SMD ESD Protection Diode CPDH6-5V0U-HF RoHS Device Halogen Free SOT-563 Features 0.067(1.70) 0.059(1.50) -IEC61000-4-2 Level 4 ESD protection -Surface mount package. 0.051(1.30) 0.043(1.10) -High component density. Mechanical data 0.022(0.55) 0.018(0.45) -Case: SOT-563 Standard package, molded plastic. 0.006(0.16) 0.004(0.09) 0.024(0.60) 0.021(0.52) -Terminals: Solderable per MIL-STD-750, method 2026. 0.067(1.70) 0.059(1.50) -Marking code: E5U 0.011(0.27) 0.007(0.17) -Mounting position: Any. 0.012(0.30) 0.004(0.10) 0.002(0.05) 0.000(0.00) -Weight: 0.0034 gram (approx.). Dimensions in inches and (millimeters) Circuit diagram 6 5 4 1 2 3 Maximum Rating and Electrical Characteristics (at TA=25°C unless otherwise noted) Parameter Diode breakdown voltage Symbol Conditions VBD IR = 1mA Leakage current IL VR = 3V Forward voltage VF IF =10mA Junction capacitance CT VR = 0V,f = 1MHz Clamping voltage VC Min Typ Max Unit 6.1 V 0.1 60 1.0 uA 1.2 V 80 pF IPP = 1A,TP=8/20us 8 IPP = 8A,TP=8/20us 10 IEC 61000-4-2(air) 15 IEC 61000-4-2(contact) 8 V ESD capability ESD Peak pulse power PPP 80 W TJ 125 °C 150 °C Operation temperature Storage temperature TSTG -55 Company reserves the right to improve product design , functions and reliability without notice. kV REV:B Page 1 QW-JP005 Comchip Technology CO., LTD. SMD ESD Protection Diode RATING AND CHARACTERISTIC CURVES (CPDH6-5V0U-HF) Fig. 1 - 8/20us Peak pulse current waveform acc. IEC 61000-4-5 120% Percentage of Ipp 100% Test Waveform parameters tf=8us td=20us Peak Valur Ipp e-t 80% 60% 40% 120 Mounting on glass epoxy PCBs 100 Power rating (%) Ta=25°C Fig.2 - Power rating derating curve td= t Ipp/2 20% 80 60 40 20 0% 0 0 5 10 15 20 25 30 0 Fig.3 - Clamping voltage vs. peak pulse current 50 75 100 125 150 Fig.4 - Capacitance between terminals characteristics 14 Capacitance between terminals (PF) 100 8/20us waveform 12 Clamping voltage,VC (V) 25 Ambient temperature, ( °C ) Time, (us) 10 8 6 4 2 0 f=1MHz TA=25°C 80 60 40 20 0 0 2 4 6 8 Peak pulse current,IPP (A) 0 1 2 3 4 5 Reverse voltage (V) Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 2 QW-JP005 Comchip Technology CO., LTD. SMD ESD Protection Diode Reel Taping Specification P1 d T . W B F E P0 XXX C A P 12 o 0 D2 D1 D W1 SOT-563 SOT-563 SYMBOL A B C d D D1 D2 (mm) 1.78 ± 0.10 1.78 ± 0.10 0.69 ± 0.10 1.50 ± 0.10 178 ± 2.00 54.4 ± 1.00 13.0 ± 1.00 (inch) 0.070 ± 0.004 0.070 ± 0.004 0.027 ± 0.004 0.059 ± 0.004 7.008 ± 0.079 2.142 ± 0.040 0.512 ± 0.040 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 8.00 ± 0.10 12.30 ± 1.00 (inch) 0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.315 ± 0.004 0.567 ± 0.040 Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 3 QW-JP005 Comchip Technology CO., LTD. SMD ESD Protection Diode Marking Code 6 Part Number Marking Code CPDH6-5V0U-HF E5U 5 4 E5U . 1 2 3 Suggested PAD Layout C SOT-563 SIZE A (mm) (inch) 0.30 0.012 A D B 0.30 0.012 C 1.00 0.039 D 1.40 0.055 E 1.70 0.067 E B Standard Packaging REEL PACK Case Type SOT-563 REEL Reel Size ( pcs ) (inch) 3,000 7 Company reserves the right to improve product design , functions and reliability without notice. REV:B Page 4 QW-JP005 Comchip Technology CO., LTD.