number VQFN020V4040,VQFN024V4040,VQFN028V5050,VQFN032V5050,VQFN20PV3535 VQFN20PV3535 3 row marking of VQFN020V4040,VQFN024V4040 Production lot number Production month code Production lot number Production month code 2 row marking of VQFN020V4040,VQFN024V040, VQFN028V5050,VQFN032V5050 3 row marking of VQFN028V5050,VQFN032V5050 Production lot number Prodction week code Production year code Production lot number Prodction week code Production year code 5. Footprint dimensions (Optimize footprint dimensions to the board design and soldering condition) (all dimensions in mm) Package ME1 l2 E3 MD1 D3 e b2 REV. V TSZ22111・05・002 Land length Land width ≧l2 b2 VQFN20PV3535 0.50 2.50 2.50 0.80 0.27 VQFN020V4040 0.50 3.00 3.00 0.80 0.27 VQFN024V4040 0.50 3.00 3.00 0.80 0.27 VQFN028V5050 0.50 4.00 4.00 0.80 0.27 VQFN032V5050 0.50 4.00 4.00 0.80 0.27 Package Thermal Via Land pitch e Land space MIE MID Radiaton land Radiaton land length width D3 E3 Thermal via Pitch Diameter VQFN20PV3535 1.50 1.50 - φ0.30 VQFN020V4040 2.00 2.00 1.20 φ0.30 VQFN024V4040 2.00 2.00 1.20 φ0.30 VQFN028V5050 3.00 3.00 1.20 φ0.30 VQFN032V5050 3.00 3.00 1.20 φ0.30 *The lead toe and lead side fillet may not be achieved because of non-lead packeges. SPECIFICATION No.TSZ02201-VQFN×××V-1-2 PRODUCTS TYPE Semiconductor PAGE Jisso Information for VQFN xxx V series 4/5 6. Soldering conditions Package surface temperature 6. 1. Recommended temperature profile for reflow Preheating temperature ; 130°C to 190°C Preheating zone ; 120sec MAX 260°C MAX 255°C Soldering temperature ; 220°C to 230°C Soldering zone ; 60sec MAX Soldering temperature 1 to 4°C/sec (Notice) Maximum 2-timessoldering Preheating temperature Time 10sec MAX Preheating zone Soldering zone 6. 2. The wave soldering method is not supported. 6. 3. Notice information of board mounting Mounting on flexible film Mounting on flexible film, film bend may occur lack of lead from package, usage of support board and under fill is recommended. Not recommended recommended under fill flexible film support board Mounting on long and narrow board Mounting on long and narrow board, bending stress may occur a luck of lead from package, bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended. recommended Not recommended outer lead direction mounting board board bending direction 6. 4. Rework by solering iron is not allowed or it may cause mold crack and terminal open. REV. V TSZ22111・05・002 SPECIFICATION No.TSZ02201-VQFN×××V-1-2 PRODUCTS TYPE Semiconductor PAGE Jisso Information for VQFN xxx V series 5/5 < Tape dimensions > Tape dimensions (all dimensions in mm) Quantity Package VQFN20PV3535 (pcs) A1 B1 D0 D1 E F K' P0 P1 P2 T W 2500 3.7 3.7 φ1.5 φ1.1 1.75 5.5 1.35 4.0 4.0 2.0 0.3 12.0 Tolerance +0.1 -0 ±0.1 ±0.1 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 ±0.05 ±0.05 ±0.2 Tape dimensions (all dimensions in mm) Quantity Package (pcs) A1 B1 D0 D1 E F K' P0 P1 P2 T W VQFN020V4040 2500 4.2 4.2 φ1.5 φ1.5 1.75 5.5 1.80 4.0 8.0 2.0 0.3 12.0 VQFN024V4040 2500 4.2 4.2 φ1.5 φ1.5 1.75 5.5 1.80 4.0 8.0 2.0 0.3 12.0 VQFN028V5050 2500 5.2 5.2 φ1.5 φ1.5 1.75 5.5 1.80 4.0 8.0 2.0 0.3 12.0 VQFN032V5050 2500 5.2 5.2 φ1.5 φ1.5 1.75 5.5 1.80 4.0 8.0 2.0 0.3 12.0 Tolerance +0.1 -0 ±0.05 ±0.05 ±0.1 ±0.1 ±0.05 ±0.1 ±0.1 ±0.1 ±0.05 ±0.05 ±0.2 < Reel dimensions > < Dehydrated weight > Reel dimensions (all dimensions in mm) Package A B C D Dehydrated weight (g) E W1 W2 2.0 13.5 17.5 0.031 VQFN20PV3535 φ330 φ80 φ13.0 φ21.0 VQFN020V4040 φ330 φ80 φ13.0 φ21.0 2.0 13.5 17.5 0.040 VQFN024V4040 φ330 φ80 φ13.0 φ21.0 2.0 13.5 17.5 0.040 VQFN028V5050 φ330 φ80 φ13.0 φ21.0 2.0 13.5 17.5 0.066 VQFN032V5050 φ330 φ80 φ13.0 φ21.0 2.0 13.5 17.5 0.066 Tolerance ±2.0 ±1.0 ±0.2 ±0.8 ±0.5 ±1.0 ±1.0 REV. V TSZ22111・05・002 SPECIFICATION No.TSZ02201-VQFN×××V-1-2 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001