SEMTECH ECLAMP2378P

EClamp2378P
ESD/EMI Protection
for Color LCD Interfaces
PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
Description
Features
The EClampTM2378P is a low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.
They have been optimized for protection of color
LCD panels in cellular phones and other portable
electronics.
‹ Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
‹ ESD protection to IEC 61000-4-2 (ESD) Level 4,
of TVS diodes for ESD protection, and a resistor capacitor network for EMI/RFI filtering. A series
resistor value of 100Ω and a capacitance value of
10pF are used to achieve 30dB minimum attenuation
from 1.8GHz to 2.5GHz. The TVS diodes provide
effective suppression of ESD voltages in excess of
±15kV (air discharge) and ±8kV (contact discharge) per
IEC 61000-4-2, level 4.
Mechanical Characteristics
±15kV (air), ±8kV (contact)
‹ Filter performance: 30dB minimum attenuation
‹
‹
‹
‹
The device consists of eight identical circuits comprised ‹
‹
‹
‹
‹
‹
‹
‹
The EClamp2378P is in a 16-pin, RoHS/WEEE compliant, SLP4016P16 package. It measures 4.0 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small package makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
1.8GHz to 2.5GHz
TVS working voltage: 5V
Resistor: 100Ω +/− 15%
Typical Capacitance: 20pF (VR = 0V)
Protection and filtering for eight lines
Solid-state technology
SLP4016P16 16-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 4.0 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
Applications
‹ Color LCD Protection
‹ Cell Phone CCD Camera Lines
‹ Clamshell Cell Phones
Package Configuration
Circuit Diagram (Each Line)
4.00
1 2
100 Ω
IN
OUT
10pF
1.60
10pF
0.50 BSC
GND
0.58
16 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
Device Schematic (8X)
Revision 12/6/2005
1
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Maximum Ratings
R ating
Symbol
Value
Units
VESD
+/- 17
+/- 12
kV
Junction Temp erature
TJ
125
o
Op erating Temp erature
Top
-40 to +85
o
Storage Temp erature
TSTG
-55 to +150
o
ESD p er IEC 61000-4-2 (Air)
ESD p er IEC 61000-4-2 (Contact)
C
C
C
Electrical Characteristics (T = 25oC)
P a r a met er
Symb ol
C on d i t i on s
Mi n i mu m
Ty p i c a l
M a xi m u m
Un i ts
5
V
10
V
0.5
µA
T VS Reverse Stand-Of f Voltage
VRWM
T VS Reverse Breakdown Voltage
VBR
It = 1mA
T VS Reverse Leakage Current
IR
VRWM = 3.0V
Total Series Resistance
R
Each Line
85
100
115
Ohms
Total Capacitance
C in
Input to Gnd,
Each Line
VR = 0V, f = 1MHz
16
20
24
pF
Total Capacitance
C in
Input to Gnd,
Each Line
VR = 2.5V, f = 1MHz
9
11
13
pF
 2005 Semtech Corp.
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21
LOG
Analog Crosstalk (Each Line)
6 dB / REF 0 dB
CH1 S21
1: -9.1473 dB
297.671 MHz
LOG
20 dB /REF 0 dB
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
1
-12 dB
4: -34.705 dB
2.5 GHz
-18 dB
2
-24 dB
-30 dB
3
4
-36 dB
-42 dB
-48 dB
1
MHz
100
MHz
10
MHz
1
3
GHz GHz
START. 030 MHz
STOP 3000. 000000 MHz
STOP 3000. 000000 MHz
START. 030 MHz
ESD Clamping (+8kV Contact)
ESD Clamping (-8kV Contact)
Capacitance vs. Reverse Voltage
(Normalized to 0 volts)
1.1
1
0.9
CJ(VR) / CJ(VR=0)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
f = 1 MHz
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Reverse Voltage - VR (V)
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Device Connection
Figure 1 - Pin Identification and Configuration
(Top Side View)
The EClamp2378P is comprised of eight identical
circuits each consisting of a low pass filter for EMI/RFI
suppression and dual TVS diodes for ESD protection.
The device is in a 16-pin SLP package. Electrical
connection is made to the 16 pins located at the
bottom of the device. A center tab serves as the
ground connection. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces. Recommendations for the ground
connection are given below.
In 1
In 2
In 3
In 4
In 5
In 6
In 7
In 8
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering performance of the device. As
frequency increases, the effect of the inductance
becomes more dominant. This effect is given by
Equation 1.
1
16
Gnd
8
9
Out 1
Out 2
Out 3
Out 4
Out 5
Out 6
Out 7
Out 8
Pin
Identification
1-8
Inp ut Lines
9 - 16
Outp ut Lines
Center Tab
Ground
Equation 1: The Impedance of an Inductor at
Frequency XLF
Figure 2 - Inductance of Rectangular Wire Loops
XLF( L, f ) = 2 * π * f * L
Ground
Via 1
Where:
L= Inductance (H)
f = Frequency (Hz)
d
Signal Layer
x
Via connections to the ground plane form rectangular
wire loops or ground loop inductance as shown in
Figure 2. Ground loop inductance can be reduced by
using multiple vias to make the connection to the
ground plane. Bringing the ground plane closer to the
signal layer (preferably the next layer) also reduces
ground loop inductance. Multiple vias in the device
ground pad will result in a lower inductive ground loop
over two exterior vias. Vias with a diameter d are
separated by a distance y run between layers separated by a distance x. The inductance of the loop path
is given by Equation 2. Thus, decreasing distance x
and y will reduce the loop inductance and result in
better high frequency filter characteristics.
 2005 Semtech Corp.
Ground
Via 2
y
Ground Layer
Layer
Equation 2: Inductance of Rectangular Wire Loop
[
LRECT(d, x , y) = 10.16 *10 −9 * x * ln
[ ] + y * ln[ ]]
2*y
d
2*x
d
Where:
d = Diameter of the wire (in)
x = Length of wire loop (in)
y = Breath of wire loop (in)
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Figure 3 shows the recommended device layout. The
ground pad vias have a diameter of 0.008 inches
(0.20 mm) while the two external vias have a diameter
of 0.010 inches (0.250mm). The internal vias are
spaced approximately evenly from the center of the
pad. The designer may choose to use more vias with a
smaller diameter (such as 0.005 inches or 0.125mm)
since changing the diameter of the via will result in
little change in inductance (i.e. the log function in
Equation 2 in highly insensitive to parameter d) .
Figure 4 shows a typical insertion loss (S21) plot for
the device using Semtech’s filter evaluation board with
50 Ohm traces and the recommended via configuration. Figure 5 shows a typical insertion loss (S21) plot
using a similar board without the internal ground pad
vias. The result is a more inductive ground loop. Note
the “hump” at a frequency of 2.5GHz. This is the
resonant frequency of the higher ground loop inductance.
Figure 4 - Filter Characteristics Using Recommended
Layout with Internal Vias
Figure 3 - Recommended Layout Using Ground Vias
Figure 5 - Filter Characteristics Using Layout without
Internal Ground Vias
CH1 S21
LOG
6 dB / REF 0 dB
1: -9.1473 dB
297.671 MHz
2: -19.559 dB
900 MHz
0 dB
3: -30.645 dB
1.8 GHz
-6 dB
1
-12 dB
4: -34.705 dB
2.5 GHz
-18 dB
2
-24 dB
-30 dB
3
4
-36 dB
-42 dB
-48 dB
1
MHz
10
MHz
100
MHz
STOP 3000. 000000 MHz
START . 030 MHz
CH1 S21
LOG
3
1
GHz GHz
6 dB / REF 0 dB
1: -8.9400 dB
288.002 MHz
2: -20.032 dB
900 MHz
3: -23.761 dB
1.8 GHz
0 dB
4: -16.085 dB
2.5 GHz
-6 dB
1
-12 dB
4
-18 dB
2
-24 dB
3
-30 dB
-36 dB
1
MHz
START . 030 MHz
 2005 Semtech Corp.
5
10
MHz
100
MHz
3
1
GHz GHz
STOP 3000. 000000 MHz
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information - Spice Model
Line In
1.4nH
1.4nH
Line Out
Figure 1 - EClamp2378P Spice Model
Table 1 - EClamp2378P Spice Parameters
 2005 Semtech Corp.
Parameter
Unit
D1 (T VS)
D2 (T VS)
IS
Amp
2E-15
2E-15
BV
Volt
7.42
7.42
VJ
Volt
0.775
0.775
RS
Ohm
1.00
1.00
IB V
Amp
1E-3
1E-3
CJO
Farad
9.8E-12
9.8E-12
TT
sec
2.541E-9
2.541E-9
M
--
0.246
0.246
N
--
1.1
1.1
EG
eV
1.11
1.11
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Outline Drawing - SLP4016P16
A
B
D
DIM
E
PIN 1
INDICATOR
(LASER MARK)
A
SEATING
PLANE
aaa C
A2
C
A1
D1
A
A1
A2
b
D
D1
E
E1
e
L
N
aaa
bbb
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.020 .023 .026 0.50 0.58 0.65
.000 .001 .002 0.00 .003 0.05
(0.13)
(.005)
.007 .010 .012 0.20 0.25 0.30
.153 .157 .161 3.90 4.00 4.10
.122 .126 .130 3.10 3.20 3.30
.059 .063 .067 1.50 1.60 1.70
.010 .016 .020 0.25 0.40 0.50
0.50 BSC
.020 BSC
.011 .013 .015 0.28 0.33 0.38
16
16
.003
0.08
.004
0.10
1 2
LxN
E/2
E1
N
bxN
e
bbb
C A B
D/2
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
Land Pattern - SLP4016P16
P
X
Z
F
G
Y
(C)
DIM
B
C
F
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
.130
3.30
.060
1.52
.018
0.45
.035
0.89
.020
0.50
.012
0.30
.025
0.63
.085
2.15
B
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
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EClamp2378P
PRELIMINARY
PROTECTION PRODUCTS
Marking
Ordering Information
2378P
PIN 1
INDICATOR
(LASER MARK)
Part Number
Qty per
Reel
R eel Size
EClamp 2378P.TCT
3000
7 Inch
EMIClamp and EClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0
1.78 +/-0.10 mm
B0
K0
4.30 +/-0.10 mm
0.74 +/-0.10 mm
Tape
Width
B, (Max)
D
D1
12 mm
8.2 mm
(.476)
1.5 + 0.1 mm
- 0.0 mm
(0.59 +.005
- .000)
1.0 mm
±0.05
(.039)
E
1.750±.10
mm
(.069±.004)
F
K
(MAX)
P
P0
P2
T(MAX)
W
5.5±0.05
mm
(.217±.002)
4.5 mm
(.177)
4.0±0.1
mm
(.157±.004)
4.0±0.1
mm
(.157±.004)
2.0±0.05mm
(.079±.002)
0.4 mm
(.016)
12.0 mm
+ 0.3 mm
- 0.1 mm
(.472±.012)
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
 2005 Semtech Corp.
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