Telegesis™
TG-PM-0511-ETRX358x-LRS r5
ETRX358x-LRS and ETRX358xHR-LRS
Product Manual
Telegesis™ is a trademark of Silicon Laboratories Inc.
ETRX358x-LRS ZIGBEE ® MODULES
PRODUCT MANUAL
©2016 Silicon Labs
ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358xHR-LRS
Table of Contents
1
1.1
2
2.1
2.1.1
2.2
2.2.1
2.3
2.4
2.5
2.6
INTRODUCTION ................................................................................................................. 5
Hardware Description ....................................................................................................... 5
PRODUCT APPROVALS ................................................................................................... 7
FCC Approvals ................................................................................................................. 7
FCC Labelling Requirements ........................................................................................... 8
IC (Industry Canada) Approvals ....................................................................................... 8
IC Labelling Requirements ............................................................................................... 9
European Certification .................................................................................................... 10
Declarations of Conformity ............................................................................................. 10
IEEE 802.15.4 ................................................................................................................ 10
The ZigBee Protocol ...................................................................................................... 11
3
MODULE PINOUT ............................................................................................................ 12
4
HARDWARE DESCRIPTION ............................................................................................ 14
4.1
5
5.1
5.2
5.3
6
6.1
6.2
Hardware Interface......................................................................................................... 14
FIRMWARE DESCRIPTION ............................................................................................. 15
Token Settings ............................................................................................................... 16
Custom Firmware ........................................................................................................... 16
Boost Mode vs. Normal Mode ........................................................................................ 16
ABSOLUTE MAXIMUM RATINGS ................................................................................... 17
Environmental Characteristics ........................................................................................ 17
Recommended Operating Conditions............................................................................. 17
7
DC ELECTRICAL CHARACTERISTICS ........................................................................... 18
8
DIGITAL I/O SPECIFICATIONS ....................................................................................... 20
9
A/D CONVERTER CHARACTERISTICS .......................................................................... 21
10
AC ELECTRICAL CHARACTERISTICS ........................................................................... 21
10.1
10.2
10.3
TX Power Characteristics ............................................................................................... 23
Power Settings for Regulatory Compliance .................................................................... 25
Temperature behaviour .................................................................................................. 26
11
PHYSICAL DIMENSIONS................................................................................................. 27
12
RECOMMENDED REFLOW PROFILE ............................................................................. 28
13
PRODUCT LABEL DRAWING ......................................................................................... 29
14
RECOMMENDED FOOTPRINT ........................................................................................ 30
14.1
14.2
Recommended Placement ............................................................................................. 32
Example carrier board .................................................................................................... 34
15
RELIABILITY TESTS ........................................................................................................ 35
16
APPLICATION NOTES ..................................................................................................... 35
16.1
16.2
16.3
17
Safety Precautions ......................................................................................................... 35
Design Engineering Notes .............................................................................................. 35
Storage Conditions......................................................................................................... 36
PACKAGING .................................................................................................................... 37
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358xHR-LRS
17.1
17.2
17.3
17.4
Embossed Tape ............................................................................................................. 37
Component Orientation .................................................................................................. 38
Reel Dimensions ............................................................................................................ 38
Packaging ...................................................................................................................... 39
18
ORDERING INFORMATION ............................................................................................. 40
19
ROHS DECLARATION ..................................................................................................... 41
20
DATA SHEET STATUS .................................................................................................... 41
21
RELATED DOCUMENTS ................................................................................................. 41
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
The Telegesis ETRX358x-LRS and ETRX358xHR-LRS modules
are low power 2.4GHz ZigBee modules with an added frontend
module (SiGe SE2432L) containing both PA and LNA for highest
possible link budget.
Based on the latest Ember EM358x family of single chip ZigBee
solutions the new long range modules are footprint compatible
with the entire Telegesis ETRX3 family, thus representing a
drop-in replacement for all applications where a high link budget
is required.
For custom application development the ETRX358x series
integrates with ease into Ember’s InSight development
environment.
Image not shown actual size; enlarged to show detail.
Module Features
Small form factor, SMT module 25mm x 19mm
Same footprint and pin-out as ETRX357-LRS
Side Castellations for easy soldering and inspection
Two antenna options: Integrated chip antenna or U.FL
coaxial connector
Based on 32-bit ARM® Cortex-M3
Industry standard JTAG Programming and real time
network level debugging via the Ember Debug Port
Up to 512kB of flash and 64kbytes of RAM
Lowest Deep Sleep Current of sub 1µA with retained
RAM and GPIO and multiple sleep modes
Ultra Wide supply voltage range (2.1 to 3.6V)
Optional 32.768kHz watch crystal can be added
externally
Can act as an End Device, Router or Coordinator
22 general-purpose I/O lines including analogue inputs
Firmware upgrades via serial port or over the air
(password protected)
Hardware supported encryption (AES-128)
CE and FCC and IC compliance, IC and FCC modular
approval
Operating temperature range: -40°C to +85°C
Standard version without LNA and PA available in the
same form factor
Suggested Applications
ZigBee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control
Development Kit
Enhancement kit available to upgrade existing
Telegesis and Ember development kits to be used with
the new ETRX358x family
Custom software development available upon request.
Radio Features
Based on the Silicon Labs EM358x family of single chip
ZigBee® SoCs
2.4GHz ISM Band
250kbit/s over the air data rate – NB: actual usable data
throughput with ZigBee is about 20kbps
15 channels (IEEE802.15.4 Channel 11 to 25)
SiGe SE2432L integrated PA and LNA
+20dBm output power (adjustable down to -41dBm)
High sensitivity of -106dBm typ. @ 1% packet error rate
RX Current: 33mA, TX Current: approx 140mA at 20dBm
Robust Wi-Fi and Bluetooth coexistence
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
1 Introduction
This document describes the Telegesis ETRX358x-LRS and ETRX358xHR-LRS ZigBee long range
modules which have been designed to be easily integrated into another device and to provide a fast,
simple and low cost wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Silicon Labs ZigBee compliant platform
consisting of the single chip family of EM358x SoCs combined with the ZigBee PRO compliant
EmberZNet meshing stack.
The ETRX358x-LRS and ETRX358xHR-LRS modules represent an ideal platform for custom
firmware development in conjunction with the Silicon Labs ZigBee development kits.
No RF experience or expertise is required to add this powerful wireless networking capability to your
products. The ETRX358x-LRS and ETRX358xHR-LRS offer fast integration opportunities and the
shortest possible time to market for your product.
1.1
Hardware Description
The main building blocks of the ETRX358x-LRS and ETRX358xHR-LRS are the single chip EM358x
SoC from Silicon Labs, a SiGe SE2432L frontend module combining a Power Amplifier with a Low
Noise Amplifier, a 24MHz reference crystal and RF front-end circuitry optimized for best RF
performance. The modules are available with on-board antenna or alternatively a U.FL connector
for attaching external antennae. Modules with the U.FL connector are identified by the “HR” suffix.
The integrated antenna is an Antenova Rufa, and details of the radiation pattern and further data are
available from the Antenova website [5].
Module
ETRX3581-LRS1
ETRX3581HR-LRS 1
ETRX3582-LRS 1
ETRX3582HR-LRS 1
ETRX3585-LRS 1
ETRX3585HR-LRS 1
ETRX3586-LRS 1
ETRX3586HR-LRS 1
ETRX3587-LRS
ETRX3587HR-LRS
ETRX3588-LRS 1
ETRX3588HR1
Chip
EM3581
EM3581
EM3582
EM3582
EM3585
EM3585
EM3586
EM3586
EM3587
EM3587
EM3588
EM3588
Flash
256kB
256kB
256kB
256kB
512kB
512kB
512kB
512kB
512kB
512kB
512kB
512kB
RAM
32kB
32kB
32kB
32kB
32kB
32kB
32kB
32kB
64kB
64kB
64kB
64kB
Antenna
Chip
External
Chip
External
Chip
External
Chip
External
Chip
External
Chip
External
USB
No
No
Yes
Yes
No
No
Yes
Yes
No
No
Yes
Yes
Table 1: Memories
The LNA and RF power amplifier of the LRS devices improve the output power by 12dB and the
sensitivity by 5dB which will increase the range by approximately 700% relative to the standard
devices (where local regulations permit the use of the maximum output power).
1
MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
The ETRX358x and ETRX358xHR are used for ZigBee (www.zigbee.org) applications. In case it is
desired to develop custom firmware, the Silicon Labs toolchain, consisting of Ember Desktop
together with a comprehensive integrated development environment (IDE), is required.
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
2 Product Approvals
The ETRX358x-LRS and ETRX358xHR-LRS have been designed to meet all national regulations
for world-wide use. In particular the following certifications have been obtained:
2.1
FCC Approvals
The Telegesis ETRX358x-LRS family integrated Antenna as well as the ETRX358xHR-LRS family
including the antennas listed in and the power levels listed in section 10.2 have been tested to
comply with FCC CFR Part 15 (USA) The devices meet the requirements for modular transmitter
approval as detailed in the FCC public notice DA00.1407.transmitter.
FCC statement:
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
FCC ID: S4GEM358L
This module complies with the USA SAR requirements and is not intended to be operated within
20cm of the body. The following statement must be included as a CAUTION statement in manuals
for OEM products to alert users on FCC RF exposure compliance.
“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a
separation distance of 20cm or more should be maintained between the antenna of this
device and persons during operation. To ensure compliance, operations at closer distances
than this are not recommended.”
Item Part No.
BT-Stubby
1
(straight)
BT-Stubby
2
(right-angle)
3
CJ-2400-6603
Rufa (on
4
board)
Manufacturer
Type
EAD Ltd. [6]
¼ Wave
EAD Ltd. [6]
¼ Wave
Chang Jia
½ Wave
Antenova
Chip
Impedance Gain
50Ω
0dBi
50Ω
50 Ω
50Ω
0dBi
2.0dBi
2.1dBi
(peak)
Table 2. Approved Antennae
An end user deploying an ETRX358x-LRS or an ETRX358xHR-LRS module together with an
antenna as listed in Table 2 is not required to obtain a new authorization for the module – BUT this
does not preclude the possibility that some other form of authorization or testing may be required for
the end product depending upon local territorial regulations.
The FCC requires the user to be notified that any changes or modifications made to this device that
are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
equipment. When using the ETRX358x-LRS with approved antennae, it is required to prevent endusers from replacing them with non-approved ones.
FCC Labelling Requirements
When integrating the ETRX358x-LRS or ETRX358xHR-LRS families into a product it must be
ensured that the FCC labelling requirements are met. This includes a clearly visible label on the
outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM358L) as
well as the notice above. This exterior label can use wording such as “Contains Transmitter
Module FCC ID: S4GEM358L” or “Contains FCC ID: S4GEM358L” although any similar wording
that expresses the same meaning may be used.
2.2
IC (Industry Canada) Approvals
The Telegesis ETRX358x-LRS family with integrated Antenna as well as the ETRX358xHR-LRS
family have been approved by Industry Canada to operate with the antenna types listed in Table 2
with the maximum permissible gain and required antenna impedance for each antenna type
indicated. Antenna types not included in this list, having a gain greater than the maximum gain
indicated for that type, are strictly prohibited for use with this device.
IC-ID: 8735A-EM358L
This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including interference that may cause undesired
operation of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
permitted for successful communication.
To comply with Industry Canada RF radiation exposure limits for general population, the
antenna(s) used for this transmitter must be installed such that a minimum separation
distance of 20cm is maintained between the radiator (antenna) and all persons at all times
This device has been designed to operate with the antennas listed in Table 2, and having a
maximum gain of 2.1 dBi. Antennas not included in this list or having a gain greater than 2.1
dBi are strictly prohibited for use with this device. The required antenna impedance is 50
ohms.
French Statements
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain
de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication satisfaisante.
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)
l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
OEM Responsibilities
The ETRX358x-LRS and ETRX358x-LRS families of module have been certified for integration into
products only by OEM integrators under the following conditions:
1. The antenna(s) must be installed such that a minimum separation distance of 0.75cm is
maintained between the radiator (antenna) and all persons at all times.
2. The transmitter module must not be co-located or operating in conjunction with any other
antenna or transmitter.
As long as the two conditions above are met, further transmitter testing will not be required. However,
the OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed (for example, digital device emissions, PC
peripheral requirements, etc.).
IMPORTANT NOTE: In the event that these conditions can not be met (for certain configurations or
co-location with another transmitter), then Industry Canada certification is no longer considered valid
and the IC Certification Number can not be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and
obtaining a separate Industry Canada authorization.
IC Labelling Requirements
The ETRX358x-LRS and ETRX358xHR-LRS family modules are labelled with its own IC Certification
Number. If the IC Certification Number is not visible when the module is installed inside another device,
then the outside of the device into which the module is installed must also display a label referring to the
enclosed module. In that case, the final end product must be labelled in a visible area with the following:
“Contains Transmitter Module IC: 8735A-EM358L”
or
“Contains IC: 8735A-EM358L”
The OEM of the ETRX358x-LRS and ETRX358xHR-LRS family modules must only use the approved
antenna(s) listed above, which have been certified with this module.
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module or change RF related parameters in the user’s manual of the end
product.
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
2.3
European Certification
The ETRX358x and ETRX358xHR families are with the maximum power settings defined in section
10.2 of this document compliant to the following standards:
Radio:
EN 300 328:V1.8.1
Safety:
EN 60950-1:2006 / A12:2011
All tests have been conducted with the antennae listed in Table 2.
If the ETRX358x-LRS and ETRX358xHR-LRS families of modules are incorporated into an OEM
product, the OEM product manufacturer must ensure compliance of the final product to the European
Harmonised EMC, and low voltage/safety standards. A Declaration of Conformity must be issued for
each of these standards and kept on file as described in the R&TTE Directive. The final product must
not exceed the specified power ratings, antenna specifications and installation requirements as
specified in this user manual. If any of these specifications are exceeded in the final product then a
submission must be made to a notified body for compliance testing to all of the required standards.
The ‘CE’ marking must be applied to a visible location on any OEM product. For more information
please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm. Customers assume full responsibility
for learning and meeting the required guidelines for each country in their distribution market.
2.4
Declarations of Conformity
Telegesis (UK) Ltd has issued Declarations of Conformity for all ETRX3 series ZigBee RF Modules,
which cover Radio Emissions and Safety. These documents will be available from our website or
on request
2.5
IEEE 802.15.4
IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
2.6
The ZigBee Protocol
The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices over
short to medium distances. The specification was originally ratified in December 2004, paving the
way for companies to start making low-power networks a reality.
ZigBee uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional
layers for networking, security and applications. What makes the specification unique is its use of a
mesh network architecture which, in bucket chain style, passes data from one node to the next until
it lands at its destination. The network is self-healing and adapts its routing as link quality changes
or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers,
but can therefore be put into a low-power sleep state.
The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,
adding new features and improvements to the only global wireless communication standard enabling
the development of easily deployable low-cost, low-power, monitoring and control products for
homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced
the PRO feature-set which offers advantages over earlier feature-sets, including
Truly self-healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
3 Module Pinout
Figure 1. ETRX3 series Module Pinout (top view)
The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series
modules to the application board. For more information on the alternate functions please refer to [2].
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally.
ETRX358x
pad
Name
Default
Use
Alternate
function
EM35x
pin
1
GND
GND
2
PC5 {1}
I/O
3
4
5
6
7
8
9
10
11
12
13
14
PC6
PC7
PA7 {4}
PB3 {2}
nReset {4}
PB4 {2}
PA0
PA1
PA2
PA3
GND
PA4
I/O
I/O
I/O
I/O
nReset
I/O
I/O
I/O
I/O
I/O
GND
I/O
15
PA5 {3}
I/O
27
16
PA6 {4}
I/O
29
17
PB1
TXD
30
18
PB2
RXD
31
©2016 Silicon Labs
Alternate functions
GND
TX_ACTIVE
CTS
RTS
11
13
14
18
19
12
20
21
22
24
25
GND
26
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TX_ACTIVE. PC5 of the EM35x is used to
control the FEM
OSC32B, nTX_ACTIVE
OSC32A, OSC32_EXT
TIM1C4
SC1nCTS, SC1SCLK, TIM2C3
TIM2C4, SC1nRTS, SC1nSSEL
TIM2C1, SC2MOS,USBDM{6}
TIM2C3, SC2SDA, SC2MISO,USBDP{6}
TIM2C4, SC2SCL, SC2SCLK
SC2nSSEL, TRACECLK, TIM2C2
ADC4, PTI_EN, TRACEDATA
ADC5, PTI_DATA, nBOOTMODE,
TRACEDATA3
TIM1C3
SC1MISO, SC1MOSI, SC1SDA, SC1TXD,
TIM2C1
SC1MISO, SC1MOSI, SC1SCL, SC1RXD,
TIM2C2
ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
ETRX358x
pad
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
Name
GND
GND
JTCK
PC2
PC3
PC4
N/C{1}
PC1
PC0 {4}
PB7 {4}
PB6 {4}
PB5
GND
Vcc
GND
Default
Use
GND
GND
JTCK
I/O
I/O
I/O
N/C
I/O
I/O
I/O
I/O
I/O
GND
Vcc
GND
Alternate
function
ADC3
ADC2
ADC1
ADC0
EM35x
pin
GND
GND
32
33
34
35
36
38
40
41
42
43
GND
Vcc
GND
Alternate functions
SWCLK
JTDO, SWO
JTDI
JTMS, SWDIO
PB0 of the EM35x is used to control the FEM
ADC3, SWO, TRACEDATA0
JRST, IRQD, TRACEDATA1
ADC2, IRQC, TIM1C2
ADC1, IRQB, TIM1C1
ADC0, TIM2CLK, TIM1MSK
Table 3. Pin Information
Notes:
{1} When the alternate GPIO function is selected, TX_ACTIVE becomes an output that indicates that the
EM35x radio transceiver is in transmit mode. PC5 must not be used in this mode as it is needed
internally as TX_ACTIVE to control the external RF front end and power amplifier. PB0 is not available
to the user.
{2} The serial UART connections TXD, RXD, CTS and RTS are PB1, PB2, PB3 and PB4 respectively
{4} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{5} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 8)
{6} nRESET is level-sensitive, not edge-sensitive. The module is held in the reset state while nRESET is
low. This signal has a 30kΩ Pull-Up.
{7} ETRX3588, ETRX3586, ETRX3582 and ETRX3588HR, ETRX3586HR, ETRX3582HR variants only
Important Note: The ETRX358x series and the ETRX358x-LRS series of modules are footprint
compatible, but on the ETRX358x-LRS series pins PB0 and PC5 of the EM358x are used internally
to control the front-end module and are not available to the user. PC5 is still available on Pad2, but
it is configured as TX_ACTIVE signal and cannot be used as a general purpose GPIO.
See also the table “Module pads and functions” in the ETRX357 Development Kit Product Manual.
Refer to the Silicon Labs EM358x manual for details of the alternate functions and pin names.
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
4 Hardware Description
Vreg
Vcc
I/O
LDO
1V8
1,8Vdc
integrated
antenna
LDO
1V25
A/D
EM358x
USB*
Match
RESET
Match
5
FEM
rf
U.FL socket terminal
selection,
filtering and
matching
circuitry
I/O
UART
JTAG
RESET
programming
24MHz
*not available on all Types
Figure 2. Hardware Diagram
The ETRX358x-LRS and ETRX358x-LRS are based on the Silicon Labs EM358x family of ZigBee
SoCs in addition to a frontend module containing a PA, LNA and RF switch in addition to the RFfrontend circuitry. The EM358x family of ZigBee SoCs are fully integrated 2.4GHz ZigBee
transceivers with a 32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and
peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM system debug components help to streamline any custom software development.
In addition to this a number of MAC functions are also implemented in hardware to help maintain the
strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new powerdown modes allow this 3rd generation module to offer a longer battery life than any 2nd generation
modules on the market.
The EM358x has fully integrated voltage regulators for both required 1.8V and 1.25V supply
voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit
eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be
connected externally to pads 3 and 4 in case more accurate timing is required.
4.1
Hardware Interface
All GPIO pins of the EM358x chips are accessible on the module’s pads. Whether signals are used
as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When
developing custom firmware please refer to the EM358x datasheet [2].
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
5 Firmware Description
By default, the modules will be pre-loaded with a standalone bootloader which supports over-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and powercycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure
not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A pull-up is not
required).
Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory.
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a coordinator and Trust Centre through external host control.
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
5.1
Token Settings
The ETRX358x-LRS Series Modules’ manufacturing tokens will be pre-programmed with the
settings shown in the table below.
Token
MFG_CIB_OBS
MFG_CUSTOM_VERSION
MFG_CUSTOM_EUI_64
MFG_STRING
MFG_BOARD_NAME
MFG_MANUF_ID
MFG_PHY_CONFIG
MFG_BOOTLOAD_AES_KEY
MFG_EZSP_STORAGE
MFG_CBKE_DATA
MFG_INSTALLATION_CODE
MFG_OSC24M_BIAS_TRIM
MFG_SYNTH_FREQ_OFFSET
MFG_OSC24M_SETTLE_DELAY
MFG_SECURITY_CONFIG
MFG_CCA_THRESHOLD
MFG_SECURE_BOOTLOADER_KEY
Description
Option Bytes
Optional Version Number
Custom EUI
Device Specific String
Hardware Identifier
Manufacturer ID
Default Power Settings
Bootloader Key
EZSP related
SE Security
SE Installation
Crystal Bias
Frequency offset
Crystal Stabilizing Time
Security Settings
CCA Threshold
Secure Bootloader Key
TG Default
<not written>
<not written>
<not written>
TELEGESIS
<Order Code>
0x1010
0xFFFD
<not written>
<not written>
<not written>
<not written>
<not written>
<not written>
<not written>
<not written>
0xFEBF
<not written>
Table 4. Manufacturing tokens
5.2
Custom Firmware
The ETRX358x-LRS series of modules is an ideal platform for developing custom firmware. In order
to develop custom firmware the Silicon Labs Ember toolchain is required.
When writing firmware for the ETRX358x-LRS it is important to ensure that pins PB0 and PC5 are
correctly configured in order that the RF front-end module can operate correctly. An application note
“Writing customised firmware for the ETRX35x-LRS” can be downloaded from the Telegesis website.
5.3
Boost Mode vs. Normal Mode
The Ember EM358x chips support a “boost mode” power setting next to the “normal mode” power
setting. The “boost mode” setting increases the sensitivity and output power of the radio transceiver,
however with the LRS variants enabling boost mode has no positive effect on neither the output
power nor the sensitivity and therefore it is recommended to not use boost mode on this platform.
Section 10.2 lists the requirements for the maximum power settings for use of the LRS family in
different countries.
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
6 Absolute Maximum Ratings
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
2
Supply voltage
Voltage on any Pad
Voltage on any Pad pin (PA4, PA5,
PB5, PB6, PB7, PC1), when used as an
input to the general purpose ADC with
the low voltage range selected
Module storage temperature range
Reel storage temperature range
Operating temperature range
Input RF level
Reflow temperature
VCC
Vin
-0.3 to +3.6
-0.3 to VCC +0.3
Vdc
Vdc
Vin
-0.3 to +2.0
Vdc
Tstg
Tstrgreel
Top
Pmax
TDeath
-40 to +105
0 to 75
-40 to +85
+6
Please refer to chapter 12
°C
°C
°C
dBm
°C
3
4
5
6
7
8
Table 5: Absolute Maximum Ratings
The absolute maximum ratings given above should under no circumstances be violated. Exceeding
one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
6.1
No.
1
2
3
4
Environmental Characteristics
Item
ESD on any pad according to
Human Body Model (HBM) circuit
description
ESD on non-RF pads according to
Charged Device Model (CDM) circuit
description
ESD on RF terminal (HBM)
Moisture Sensitivity Level
Symbol
Absolute Maximum Ratings
Unit
VTHHBM
2
kV
VTHCDM
400
V
VTHCDM
MSL
1000
MSL3, per J-STD-033
V
Table 6: Absolute Maximum Ratings
6.2
No.
Recommended Operating Conditions
Item
Condition /
Remark
Symbol
Value
Min
1
2
3
4
Supply voltage
RF Input Frequency
RF Input Power
Operating temperature
range
VCC
fC
pIN
2.1
2405
Top
-40
Typ
3.0
Unit
Max
3.6
2480
0
Vdc
MHz
dBm
+85
°C
Table 7. Recommended Operating Conditions
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
7 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE (non-Boost) unless otherwise stated
No.
Item
Condition /
Remark
Symbol
Value
Min
1
Module supply voltage
Deep Sleep Current
Quiescent current,
4kB RAM
2
internal RC oscillator
retained
disabled,
Quiescent current,
4kB RAM
3
internal RC oscillator
retained
enabled
Quiescent current,
4kB RAM
4
including
retained
32.768kHz oscillator
Quiescent current
including internal RC
4kB RAM
5
oscillator and 32.768kHz retained
oscillator
Additional current per
6
4kB block of RAM
retained
Reset Current
Quiescent current
7
nReset asserted
Processor and Peripheral Currents
ARM® CortexTM M3,
25°C, 12MHz
8
RAM and flash memory
Core clock
ARM® CortexTM M3,
25°C, 24MHz
9
RAM and flash memory
Core clock
ARM® CortexTM M3,
25°C, 12MHz
10
RAM and flash memory
Core clock
sleep current
®
TM
ARM Cortex M3,
25°C, 6MHz Core
11
RAM and flash memory
clock
sleep current
Per serial
12
Serial controller current
controller at max.
clock rate
General purpose timer
Per timer at max.
13
current
clock rate
General purpose ADC
Max. Sample
14
current
rate, DMA
15
USB Active Current
USB Suspend Mode
16
Current
RX Current
LNA,Radio receiver
ARM® CortexTM
17
MAC and Baseband
M3 sleeping.
Receive current
Total, 12MHz
18
consumption
clock speed
Receive current
Total, 24MHz
19
consumption
clock speed
©2016 Silicon Labs
VCC
Unit
Typ
2.1
Max
3.6
Vdc
ISLEEP
1.0
µA
ISLEEP
1.25
µA
ISLEEP
1.6
µA
ISLEEP
1.9
µA
IRAMSLEEP
0,067
µA
IRESET
2
IMCU
7.5
mA
IMCU
8.5
mA
IMCU
4.0
mA
IMCU
2.5
mA
ISC
0.2
mA
ITIM
0.25
mA
IADC
1.1
mA
IUSB
1
mA
IUSBSUSP
3
2.5
mA
mA
IRX
26.5
mA
IRX
30
mA
IRX
31.5
mA
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
TX Current
20
Transmit current
consumption
Transmit Current
consumption
Sleep Modes & Peripheral Current
MCU, RAM and flash,
22
FEM, radio off
MCU, RAM and flash,
23
FEM, radio off
24
Serial Controller
25
Timer
26
ADC
21
at +20dBm
module output
power
at min module
output power
12MHz clock
speed
24MHz clock
speed
Max data rate
Max clock rate
Max sample rate
ITXVCC
140
mA
ITXVCC
52
mA
IMCU
7
mA
IMCU
8
mA
ISC
ITMR
IADC
0.2
0.25
1.1
mA
mA
mA
Table 8: DC Electrical Characteristics
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
8 Digital I/O Specifications
The digital I/Os of the ETRX358x-LRS module have the ratings shown below.
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No.
Item
Condition /
Remark
Symbol
Value
Min
1
Low Schmitt switching
threshold
2
High Schmitt switching
threshold
3
4
5
6
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-down resistor
value
7
Output voltage for logic 0
8
Output voltage for logic 1
9
Output Source Current
10
Output Sink current
11
12
13
Output Source Current
Output Sink current
Total output current
Typ
Max
VSWIL
0.42 x VCC
0.5 x VCC
Vdc
VSWIH
0.62 x VCC
0.8 x VCC
MHz
-0.5
0.5
µA
µA
IIL
IIH
IOL = 4mA (8mA) for
standard (high
current) pads
IOH = 4mA (8mA)for
standard (high
current) pads
Standard current
pad
Standard current
pad
High current pad (1)
High current pad (1)
Unit
RIPU
24
29
34
kΩ
RIPD
24
29
34
kΩ
VOL
0
0.18 x VCC
V
VOH
0.82 x VCC
VCC
V
IOHS
4
mA
IOLS
4
mA
IOHH
IOLH
IOH + IOL
8
8
40
mA
mA
mA
Table 9. Digital I/O Specifications
No.
Item
Condition /
Remark
Symbol
Value
Min
1
Low Schmitt switching
threshold
2
High Schmitt switching
threshold
3
4
5
6
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-up resistor
value
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Unit
Typ
Max
VSWIL
0.42 x VCC
0.5 x VCC
Vdc
VSWIH
0.62 x VCC
0.68 x VCC
Vdc
-0.5
0.5
µA
µA
IIL
IIH
Chip not reset
RIPU
24
29
34
kΩ
Chip reset
RIPURESET
12
14.5
17
kΩ
Table 10. nReset Pin Specifications
Notes
1) High current pads are PA6, PA7, PB6, PB7, PC0
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
9 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to the EM358x datasheet.
No.
1
2
3
4
Item
A/D resolution
A/D sample time for 7-bit conversion
A/D sample time for 14-bit conversion
Reference Voltage
Up to 14 bits
5.33µs (188kHz)
682µs
1.2V
Table 11. A/D Converter Characteristics
10 AC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50 terminal load connected to the U.FL socket
No.
Receiver
Value
Typ
Min
1
2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Frequency range
Sensitivity for 1% Packet Error Rate (PER)
Saturation (maximum input level for correct operation)
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Carrier frequency error
2400
-107
-3
-106
2
Unit
Max
2500
-100
MHz
dBm
dBm
41
dB
40
dB
54
dB
52
dB
tbd
dB
tbd
dB
tbd
dBc
-120
120
ppm
-120
120
ppm
35
dB
20
20
-40
21
21
21.5
21.5
dBm
7
-40
15
40
dBm
%
ppm
Table 12. AC Electrical Characteristics
Please Note: For the relationship between EM358x power settings and module output power please
relate to chapter 10.1 of this document. When developing custom firmware the output power settings
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
described in this document relate directly to the EM358x power settings accessible via the Ember
stack API.
No.
Synthesiser Characteristics
Limit
Typ
Min
22
23
24
25
26
27
28
29
Frequency range
Frequency resolution
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Phase noise at 100kHz offset
Phase noise at 1MHz offset
Phase noise at 4MHz offset
Phase noise at 10MHz offset
2400
11.7
Unit
Max
2500 MHz
kHz
100 µs
100 µs
-71dBc/Hz
-91dBc/Hz
-103dBc/Hz
-111dBc/Hz
Table 13. Synthesiser Characteristics
No.
30
31
Power On Reset (POR) Specifications
VCC POR release
VCC POR assert
Min
Limit
Typ
Max
Unit
0.62
0.45
0.95
0.65
1.2
0.85
Limit
Typ
Max
Vdc
Vdc
Table 14. Power On Reset Specifications
No.
nRESET Specifications
Min
32
33
34
Reset Filter Time constant
Reset Pulse width to guarantee a reset
Reset Pulse width guaranteed not to cause reset
2.1
26
0
12
Unit
16
1
µs
µs
µs
Table 15. nReset Specifications
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
10.1 TX Power Characteristics
The diagrams below show the typical output power and module current in dependency on EM358xLRS power setting in NORMAL MODE at 3.6V and room temperature.
Pin vs. Pout
25
20
Pout [dBm]
15
Channel
11
Channel
19
10
5
0
-5
-30
-25
-20
-15
-10
-5
0
5
10
Pin setting of EM35x [dBm]
Figure 3. Output Power vs. Power Setting
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
Pin vs. Current Consumption
300
250
I in mA
200
Channel
11
Channel
19
150
100
50
0
-30
-25
-20
-15
-10
-5
0
5
10
Pin setting of EM35x [dBm]
Figure 4. Module Current vs. Power Setting
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
10.2 Power Settings for Regulatory Compliance
Because of the high gain of the frontend module output power of up to 22dBm can be achieved
When the antenna gain is included the output power of the EM358x transceivers needs to be reduced
for regulatory compliance. The following tables list the maximum permitted power setting for the
antenna types listed in Table 2. Note that this is the power out of the EM358x chip, and the power
delivered to the antenna will be higher by the gain of the RF power amplifier.
(VCC = 3.3V, TAMB = 25°C, NORMAL MODE)
Antenna
1/2 Wave
1/4 Wave
On Board
Channels 11-24
-17
-17
-17
Channel 25
-17
-17
-17
Channel 26
-17
-17
-17
Table 16: Maximum Power Settings for European Compliance
Finally Table 17 the maximum Power settings for FCC and IC compliance.
Antenna
1/2 Wave
1/4 Wave
On Board
Channels 11-24
-8
-8
-7
Channel 25
-12
-8
-7
Channel 26
-43
-26
-26
Table 17: Maximum Power Settings for FCC, IC Compliance
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
10.3 Temperature behaviour
Figure 5 and Figure 6 illustrate the temperature behaviour of the ETRX358x-LRS series of
modules. Please note that although the temperature behaviour was measured to up to 100
degrees Celsius the absolute maximum rating is 85 degrees Celsius.
Figure 5. Sensitivity vs. Temperature
Figure 6. TX Power vs. Temperature
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
11 Physical Dimensions
Figure 7. ETRX3 Physical Dimensions
Symbol
Explanation
L
W
H
A1
A2
R1
R2
X1
X2
Length of the module
Width of the module
Height of the module
Distance centre of pad PCB edge
Pitch
Keep-out Zone from corner of PCB
Keep-out Zone from corner of PCB
Distance centre of Antenna connector PCB edge
Distance centre of Antenna connector PCB edge
Distance
25.0mm
19.0mm
3.8mm
0.9mm
1.27mm
17.5mm
4.1mm
3.8mm
2.8mm
Table 18. ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no components, tracks or copper planes in the “keepout” area which should be as large as possible. When using the U.FL RF connector the “keep-out”
area does not have to be kept. NB: The modules’ transmit/receive range will depend on the antenna
used and also the housing of the finished product.
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
12 Recommended Reflow Profile
Recommended temperature profile
for reflow soldering
60 +60-20s
Temp.[°C]
230°C -250°C max.
220°C
150°C – 200°C
90 30s
Time [s]
Figure 8. Recommended Reflow Profile
Use of “No-Clean” solder paste is recommended to avoid the requirement for a cleaning process.
Cleaning the module is strongly discouraged because it will be difficult to ensure no cleaning agent
and other residuals are remaining underneath the shielding can as well as in the gap between the
module and the host board.
Please Note:
Maximum number of reflow cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your PCB and re-flow).
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
13 Product Label Drawing
Figure 9. Product Label
The label dimensions are 16mm x 14 mm. The label will withstand temperatures used during reflow
soldering. The characters “HR” are only present on the versions with the Hirose connector,
Imprint
ETRX3587HRLRS
000001
090101
01
02
FCC ID:
S4GEM358L
IC: 8735AEM358L
CE
2D-Barcode
Description
Module Order code Possible codes are:
- ETRX3581-LRS
- ETRX3581HR-LRS
- ETRX3582-LRS
- ETRX3582HR-LRS
- ETRX3585-LRS
- ETRX3585HR-LRS
- ETRX3586-LRS
- ETRX3586HR-LRS
- ETRX3587-LRS
- ETRX3587HR-LRS
- ETRX3588-LRS
- ETRX3588HR-LRS
Indication for the serial number.
Production Date Code in the format YYMMDD, e.g. 090602
Indication for batch number
Indication for the production location (first character) and the hardware
revision (second character)
FCC ID code for this product
The IC ID
The CE Mark
Information in the 2D-Barcode are the serial number [6 characters], the
Part-Order code, identifier for the batch number [2 characters], the
identifier for the hardware release [2 characters] and the production date
code in the format Year-Month-Day [6 characters], all separated by a
semicolon.
Table 19. ETRX358x-LRS Label Details
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
14 Recommended Footprint
In order to surface mount an ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. Unless using the “HR” variants the “keep-out” zone shown in section 11
must be retained, and it must be ensured that this area is free of copper tracks and/or copper
planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
underside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.
Figure 10. Recommended Footprint
The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120μm to 150μm.
Figure 11 shows the typical pad dimensions of the module and Figure 12-Figure 14 in section 14.1
show examples of how to align the module on its host PCB.
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as
through-hole vias, planes or tracks on your board component layer, should be located below the
ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB
containing an inner RF shielding ground plane, therefore there is no need to have an additional
copper plane directly under the ETRX3 series module.
Figure 11. Typical pad dimensions
Finally it is recommended to use no clean flux when soldering the ETRX358x family of modules and
to not use a washing process after reflow. If the process does require washing then care must be
taken that no washing agent is trapped underneath the shielding can after the drying process has
completed.
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
14.1 Recommended Placement
When placing the module please either locate the antenna in the corner as shown in Figure 12 so
that the recommended antenna keepout zone is being followed, or add a no copper zone as
indicated in Figure 14.
Figure 12. Typical placement
Figure 13. How to not place the Module
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
Figure 14. Adding a no copper / no component area
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
14.2 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, shows the reference carrier board which was used
during testing by Telegesis.
Figure 15. Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 11.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice,
but a degradation in radio performance could be the result.
©2016 Silicon Labs
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ETRX358x-LRS Product Manual
ETRX358x-LRS and ETRX358x-LRS
15 Reliability Tests
The following measurements will be conducted after the module has been exposed to standard room
temperature and humidity for 1 hour.
No
Item
Limit
1
Vibration test
Electrical parameter should be
in specification
2
Shock test
the same as the above
3
Heat cycle test
the same as the above
5
6
Low temp. test
High temp. test
the same as the above
the same as the above
Condition
Freq.:40Hz,Amplitude:1.5mm
20min. / cycle,1hrs. each of X and Y axis
Dropped onto hard wood from height of
50cm for 10 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
-40°C, 300h
+85°C, 300h
Table 20: Reliability Tests
16 Application Notes
16.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit
occurs, then provide the following failsafe functions as a minimum:
(1)
(2)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
16.2 Design Engineering Notes
(1)
(2)
(3)
(4)
(5)
(6)
Heat is the major cause of shortening the life of these products. Avoid assembly and
use of the target equipment in conditions where the product’s temperature may exceed
the maximum allowable.
Failure to do so may result in degrading of the product’s functions and damage to the
product.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid
may splash.
In direct sunlight, outdoors, or in a dusty environment
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(7)
(8)
In an environment where condensation occurs.
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOx)
(9) If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
16.3 Storage Conditions
(1)
(2)
(3)
(4)
The module must not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance, may well be adversely affected:
Storage in salty air or in an environment with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3) have
been met, should be avoided.
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17 Packaging
17.1 Embossed Tape
(1)
Dimension of the tape
(2)
Cover tape peel force
Force direction
θ= 10deg
Speed = 300mm/min.
Cover tape peel force
=0.098～0.68N (10～70g)
(3)
Empty pockets
Direction of
gfeed
Empty pockets
more
Components Empty pockets Top cover
tape
NB: Empty pockets in the component packed area will be less than two per reel and those empty
pockets will not be consecutive.
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17.2 Component Orientation
Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the
carrier tape
(top view)
Part No.
Direction
Component Orientation
17.3 Reel Dimensions
(4)
(5)
Quantity per reel: 600 pieces
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
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17.4 Packaging
(6)
(7)
Each reel will be packed in a hermetically-sealed bag
Marking: Reel / Antistatic Packaging / Reel Box and outer Box will carry the following
label
Imprint
Description
MFG P/N: 99X902DL
Lot: 00
P/N:ETRX3587-LRS
Quantity:600
Reel No: 000001
Internal use
Internal use
Telegesis Module Order Code.
Quantity of modules inside the reel/carton
Six digit unique Reel number counting up from 000001
Date:120824
Date Code in the format YYMMDD, e.g. 120824
P/C: ETRX3587-LRSR308
Module product code with reference to firmware/module type selected during ATE. If
needed multiline.
Information in the 32x32 Datamatrix 2D-Barcode are and identifier “!REEL” [5
characters], the reel number [6 characters], the Module Order code [max 18 characters
], the quantity [max 4 characters] , the date code in the format Year-Month-Day [6
characters] and the product code [max 40 characters] , all separated by a semicolon.
2D-Barcode
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18 Ordering Information
Ordering/Product Code
Description
ETRX3581-LRS2
ETRX3582-LRS2
ETRX3585-LRS2
ETRX3586-LRS2
ETRX3587-LRS
ETRX3588-LRS2
Power amplified Telegesis Wireless Mesh Networking Module
with Silicon Labs ZigBee Technology:
ETRX3581HR-LRS2
ETRX3582HR-LRS2
ETRX3585HR-LRS2
ETRX3586HR-LRS2
ETRX3587HR-LRS
ETRX3588HR-LRS2
Power amplified Telegesis Wireless Mesh Networking Module
with Silicon Labs ZigBee Technology:
ETRX357DVK
Telegesis Development Kit with:
ETRX3587 Expansion Pack
Based on Silicon Labs EM358x SoC
Integrated 2.4GHz Antenna
Based on Silicon Labs EM358x SoC
U.FL coaxial Antenna Connector
3 x ETRX3DVK Development Boards
3 x USB cables
2 x ETRX357 on carrier boards
2 x ETRX357HR on carrier boards
2 x ETRX357-LRS on carrier boards
2 x ETRX357HR-LRS on carrier boards
1 x ETRX3USB USB stick
2 x ½-wave antennae
2 x ¼-wave antennae
2 x ETRX3587 on carrier boards
2 x ETRX3587HR on carrier boards
2 x ETRX3587-LRS on carrier boards
2 x ETRX3587HR-LRS on carrier boards
Notes:
Customers’ PO’s must state the Ordering/Product Code.
There is no “blank” version of the ETRX358x modules available.
2
MOQ and Lead Time applies. Only stocked modules are ETRX3587 and ETRX3587HR
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19 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Hereby we declare based on the declaration of our suppliers that this product does not contain any
of the substances which are banned by Directive 2011/65/EU (RoHS2) or if they do, contain a
maximum concentration of 0,1% by weight in homogeneous materials for:
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
Cadmium and cadmium compounds
20 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve
the design and supply the best possible product. Please consult the most recently issued data sheet
before initiating or completing a design.
21 Related Documents
[1]
[2]
[3]
[4]
[5]
[6]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs)
Datasheet EM35x, Ember. (www.ember.com)
Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height
The ZigBee specification (www.zigbee.org)
Specification for Antenova Rufa Antenna (www.antenova.com)
Embedded Antenna design Ltd. (EAD Ltd.) (www.ead-ltd.com)
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Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using
or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and
"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to
make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the
included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses
granted hereunder to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any Life Support System without the specific written consent
of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant
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