SMD ESD Protection Diode CPDH3-5V0U-HF RoHS Device Halogen Free Features SOT-523 -IEC61000-4-2 Level 4 ESD protection. -Surface mount package. 0.067(1.70) 0.059(1.50) -High component density. 3 0.035(0.90) Mechanical data 0.028(0.70) 1 -Case: SOT-523 Standard package, molded plastic. 2 0.043(1.10) 0.035(0.90) -Terminals: Solderable per MIL-STD-750, method 2026. 0.008(0.20) 0.004(0.10) 0.031(0.80) -Marking code: E5U 0.069(1.75) 0.028(0.70) 0.057(1.45) -Mounting position: Any. 0.004(0.10) -Weight: 0.0028 gram (approx.). 0.014(0.35) 0.000(0.00) 0.018(0.46) 0.011(0.26) 0.010(0.25) Circuit diagram Dimensions in inches and (millimeter) Maximum Rating and Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Diode breakdown voltage Symbol Conditions VBD IR = 1mA Leakage current IL VR = 3V Forward voltage VF IF =10mA Junction capacitance CT VR = 0V,f = 1MHz ESD capability ESD Min Typ Max Unit 6.1 V 0.1 60 1.0 uA 1.2 V 80 pF IEC 61000-4-2(air) 15 IEC 61000-4-2(contact) 8 IPP = 1A,TP=8/20us 8 IPP = 8A,TP=8/20us 10 kV Clamping voltage VC Peak pulse power PPP 80 W TJ 125 °C 150 °C Operation temperature Storage temperature TSTG -55 Company reserves the right to improve product design , functions and reliability without notice. V REV:B Page 1 QW-JP011 Comchip Technology CO., LTD. SMD ESD Protection Diode RATING AND CHARACTERISTIC CURVES (CPDH3-5V0U-HF) Fig. 1 - 8/20us Peak pulse current waveform acc. IEC 61000-4-5 120% Percentage of Ipp 100% Test Waveform parameters tf=8us td=20us Peak Valur Ipp e-t 80% 60% 40% 120 Mounting on glass epoxy PCBs 100 Power rating, (%) Ta=25°C Fig.2 - Power rating derating curve td= t Ipp/2 20% 80 60 40 20 0% 0 0 5 10 15 20 25 30 0 Fig.3 - Clamping voltage vs. peak pulse current 50 75 100 125 150 Fig.4 - Capacitance between terminals characteristics Capacitance between terminals, (PF) 14 8/20us waveform 12 Clamping voltage, VC (V) 25 Ambient temperature, ( °C ) Time, (us) 10 8 6 4 2 0 100 f=1MHz TA=25°C 80 60 40 20 0 0 2 4 6 8 Peak pulse current, IPP (A) 0 1 2 3 4 5 Reverse voltage, (V) Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 2 QW-JP011 Comchip Technology CO., LTD. SMD ESD Protection Diode Reel Taping Specification P1 d T F E P0 W B 3 XXX 1 2 C A P 12 o 0 D2 D1 D W1 SOT-523 SOT-523 SYMBOL A B C d D D1 D2 (mm) 1.85 ± 0.05 1.85 ± 0.05 0.88 ± 0.05 1.50 ± 0.10 178 ± 2.00 54.40 ± 1.00 13.00 ± 1.00 (inch) 0.073 ± 0.002 0.073 ± 0.002 0.035 ± 0.002 0.059 ± 0.004 7.008 ± 0.079 2.142 ± 0.039 0.512 ± 0.039 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 8.00 + 0.30 /–0.10 12.30 ± 1.00 (inch) 0.069 ± 0.004 0.138 ± 0.004 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.315 + 0.012 /–0.004 0.484 ± 0.039 Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 3 QW-JP011 Comchip Technology CO., LTD. SMD ESD Protection Diode Marking Code 3 Part Number Marking Code CPDH3-5V0U-HF E5U E5U 1 2 Suggested PAD Layout SOT-523 B SIZE (mm) (inch) A 0.60 0.024 B 0.50 0.020 C 0.40 0.016 D 1.00 0.039 E 1.24 0.049 F 1.84 0.072 A E F A C D Standard Packaging REEL PACK Case Type SOT-523 REEL Reel Size ( pcs ) (inch) 3,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 4 QW-JP011 Comchip Technology CO., LTD.