711AV

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
XDFN6 1.40x1.35, 0.4P
CASE 711AV
ISSUE A
SCALE 4:1
DATE 04 JUN 2014
PIN 1
REFERENCE
ÎÎ
ÎÎ
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
E
0.10 C
2X
L
L
A B
D
L1
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
ALTERNATE TERMINAL
CONSTRUCTIONS
0.10 C
TOP VIEW
ÏÏ
ÏÏ
ÎÎ
EXPOSED Cu
A
DETAIL B
(A3)
A1
0.10 C
6X
MOLD CMPD
DETAIL B
0.08 C
C
SIDE VIEW
GENERIC
MARKING DIAGRAM*
XXMG
G
4
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
6X
L
DETAIL A
6
ALTERNATE
CONSTRUCTION
3
e
1
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.40
0.50
0.00
0.05
0.15 REF
0.15
0.25
1.40 BSC
1.35 BSC
0.40 BSC
0.40
0.60
--0.15
6X
BOTTOM VIEW
b
(Note: Microdot may be in either location)
0.10
M
C A B
0.05
M
C
NOTE 3
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
0.40
PITCH
6X
0.65
1.55
1
0.50
5X
0.25
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON83554F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
XDFN6 1.40X1.35, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON83554F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
25 MAR 2014
A
CHANGED DIMENSION A3 FROM 0.13 TO 0.15. REQ. BY D. TRUHITTE.
04 JUN 2014
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. A
Case Outline Number:
711AV