EClamp2386P Datasheet

EClamp2386P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
Description
Features
The EClampTM2386P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
‹ Filter performance: 30dB minimum attenuation
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The device consists of six identical circuits comprised
of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series
resistor value of 200Ω and a capacitance value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 610004-2, level 4.
800MHz to 2.7GHz
TVS working voltage: 5V
Resistor: 200Ω +/− 15%
Total Capacitance: 12pF (VR = 2.5V)
Protection and filtering for six lines
Solid-state technology
Mechanical Characteristics
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The EClamp2386P is in a 12-pin, RoHS/WEEE compliant, SLP3016P12 package. It measures 3.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
SLP3016P12 12-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 3.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
3.00
1 2
200 Ω
IN
1.60
OUT
12pF
12pF
0.50 BSC
GND
0.58
12 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
Device Schematic (6X)
Revision 2/27/2006
1
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
R ating
Symbol
Value
Units
VESD
+/- 17
+/- 12
kV
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T = 25oC)
P a r a met er
Symb ol
C on d i t i on s
Mi n i mu m
Ty p i c a l
M a xi m u m
Un i ts
5
V
10
V
0.5
µA
T VS Reverse Stand-Of f Voltage
VRWM
T VS Reverse Breakdown Voltage
VBR
It = 1mA
T VS Reverse Leakage Current
IR
VRWM = 3.0V
Total Series Resistance
R
Each Line
170
200
230
Ohms
C 1, C 2
Each Line
VR = 2.5V, f = 1MHz
10
12
15
pF
C in
Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
20
24
30
pF
Capacitance
Total Capacitance
 2006 Semtech Corp.
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21
LOG
Analog Crosstalk (Each Line)
CH1 S21
6 dB / REF 0 dB
LOG
20 dB /REF 0 dB
1: -12.260 dB
112 MHz
2: -35.300 dB
800 MHz
0 dB
3: -34.405 dB
1.8 GHz
-6 dB
-12 dB
4: -30.362 dB
2.7 GHz
1
-18 dB
-24 dB
4
-30 dB
-36 dB
2
3
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
3
1
GHz GHz
START . 030 MHz
STOP 3000. 000000 MHz
STOP 3 000. 000000 MHz
START . 030 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Note: Data is taken with a 10x attenuator
Note: Data is taken with a 10x attenuator
Capacitance vs. Reverse Voltage
(Normalized to 2.5 volts)
2
CJ(VR) / CJ(VR=0)
1.5
1
0.5
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Device Connection
The EClamp2386P is comprised of six identical circuits
each consisting of a low pass filter for EMI/RFI suppression and dual TVS diodes for ESD protection. The
device is in a 12-pin SLP package. Electrical connection is made to the 12 pins located at the bottom of
the device. A center tab serves as the ground connection. The device has a flow through design for easy
layout. Pin connections are noted in Figure 1. All path
lengths should be kept as short as possible to minimize
the effects of parasitic inductance in the board traces.
Recommendations for the ground connection are given
below.
Figure 1 - Pin Identification and Configuration
(Top Side View)
In 1
In 2
In 3
In 4
In 5
In 6
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
Equation 1: The Impedance of an Inductor at
Frequency XLF
XLF(L, f ) = 2 * π * f * L
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
12
GND
6
7
Pin
Identification
1-6
Inp ut Lines
7 - 12
Outp ut Lines
Center Tab
Ground
Figure 2 - Inductance of Rectangular Wire Loops
Where:
L= Inductance (H)
f = Frequency (Hz)
Ground
Via 1
Ground
Via 2
d
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers separated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
 2006 Semtech Corp.
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Signal Layer
x
Ground Layer
Layer
y
Equation 2: Inductance of Rectangular Wire Loop
[
LRECT(d, x , y) = 10.16 *10 −9 * x * ln
[ ] + y * ln[ ]]
2*y
d
2*x
d
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches (0.20
mm) while the two external vias have a diameter of
0.010 inches (0.250mm). The internal vias are spaced
approximately evenly from the center of the pad. The
designer may choose to use more vias with a smaller
diameter (such as 0.005 inches or 0.125mm) since
changing the diameter of the via will result in little
change in inductance (i.e. the log function in Equation 2
in highly insensitive to parameter d) . Figure 4 shows a
typical insertion loss (S21) plot for the device using
Semtech’s filter evaluation board with 50 Ohm traces
and the recommended via configuration.
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
CH1 S21
LOG
6 dB / REF 0 dB
1: -12.260 dB
112 MHz
2: -35.300 dB
800 MHz
0 dB
3: -34.405 dB
1.8 GHz
-6 dB
-12 dB
4: -30.362 dB
2.7 GHz
1
-18 dB
-24 dB
4
-30 dB
-36 dB
2
3
-42 dB
Figure 3 - Recommended Layout Using Ground Vias
-48 dB
1
MHz
START . 030 MHz
 2006 Semtech Corp.
5
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
0.7nH
0.7nH
Line Out
200
EClamp2386P Spice Model
Table 1 - EClamp2386P Spice Parameters
 2006 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
5.15E-15
5.15E-15
BV
Volt
7.53
7.53
VJ
Volt
0.75
0.75
RS
Ohm
0.426
0.426
IB V
A mp
1E-3
1E-3
CJO
Farad
23E-12
23E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.256
0.256
N
--
1.1
1.1
EG
eV
1.11
1.11
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SLP3016P12
A
B
D
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A1
A2
C
D1
1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.020 .023 .026
.000 .001 .002
(.006)
.007 .010 .012
.114 .118 .122
.083 .087 .091
.059 .063 .067
.010 .016 .020
.020 BSC
.011 .013 .015
12
.003
.004
0.50 0.58 0.65
0.00 .003 0.05
(0.15)
0.20 0.25 0.30
2.90 3.00 3.10
2.10 2.20 2.30
1.50 1.60 1.70
0.25 0.40 0.50
0.50 BSC
0.28 0.33 0.38
12
0.08
0.10
2
LxN
E/2
E1
N
bxN
e
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP3016P12
P
X
Z
F
G
Y
(C)
DIM
B
C
F
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
.091
2.30
.060
1.52
.018
0.45
.035
0.89
.020
0.50
.012
0.30
.025
0.63
.085
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
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EClamp2386P
PRELIMINARY
PROTECTION PRODUCTS
Marking
Ordering Information
2386P
PIN 1
INDICATOR
(LASER MARK)
Part Number
Qty per
Reel
R eel Size
EClamp 2386P.TCT
3000
7 Inch
EMIClamp and EClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.78 +/-0.05 mm
B0
K0
3.18 +/-0.05 mm
0.76 +/-0.05 mm
Tape
Width
B, (Max)
D
D1
8 mm
4.2 mm
(.165)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
0.8 mm
±0.05
(.031)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
3.5±0.05
mm
(.138±.002)
2.4 mm
(.094)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
8.0 mm
+ 0.3 mm
- 0.1 mm
(.312±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2006 Semtech Corp.
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