Process Change Notice #0912242 ____________________________________________________________________________________________________ User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content available only to registered users. http://www.silabs.com/profile PCN Date: 24Dec09 Effective Date: 24Mar10 Title: Si53x/55x/57x XO/VCXOs Second Source Assembly Site Originator: Juan Conchas Phone: 512-532-5245 Dept: Wireline Customer Contact: Kathy Haggar Phone: 512-532-5261 Dept: Sales PCN Type: Assembly Discontinuance Package Datasheet Fabrication Product Revision Packing Labeling Location Test Other Last Order Date: N/A PCN Details Description of Change: Silicon Labs is announcing the addition of a second source assembly site for Si53x/55x/57x XO/VCXO devices. Reason for Change: A second assembly site has been added to increase manufacturing capacity and to help ensure business continuity planning. Impact on Form, Fit, Function, Quality, Reliability: There is no impact on form, fit, function, quality and reliability. Assembly materials and processes have been qualified to match the specifications provided by the current site. The crystal matches mechanical dimensions and electrical properties of the current crystal including frequency of operation, plating material and AT-cut angle. Product Identification: Si5xx XO/VCXO products marked with date code 0945 or later may be sourced from either the current assembly vendor or SIWARD as determined by Silicon Labs after the Effective Date of this PCN. Orderable part numbers affected begin with: 520, 530, 531, 532, 533, 534, 550, 552, 554, 570 & 571. Part numbers and top mark conventions remain unchanged between the two sites. For purposes of traceability, Silicon Labs can identify the assembly site of each device. SIWARD is certified to ISO9001, ISO14001 and ISO/TS16949 and is a Sony Green Partner. Last Date of Unchanged Product: 24Mar10 Qualification Samples: Qualification samples are available upon request. Please contact your local Silicon Laboratories sales representative to order samples. A list of authorized sales representatives may be found at www.silabs.com W7206F1 Process Change Notice Form rev U The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1 Process Change Notice #0912242 ____________________________________________________________________________________________________ Customer Early Acceptance Sign Off: Customers may approve early PCN acceptance by completing the information below: Early Acceptance Date: Name: Company: Email your early Acceptance approval to: [email protected] Qualification Data: Please see Appendix A for the Qualification Report The following plots provide frequency versus temperature data for the current assembly site and crystal and the second source assembly site and crystal. The AT-cut angle of both crystals is well controlled and both assembly processes provide identical frequency stability over temperature. Frequency Deviation vs Temperature Current Assembly Site +/-20ppm Temperature Drift Option 25 Frequency Deviation (PPM) 20 15 10 5 0 -5 -10 -15 -20 -25 -40 -30 -20 -10 0 10 20 30 40 50 60 40 50 60 70 80 90 Temperature (°C) Frequency Deviation vs Temperature Second Source Assembly Site +/-20ppm Temperature Drift Option 25 Frequency Deviation (PPM) 20 15 10 5 0 -5 -10 -15 -20 -25 -40 -30 -20 -10 0 10 20 30 70 80 90 Temperature (°C) W7206F1 Process Change Notice Form rev U The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2 Process Change Notice #0912242 ____________________________________________________________________________________________________ The following plots show the aging performance of the current and second source assembly sites. Tight grouping of frequency shift over time as well as extrapolated aging that meets the specified ±10ppm limit over 15 years shows that both processes produce compatible results. Second Source Assembly Site Frequency Aging 10 8 PPM Shift 6 4 2 0 -2 -4 -6 -8 -10 1.00 10.00 100.00 Number of Days 1000.00 10000.00 Current Assembly Site Frequency Aging 10 8 PPM Shift 6 4 2 0 -2 -4 -6 -8 -10 1.00 10.00 100.00 1000.00 10000.00 Number of Days W7206F1 Process Change Notice Form rev U The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3 Process Change Notice #0912242 ____________________________________________________________________________________________________ Appendix A: Qualification Report W7101F1 Product Qualification Plan and Report Rev. C The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or w hole w ithout Silicon Laboratories’ w ritten consent. The document is uncontrolled if printed or electronically saved. Part Rev D, TSMC Fabrication TEST NAME Die Qualification Tests TEST CONDITION High Temp Operating Life JA108 110°C, Dynamic QUALIFICATION Lot ID or Start Fail/Pass or End Q24624 0/80 3 lots, N=>77 Q24672 0/80 Q26037 0/80 Q24520 0/402 Q24548 0/512 Vcc=3.6V for 1000 hours ELFR JA108 Summary Notes Status 1, 3 0/240 1 Pass 1, 4 1, 5 110°C, Dynamic 3 lots, N>=500 Vcc=3.6V for 48 hours JA114 Q25680 0/505 1 lot / 3 devices Q24784 0/3 2,500 V 1 Pass ESD: Machine Model JA115 1 lot / 3 devices Q24785 0/3 250 V 1 Pass ESD: Charged Device Model JC101 1 lot / 3 devices Q27896 0/3 750 V 2 Pass Latch-up JESD78, ±200mA 1 lot / 6 devices Q24740 0/6 70 °C 1 Pass Q27809 0/25 Q27810 0/30 Q27811 0/25 ESD: Human Body Model 0/1419 1 Pass 1 Siward Package Qualification Tests High Temp Storage Life JA103 150°C for 1000 hours Temperature Cycling 3 lots, N=>25 JA104 Q27806 0/25 3 lots, N=>25 Q27807 0/25 Damp Heat 1000 cycles IEC 68-2-3 1 lot, N => 35 Q27808 Q27814 0/25 0/35 Mechanical Shock JESD22-B104, Cond. B 3 lot, N => 45 Mechanical Vibration JESD22-B103, Cond. 1 3 lot, N => 45 Internal Water Vapor Residual Gas Analysis 3 lot, N = 1 Resistance to Solder Heat Solderability MIL-STD-883, Method 2036, 1 lot, N => 15 Cond B MIL-STD-883, Method 1 lot, N => 15 2003.8 Q27817 Q28024 Q28026 Q27817 Q28025 Q28027 Q27819 Q27819 Q27819 Q27980 0/45 0/45 0/45 0/45 0/45 0/45 0/1 0/1 0/1 0/15 Q27849 0/15 Cond B: -55°C to 125°C Notes: 1 - TXC assembled parts 2 - Siward assembled parts 3 - 2000 hours total on this lot 4 - 2267 hours total on this lot 5 - Stress run at 125°C 2 0/80 2 Pass 2 2 0/75 2 Pass 0/39 2 2 Pass 0/15 2 2 2 2 2 2 2 2 2 2 0/15 2 0/135 0/135 0/3 Pass Pass Pass Pass Pass This report applies to the following part number series 520 533 554 530 534 570 531 550 571 532 552 W7206F1 Process Change Notice Form rev U The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4