Si1153 Proximity/Ambient Light Sensor IC with I2C Interface

Si1153 Data Sheet
Proximity/Ambient Light Sensor IC with I2C Interface
KEY FEATURES
The Si1153-AA00/AA09/AA9x is an ambient light sensor, proximity, and gesture detector with I2C digital interface and programmable-event interrupt output.
This touchless sensor IC includes dual 23-bit analog-to-digital converters, an integrated
high-sensitivity array of visible and infrared photodiodes, a digital signal processor, and
three integrated LED drivers with programmable drive levels. The Si1153 offers excellent performance under a wide dynamic range and a variety of light sources, including
direct sunlight. The Si1153 can also work under dark glass covers. The photodiode response and associated digital conversion circuitry provide excellent immunity to artificial
light flicker noise and natural light flutter noise. With two or more LEDs, the Si1153 is
capable of supporting multiple-axis proximity motion detection. The Si1153 is provided in
a 10-lead 2x2 mm DFN package or in a 10-lead 2.9x4.9 mm LGA module with integrated LED, and is capable of operation from 1.62 to 3.6 V over the –40 to +85 °C temperature range.
VDD
940 nm Bandpass
Filter.
MUX
.
.
ADC1
LED1
ADC2
Signal
Processor
and
Control
(Filter Only in
AA09 & AA9X
versions)
LED
Drivers
• On die 940 bandpass filter that rejects
unwanted visible light and IR from
daylight and other sources (Si1153AA09/AA9X).
LED2 *
LED3 **
• Industry’s lowest power consumption
• 1.62 to 3.6 V supply voltage.
• 9 μA average current (LED pulsed 25.6
μs every 800 ms at 180 mA plus 3 μA
Si1153 supply).
• <500 nA standby current.
• 25.6 μs LED “on” time keeps total power
consumption duty cycle low without
compromising performance or noise
community.
• Built-in voltage supply monitor and
power-on reset controller.
SCL
AD
• Operates in direct sunlight with optional
on-die 940 nm passband filter.
• Internal and external wake support.
INT
SDA
• Up to three independent LED drivers.
• 30 current settings from 5.6 mA to 360
mA for each LED driver.
• Up to 128 klx dynamic range possible
across two ADC range settings.
ALS Photodiodes
LIGHT
• From under 1 cm, to 200 cm with
additional lensing (e.g., 5 mm
hemispherical lens as in our EVB).
• Ambient light sensor
• <100 mlx resolution possible, allowing
operation under dark glass.
Internal Osc.
Regulator
• Proximity detector
• From under 1 cm, to 50 cm without
additional lensing.
I2C
Engine
I2C addr sel
APPLICATIONS
• Wearables
* Pull up to VDD with 47 kOhm resistor to select primary I2C address (0x53),
or down to GND for alt I2C address 0x52.
** Pull up to VDD with 47 kOhm resistor
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• Handsets
• Display backlighting control
• Consumer electronics
Rev. 0.9
Si1153 Data Sheet
Feature List
1. Feature List
• Proximity detector
• From under 1 cm to 50 cm without additional lensing.
• From under 1 cm to 200 cm with additional lensing (e.g., 5
mm hemispherical lens).
• Up to three independent LED drivers.
• 30 current settings from 5.6 mA to 360 mA for each LED
driver.
• Operates in direct sunlight with optional on-die 940 nm
passband filter.
• On die 940 bandpass filter that rejects unwanted visible light
and IR from daylight and other sources. (Si1153-AA09/
AA9x).
• Ambient light sensor
• <100 mlx resolution possible, allowing operation under dark
glass.
• Up to 128 klx dynamic range possible across two ADC
range settings.
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• Industry’s lowest power consumption
• 1.62 to 3.6 V supply voltage.
• 9 μA average current (LED pulsed 25.6 μs every 800 ms at
180 mA plus 3 μA Si1153 supply).
• <500 nA standby current.
• 25.6 μs LED “on” time keeps total power consumption duty
cycle low without compromising performance or noise community.
• Internal and external wake support.
• Built-in voltage supply monitor and power-on reset controller.
• Trim-able internal oscillator with typical 1% accuracy.
• I2C Serial communications
• Up to 3.4 Mbps data rate.
• Slave mode hardware address decoding.
• Two package options:
• 10-lead 2 x 2 x 0.65 mm DFN
• 10-lead 2.9 x 4.9 x1.2 mm LGA module with integrated 940
nm LED
• Temperature Range: –40 to +85 °C
Rev. 0.9 | 1
Si1153 Data Sheet
Ordering Guide
2. Ordering Guide
Table 2.1. Ordering Guide
Family
DFN
Package
ALS
OPNs
Si1153
Si1153-AA00-GMR
2 x 2 mm DFN
Si1153
Si1153-AA09-GMR
2 x 2 mm DFN
Si1153
Si1153-AA9x-GMR
2.85 x 4.9 mm LGA
Module
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940 nm
Proximity
Filter
(# of LED Drivers)
Y
# of LEDs Included
3
0
Y
3
0
Y
3
1
Rev. 0.9 | 2
Si1153 Data Sheet
Functional Description
3. Functional Description
The Si1153 is an active optical reflectance proximity detector, with ambient light sensors whose operational state is controlled through
registers accessible through the I2C interface. The host can command the Si1153 to initiate on-demand Ambient Light or proximity
measurements. The host can also place the Si1153 in an autonomous operational state where it performs measurements at set intervals and interrupts the host either after each measurement is completed or whenever a set threshold has been crossed. This results in
overall system power saving, allowing the host controller to operate longer in its sleep state instead of polling the Si1153.
VDD
Internal Osc.
Regulator
ALS Photodiodes
.
.
MUX
940 nm Bandpass
Filter.
LIGHT
ADC1
LED1
ADC2
Signal
Processor
and
Control
(Filter Only in
AA09 & AA9X
versions)
LED
Drivers
LED2 *
LED3 **
INT
SCL
I2C
Engine
SDA
AD
I2C addr sel
* Pull up to VDD with 47 kOhm resistor to select primary I2C address (0x53),
or down to GND for alt I2C address 0x52.
** Pull up to VDD with 47 kOhm resistor
Figure 3.1. Functional Block Diagram
Figure 3.2. Si1153 DFN Package Basic Application
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Rev. 0.9 | 3
Si1153 Data Sheet
Functional Description
Figure 3.3. Si1153 LGA Module Basic Application
3.1 Ambient Light Sensing
The Si1153 has photodiodes capable of measuring visible and infrared light. However, the visible photodiode is also influenced by infrared light. The measurement of illuminance requires the same spectral response as the human eye. If an accurate lux measurement is
desired, the extra IR response of the visible-light photodiode must be compensated. Therefore, to allow the host to make corrections to
the infrared light’s influence, the Si1153 reports the infrared light measurement on a separate channel. The separate visible and IR
photodiodes lend themselves to a variety of algorithmic solutions. The host can then take these two measurements and run an algorithm to derive an equivalent lux level as perceived by a human eye. Having the IR correction algorithm running in the host allows for
the most flexibility in adjusting for system-dependent variables. For example, if the glass used in the system blocks visible light more
than infrared light, the IR correction needs to be adjusted.
If the host is not making any infrared corrections, the infrared measurement can be turned off in the CHAN_LIST parameter.
By default, the measurement parameters are optimized for indoor ambient light levels, where it is possible to detect low light levels. For
operation under direct sunlight, the ADC can be programmed to operate in a high signal operation so that it is possible to measure
direct sunlight without overflowing.
For low-light applications, it is possible to increase the ADC integration time. Normally, the integration time is 24.4 µs. By increasing this
integration time, the ADC can detect light levels as low as 100 mlx. The ADC integration time for the Visible Light Ambient measurement can be programmed independently of the ADC integration time of the Infrared Light Ambient measurement. The independent ADC
parameters allow operation under glass covers having a higher transmittance to Infrared Light than Visible Light.
When operating in the lower signal range, or when the integration time is increased, it is possible to saturate the ADC when the ambient
light suddenly increases. Any overflow condition will have the corresponding data registers report a value of 0xFFddFF for 16-bit mode
and 0x7FFFFF for 24-bit mode. The host can adjust the ADC sensitivity to avoid an overflow condition. If the light levels return to a
range within the capabilities of the ADC, the corresponding data registers begin to operate normally.
The Si1153 can initiate ALS measurements either when explicitly commanded by the host or periodically through an autonomous process. Refer to Section 4. Operational Modes for additional details.
Two ADCs can be used for simultaneous readings of the visible or proximity photodiode and black dark current reference photodiode.
When subtracted, these differential measurements remove dark current, reducing noise that enables lower light sensitivity.
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Si1153 Data Sheet
Functional Description
3.2 Proximity Sensing
The Si1153 has been optimized for use as either a dual-port or single-port active reflection proximity detector. Over distances of less
than 50 cm, the dual-port active reflection proximity detector has significant advantages over single-port, motion-based infrared systems, which are only good for triggered events. Motion-based infrared detectors identify objects within proximity, but only if they are
moving. Single-port motion-based infrared systems are ambiguous about stationary objects even if they are within the proximity field.
The Si1153 can reliably detect an object entering or exiting a specified proximity field, even if the object is not moving or is moving very
slowly. However, beyond about 30–50 cm, even with good optical isolation, single-port signal processing may be required due to static
reflections from nearby objects, such as tables, walls, etc. If motion detection is acceptable, the Si1153 can achieve ranges of up to 50
cm, through a single product window.
For small objects, the drop in reflectance is as much as the fourth power of the distance. This means that there is less range ambiguity
than with passive motion-based devices. For example, a sixteen fold change in an object's reflectance means only a fifty-percent drop
in detection range.
The Si1153 can drive up to three separate infrared LEDs. When the three infrared LEDs are placed in an L-shaped configuration, it is
possible to triangulate an object within the three-dimensional proximity field. Thus, a touchless user interface can be implemented with
the aid of host software.
The Si1153 can initiate proximity sense measurements when explicitly commanded by the host or periodically through an autonomous
process.
Whenever it is time to make a PS measurement, the Si1153 makes up to six measurements, depending on what is enabled in the
CHLIST parameter. Other ADC parameters for these measurements can also be modified to allow proper operation under different ambient light conditions.
The LED choice is programmable for each of these six measurements. Each measurement can select which combination of 3 LEDs are
turned on and which of two LED current setting banks are used to set the LED currents. Optionally, each proximity measurement can
be compared against a host-programmable threshold. With threshold settings for each PS channel, it is also possible for the Si1153 to
notify the host whenever the threshold has been crossed. This reduces the number of interrupts to the host, aiding in efficient software
algorithms.
The Si1153 can also generate an interrupt after a complete set of proximity measurements, ignoring any threshold settings.
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Si1153 Data Sheet
Functional Description
To support different power usage cases dynamically, the infrared LED current of each output is independently programmable. The current can be programmed anywhere from 5.5 to 354 mA. (See Table 8.8 Typical LED Current vs. LED Code on page 44.) Therefore,
the host can optimize for proximity detection performance or for power saving dynamically. This feature can be useful since it allows the
host to reduce the LED current once an object has entered a proximity sphere, and the object can still be tracked at a lower current
setting. Finally, the flexible current settings make it possible to control the infrared LED currents with a controlled current sink, resulting
in higher precision. The ADC properties are programmable. For indoor operation, the ADC should be configured for low signal range for
best reflectance sensitivity. When under high ambient conditions, the ADC should be configured for high signal level range operation.
When operating in the lower signal range, it is possible to saturate the ADC when the ambient light level is high. Any overflow condition
is reported with a value of 0xFFFF for 16-bit mode and 0x7FFFFF for 24-bit mode. The host can then adjust the ADC sensitivity to
avoid an overflow condition. If the light levels return to a range within the capabilities of the ADC, the corresponding data registers begin
to operate normally.
The Si1153 can be configured with three different sizes of proximity photodiode to enable the highest sensitivity without saturation.
Proximity detection ranges beyond 50 cm can be achieved with lensing and by selecting a longer integration time. The detection range
may be increased further, even with high ambient light, by averaging multiple measurements.
The Si1153-AA09 version of the Si1153 is designed with an on die 940 nm bandpass filter. It is designed to reject sunlight and to pass
as much of the LED excitation energy as possible. 940 nm is selected as the operating wavelength since it corresponds to a dip in the
energy of the solar spectrum.
Figure 3.4. Typical Si1153-AA09 Filter Response Compared to the Sunlight Energy Spectrum
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Si1153 Data Sheet
Functional Description
3.3 Power Consumption
The Si1153 alternates between three power consumption states: Active, Suspend, and Sleep. (See the diagram below for an illustratation of each of these states.) The total power consumed by the part depends heavily on the measurement rate, measurement mode,
and measurement gain for the various channels enabled. The power levels for the three modes, as well as the Active Power time per
reading, are provided in this document. The Suspend time (where the A/D and PD are operating) has two parts. One is determined by
the user setup and can be determined by the DECIM_RATE and HW_GAIN setup information in Section 7.2 Channel Specific Setup
Areas of the Parameter Table, while the other (A/D Startup time) is determined by tadstart, shown in Table 8.2 Electrical Performance
Characteristics on page 38.
Sum is “Processing Time Per
Measurement” (tprocess)
Mid Reading Op
Suspend Power
(PD & A/D Active)
Reading Init.
Power
Reading Conclude
Active Power
A Phase
Sleep Power
B Phase
Time
A/D startup time per
measurement is
determined by the
data sheet (tadstart)
The A/D time (per
measurement) is determined
by the user’s configuration of
the parameter table.
This complete measurement is repeated at the
rates determined by the user’s configuration of
the parameter table.
Figure 3.5. Power Consumption States During a Reading
Every A/D conversion has three periods:
155 μs at 4.5 mA
(setup time by internal controller)
48.8 μs at 525 μA
(setup time by A/D)
48.8 μs * (2 ** gain) at 525 μA
(Actual A/D time that will vary with integration time)
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Si1153 Data Sheet
Functional Description
3.4 Host Interface
The host interface to the Si1153 consists of three pins:
• SCL
• SDA
• INT
SCL and SDA are standard open-drain pins as required for I2C operation.The Si1153 asserts the INT pin to interrupt the host processor. The INT pin is an open-drain output. A pull-up resistor is needed for proper operation. As an open-drain output, it can be shared with
other open-drain interrupt sources in the system.
For proper operation, the Si1153 is expected to fully complete its Initialization Mode prior to any activity on the I2C.
The INT, SCL, and SDA pins are designed so that it is possible for the Si1153 to enter the Off Mode by software command without
interfering with normal operation of other I2C devices on the bus.
Conceptually, the I2C interface allows access to the Si1153 internal registers.
An I2C write access always begins with a start (or restart) condition. The first byte after the start condition is the I2C address and a
read-write bit. The second byte specifies the starting address of the Si1153 internal register. Subsequent bytes are written to the Si1153
internal register sequentially until a stop condition is encountered. An I2C write access with only two bytes is typically used to set up the
Si1153 internal address in preparation for an I2C read.
The I 2C read access, like the I2C write access, begins with a start or restart condition. In an I2C read, the I2C master then continues to
clock SCK to allow the Si1153 to drive the I2C with the internal register contents.The Si1153 also supports burst reads and burst writes.
The burst read is useful in collecting contiguous, sequential registers. The Si1153 register map was designed to optimize for burst
reads for interrupt handlers, and the burst writes are designed to facilitate rapid programming of commonly used fields, such as thresholds registers.
The internal register address is a six-bit (bit 5 to bit 0) plus an Auto increment Disable (on bit 6). The Auto increment Disable is turned
off by default. Disabling the auto incrementing feature allows the host to poll any single internal register repeatedly without having to
keep updating the Si1153 internal address every time the register is read.
It is recommended that the host should read performance measurements (in the I2C Register Map) when the Si1153 asserts INT. Although the host can read any of the Si1153’s I2C registers at any time, care must be taken when reading 2-byte measurements outside
the context of an interrupt handler. The host could be reading part of the 2-byte measurement when the internal sequencer is updating
that same measurement coincidentally. When this happens, the host could be reading a hybrid 2-byte quantity whose high byte and low
byte are parts of different samples. If the host must read these 2-byte registers outside the context of an interrupt handler, the host
should “double-check” a measurement if the measurement deviates significantly from a previous reading.
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Si1153 Data Sheet
Functional Description
Figure 3.6. I2C Bit Timing Diagram
Figure 3.7. Host Interface Single Write
Figure 3.8. Host Interface Single Read
Figure 3.9. Host Interface Burst Write
Figure 3.10. Host Interface Burst Read
Figure 3.11. Si1153 REG ADDRESS Format
The following notes apply for the figures above:
1. Gray boxes are driven by the host to the Si1153.
2. White boxes are driven by the Si1153.
3. A = ACK or “acknowledge”.
4. N = NACK or “no acknowledge”.
5. S = START condition.
6. Sr = repeat START condition.
7. P = STOP condition.
8. AI = Disable Auto Increment when set.
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Si1153 Data Sheet
Operational Modes
4. Operational Modes
The Si1153 can be in one of many operational modes at any time. It is important to consider the operation mode, since the mode has
an impact on the overall power consumption of the Si1153. The various modes are:
• Off Mode
• Initialization Mode
• Standby Mode
• Forced Conversion Mode
• Autonomous Mode
4.1 Off Mode
The Si1153 is in the Off Mode when VDD is either not connected to a power supply or if the VDD voltage is below the stated VDD_OFF
voltage described in the electrical specifications. As long as the parameters stated in Table 8.7 Absolute Maximum Ratings on page
43 are not violated, no current will flow through the Si1153. In the Off Mode, the Si1153 SCL and SDA pins do not interfere with other
I2C devices on the bus. Keeping VDD less than VDD_OFF is not intended as a method of achieving lowest system current draw. The
reason is that the ESD protection devices on the SCL, SDA, and INT pins also draw from a current path through VDD. If VDD is grounded, for example, then current flows from system power to system ground through the SCL, SDA, and INT pull-up resistors and the
ESD protection devices. Allowing VDD to be less than VDD_OFF is intended to serve as a hardware method of resetting the Si1153
without a dedicated reset pin.
The Si1153 can also re-enter the Off Mode upon receipt of a software reset sequence. Upon entering Off Mode, the Si1153 proceeds
directly from the Off Mode to the Initialization Mode.
4.2 Initialization Mode
When power is applied to VDD and is greater than the minimum VDD Supply Voltage stated in the electrical specification table, the
Si1153 enters its Initialization Mode. In the Initialization Mode, the Si1153 performs its initial startup sequence. Since the I2C may not
yet be active, it is recommended that no I2C activity occur during this brief Initialization Mode period. The “Start-up time” specification in
the electrical specification table is the minimum recommended time the host needs to wait before sending any I2C accesses following a
power-up sequence. After Initialization Mode has completed, the Si1153 enters Standby Mode. During the Initialization mode, the I2C
address selection is made according to whether LED2 is pulled up or down.
4.3 Standby Mode
The Si1153 spends most of its time in Standby Mode. After the Si1153 completes the Initialization Mode sequence, it enters Standby
Mode. While in Standby Mode, the Si1153 does not perform any Ambient Light measurements or Proximity Detection functions. However, the I2C interface is active and ready to accept reads and writes to the Si1153 registers. The internal Digital Sequence Controller is in
its sleep state and does not draw much power. In addition, the INT output retains its state until it is cleared by the host.
I2C accesses do not necessarily cause the Si1153 to exit the Standby Mode. For example, reading Si1153 registers is accomplished
without needing the Digital Sequence Controller to wake from its sleep state.
4.4 Forced Conversion Mode
The Si1153 can operate in Forced Conversion Mode under the specific command of the host processor. The Forced Conversion Mode
is entered when the FORCE command is sent. Upon completion of the conversion, the Si1153 can generate an interrupt to the host if
the corresponding interrupt is enabled. It is possible to initiate both a proximity and ALS measurement.
4.5 Automated Operation Mode
The Si1153 can be placed in the Autonomous Operation Mode where measurements are performed automatically without requiring an
explicit host command for every measurement. The START command is used to place the Si1153 in the Autonomous Operation Mode.
The Si1153 updates the I2C registers for proximity and ALS automatically. The host can also choose to be notified when these new
measurements are available by enabling interrupts. The conversion frequency for autonomous operation is set up by the host prior to
the START command.
The Si1153 can also interrupt the host when the proximity or ALS measurement reach a pre-set threshold. To assist in the handling of
interrupts the registers are arranged so that the interrupt handler can perform an I2C burst read operation to read the necessary registers, beginning with the interrupt status register, and cycle through the various output registers.
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Si1153 Data Sheet
User to Sensor Communication
5. User to Sensor Communication
5.1 Basic I2C Operation
I2C operation is dependent on serial I2C reads and writes to an addressable bank of memory referred to as I2C space. The diagram
below outlines the registers used, some functionality and the direction of data flow. The I2C address is initially fixed but can be programmed to a new value. This new value is volatile and reverts to the old value on hardware or software reset. Only 7-bit I2C addressing is
supported; 10-bit I2C addressing is not supported. The Si1153 responds to the I2C address of 0x53 or to an alternate address of 0x52.
Part and Version ID Group
PART ID
REV ID
SDA
SDA
Engine
MFR ID
INFO_0 & 1 (SPARES)
SCL
INPUT3 -> 0
MCU
COMMAND
COMMAND_WR_INT
Sequencial Write Group
SFR
SPACE
IRQ_EN
6
6
RESPONSE_1
Bit7: RUNNING
Bit6: SUSPEND
Bit5: SLEEP
Interrupt
Logic
I2C
SPACE
5
OR
INT
OD
AND
RESPONSE_0
CR
6
IRQ_STATUS
OUTPUT0 to 25
Sequencial Read Group
Figure 5.1. I2C Interface Block Diagram
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Rev. 0.9 | 11
Si1153 Data Sheet
User to Sensor Communication
5.2 Relationship Between I2C Registers and Parameter Table
Note that most of the Si1153 configuration is accomplished through ‘Parameters’. The Si1153 has an internal MCU with SRAM. The
Parameters are stored in the Si1153 Internal MCU SRAM. The I2C Registers can be viewed as mailbox registers that form an interface
between the host and the internal MCU. The figure below shows the relationship between some of the key interface registers to the
internal Parameters managed by the internal MCU.
• The I2C registers are directly accessible by the host.
• The parameter table is:
• Accessible indirectly via the command register (and others).
• Used during setup to fix the operating modes of the Si1153.
• 0x2C bytes long and is read and written indirectly, one bye at a time, via the command register.
The data stored in the parameter table is volatile and is lost when the part is powered down or software reset command is sent to the
part via the I2C part.
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Si1153 Data Sheet
User to Sensor Communication
Figure 5.2. Accessing Parameters through I2C Registers
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Si1153 Data Sheet
User to Sensor Communication
5.3 I2C Command Register Operation
Writing the codes shown below in the command summary table signals the sensor to undertake one of several complex operations.
These operations take time and all commands should be followed by a read of the RESPONSE0 register to confirm the operation is
complete by examining the counter and to check for an error in the error bit. The error bit is set in the RESPONSE0 register’s command
counter if there is an error in the previous command (e.g., attempt to write to an illegal address beyond the parameter table, or a channel and /or burst configuration that exceeds the size of the output field (26 bytes)). If there is no such error, then the counter portion of
the command counter will be incremented.
The RESPONSE_0 register should be read after every command to determine completion and to check for an error. If an error is found,
which should not happen except for a host SW bug, the host should clear the error with a RESET command or a RESET_CMD_CTR
command.
One operating option is to do a RESET_CMD_CTR command before every command.
Two of the commands imply another I2C register contains an argument.
• STORE_NEW_I2C ADDR command implies a new address has been loaded in the parameter table location I2CID PARAMETER.
• PARAM_SET command implies a byte has been stuffed into INPUT0 register.
• The three CHAN_LIST commands imply the CHAN_LIST location in the parameter table has been configured. A valid CHAN_LIST
implies other configuration areas in the parameter table are correctly setup as well.
Two of the commands result in another I2C register containing return arguments (aside from incrementing RESPONSE0).
• PARAM_SET results in the write data being copied in to I2C RESPONSE1 register.
• PARAM_QUERY results in read data in the I2C RESPONSE1 register.
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Si1153 Data Sheet
User to Sensor Communication
Table 5.1. Command Summary
Command Register Commands
RESET_CMD_CTR
Code
Input to Sensor
Output of Sensor
0x00
-----------
-----------
0x01
-----------
-----------
0x11
-----------
-----------
0x12
-----------
-----------
0x13
-----------
-----------
Resets RESPONSE0 CMMND_CTR field to 0.
RESET_SW
Forces a Reset, Resets RESPONSE0
CMMND_CTR field to 0xXXX01111.
FORCE
Initiates a set of measurements specified in
CHAN_LIST parameter. A FORCE command will
only execute the measurements which do not
have a meas counter index configured in MEASCONFIGx.
PAUSE
Pauses autonomous measurements specified in
CHAN_LIST.
START
Starts autonomous measurements specified in
CHAN_LIST. A START autonomous command will
only start the measurements which has a counter
index selected in MEASCONFIGx.
PARAM_QUERY
0b01xxxxxx
RESPONSE1 = result
Reads Parameter xxxxxx and store results in RESPONSE1.xxxxxx is a 6 bit Address Field (64
bytes).
PARAM_SET
0b10xxxxxx
INPUT0
RESPONSE1 = INPUT0
Writes INPUT0 to the Parameter xxxxxx.xxxxxx is
a 6 bit Address Field (64 bytes).
Notes:
1. The successful completion of all commands except RESET_CMD_CTR and RESET_SW causes an increment of the CMD_CTR
field of the RESPONSE0 register (bits [3:0].
2. Resets RESPONSE0 CMMND_CTR field to 0.
3. Forces a Reset, Resets RESPONSE0 CMMND_CTR field to 0xXXX01111.
4. Uses CHAN_LIST in Parameter Space.
5. "xxxxxx" is a 6-bit Address Field (64 bytes).
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Si1153 Data Sheet
User to Sensor Communication
5.3.1 Accessing the Parameter Table (PARAM_QUERY & PARAM_SET Commands)
The parameter table is written to by writing the INPUT_0 I2C register and the PARAM_SET command byte to the Command I2C register. The format of the PARAM_SET word is such that the 6 LSBits contain the location of the target byte in the parameter table.
Example: To transfer 0xA5 to parameter table location 0b010101.
Read RESPONSE0 (address 0x11)
and store the CMMND_CTR field.
Write 0xA5 to INPUT0 (address 0x0A).
Write 0b10010101 to COMMAND (address 0x0B).
Read RESPONSE0 (address 0x11)
and check if the CMMND_CTR field incremented.
If there is no increment or error, repeat the “read the RESPONSE0” step until the CMMND_CTR has incremented. If there is an error
send a RESET or a RESET_CMD_CTR command.
The two write commands (to INPUT0 and COMMAND) can be in the same I2C transaction.
Example: To read data from the parameter table location 0b010101.
Read the RESPONSE0 (address 0x11)
and store the CMMND_CTR field.
Write 0b01010101 to the COMMAND (address 0x0B).
Read RESPONSE0 (address 0x11)
and check if the CMMND_CTR field incremented.
If there is no increment or error, repeat the “read RESPONSE0” step until the CMMND_CTR has incremented.
Read RESPONSE1 (address 0x10)
this gives the read result. If there is an error send RESET or a RESET_CMD_CTR command.
The last two read commands (from RESPONSE0 and RESPONSE1) should not be in the same I2C transaction.
5.3.2 Sensor Operation Initiation Commands
The FORCE, PAUSE, and START commands make use of the information in CHAN_LIST. Configure CHAN_LIST prior to using any of
these commands.
5.3.3 RESET_CMD_CTR Command
Resets RESPONSE0 CMMND_CTR field and does nothing else.
5.3.4 RESET Command
Resets the sensor and puts it into the same state as when powering up. The parameter table and all I2C registers are reset to their
default values.
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Si1153 Data Sheet
User to Sensor Communication
5.4 I2C Register Summary
The content of the three MSBits of Response0 after reset will depend on the running state (see the Response0 write up).
Table 5.2. I2C Registers
Register Name
I2C Address
Direction WRT
Host
Function
Value after Reset
(Hard or Soft)
Direction WRT Sensor
PART_ID
0x00
IN
Returns DEVID
(0x53 for the
Si1153).
PART_ID
OUT
HW_ID
0x01
IN
Returns Hardware
ID.
HW_ID
OUT
REV_ID
0x02
IN
Hardware Rev
(0xMN).
REV_ID
OUT
HOSTIN0
0x0A
IN/OUT
Data for parameter
table on PARAM_SET write to
COMMAND register.
0x00
IN
COMMAND
0x0B
IN/OUT
Initiated action in
Sensor when specific codes written
here.
0x00
IN
RESET
0x0F
IN/OUT
The six least significant bits enable Interrupt Operation.
0x00
IN
RESPONSE1
0x10
IN
Contains the readback value from a
param query or a
param set command.
0x00
IN/OUT
RESPONSE0
0x11
IN
The 5th MSB of the
counter is an error
indicator, with the 4
LSBits indicating the
error code when the
MSB is set.
0xXXXX1111
IN/OUT
IRQ_STATUS
0x12
IN
The six least significant bits show the
interrupt status.
0x00
IN/OUT
HOSTOUT0
0x13
0x00
IN/OUT
to
to
HOSTOUT25
0x2C
IN
Captured Sensor
Data.
5.4.1 PART_ID
I2C Address = 0x00;
Contains Part ID, e.g., 0x53 for Si1153.
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Si1153 Data Sheet
User to Sensor Communication
5.4.2 HW_ID
I2C Address = 0x01;
Contains the Hardware information.
BITS4:0 = Filter, LED & Module code
BITS7:5 = Silicon HW rev (Steps with silicon mask change)
Part Number
Features
BITS4:0 code
Si1153-AA00
—
0x00
Si1153-AA09
940 nm filter
0x01
Si1153-AAX9
Module with 940 nm filter & LED
0x02
5.4.3 REV_ID
I2C Address = 0x02;
Contains the product revision, in a 0xMN format where “M” is the major rev and “N” the minor rev.
5.4.4 INFO0
I2C Address = 3;
Contains 0 after a hard reset or a RESET Command.
5.4.5 INFO1
I2C Address = 4;
Contains 0 after a hard reset or a RESET Command.
5.4.6 HOSTIN0
Bit
7
Name
I2C Address
HOSTIN0
0x04
6
5
4
3
Name
HOSTIN0
Type
R/W
Reset
0
Bit
Name
7:0
HOSTIN0
2
1
0
Function
This Register is the Input to the Sensor and Output of the Host.
Contain 0 after a hard reset or a RESET Command.
5.4.7 COMMAND
I2C Address = 0x0B;
Contains 0 after a hard reset or a RESET Command.
5.4.8 IRQENABLE
I2C Address = 0x0F;
Contains 0 after a hard reset or a RESET Command.
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Si1153 Data Sheet
User to Sensor Communication
5.4.9 RESPONSE1
I2C Address = 0x10;
Bit
7
6
5
4
3
Name
RESPONSE1[7:0]
Type
R
Reset
0
0
0
0
0
2
1
0
0
0
0
Bit
Name
Function
7:0
RESPONSE1[7:0]
The sensor mirrors the data byte written to the parameter table here for the user to
verify the write was successful.
A parameter read command results in the byte read being available here for the
host.
5.4.10 RESPONSE0
I2C Address = 0x11;
Bit
7
6
5
4
Name
RUNNING
SUSPEND
SLEEP
CMD_ERR
Type
R
R
R
R
R
R
R
R
Reset
N/A
N/A
N/A
0
1
1
1
1
Bit
Name
7
RUNNING
Indicator of MCU state.
6
SUSPEND
Indicator of MCU state.
5
SLEEP
Indicator of MCU state.
4
CMD_ERR
3
2
1
0
CMD_CTR[4:0]
Function
It is cleared by a hardware reset (power up) or a RESET command or a RESET_CMD_CTR.
It is set by a bad command. E.g., an attempt to write beyond the parameter table.
If it is set, the CMMND_CTR field is the error code.
3:0
CMMND_CTR
IF CMD_ERR = 0
A counter that increments on every GOOD command (successful
I2C Command Register write and sensor execution of the command).
It is reset to 0 by the RESET_CMD_CTR command.
It is set to 0b1111 on Power Up or a RESET command. This is how
a user can detect a fresh SW reset or a power up event.
IF CMD_ERR = 1
Code
Meaning
0x10
Invalid command.
0x11
Parameter access to an invalid location.
0x12
Saturation of the ADC or overflow of accumulation.
0x13
Output buffer overflow—this can happen when
Burst mode is enabled and configured for greater
than 26 bytes of output.
The RESPONSE0 register will show “RUNNING” immediately after reset and then “SLEEP” after initialization is complete.
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Si1153 Data Sheet
User to Sensor Communication
5.4.11 IRQ_STATUS
I2C Address = 0x12;
Bit
7
6
5
4
3
2
1
0
Name
—
IRQ5
IRQ4
IRQ3
IRQ2
Type
RSVD
CR
CR
CR
CR
CR
CR
0
0
0
0
0
0
Reset
Bit
Name
7:6
UNUSED
5
IRQ5
Enables an IRQ for channel 5 result being ready.
4
IRQ4
Enables an IRQ for channel 4 result being ready.
3
IRQ3
Enables an IRQ for channel 3 result being ready.
2
IRQ2
Enables an IRQ for channel 2 result being ready.
1
IRQ1
Enables an IRQ for channel 1 result being ready
0
IRQ0
Enables an IRQ for channel 0 result being ready.
IRQ1
Function
Unused. Read = 00b; Write = Don’t Care.
5.4.12 HOSTOUTx
This section covers the twenty-six I2C Host Output Registers. These registers are the output of the sensor and input to the host.
Bit
Name
I2C Address
HOSTOUT0
0x13
to
to
HOSTOUT25
0x2C
7
6
5
4
Name
HOSTOUTx
Type
R
Reset
0
0
Bit
Name
7:0
HOSTOUTx
0
0
3
2
1
0
0
0
0
0
Function
These registers are the output of the MCU and input to the host. The results of the CHAN_LIST
enabled “active channel” readings are located sequentially in this table. Each channel may use 2
or 3 bytes depending on the setup.
The validity of the various channel outputs located in this table is determined by other factors. Data is valid when an IRQ status says that it is and remains valid until another reading happens.
This is why it is imperative to service the interrupt before the next measurement cycle begins (Autonomous Mode), unless forced mode is used.
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Si1153 Data Sheet
Measurement: Principle of Operation
6. Measurement: Principle of Operation
Operation is based on the concept of channels. Channels are essentially tasks that have been setup by the user.
To setup these channels, the channel specific areas of the parameter table need to be loaded with the correct information as well as the
global area of this table.
The channels’ specific areas are described below, including:
• ADC gain
• The photodiode selected
• The counter selected to time
• How often to make a measurement
• The format of the output (16 vs. 24 bits)
• And other areas
The global area includes global information that affect all tasks, such as:
• The list of channels that are enabled.
• The setup of the two counters that can be used by the channels.
• The three light thresholds that can be selected from by the channels.
The list of channels, CHAN_LIST, in the global area determines what operations are run and how the results are packed in the output
fields.
The packing of the result data in the output fields is totally determined by the enabled channels as they are packed sequentially from
the lowest enabled channel to the highest in the output field (I2C space- HOSTOUT0 to HOSTOUT25). The amount of space used by
each channel is determined by the 16 vs. 24 bit selection made in the channel setup.
Although space in the output buffer is reserved by the CHAN_LIST, the data validity is determined by the IRQ_STATUS register in Autonomous Mode and by elapsed time in Forced Mode. In Burst Mode, a subset of Autonomous Mode, all the expected data is valid.
6.1 Output Field Utilization
In all modes, the CHAN_LIST configuration determines how the data is stacked in the 26 byte output field. It is done on a first-come
first-served basis, with the enabled lower channels taking up the lower addresses. When burst is enabled, the channel arrangement is
just repeated to higher and higher addresses. See the example below.
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Si1153 Data Sheet
Measurement: Principle of Operation
Figure 6.1. Output Table Data Packing
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Si1153 Data Sheet
Measurement: Principle of Operation
6.2 Autonomous and Forced Modes
In Autonomous Mode, the user uses the timer fields in both the global and channels specific areas in order to set up the timing for
repeated measurements. The user then sends the command to start these autonomous measurements repeatedly. When each channel's timer is tripped, the measurement for that channel is started. When the channel measurement completes, it is signaled by the
IRQ_STATUS bits and by an interrupt (if the interrupt is enabled). After that signal, the sensor restarts the channel timer and waits for it
to trip and signal the next measurement. The host must read the data before the next reading is generated, or risk losing the reading or
getting garbage data to sample smearing (reading data in the midst of it changing).
In Forced Mode, all measurements enabled in the CHAN_LIST start as a result of a FORCE command and are only done once. If there
are multiple channels enabled, then the measurements are done back-to-back starting with the lower number channel.The completion
signaling is the same as for autonomous, the IRQ_STATUS and interrupt if it is enabled. The logical difference is that all the enabled
channels are always shown as simultaneously ready in the IRQ_STATUS, whereas in Autonomous Mode this is not true. FORCE command only works on measurements which do not have a measurement counter selected in MEASCONFIGx.
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Si1153 Data Sheet
Measurement: Principle of Operation
Figure 6.2. IRQ_STATUS Shows Which Output Fields Have Valid Data
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Si1153 Data Sheet
Measurement: Principle of Operation
6.3 Burst Mode
Burst Mode is always used in Autonomous Mode.
The Burst Mode is enabled by the BURST register’s bit 7. The burst register is in the global area of the parameter table. Bits 6:0 of the
register define the number of readings to be made.
All channels set up in the CHAN_LIST operate in this mode and they operate in unison governed by the MEASRATE register in the
parameter table. The individual channel MEASCONFIGx.COUNTER_INDEX [1:0] value is ignored.
The burst is started by the START command and may be paused by the PAUSE command. All measurements enabled in the
CHAN_LIST are done as a quick set then repeated after the delay determined by the MEASRATE register. The number of repeats are
set by the BURST register.
The measurements called for by the enabled channels are done without an intervening delay, starting with the lower number channel
and ending with the highest channel number.
The burst will proceed until it is complete or until the output buffer is full, after which an interrupt may be generated if enabled and the
IRQ_STATUS bit(s) associated with all the channels in the CHAN_LIST will be set. The user has the time period until the next set of
reads are finished to read back the data in the output field.
The output data will be stacked in the 26 bytes output data field and will be sequential. For example, if the CHAN_LIST enables channels X, Y, and Z, then the data will be found in the output buffer as multiple sets: X1, Y1, Z1, X2, Y2, Z2... The fields X, Y, and Z are
packed efficiently and are not necessarily the same length since they can be a mix of 16 and 24 bit values.
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Si1153 Data Sheet
Measurement: Principle of Operation
Figure 6.3. Burst Mode Example of Two Sets of Readings
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Si1153 Data Sheet
Measurement: Principle of Operation
6.4 Interrupt Operation
The INT output pin is asserted by the sensor when an enabled channel in the CHAN_LIST (which has the corresponding bit in the
RESET register) has finished. In Burst Mode, the interrupt is delayed until the number of readings is reached or the buffer is full.
When the host reads the IRQ_STATUS register to learn which source generated the interrupt, the IRQ_STATUS register is cleared
automatically.
The most efficient method of extracting measurements from the Si1153 is an I2C Burst Read beginning at the IRQ_STATUS register.
6.5 Timing of Channel Measurements
The timing of measurements has two aspects:
1. The length of time to take a measurement.
2. How frequently the measurement is taken.
The amount of time to take the measurement is controlled by factors like HW_GAIN (which is really the integration time), SW_GAIN,
and the decimation rate setting.
Note: Each measurement is composed of two measurement times.
In an ALS measurement, two measurements are always taken and added together. In a proximity measurement, two measurements
are always taken, one without the LED light and one with the LED light. The difference is then created by subtraction. See the timing
diagram below for an example of ALS and proximity measurement timing.
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Si1153 Data Sheet
Measurement: Principle of Operation
Figure 6.4. Example of Measurement Timing
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Si1153 Data Sheet
Parameter Table
7. Parameter Table
Table 7.1. Parameter Table
Address
Name
0x00
I2C_ADDR
I2C Address (Temp)
0x01
CHAN_LIST
Channel List
0x02
ADCCONFIG0
Channel 0 Setup
0x03
ADCSENS0
0x04
ADCPOST0
0x05
MEASCONFIG0
0x06
ADCCONFIG1
0x07
ADCSENS1
0x08
ADCPOST1
0x09
MEASCONFIG1
0x0A
ADCCONFIG2
0x0B
ADCSENS2
0x0C
ADCPOST2
0x0D
MEASCONFIG2
0x0E
ADCCONFIG3
0x0F
ADCSENS3
0x10
ADCPOST3
0x11
MEASCONFIG3
0x12
ADCCONFIG4
0x13
ADCSENS4
0x14
ADCPOST4
0x15
MEASCONFIG4
0x16
ADCCONFIG5
0x17
ADCSENS5
0x18
ADCPOST5
0x19
MEASCONFIG5
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Description
Global Area: Affects all Channels
Channel Areas: Specific Channel Setup
Channel 1 Setup
Channel 2 Setup
Channel 3 Setup
Channel 4 Setup
Channel 5 Setup
Rev. 0.9 | 29
Si1153 Data Sheet
Parameter Table
Address
Name
Description
0x1A
MEASRATE_H
0x1B
MEASRATE_L
0x1C
MEASCOUNT0
0x1D
MEASCOUNT1
0x1E
MEASCOUNT2
0x25
THRESHOLD0_H
0x26
THRESHOLD0_L
0x27
THRESHOLD1_H
0x28
THRESHOLD1_L
0x29
THRESHOLD2_H
0x2A
THRESHOLD2_L
0x2B
BURST
MEASURE RATE
Global Area: Affects all Channels
MEASCOUNT
THRESHOLD SETUP
BURST
7.1 Global Area of the Parameter Table
The Global Area represents resources that are shared among the six channels. See the next section for specific channel properties,
and for channel-specific parameter setup.
Table 7.2. Global Area of the Parameter Table
Parameter
Parameter Address
MEASRATE[1]
0x1A
MEASRATE[15:8]
MEASRATE[0]
0x1B
MEASRATE[7:0]
MEASCOUNT0
0x1C
MEASCOUNT0[7:0]
MEASCOUNT1
0x1D
MEASCOUNT1[7:0]
MEASCOUNT2
0x1E
MEASCOUNT2[7:0]
THRESHOLD0[1]
0x25
THRESHOLD0[15:8]
THRESHOLD0[0]
0x26
THRESHOLD0[7:0]
THRESHOLD1[1]
0x27
THRESHOLD1[15:8]
THRESHOLD1[0]
0x28
THRESHOLD1[7:0]
THRESHOLD2[1]
0x29
THRESHOLD2[15:8]
THRESHOLD2[0]
0x2A
THRESHOLD2[7:0]
BURST
0x2B
BURST[7:0]
CHAN_LIST
0x01
CHAN_LIST[5:0]
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Main Measurement Rate
Counter
Governs how much time between measurement groups.
One count represents an 800
μs time period.
Three Measurement Rate
extension counters available
for setting the rate.
Each of 6 channel setups selected which of these counters to use via the MEASCONFIG::COUNTER_INDEX[1:0] bits:
THRESHOLD0
One of these three (or none)
us Chosen by MEASCONFIGx.THRESH_SEL[1:0]
THRESHOLD1
THRESHOLD2
Bit 7 is Burst Enable while
BURST_COUNT[6:0] are the
count
The six least significant bits
enable the 6 possible channels.
Rev. 0.9 | 30
Si1153 Data Sheet
Parameter Table
7.2 Channel Specific Setup Areas of the Parameter Table
Below is the summary of the four-byte channel-specific area in the parameter table. There are six copies in the table corresponding to
up to six tasks/channels assigned to the sensor. They are located between addresses 0x02 and 0x18 hex.
Table 7.3. Channel Specific Setup Areas of the Parameter Table
7
ADCCONFIGx
RSRVD
ADCSENSx
HSIG
ADCPOSTx
RSRVD
MEASCONFIGx
6
5
4
3
DECIM_RATE[1:0]
COUNTER_INDEX[1:0]
1
0
ADCMUX[4:0]
SW_GAIN[2:0]
24BIT_OUT
2
HW_GAIN[3:0]
POSTSHIFT[2:0]
LED_TRIM[1:0]
UNUSED
BANK_SEL
LED3 En.
THRESH_SEL[1:0]
LED2 En.
LED1 En.
The following figure illustrates how to use the channel-specific registers in the parameter table above.
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Si1153 Data Sheet
Parameter Table
Figure 7.1. THRESH_SEL, COUNTER_INDEX Fields in Each Channel Specific Register Area Points to Global Area Register
THRESHOLDx and MEASCOUNTx (Respectively)
Note: In the figure above, the counter selected (1, 2, or 3) defines the number of 800 µs periods to have between readings when the
channel runs. The threshold selected (0, 1, or 2) defines the threshold used.
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Si1153 Data Sheet
Parameter Table
7.2.1 ADCCONFIGx
Parameter Addresses: 0x02, 0x06, 0x0A, 0x0E, 0x12, 0x16
Bit
7
Name
Reserved
Reset
0
6
5
4
3
2
DECIM_RATE[1:0]
0
1
0
0
0
ADCMUX[4:0]
0
0
0
0
Bit
Name
Function
7
RESERVED
Must remain at 0.
6:5
DECIM_RATE[1:0]
Selects Decimations rate of A/Ds. This setting affects the number of clocks used per measurements. Decimation rate is an A/D optimization parameter. The most common decimation value is 0 for a 1024 clocks
and 48.8 μs min measurement time. Consult the related application notes for more details.
Increasing the reading time by using more clocks does not cause the ADC count to be larger.
Value
No of 21 MHz
Clocks
Measurement time at
HW_GAIN[3:0] = 0
Measurement time at
HW_GAIN[3:0] = n
Usage
Note: All measurements are repeated 2X internally for ADC offset cancellation purposes. The
times below represent the integration time for
one of these measurement pairs.
4:0
ADCMUX[4:0]
0
1024
48.8 μs
48.8*(2**n) μs
Normal
1
2048
97.6 μs
97.6*(2**n) μs
Useful for longer short
measurement times
2
4096
195 μs
195*(2**n) μs
Useful for longer short
measurement times
3
512
24.4 μs
24.4*(2**n) μs
Useful for very short
measurement times
The ADC Mux selects which photodiode(s) are connected to the ADCs for measurement.
See Photodiode Section for more information regarding the location of the photodiodes.
ADCMUX[4:0]
Optical Functions
Operation
0
0
0
0
0
Small IR
D1b
0
0
0
0
1
Medium IR
D1b + D2b
0
0
0
1
0
Large IR
D1b + D2b + D3b +
D4b
0
1
0
1
1
White
D1
0
1
1
0
1
Large White
D1 + D4
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Comments
Rev. 0.9 | 33
Si1153 Data Sheet
Parameter Table
7.2.2 ADCSENSx
Parameter Addresses: 0x03, 0x07, 0x0B, 0x0F, 0x13, 0x17
Bit
7
Name
HSIG
Reset
0
Bit
6
5
4
3
2
SW_GAIN[2:0]
0
Name
0
1
0
HW_GAIN[2:0]
0
0
0
0
0
Function
7
HSIG
This is the Ranging bit for the A/D. Normal gain at 0 and High range (sensitivity is divided
by 14.5) when set to 1.
6:4
SW_GAIN[2:0]
Causes an internal accumulation of samples with no pause between readings when in
FORCED Mode. In Autonomous mode the the accumulation happens at the measurement
rate selected.
The calculations are accumulated in 24 bits and an optional shift is applied later. See ADCPOSTx.ADC_MISC[1:0]
3:0
HW_GAIN[3:0]
Value
Number of Measurements
0
1
1
2
2
4
3
8
4
16
5
32
6
64
7
128
Value
Nominal Measurement time for 512 clocks
0
24.4 µs
1
48.8 µs
2
97.5 µs
……
……
10
25 ms
11
50 ms
12 to 15
unused
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Si1153 Data Sheet
Parameter Table
7.2.3 ADCPOSTx
Parameter Addresses: 0x04, 0x08, 0x0C, 0x10, 0x14, 0x18
Bit
7
6
5
Name
Reserved
24BIT_OUT
Reset
0
0
4
3
POSTSHIFT[2:0]
0
0
0
Name
7
RESERVED
Must be set to 0
6
24BIT_OUT
Determines the size of the fields in the output registers.
POSTSHIFT[2:0]
2
UNUSED
1:0
THRESH_EN [1:0]
1
UNUSED
Bit
5:3
2
0
0
THRESH_EN[1:0]
0
0
Function
Value
Bits/Result
Output
0
16
Unsigned integer
1
24
Signed Integer
The number of bits to shift right after SW accumulation. Allows the results of many additions not to
overflow the output. Especially useful when the output is in 16 bit mode.
Value
Operation
0
Do not use THRESHOLDs
1
Interrupt when the measurement is larger than the THRESHOLD0 Global Parameters
2
Interrupt when the measurement is larger than the THRESHOLD1 Global Parameters
3
Interrupt when the measurement is larger than the THRESHOLD2 Global Parameters
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Si1153 Data Sheet
Parameter Table
7.2.4 MEASCONFIGx
Parameter Addresses: 0x05, 0x0A, 0x0D, 0x11, 0x15, 0x19
Bit
Name
Reset
Bit
7:6
7
6
5
COUNTER_INDEX[1:0]
0
4
LED_TRIM[1:0]
0
0
3
2
1
0
BANK_SEL
LED3_EN
LED2_EN
LED1_EN
0
0
0
0
0
Name
Function
COUNTER_INDEX[1:0] Selects which of the three counters (MEASCOUNTx) in the global parameter list is in use by
this channel. These counters control the period/frequency of measurements. When the
channel uses the COUNTER_INDEX[1:0] to select a MEASCOUNTk register in the parameter table, then the time between measurements for this channel is = 800 us * MEASRATE *
MEASCOUNTk.
A value of zero in MEASRATE will prevent autonomous mode from working. Similarly a zero
in MEASCOUNTk will prevent the autonomous mode from working for the concerned channel
Value
5:4
3
LED_TRIM[1:0]
0
Measurement not be performed except in BURST or Forced
modes
1
Selects MEASCOUNT0
2
Selects MEASCOUNT1
3
Selects MEASCOUNT2
Value
BANK_SEL
Results
Results
0
Nominal LED Currents
1
UNDEFINED
2
LED Currents Increased by 9%
3
LED Currents decreased by 10%
Value
LED Current Registers Selected in Global Register Area
0
LED1_A, LED2_A, LED3_A
1
LED1_B, LED2_B, LED3_B
2
LED3_EN
One value enables the LED
1
LED2_EN
One value enables the LED
0
LED1_EN
One value enables the LED
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Si1153 Data Sheet
Parameter Table
7.3 Photodiode Selection
The ADCCONFIGx.ADCMUX [4:0] Register controls the photodiode selection.
Figure 7.2. Photodiode Locations
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Si1153 Data Sheet
Electrical Specifications
8. Electrical Specifications
Table 8.1. Recommended Operating Conditions
Parameter
VDD Supply Voltage
VDD OFF Supply Voltage
Symbol
Condition
VDD
VDD_OFF
Min
Typ
Max
Unit
1.62
—
3.6
V
1.0
V
50
mVpp
OFF mode
–0.3
VDD = 3.3 V
—
—
T
–40
25
85
°C
SCL, SDA, Input High Logic Voltage
I2CVIH
VDD x 0.7
—
VDD
V
SCL, SDA Input Low Logic
I2CVIL
0
—
VDD x 0.3
V
25
—
—
ms
VDD Supply Ripple Voltage
1 kHz – 10 MHz
Operating Temperature
Voltage
Start-Up Time
VDD above 1.62 V
Table 8.2. Electrical Performance Characteristics
Parameter
IDD Standby Mode (sleep)
Symbol
Condition1
Min
Typ
Max
Unit
Isb
No ADC Conversions
—
125
—
nA
—
1.25
—
µA
—
0.550
—
mA
—
0.525
—
mA
No I2C Activity
VDD = 1.8 V
Isb
No ADC Conversions
No I2C Activity
VDD = 3.3 V
IDD Suspend Mode
Isus
Autonomous Operation
(RTC On)
ADC conversion in Progress
No I2C Activity
VDD = 1.8 V
Isus
Autonomous Operation
(RTC On)
ADC conversion in Progress
No I2C Activity
VDD = 3.3 V
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Si1153 Data Sheet
Electrical Specifications
Parameter
I active, but not measuring
Symbol
Condition1
I active
Responding to commands, Preparing and
calculating results of
readings.
Min
Typ
Max
Unit
4.25
—
mA
4.5
—
mA
—
1
µA
VDD = 1.8 V
I active
Responding to commands, Preparing and
calculating results of
readings.
VDD = 3.3 V
INT, SCL, SDA
VDD = 3.3 V
–1
Leakage Current
Processing Time per Measurement
(During this time the current is I Active)
tprocess
ALS or Prox
A/D startup time per measurement
(During this time the current is I
Suspend)
tadstart
ALS or Prox
—
48.8
—
µs
525 nm, Internal
—
15.2
—
units
—
15.2
—
units
SCL, SDA VOL
—
—
VDD * 0.2
V
INT VOL
—
—
0.4
V
Ratio of readings with HSIG=0 and
HSIG=1 for the shallow PD.
155
µs
ADCMUX=11,
ADC_GAIN=0
Ratio of readings with HSIG=0 and
HSIG=1 for the deep PD.
940 nm
ADCMUX=0,
ADC_GAIN=0
Notes:
1. Unless specifically stated in the Condition column, electrical data assumes ambient light levels < 1 klx.
2. Guaranteed by design and characterization.
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Si1153 Data Sheet
Electrical Specifications
Table 8.3. Optical Performance Characteristics: Si1153-AA00
Parameter
Symbol
Condition
Min
Typ
Max
Unit
460 nm (blue)
—
190
—
525 nm (green)
—
160
—
ADC
Counts /(W/m2)
ADCMUX=11
625 nm (red)
—
100
—
DECIM=0
850 nm (IR)
—
30
ADC_RANGE=0
940 nm (IR)
—
10
—
460 nm (blue)
—
380
—
525 nm (green)
—
320
—
ADCMUX=13
625 nm (red)
—
200
—
DECIM=0
850 nm (IR)
—
60
—
ADC_GAIN = 0
940 nm (IR)
—
20
—
460 nm (blue)
—
90
—
525 nm (green)
—
260
—
625 nm (red)
—
510
—
850 nm (IR)
—
690
—
940 nm (IR)
—
490
—
460 nm (blue)
—
190
—
525 nm (green)
—
520
—
625 nm (red)
—
1000
—
850 nm (IR)
—
1280
—
940 nm (IR)
—
860
—
White minus Dark Shallow Photodiode Response
HSIG=0
Dual White minus Dual Dark Photodiode Response
ADC
Counts /(W/m2)
HSIG=0
Deep minus Dark
Photodiode Response
ADCMUX=0
DECIM=0
ADC_GAIN =0
ADC
Counts /(W/m2)
HSIG=0
Dual Deep Photodiode minus Dual
Dark
Photodiode Response
ADCMUX=1
DECIM=0
ADC
Counts /(W/m2)
ADC_GAIN =0
HSIG=0
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Si1153 Data Sheet
Electrical Specifications
Table 8.4. Optical Performance Characteristics: Si1153-AA09
Parameter
Symbol
Condition
Min
Typ
Max
Unit
460 nm (blue)
—
0
—
525 nm (green)
—
0
—
ADC
Counts /(W/m2)
ADCMUX=11
625 nm (red)
—
0
—
DECIM=0
850 nm (IR)
—
0
ADC_RANGE=0
940 nm (IR)
—
10
—
460 nm (blue)
—
0
—
525 nm (green)
—
0
—
ADCMUX=13
625 nm (red)
—
10
—
DECIM=0
850 nm (IR)
—
0
—
ADC_GAIN = 0
940 nm (IR)
—
20
—
460 nm (blue)
—
0
—
525 nm (green)
—
0
—
625 nm (red)
—
10
—
850 nm (IR)
—
40
—
940 nm (IR)
—
410
—
460 nm (blue)
—
0
—
525 nm (green)
—
0
—
625 nm (red)
—
10
—
850 nm (IR)
—
80
—
940 nm (IR)
—
710
—
White minus Dark Shallow Photodiode Response
HSIG=0
Dual White minus Dual Dark Photodiode Response
ADC
Counts /(W/m2)
HSIG=0
Deep minus Dark
Photodiode Response
ADCMUX=0
DECIM=0
ADC_GAIN =0
ADC
Counts /(W/m2)
HSIG=0
Dual Deep Photodiode minus Dual
Dark
Photodiode Response
ADCMUX=1
DECIM=0
ADC
Counts /(W/m2)
ADC_GAIN =0
HSIG=0
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Si1153 Data Sheet
Electrical Specifications
Table 8.5. I2C Timing Specifications
Parameter
Symbol
Min
Typ
Max
Unit
Clock Frequency
fSCL
—
—
400
KHz
Clock Pulse Width Low
tLOW
1.3
—
—
μs
Clock Pulse Width High
tHIGH
0.6
—
—
μs
Rise Time
tR
20
—
300
ns
Fall Time
tF
20 *
—
300
ns
(VDD / 5.5)
Start Condition Hold Time
tHD:STA
0.6
—
—
μs
Start Condition Setup Time
tSU:STA
0.6
—
—
μs
Input Data Setup Time
tSU:DAT
100
—
—
ns
Data Hold Time
tHD:DAT
0
—
—
ns
Output Data Valid Time
tVD:DAT
—
—
0.9
μs
Stop Setup Time
tSU:STO
0.6
—
—
μs
Bus Free Time
tBUF
1.3
—
—
μs
Suppressed Pulse Width
tSP
—
—
40
ns
Bus Capacitance
Cb
—
—
400
pF
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Si1153 Data Sheet
Electrical Specifications
Table 8.6. LED Optical Characteristics
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Forward voltage
Vf1
If = 10 μA
0.8
—
—
V
Forward voltage
Vf2
If = 50 mA
—
1.4
1.8
V
Reverse current
Ir
Vr = 10 V
—
—
5.0
μA
Peak wavelength
λp
If = 50 mA
925
940
955
nm
Spectral half-width
Δλ
If = 50 mA
—
30
—
nm
Radiant flux
Po
If = 50 mA
10
—
—
mW
Radiant Intensity
Ie
If = 50 mA
17
23
30
mW/sr
Half Angle
ϕ
—
25
—
°C
Note:
1. All specifications measured at 25 °C.
Table 8.7. Absolute Maximum Ratings
Parameter
Min
Typ
Max
Unit
VDD Supply Voltage
–0.3
—
4
V
Operating Temperature
–40
—
85
°C
Storage Temperature
–65
—
85
°C
at VDD = 0 V, TA < 85 °C
–0.5
—
3.6
V
Human Body Model
—
—
2
kV
Machine Model
—
—
225
V
Charged-Device Model
—
—
2
kV
INT, SCL, SDA Voltage
ESD Rating
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Condition
Rev. 0.9 | 43
Si1153 Data Sheet
Electrical Specifications
Table 8.8. Typical LED Current vs. LED Code
Order No.
LED Code
Current
0
0x00
5.5
1
0x08
11
2
0x10
17
3
0x18
22
4
0x20
28
5
0x28
33
6
0x30
39
7
0x38
44
8
0x12
50
9
0x21
55
10
0x29
66
11
0x31
77
12
0x22
83
13
0x39
88
14
0x2A
100
15
0x23
111
16
0x32
116
17
0x3A
133
18
0x24
138
19
0x33
155
20
0x2C
166
21
0x3B
177
22
0x34
194
23
0x2D
199
24
0x3C
221
25
0x35
232
26
0x3D
265
27
0x36
271
28
0x3E
310
29
0x3F
354
Note:
1. At trim bit = 0.
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Si1153 Data Sheet
Electrical Specifications
Figure 8.1. Typical LED Currents as a Function of LED Code and the Trim Bit
Note: In the figure above, the LED configuration happens in the Global Area registers, LED[1,2,3]_[A,B], and in the MEASCONFIGx
register of the channel-specific registers.
Figure 8.2. ADC Out as a Function of Distance
Note: The above graph is created under the following conditions: (LED I = 16.6 mA, t = 24.4 μs, Range = low). Grey 18% reflector. Dual
Section photodiode. LED beam ½ power is at ±30 °C. Output is 5 mW total.
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Si1153 Data Sheet
Electrical Specifications
Figure 8.3. Si115-AA9X LED Radiant Intensity vs. Angle (Indicative)
Figure 8.4. Si115-AA9X LED Radiant Intensity vs. Forward Current (Indicative)
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Si1153 Data Sheet
Electrical Specifications
Figure 8.5. Si1153-AA00 Shallow and Deep Photodiode Spectral Response (Indicative)
Figure 8.6. Typical Angular Sensitivity of the Photodiodes (%)
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Si1153 Data Sheet
Pin Descriptions
9. Pin Descriptions
9.1 DFN Pin Description
Figure 9.1. 10-Pin DFN
Table 9.1. Pin Descriptions
Pin
Name
Type
Description
1
SDA
Bidirectional
I2C Data.
2
SCL
Input
I2C Clock.
3
VDD
Power
Power Supply.
Voltage source.
4
INT
Bidirectional
Interrupt Output.
Open-drain interrupt output pin. Must be at logic level high during power-up sequence to enable low power operation.
5
DNC
Do Not Connect.
This pin is electrically connected to an internal Si1153 node. It should remain unconnected.
6
AD / LED2
Bidirectional
LED2 output.
It is sensed during startup. Pull up to VDD with 47 k Resistor for default I2C address (0x53). Pull down with 47 k Resistor to select alternate I2C address (0c52)
and do not use it as an LED driver in that case.
7
LED3
Bidirectional
LED3 output.
Always connect to VDD through a pull-up resistor. Connect to an LED cathode if
that output is used. Must be at logic level high during power-up sequence to allow
normal operation.
8
GND
Power
Ground.
Reference voltage.
9
LED1
Output
Connect to VDD.
Connect to VDD through a pull-up resistor when not in use.
10
DNC
Do Not Connect.
This pin is electrically connected to an internal Si1153 node. It should remain unconnected.
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Si1153 Data Sheet
Pin Descriptions
9.2 Module Pin Description
Figure 9.2. 2 x 2 mm QFN
Table 9.2. Pin Descriptions
Pin
Name
1
DNC
Type
Description
Do Not Connect.
This pin is electrically connected to an internal Si1153 node. It should remain unconnected.
2
SDA
Bidirectional
I2C Data.
3
SCL
Input
I2C Clock.
4
VDD
Power
Power Supply.
Voltage source.
5
INT
Bidirectional
Interrupt Output.
Open-drain interrupt output pin. Must be at logic level high during power-up sequence to enable low power operation.
6
AD / LED2
Bidirectional
LED2 output.
It is sensed during startup. Pull up to VDD with 47 k Resistor for default I2C address (0x53). Pull down with 47 k Resistor to select alternate I2C address (0c52)
and do not use it as an LED driver in that case.
7
LED3
Bidirectional
LED3 output.
Always connect to VDD through a pull-up resistor. Connect to an LED cathode if
that output is used. Must be at logic level high during power-up sequence to allow
normal operation.
8
GND
Power
Ground.
Reference voltage.
9
LED1
Output
Connect to VDD.
Connect to VDD through a pull-up resistor when not in use.
10
LEDA
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LED Anode Supply. Connect to VLED.
Rev. 0.9 | 49
Si1153 Data Sheet
Modules Outline
10. Modules Outline
10.1 10-Pin 2x2 mm DFN
DFN Package Diagram Dimensions illustrates the package details for the Si1153 DFN package lists the values for the dimensions
shown in the illustration.
Figure 10.1. DFN Package Diagram Dimensions
Table 10.1. Package Diagram Dimensions
Dimension
Min
Nom
Max
A
0.55
0.65
0.75
b
0.20
0.25
0.30
D
2.00 BSC.
e
0.50 BSC.
E
2.00 BSC.
L
0.30
0.35
aaa
0.10
bbb
0.10
ccc
0.08
ddd
0.10
0.40
Notes:
1. All dimensions shown are in millimeters (mm).
2. Dimensioning and Tolerance per ANSI Y14.5M-1994.
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Si1153 Data Sheet
Modules Outline
10.2 10-Pin LGA Module
The figure below illustrates the package details for the Si1153 DFN package while the table lists the values for the dimensions shown in
the illustration.
Figure 10.2. DFN Package Diagram Dimensions
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Si1153 Data Sheet
Modules Outline
Table 10.2. 10-Pin LGA Module Package Diagram Dimensions
Dimension
Min
Nom
Max
A
1.10
1.20
1.30
A1
0.28
0.30
0.32
b
0.55
0.60
0.65
D
4.90 BSC
D1
4.00 BSC
e
1.00 BSC
E
2.85 BSC
E1
1.95 BSC
f
1.56 BSC
g
1.44 BSC
H1
0.98
1.03
1.08
H2
1.19
1.24
1.29
L
0.55
0.60
0.65
y
3° REF
aaa
0.10
bbb
0.10
ccc
0.08
ddd
0.10
eee
0.10
fff
0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
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Si1153 Data Sheet
Land Patterns
11. Land Patterns
11.1 2x2 mm DFN Land Pattern
See the figure and table below for the suggested 2 x 2 mm DFN PCB land pattern.
Figure 11.1. 2 x 2 mm DFN PCB Land Pattern
Table 11.1. Land Pattern Dimensions
Dimension
mm
C1
1.90
C2
1.90
E
0.50
X
0.30
Y
0.80
Notes:
General
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm
minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
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Si1153 Data Sheet
Land Patterns
11.2 10-Pin LGA Module
Figure 11.2. 10-Pin LGA Module Land Pattern
Table 11.2. Land Pattern Dimensions
Dimension
mm
C
2.20
E
1.00
X
1.15
Y
0.65
Notes:
General
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 mm
minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020D specification for Small Body Components.
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Table of Contents
1. Feature List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Ordering Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 Ambient Light Sensing .
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3.2 Proximity Sensing
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3.3 Power Consumption .
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3.4 Host Interface .
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4. Operational Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
4.1 Off Mode
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4.2 Initialization Mode
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4.3 Standby Mode .
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4.4 Forced Conversion Mode .
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4.5 Automated Operation Mode .
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5. User to Sensor Communication . . . . . . . . . . . . . . . . . . . . . . .
11
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5.1 Basic I2C Operation .
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5.2 Relationship Between I2C Registers and Parameter Table .
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.12
5.3 I2C Command Register Operation . . . . . . . . . . . . . . . . .
5.3.1 Accessing the Parameter Table (PARAM_QUERY & PARAM_SET Commands) .
5.3.2 Sensor Operation Initiation Commands. . . . . . . . . . . . . . .
5.3.3 RESET_CMD_CTR Command . . . . . . . . . . . . . . . . .
5.3.4 RESET Command. . . . . . . . . . . . . . . . . . . . . .
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.14
.16
.16
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.16
5.4 I2C Register Summary
5.4.1 PART_ID . . . .
5.4.2 HW_ID . . . .
5.4.3 REV_ID . . . .
5.4.4 INFO0 . . . . .
5.4.5 INFO1 . . . . .
5.4.6 HOSTIN0 . . . .
5.4.7 COMMAND . . .
5.4.8 IRQENABLE. . .
5.4.9 RESPONSE1 . .
5.4.10 RESPONSE0 . .
5.4.11 IRQ_STATUS . .
5.4.12 HOSTOUTx . .
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.17
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.20
.20
6. Measurement: Principle of Operation . . . . . . . . . . . . . . . . . . . . .
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6.1 Output Field Utilization .
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.21
6.2 Autonomous and Forced Modes.
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.23
6.3 Burst Mode .
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.25
6.4 Interrupt Operation .
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.27
Table of Contents
55
6.5 Timing of Channel Measurements .
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.27
7. Parameter Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
29
7.1 Global Area of the Parameter Table
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.30
7.2 Channel Specific Setup Areas of the Parameter Table
7.2.1 ADCCONFIGx . . . . . . . . . . . . .
7.2.2 ADCSENSx . . . . . . . . . . . . . .
7.2.3 ADCPOSTx . . . . . . . . . . . . . .
7.2.4 MEASCONFIGx . . . . . . . . . . . .
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.31
.33
.34
.35
.36
7.3 Photodiode Selection .
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.37
8. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .
38
9. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
48
9.1 DFN Pin Description.
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.48
9.2 Module Pin Description .
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.49
10. Modules Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
50
10.1 10-Pin 2x2 mm DFN .
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.50
10.2 10-Pin LGA Module
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.51
11. Land Patterns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
53
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11.1 2x2 mm DFN Land Pattern .
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.53
11.2 10-Pin LGA Module
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.54
Table of Contents
56
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Smart.
Connected.
Energy-Friendly
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Quality
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Disclaimer
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories
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