ETRX2-PA and ETRX2HR-PA ZigBee® Modules Product Manual

Telegesis™
TG-ETRX2PA-PM-003-110
ETRX2-PA, ETRX2HR-PA
Product Manual 1.10
Telegesis™ is a trademark of Silicon Laboratories Inc.
ETRX2-PA and ETRX2HR-PA ZigBee ® MODULES
PRODUCT MANUAL
©2016 Silicon Labs
ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
Table of Contents
1
1.1
1.2
1.2.1
2
2.1
2.1.1
2.2
2.3
2.4
2.5
2.6
INTRODUCTION ................................................................................................................. 5
Hardware Description ....................................................................................................... 5
Hardware precautions ...................................................................................................... 6
Unexpected start-up in bootloader mode.......................................................................... 6
PRODUCT APPROVALS ................................................................................................... 6
FCC Approvals ................................................................................................................. 6
FCC Labelling Requirements ........................................................................................... 7
IC (Industry Canada) Approvals ....................................................................................... 7
European Certification ...................................................................................................... 8
Declarations of Conformity ............................................................................................... 9
IEEE 802.15.4 .................................................................................................................. 9
The ZigBee Protocol ........................................................................................................ 9
3
MODULE PINOUT ............................................................................................................ 10
4
HARDWARE DESCRIPTION ............................................................................................ 12
5
HARDWARE INTERFACE ................................................................................................ 13
6
FIRMWARE DESCRIPTION ............................................................................................. 14
6.1
6.2
Custom Firmware ........................................................................................................... 14
Software Interface .......................................................................................................... 15
7
ABSOLUTE MAXIMUM RATINGS ................................................................................... 15
8
OPERATING CONDITIONS .............................................................................................. 16
9
DC ELECTRICAL CHARACTERISTICS ........................................................................... 18
10
A/D CONVERTER CHARACTERISTICS .......................................................................... 19
11
AC ELECTRICAL CHARACTERISTICS ........................................................................... 19
11.1
TX Power Characteristics ............................................................................................... 21
12
PHYSICAL DIMENSIONS................................................................................................. 22
13
SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 24
13.1
13.2
For Leaded Solder ......................................................................................................... 24
For Lead-free Solder ...................................................................................................... 24
14
PRODUCT LABEL DRAWINGS ....................................................................................... 25
15
RECOMMENDED FOOTPRINT ........................................................................................ 26
15.1
Example carrier board .................................................................................................... 27
16
RELIABILITY TESTS ........................................................................................................ 28
17
APPLICATION NOTES ..................................................................................................... 28
17.1
Safety Precautions ......................................................................................................... 28
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ETRX2PA
17.2
17.3
18
18.1
18.2
18.3
18.4
Design Engineering Notes .............................................................................................. 28
Storage Conditions......................................................................................................... 29
PACKAGING .................................................................................................................... 30
Embossed Tape ............................................................................................................. 30
Component Orientation .................................................................................................. 31
Reel Dimensions ............................................................................................................ 31
Packaging ...................................................................................................................... 31
19
ORDERING INFORMATION ............................................................................................. 32
20
ROHS DECLARATION ..................................................................................................... 33
21
RELATED DOCUMENTS ................................................................................................. 33
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
ETRX2-PA Summary
The Telegesis ETRX2-PA module is a power
amplified 2.4GHz ISM band transceiver based on the
Ember EM250 single chip ZigBee/IEEE802.15.4
solution. It has been designed to be integrated into
any device without the need for RF experience and
expertise. The form factor of the ETRX2-PA is
identical to the ETRX2, so either module can be
used depending on the range requirements of the
particular application. Utilizing the EmberZNet
meshing and self-healing stack, the ETRX2-PA
enables you to add powerful wireless networking
capability to your products and quickly bring them to
market. The module’s unique AT-style command line
interface allows you to quickly integrate meshing
radio technology without complex software
engineering.
Image not shown actual size; enlarged to show detail.
Module Features

















Small form factor, SMT module 37.5 x 20.5 x 3.2 mm
Same Form Factor as ETRX2
Optional board-to-board or board-to-cable connector
2 RF output options: Integrated ceramic antenna or
Hirose U.FL coaxial connector
XAP2b microcontroller with non intrusive debug
interface (SIF)
128k of flash and 5kbytes of SRAM
UART interface with DMA, hardware I2C and SPI
accessible with custom firmware
Wide supply voltage range (2.7 to 3.5V)
Module ships with standard Telegesis AT-style
software interface based on the EmberZNet meshing
stack.
Can act as ZigBee End Device, Router or Coordinator
12 general-purpose I/O lines and 4 analogue inputs (all
17 GPIOs of the EM250 are accessible)
Supports 4 different power modes
Current consumption below 1µA in deep sleep mode
with self wakeup
Firmware upgrades via RS232 or over the air
(password protected)
Hardware supported encryption (AES-128)
Tested for CE and FCC compliance
Operating temperature range: -40°C to +85°C
Radio Features
 Based
on
the
Ember
EM250
single
chip
ZigBee/IEEE802.15.4 solution
 2.4GHz ISM Band
 250kbit/s over the air data rate – NB: actual usable data
throughput with ZigBee is about 20kbps
 14 channels (802.15.4 Channel 12 to 25)
 Typically 18dBm (63mW) output power
 High sensitivity of up to -97Bm typ. at 1% packet error
rate
 Hardware acceleration for IEEE 802.15.4 compliant
transmissions
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Suggested Applications








ZigBee Smart energy devices
AMR – Automatic Meter Reading
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
PC Peripherals
Item Tracking
Firmware



Supplied with AT command set firmware pre-installed
AT-style software interface command dictionary can
be modified for high volume customers
Custom software development available upon request
Example AT-Style Commands
AT+BCAST
AT+UCAST:<address>
AT+EN
AT+JN
Sends a Broadcast
Sends a Unicast
Establish PAN network
Join any PAN
At power-up the last configuration is loaded from non
volatile S-Registers, which can eliminate the need for an
additional host controller.
ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
1 Introduction
This document describes the Telegesis ETRX2-PA ZigBee module which has been designed to be
integrated into another device and to provide a fast, simple and low cost wireless mesh networking
interface. Unless clearly indicated, its contents also apply to the ETRX2HR-PA module with a
Hirose U.FL coaxial antenna connector in place of the on-board ceramic antenna. The user
cannot convert an ETRX2-PA into an ETRX2HR-PA or vice-versa.
The Telegesis ETRX2-PA module is based on the Ember ZigBee platform consisting of the single
chip EM250 combined with the ZigBee PRO compliant EmberZNet meshing stack. Integration into
a wide range of applications is made easy using a simple AT style command interface and
advanced hardware design.
The configurable functionality often allows the ETRX2-PA wireless meshing module to be used
without an additional host microcontroller saving even more integration time and costs. In addition
to the Telegesis AT Commandset, the ETRX2-PA can be used in with custom build firmware or the
Ember EZSP over UART protocol interface...
No RF experience or expertise is required to add this powerful wireless networking capability to
your products. The ETRX2-PA offers fast integration opportunities and the shortest possible time
to market for your product.
1.1
Hardware Description
The main building blocks of the ETRX2-PA are the single chip EM250 from Ember, a 24MHz
reference crystal and RF front-end circuitry optimized for best RF performance. With single ended
RF output, the module is available with an integrated antenna or 50Ω U.FL coaxial connector.
The integrated antenna is a Johanson 2450AT43A100, and details of the radiation pattern etc are
available from their website [4].
Compared to the ETRX2, the ETRX2-PA module allows extended range of operation by means of
an integrated high efficiency power amplifier inserted in the Tx path.
A low loss LTCC band-pass filter for the 2.4GHz ISM band is added to both the Tx and Rx path.
As a result for Rx mode the immunity against interferers (for example operating at 1.8 GHz) is
improved compared to the standard ETRX2.
The ETRX2-PA is used for ZigBee (www.zigbee.org) applications. If you wish to create your own
custom firmware, and not use the pre-loaded Telegesis AT-Command interface, you will need the
InSight toolchain, consisting of InSight Desktop™ together with a comprehensive integrated
development environment (IDE) and C-language compiler toolchain from SiLabs. The SiLabs
firmware is not suitable for an 802.15.4-only application that does not use the ZigBee layer.
As an alternative to the Telegesis R2xx and R3xx series AT Command interfaces, the ETRX2-PA
can also be supplied with SiLabs’ UART EZSP (Ember ZigBee Serial Protocol) firmware. Please
refer to the Ember EM260 manual for more information on the EZSP.
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
1.2
1.2.1
Hardware precautions
Unexpected start-up in bootloader mode
The bootloader which runs on the ETRX2-PA can be initiated with a firmware command, but it can
also be triggered in hardware. If the A/D2 input (pad 10) is pulled low during the boot-up of the
module it will enter the bootloader routine, so exercise caution when doing hardware design and
ensure that this pin is not grounded during start-up and reset or driven from an analogue voltage
that may be sensed as a logic 0. If unused the pad can be left floating and a pull-up is not
required.
2 Product Approvals
The ETRX2-PA and ETRX2HR-PA have been designed to meet all national regulations for worldwide use. In particular the following certifications have been obtained:
2.1
FCC Approvals
The Telegesis ETRX2-PA and also the ETRX2HR-PA including the antennae listed in Table 1
complies with FCC CFR Part 15 (USA). The devices meet the requirements for modular
transmitter approval as detailed in the FCC public notice DA00.1407.transmitter.
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
FCC ID: T7VEM250B
This module complies with the USA SAR requirements and is not intended to be operated within
20cm of the body. The following statement must be included as a CAUTION statement in manuals
for OEM products to alert users on FCC RF exposure compliance:
“WARNING: To satisfy FCC RF exposure requirements for mobile transmitting devices, a
separation distance of 20cm or more should be maintained between the antenna of this
device and persons during operation. To ensure compliance, operations at closer
distances than this are not recommended.”
Item
1
2
3
4
Part No.
BKR2400
BT-Stubby
(Straight)
BT-Stubby
(right-angle)
2450AT43A100
(on board)
Manufacturer
Embedded Antenna Design Ltd.
Type
½ Wave
Embedded Antenna Design Ltd.
¼ Wave
Embedded Antenna Design Ltd.
¼ Wave
Johanson
Chip
Impedance Gain
50Ω
2 dBi
50Ω
0 dBi
50Ω
50Ω
0 dBi
2dBi
(peak)
Table 1: Approved Antennae
While the applicant for a device into which the ETRX2-PA or ETRX2HR-PA (with an antenna listed
in Table 1) is installed is not required to obtain a new authorization for the module, this does not
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
preclude the possibility that some other form of authorization or testing may be required for the end
product.
The FCC requires the user to be notified that any changes or modifications made to this device
that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
When using the ETRX2HR-PA with approved antennae, it is required to prevent end-users from
replacing them with non-approved ones.
2.1.1
FCC Labelling Requirements
When integrating the ETRX2-PA or ETRX2HR-PA into a product if must be ensured that the FCC
labelling requirements are met. This includes a clearly visible label on the outside of the finished
product specifying the Telegesis FCC identifier (FCC ID: T7VEM250B) as well as the notice
above. This exterior label can use wording such as “Contains Transmitter Module FCC ID:
T7VEM250B” or “Contains FCC ID: T7VEM250B” although any similar wording that expresses
the same meaning may be used.
2.2
IC (Industry Canada) Approvals
The Telegesis ETRX2-PA and ETRX2HR-PA have been approved by Industry Canada to
operate with the antenna types listed in Table1 with the maximum permissible gain and required
antenna impedance for each antenna type indicated. Antenna types not included in this list, having
a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this
device.
IC-ID: 8735A-EM250B
 This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference
that may cause undesired operation of the device.
 Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain
should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not
more than that permitted for successful communication.
 To comply with Industry Canada RF radiation exposure limits for general population, the
antenna(s) used for this transmitter must be installed such that a minimum separation
distance of 20cm is maintained between the radiator (antenna) and all persons at all times
and must not be co-located or operating in conjunction with any other antenna or transmitter.
 This device has been designed to operate with the antennas listed in table 1, and
having a maximum gain of 2.0 dBi. Antennas not included in this list or having a
gain greater than 2.0 dBi are strictly prohibited for use with this device. The required
antenna impedance is 50 ohms.
The labeling requirements for Industry Canada are similar to those of the FCC. Again a clearly
visibly label must be placed on the outside of the finished product stating something like “Contains
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
Transmitter Module, IC: 8735A-EM250B”, although any similar wording that expresses the same
meaning may be used.
The integrator is responsible for the final product to comply to IC ICES-003 and FCC Part 15, Sub.
B – Unintentional Radiators.
2.3
European Certification
The ETRX2-PA and ETRX2HR-PA are certified at a power level of 21.15mW e.i.r.p. (13.2dBm) to
the following standards:



Radio:
EMC:
Safety:
EN 300 328 v1.7.1 (10/2006)
EN 301 489-17 v2.1.1 (09/2008)
EN 60950-1:2006
The ETRX2HR-PA was tested with the antennae listed in Table 1.
If the ETRX2-PA or ETRX2HR-PA module is incorporated into an OEM product, the OEM product
manufacturer must ensure compliance of the final product to the European Harmonised EMC, and
low voltage/safety standards. A Declaration of Conformity must be issued for each of these
standards and kept on file as described in the R&TTE Directive. The final product must not exceed
the specified power ratings, antenna specifications and installation requirements as specified in
this ETRX2-PA user manual. If any of these specifications are exceeded in the final product then a
submission must be made to a notified body for compliance testing to all of the required standards.
The ‘CE’ marking must be applied to a visible location on any OEM product. For more information
please refer to http://ec.europa.eu/enterprise/faq/ce-mark.htm.
Customers assume full
responsibility for learning and meeting the required guidelines for each country in their distribution
market.
Important Note: In Europe the regulations for the 2.4GHz frequency band are only harmonized for
devices with an e.i.r.p. of less than 10mW (10dBm). In the case of e.i.r.p. of more than 10mW the
manufacturer or his authorised representative established within the community or the person
responsible for placing the equipment on the market shall notify the national authority responsible
in the relevant Member State for spectrum management of the intention to place such equipment
on its national market. This notification shall be given no less than four weeks in advance of the
start of placing on the market. In addition to this equipment must also be marked with a warning
symbol to draw the user's attention to the fact that it might not be legal to use the equipment in
every member state.
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
Because of this Telegesis recommends that the user limit the output power to 10mW (10dBm) for
Europe to avoid having to deal with the local authorities for spectrum management of each
relevant member state.
2.4
Declarations of Conformity
Telegesis (UK) Ltd has issued Declarations of Conformity for the ETRX2-PA ZigBee RF Modules,
which cover Radio Emissions, EMC and Safety. These documents are available from our website
or on request
2.5
IEEE 802.15.4
IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee Protocol.
2.6
The ZigBee Protocol
The ZigBee Protocol is a set of standards for wireless connectivity for use between any devices
over short to medium distances. The specification was originally ratified in December 2004, paving
the way for companies to start making low-power networks a reality.
ZigBee uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three
additional layers for networking, security and applications. What makes the specification unique is
its use of a mesh network architecture which, in bucket chain style, passes data from one node to
the next until it lands at its destination. The network is self-healing and adapts its routing as link
quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not
act as routers, but can therefore be put into a low-power sleep state.
The enhanced version of the ZigBee standard (or ZigBee 2006) was released in December 2006,
adding new features and improvements to the only global wireless communication standard
enabling the development of easily deployable low-cost, low-power, monitoring and control
products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee
Alliance produced the very latest edition of the standard including the PRO featureset which offers
advantages over earlier versions, including





Truly self healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options
Based on this latest standard, the Telegesis R3xx firmware for ZigBee PRO allows for



Support for up to 4 external interrupts and 4 analogue inputs
Nodes can be addressed by their EUI as well as their 16 bit NodeID
Some level of interoperability with 3rd party ZigBee PRO compliant nodes
Please note that the R2xx and to some extent the Telegesis AT-Command line interpreter are
based on a private application profile and use the Ember meshing and self-healing stack, so
interoperability with wireless mesh networking solutions from other manufacturers is unlikely when
using this default firmware. For more information on ZigBee compliance and the AT command
interface please refer to the latest AT command dictionary and the ETRX2 user guide.
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
3 Module Pinout
The ETRX2-PA is pin-compatible with the ETRX1, (NB: it has additional pins to the ETRX1). For
all new designs using either ETRX1 or ETRX2 it is recommended that you use the ETRX2 footprint
to ensure the option of future upgrading is guaranteed.
Figure 1: ETRX2-PA Module Pinout
The table below gives details about the 38 module pin signals for direct SMD soldering of the
ETRX2-PA to the application board. The pin numbers shown in brackets () are the related pins of
the EM250. In order to use the ETRX2-PA as a plug-in solution a Harwin 1.27mm pitch connector
can be fitted on the bottom of the ETRX2-PA (Harwin part number M50-3601042). Other
connectors that use the same footprint may also be used, such as a Samtec TFML-110-02-S-D.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally.
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
ETRX2
Pad
Function
EM250 GPIO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
GND
Antenna
GND
I/O9
Vreg {1}
GND
Vcc
GND
A/D1
A/D2
I/O7
I/O6
I/O5
I/O4 or RTS {3}
GND
SIF CLK
SIF MISO
SIF MOSI
SIF LOADB
GND
I/O8
I/O2 or CTS {3}
I/O3
Reset
I/O1
I/O0
TXD
RXD
GND
I/O10
I/O11
GND
VCONT {2}
GND
GND
GND
GND
N/C {4}
GND
ETRX2
Harwin Pin
GND
GPIO 0 (21)
1
2
3
10
3
4
5
6
7
8
9
GND
GND
GPIO 4 (26)
GPIO 5 (27)
GPIO 3 (25)
GPIO 2 (24)
GPIO 1 (22)
GPIO 12 (20)
GND
SIF CLK
SIF MISO
SIF MOSI
SIF LOADB
GND
GPIO 6 (29)
GPIO 11 (19)
GPIO 13 (43)
(13)
GPIO 14 (42)
GPIO 8 (31)
GPIO 9 (32)
GPIO 10 (33)
GND
GPIO 15 (41)
GPIO 16 (40)
GND
n/a
GND
GND
GND
GND
GPIO 7 (30)
11
12
13
14
15
16
18
17
3
19
20
Table 2. Pin Information
Notes:
{1} VCONT is the internal amplifier gain control voltage, resistive external loading to ground can reduce
the amplifier gain and therefore lower the maximum available module Tx output power. For most of
the applications this pin is NOT connected and the amplifier is working at maximum gain.
Controlling the maximum output power can also be achieved in software.
{2} RTS/CTS handshaking is selectable in firmware. See the AT Command Manual.
{3} Pad 38 is connected to GPIO7 but is only used by the Telegesis firmware as an optional ADC
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
4 Hardware Description
Integrated
antenna
EM250
Vcc
Vreg
A/D
RF transceiver 2.4GHz
A/D Vref
RX/TX
switch
I/O0-I/O11
16-bit XAP2b µC
128kB flash / 5k RAM
Balun
I/O
UART
Reset
4 SIF
U.FL
socket
Terminal
selection,
filtering
and
matching
Programming
PA
Balun
24MHz
Figure 2. Block diagram
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
5 Hardware Interface
All I/O pins of the EM250 are accessible on the module’s pads. The pre-loaded Telegesis AT
Command Interface defines those I/Os as described below. Please refer to the Command
Dictionary and to the User Guide to learn more about the pre-loaded firmware. When developing
custom firmware all pins can be utilised as described in the EM250 datasheet.
ADC
The module has up to four analogue inputs. Readings with reference to the internal 1.2V
reference voltage can be made locally as well as over the air.
I/O
Pins I/O11 down to I/O0 are bi-directional I/O ports which can be controlled locally as well as
remotely by accessing local as well as remote S-registers. The functionality of the I/Os can be
controlled using three single 16-bit registers representing the data direction, the output buffer and
the input buffer. With the R3xx series of firmware it is now also possible to select internal pull-ups
or pull-downs for each individual I/O.
UART
The AT style command interpreter can be accessed via the TXD and RXD pins. The ETRX2-PA
can buffer up to 128 bytes of incoming data in a software FIFO buffer and uses XON/XOFF or
hardware flow control. See [2] for more information about the built-in UART.
Interrupt
Up to 4 I/Os can trigger user definable actions. User configurable edges can cause interrupts if
this function is enabled in the S-Registers.
Reset
Pulling the reset pin low will cause the module to restart. An external pull-up is not required, but
can be added for use in a very noisy environment.
PWM
I/O3 can alternatively act as a special function pin which can generate output waveforms up to
12MHz or act as a PWM. This functionality can be controlled locally as well as remotely by
accessing local as well as remote S-registers.
Antenna
Matching is provided to match the radio to the integrated antenna or to an optional external general
purpose 2.4GHz antenna. The on board antenna is supplied by Johanson. For full data on the
Johanson antenna please refer to [4]. The connector on the ETRX2HR-PA is Hirose part number
U.FL-SMT-R.
Power
The module is able to operate from 3.5V down to 2.7V which makes it ideally suited for batterypowered applications.
SIF
Interface for programming and real-time debugging the EM250.
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
6 Firmware Description
The modules are pre-loaded with a standalone bootloader which supports over-the-air bootloading
as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull A/D2 (GPIO5) to ground
and power-cycle the module. To avoid entering the standalone bootloader unintentionally make
sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A pull-up
is not required).
In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.silabs.com/telegesissoftware for updates. Each module
comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The
commands and responses pass through the serial port of the ETRX2-PA as ASCII text, so a
simple terminal application will usually suffice. We provide Telegesis Terminal but it is not an
essential feature.
The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing
stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have
no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and
receive messages via a parent router. In addition to a classical (sleepy) end device the module
firmware also supports mobile (sleepy) end devices capable of changing their parent quickly
whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a PAN coordinator through external host control. The AT style
command line supplies all the tools required to set up and manage a wireless mesh network by
allowing easy access to the low-level functionality of the stack.
The ETRX2-PA firmware uses the meshing and self healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the ZigBee 2006 stack. Following further
evolution of the ZigBee mesh networking specification, Telegesis also offer firmware that
implements the PRO feature set of ZigBee 2007.
The Telegesis firmware also allows low-level access to physical parameters such as channel and
power level. Parameters that define the functionality of the ETRX2-PA module and also allow
standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The
SPI and I2C buses are not supported by the current firmware release, but can be used with custom
firmware.
As a third option as opposed to using the Telegesis AT command interface or developing custom
firmware, the Ember EZSP UART interface can be provided to allow ZigBee application
development using a host controller driven binary protocol. For more information on the EZSP
interface please refer to the Ember EM260 datasheet.
6.1
Custom Firmware
For high volume customers the firmware can be customised on request. Customers can use the
ETRX2-PA module as hardware only and develop their own firmware based on the EmberZNet
stack. In order to develop custom firmware Insight Desktop™ is required together with a
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
comprehensive integrated development environment (IDE) and C-language compiler toolchain
from Ember.
6.2
Software Interface
Using the default firmware the ETRX2-PA is controlled using a simple AT-style command interface
and (mostly) non-volatile S-Registers. In order to get a full listing of all the available ATCommands, please refer to the AT command dictionary document which corresponds to the
firmware revision you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage return and you will be prompted with the module’s manufacturing
information.
The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
7 Absolute Maximum Ratings
Supply:
Inputs:
Operating temperature:
3.5V
-0.3V to Vcc+0.3V
-40 to 85°C
No.
Item
Symbol
Absolute Maximum Ratings
Unit
1
Supply voltage
Voltage on any I/O11:0 ,
SIF_CLK, SIF_MISO, SIF_MOSI,
SIF_LOADB, RESET
Voltage applied to Vreg
Storage temperature range
Operating temperature range
Input RF level
ESD on any pin (1) according to
Human Body Model (HBM) circuit
description
Reflow temperature
VBAT
-0.1 to +3.5
Vdc
Vin
-0.3 to VBAT+0.3
Vdc
Vreg
Tstg
Top
Pmax
-0.3 to 2.0
-40 to +105
-40 to +85
0
Vdc
°C
°C
dBm
VTHHBM
2
kV
TDeath
Please refer to chapter 13
°C
2
3
4
5
6
7
8
Table 3. Absolute Maximum Ratings
Notes:
(1)
Input must be current limited to the value specified.
The absolute maximum ratings given above should under no circumstances be violated.
Exceeding one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
8 Operating Conditions
Please Note: The firmware of the ETRX2 series and the ETRX2-PA series is identical, therefore
when talking about power settings in the following chapters, the actual output power out of the on
board EM250 is described, rather than the power amplified output out of the module. For the
relationship between EM250 power settings and module output power please relate to chapter
11.1 of this document. When developing custom firmware the output power settings described in
this document relate directly to the EM250 power settings accessible via the Ember stack API.
No.
Item
Condition /
Remark
Symbol
Value
Min
1
Supply voltage
2
3
RF Input Frequency
RF Input Power
EM250 Tx power mode
setting
EM250 Tx output power
setting
EM250 Tx output power
setting(2)
EM250 Tx output power
setting(2)
4
5
6
7
The typical value
is recommended
VDD
2.7
Typ
3.3
Unit
Max
3.5
Vdc
fC
2405
2480
MHz
pIN
0
dBm
NORMAL MODE or BOOST MODE(1) and
external PA
Channels 12-25
pOUTSET
-43
+3
dBm
Channel 11
pOUTSET
-43
-3
dBm
Channel 26
pOUTSET
-43
-14
dBm
pOUT
-22
-21
+17.5
+18.5
dBm
10
%
Channels 12-25
8
Typical module output
power corresponding to
Item 5. For more details
see part 11.1.
9
Tx Duty Cycle
10
Logic Input Voltage Low
VIL
0
0.2x
VBAT
V
11
Logic Input Voltage High
VIH
0.8x
VBAT
VBAT
V
VA/D
1.2
V
fSPI
12
MHz
+85
°C
12
13
14
NORMAL MODE
BOOST MODE
Maximum output
power set and 0dBi
Antenna (3)
Voltage Level on any of
the A/D Inputs
SPI clock rate
Operating temperature
range
Top
-40
Table 4. Operating Conditions
The conditions for compliance are:
(1)
BOOST MODE is allowed with some restrictions:
In order to stay within the output power limits of 20dBm and -30dBm PSD mask
absolute (IEEE802.15.4) the power setting value is limited to 0dBm, the maximum
supply voltage is limited to 3.3V and the operating temperature is limited to
temperatures above 0°C.
(2)
On the lowest channel 11 (2405 MHz) and the highest channel 26 (2480 MHz) the
maximum allowed output power settings are limited to the maximum values stated
above in order to not exceed the spectral power limits at the 2.4GHz ISM band edges
under extreme conditions as stated in part 4.3.3 “Frequency Range” of [1]
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
(3)
With these settings and duty cycles below 10% the limits for “Maximum Spectral Output
Power density” according to part 4.3.2 of [1] are not exceeded. For lower antenna gain
and/or lower TX output power the duty cycle may be increased according to the
formula in [1].
Please Note: The average current consumption during operation is dependent on the firmware
and the network load, therefore these figures are given in the command dictionary of the
respective firmware.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
9 DC Electrical Characteristics
VBAT = 3.3V, TAMB = 25°C, NORMAL MODE unless otherwise stated
Condition /
No.
Item
Symbol
Remark
Min
1
2
3
4
Module supply voltage
VBAT
Internal regulated core
voltage
Quiescent current,
excluding
internal RC oscillator
Quiescent current,
including
32.768kHz oscillator
5
Transmit current
consumption
6
Transmit Current
consumption
BOOST MODE
7
Transmit current
consumption
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Transmit current
consumption
Receive current
consumption
External load on internal
regulated core voltage
Input voltage for logic 0
input voltage for logic 1
Input current for logic 0
input current for logic 1
input pull-up resistor
value
input pull-down resistor
value
Output voltage for logic 0
Output voltage for logic 1
Output source current
(standard current pad)
Output sink current
(standard current pad)
Output source current
(high current pad: I/O3,
I/O1, I/O10, I/O11 )
Output sink current (high
current pad: I/O3, I/O1,
I/O10, I/O11)
Total output current
for I/O pads
Value
Unit
Typ
Max
VBAT
2.7
3.3
3.5
Vdc
connected to
Vreg pin 5 (1)
VCORE
1.7
1.8
1.9
Vdc
10k pull-down at
SIF_MOSI pin
ISLEEP
0.8
3.0
µA
10k pull-down at
SIF_MOSI pin
ISLEEP
1.5
3.5
µA
ITXVBAT
106
120
mA
ITXVBAT
121
130
mA
ITXVBAT
63
mA
ITXVBAT
56
mA
total
IRX
37
mA
connected to
Vreg pin 5 (1)
IREG_OUT
at +17.5dBm
module output
power
at +18.5dBm
module output
power
at +10dBm
module output
power
at +0dBm module
output power
VIL
VIH
IIL
IIH
0
0.8xVBAT
RIPU
30
RIPD
30
VOL
VOH
0
0.82xVBAT
2
mA
0.2xVBAT
VBAT
-0.5
0.5
Vdc
Vdc
µA
µA
k
k
0.18xVBAT
VBAT
Vdc
Vdc
IOHS
4
mA
IOLS
4
mA
IOHH
8
mA
IOLH
8
mA
IOH + IOL
40
mA
Table 5. DC Electrical Characteristics
Notes: (1) For more information about the internal regulated core voltage refer to part 5.7 in [2]. As the
internal regulated core voltage at VREG mainly feeds circuitry on ETRX2-PA, the VREG module pin may only
be slightly loaded and without feeding noise to VREG. VREG is not available in Power Mode 3 (see the AT
Command Manual for details of power modes).
Where the dc regulator option is mounted VREG is connected to the regulator option output instead and the
internal regulated core voltage is not accessible.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
10 A/D Converter Characteristics
No.
1
2
3
4
Item
A/D characteristics
A/D timing/performance characteristics
Reference Voltage
Maximum Input Voltage
refer to datasheet EM250 part 5.5 ADC Module
refer to datasheet EM250 part 5.5 ADC Module
1.2V
1.2V
Table 6. A/D Converter Characteristics
Note:
If a voltage higher than 1.2V is applied to any of the ADC inputs, the readings on the
other ADCs will be incorrect.
11 AC Electrical Characteristics
VBAT = 3.3V, TAMB = 25°C, NORMAL MODE measured at 50 terminal load connected to the U.FL socket
No.
Receiver
Min
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Sensitivity for 1% Packet Error Rate (PER)
Sensitivity for 1% Packet Error Rate (PER) BOOST MODE
Saturation (maximum input level for correct operation, low gain)
Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Alternate Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
RF frontend filter attenuation for interferers in the range 17101910MHz
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Spurious Emissions <1GHz
Spurious Emissions >1GHz
©2016 Silicon Labs
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-92
-93
0
Value
Typ
-96
-97
4
Unit
Max
-
dBm
dBm
dBm
30
dB
40
dB
40
dB
40
dB
-6
dBc
30
dB
-80
80
ppm
-80
80
ppm
-57
-47
dB
dBm
dBm
40
-
50
-74
-60
ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
No.
Receiver
Min
15
16
17
18
19
20
21
22
23
24
25
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at power setting -20dBm
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Carrier frequency error
PSD mask relative
3.5MHz distance from carrier
PSD mask absolute
3.5MHz distance from carrier
2nd harmonic at highest power setting
3rd harmonic at highest power setting
Spurious Emissions <1GHz
Spurious Emissions >1GHz
14
15
Value
Typ
17.5
18.5
0
-22
10
-40
Unit
Max
20
dBm
35
40
dBm
dBm
%
ppm
-20
-36
dB
-30
TBD
dBm
-
-60
-52
-60
-57
-30
-30
-36
-30
dBm
dBm
dBm
dBm
Table 7. AC Electrical Characteristics
Notes:
(1) at pin 38 RF or U.FL socket, for all channels number 11,12,..., 26 according to ref [1]
No.
Standby
Min
26
27
Spurious Emissions <1GHz
Spurious Emissions >1GHz
-
Limit
Typ
-66
-66
Unit
Max
-57
-47
dBm
dBm
Table 8. Standby Spurious Emissions
No.
Synthesiser Characteristics
Min
29
30
Limit
Typ
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Unit
Max
100
100
µs
µs
Table 9. Synthesiser Characteristics
No.
Power On Reset (POR) Specifications
Min
31
32
33
34
VBAT POR release
VBAT POR assert
VCORE POR release
VCORE POR hysteresis
1.0
0.5
1.35
0.08
Limit
Typ
1.2
0.6
1.5
0.1
Unit
Max
1.4
0.7
1.65
0.12
Vdc
Vdc
Vdc
Vdc
Table 10. Power On Reset Specifications for EM250 chip
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
11.1 TX Power Characteristics
The diagrams below show the typical output power and module current in dependency on module
supply voltage and EM250 power setting in NORMAL MODE.
Output power vs power setting
20
15
output power dBm
10
5
2.7
0
3
-5
3.3
-10
3.5
-15
-20
-25
-30
-50
-40
-30
-20
-10
power setting dBm
0
10
Figure 3. Output Power vs. Power Setting
Module current vs power setting
120
100
current mA
80
2.7
3
60
3.3
3.5
40
20
0
-50
-40
-30
-20
-10
power setting dBm
0
10
Figure 4. Module Current vs. Power Setting
Please Note: The power setting is the setting of the EM250’s output power (before amplification). This setting is used by
all firmware running on the ETRX2-PA.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
12 Physical Dimensions
Figure 5: ETRX2-PA Physical Dimensions
Symbol
L
W
H
A1
A2
A3
A4
A5
R1
R2
R3
X1
X2
Y1
Y2
Y3
Y4
Explanation
Length of the module
Width of the module
Height of the module
Pitch
Distance centre of pad PCB edge
Distance centre of pad PCB edge
Distance PCB edge metal can
Distance PCB edge start of pad
Keep-out Zone from corner of PCB
Keep-out Zone from corner of PCB
Width of keep-out Zone adjacent to PCB
Distance centre of Antenna connector PCB edge
Distance centre of Antenna connector PCB edge
Pitch
Distance between rows of pads
Distance between edge of PCB and pad
Distance between edge of PCB and pad
Distance
37.5mm
20.5mm
3.20mm
2.54mm
2.24mm
3.9mm
6.5mm
6.7mm
5.0mm
5.0mm
12.7mm
3.00mm
3.80mm
1.27mm
1.50mm
2.75mm
3.8mm
Table 11. Physical Dimensions ETRX2-PA
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no components, tracks or copper planes in the “keepout” area which should be as large as possible; note also the small secondary keep-out area which
is required for best performance using the -PA version. If using the U.FL RF connector the “keepout” area can be significantly reduced. NB: The module transmit/receive range will depend
strongly on the antenna used and also the housing of the finished product.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
13 Soldering Temperature Time Profile (for reflow soldering)
13.1 For Leaded Solder
10 1s
Recommended temp. profile
for reflow soldering
30 +20/-10s
235°C max.
Temp.[°C]
220 5°C
200°C
150 10°C
90 30s
Time [s]
Figure 6: Temperature Profile for Lead Solder
13.2 For Lead-free Solder
Our used temp. profile
for reflow soldering
30 +20/-10s
Temp.[°C]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
Time [s]
Figure 7: Temperature Profile for Lead-free Solder
NB:
Maximum Reflow Cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your pcb and re-flow).
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
14 Product Label Drawings
Figure 8: Product Labels
The label dimensions are 16.0mm x 14 mm (width x height). The label is suitable for reflow
soldering.
Imprint
Description
Module Order Code. Could Be:
Model: ETRX2
0000001
090101
01
10
FCC ID: T7VEM250A
IC: 8735A-EM250B
CE
2D-Barcode
ETRX2-PA
ETRX2HR-PA
Indication for the serial number.
Starting at 0000000 for each batch incrementing with each module
Production Date Code in the format YYMMDD, e.g. 090101
Indication for batch number
Starting at 00 for beta panel, 01 for pilot run, etc…
Indication for the hardware revision
This should be left at 10 until further notice
FCC ID for –PA modules: T7VEM250B
IC for –PA modules: 8735A-EM250B
The CE Mark
Information in the 2D-Barcode are the serial number [7 signs], the Part-Name, identifier for the
batch number [2 signs], the identifier for the hardware release [2 signs] and the production
date code in the format Year-Month-Day [6 signs], separated by a semicolon.
Table 12. ETRX2-PA Label Details
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
15 Recommended Footprint
In order to surface mount the module, we recommend that you use pads which are 1.5mm wide
and 1.7mm high, the extra height extending the pads shown in Figure 9 towards the outside of
your layout. You must retain the “keep-out” zone shown in Figure 5 (page 22), and ensure that this
area is free of copper tracks and/or copper planes/layers.
You must also ensure that there are no exposed pads or vias on your layout which may contact
with the pads (for the optional connector), or vias on the bottom surface of the ETRX2-PA module.
If the module is to be soldered by hand for prototyping we recommend that you increase the height
of the pads to allow easier access.
Figure 9: Recommended Footprint
The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120μm to 150μm, although it may be necessary to go up to 200µm to ensure reliable
joints.
Although the under side of ETRX2-PA is fully coated (except for the footprint of the additional
Harwin SMT connector), no exposed copper, such as through-hole vias, planes or tracks on your
board component layer, should be located below the ETRX2-PA in order to avoid ‘shorts’. In
cases where a exposed track or through hole via has to be located under the module it must be
kept away from ETRX2-PA via holes. The ETRX2-PA multilayer PCB contains an inner RF
shielding ground plane, therefore there is no need to have an additional copper plane directly
under the ETRX2-PA; however it can help to reduce the operating temperature by acting as a
heatsink.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
15.1 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 10 shows the reference carrier board
which was used during testing by Telegesis.
Figure 10: Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 12.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 60 x 50mm. In many cases a smaller ground plane will
suffice, but a degradation in radio performance could be the result.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
16 Reliability Tests
The measurements were conducted after the module being exposed to room temperature and
humidity for 1 hour.
No
Item
Limit
Condition
1
Vibration test
Electrical parameter should be
in specification
2
Shock test
the same as the above
3
Heat cycle test
the same as the above
4
5
6
Moisture test
Low temp. test
High temp. test
the same as the above
the same as the above
the same as the above
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of
50cm for 3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
+60°C, 90% RH, 300h
-40°C, 300h
+85°C, 300h
Table 13. Reliability Tests
17 Application Notes
17.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated
when a short circuit occurs, then at least, provide the following failsafe functions, as a
minimum:
(1)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2)
Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
17.2 Design Engineering Notes
(1)
Heat is the major cause of shortening the life of these products. Avoid assembly and
use of the target equipment in conditions where the product’s temperature may exceed
the maximum allowable.
(2)
Failure to do so may result in degrading of the product’s functions and damage to the
product.
(3)
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
(4)
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
(5)
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
(6)
In direct sunlight, outdoors, or in a dusty environment
(7)
In an environment where condensation occurs.
(8)
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOx)
(9)
If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
17.3 Storage Conditions
(1)
The module must not be stressed mechanically during storage.
(2)
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance, may well be adversely
affected:
(3)
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
(4)
Storage in direct sunlight
(5)
Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
(6)
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3)
have been met, should be avoided.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
18 Packaging
18.1 Embossed Tape
(1)
Dimension of the tape (EIAJ-tbd)
(2)
Cover tape reel strength
Force direction
Speed = 300mm/min.
θ= 10deg
Cover tape reel strength
=0.098～0.68N (10～70g)
(3)
Empty pockets
Direction of
feed
g
Empty pockets
more
Components Empty pockets Top cover
tape
NB: Empty pockets in the component packed area shall be less than two per reel and those
empty pockets shall not be consecutive.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
18.2 Component Orientation
Top cover tape shall not be found on reel holes and will not stick out from the reel
(top view)
Part No.
Direction
Component Orientation
18.3 Reel Dimensions
Quantity per reel: 400 pieces
(5)
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
φ 13 +/-0.5
(4)
φ 13 +/-1
φ 80 +/-2
2 +/-0.5
Marking
?
33.5 +/-1.0
φ 330
Figure 2
2.0 +/-0.2
18.4 Packaging
(6)
Each reel will be packed in a hermetically-sealed bag
(7)
Marking :
©2016 Silicon Labs
Part No. / Quantity / Lot No. and manufacturer part# with bar-code
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
19 Ordering Information
Ordering/Product Code
Description
ETRX2
Telegesis Wireless Mesh Networking Module with Ember
ZigBee Technology:


ETRX2HR
Telegesis Wireless Mesh Networking Module with Ember
ZigBee Technology:


ETRX2-PA
Telegesis AT Style Command Interpreter and
EmberZNet meshing and self-healing stack
Hirose U.FL Antenna Connector
Long-range Telegesis Wireless Mesh Networking Module with
Ember ZigBee Technology:



ETRX2HR-PA
Telegesis AT Style Command Interpreter and
EmberZNet meshing and self-healing stack
Integrated 2.4GHz Antenna
Telegesis AT Style Command Interpreter and
EmberZNet meshing and self-healing stack
Integrated 2.4GHz Antenna
RF amplifier with 18dBm output
Long-range Telegesis Wireless Mesh Networking Module with
Ember ZigBee Technology:



Telegesis AT Style Command Interpreter and
EmberZNet meshing and self-healing stack
Hirose U.FL Antenna Connector
RF amplifier with 18dBm output
Notes:
 Customers’ PO’s must state the Ordering/Product Code.
 There is no “blank” version of the ETRX2-PA Module available. All Modules are preprogrammed with the Telegesis AT style command interpreter based on the EmberZNet
stack. (Where customers wish to add their own firmware they can erase and write it to the
flash memory of the EM250).
 Please contact Telegesis if you require additional AT style commands or specific
integration assistance.
 See the ETRX2 Product Manual for details of this variant.
©2016 Silicon Labs
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ETRX2PA Product Manual (Rev 1.10)
ETRX2PA
20 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on the declaration of our suppliers that
this product does not contain the following substances which are banned by Directive 2002/95/EC
(RoHS) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous
materials for:





Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:

Cadmium and cadmium compounds
21 Related Documents
[1]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs)
[2]
Datasheet EM250, Ember. (www.silabs.com)
[3]
Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height
[4]
Johanson 2450AT43A100 Antenna datasheet (www.johansontechnology.com)
[5]
The ZigBee specification (www.zigbee.org)
©2016 Silicon Labs
- 33 -
ETRX2PA Product Manual (Rev 1.10)
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or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and
"Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to
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