SD05C through SD24C Single Line TVS Diode for ESD Protection in Portable Electronics PRELIMINARY PROTECTION PRODUCTS Description Features The SDxxC TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDA’s. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. The SDxxC series TVS diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. 350 Watts peak pulse power (tp = 8/20µs) Transient protection for data lines to The SDxxC is in a SOD-323 package and will protect one bidirectional line. They are available with working voltages of 5 - 24 volts. These devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be “sprinkled” around the board in applications where board space is at a premium. IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 24A (8/20µs) Small package for use in portable electronics Suitable replacement for MLV’s in ESD protection applications Protects one I/O or power line Low clamping voltage Working voltages: 5V, 12V, 15V, 24V Low leakage current Solid-state silicon avalanche technology Mechanical Characteristics They may may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (±15kV air, ±8kV contact discharge). EIAJ SOD-323 package Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel per EIA 481 Applications Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDA’s) Notebooks, Desktops, and Servers Portable Instrumentation Pagers Peripherals Schematic & PIN Configuration 1 2 SOD-323 (Top View) Revision 07/06/04 1 www.semtech.com SD05C through SD24C PROTECTION PRODUCTS Absolute Maximum Rating R ating Symbol Value Units Peak Pulse Power (tp = 8/20µs) Pp k 350 Watts ESD Voltage (HBM Waveform p er IEC 61000-4-2) VESD 30 kV Lead Soldering Temp erature TL 260 (10 sec.) °C Op erating Temp erature TJ -55 to +125 °C TSTG -55 to +150 °C Storage Temp erature Electrical Characteristics SD05C T VS Parameter Symbol Conditions Minimum Typical Maximum Units 5 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 5V, T=25°C 10 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 9.8 V Clamp ing Voltage VC IPP = 24A, tp = 8/20µs 14.5 V Peak Pulse Current IP P tp = 8/20µs 24 A Junction Cap acitance Cj VR = 0V, f = 1MHz 200 pF Symbol Conditions Maximum Units 12 V 6 V SD12C T VS Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 12V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 19 V Clamp ing Voltage VC IPP = 15A, tp = 8/20µs 24 V Peak Pulse Current IP P tp = 8/20µs 15 A Junction Cap acitance Cj VR = 0V, f = 1MHz 100 pF 2004 Semtech Corp. 2 13.3 V www.semtech.com SD05C through SD24C PRELIMINARY PROTECTION PRODUCTS Electrical Characteristics (Continued) SD15C T VS Parameter Symbol Conditions Minimum Typical Maximum Units 15 V Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 15V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 24 V Clamp ing Voltage VC IPP = 12A, tp = 8/20µs 29 V Peak Pulse Current IP P tp = 8/20µs 12 A Junction Cap acitance Cj VR = 0V, f = 1MHz 75 pF Symbol Conditions Maximum Units 24 V 16.7 V SD24C T VS Parameter Minimum Typical Reverse Stand-Off Voltage VRWM Reverse Breakdown Voltage V BR It = 1mA Reverse Leakage Current IR VRWM = 24V, T=25°C 1 µA Clamp ing Voltage VC IPP = 5A, tp = 8/20µs 40 V Clamp ing Voltage VC IPP = 8A, tp = 8/20µs 44 V Peak Pulse Current IP P tp = 8/20µs 8 A Junction Cap acitance Cj VR = 0V, f = 1MHz 50 pF 2004 Semtech Corp. 3 26.7 V www.semtech.com SD05C through SD24C PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 10 100 90 % of Rated Power or PI P Peak Pulse Power - Ppk (kW) 110 1 0.1 80 70 60 50 40 30 20 10 0.01 0 0.1 1 10 100 1000 0 25 Pulse Waveform Percent of IPP 80 Clamping Voltage - VC (V) 90 e -t 50 40 100 125 150 30 Waveform Parameters: tr = 8µs td = 20µs 100 60 75 Clamping Voltage vs. Peak Pulse Current 110 70 50 Ambient Temperature - TA (oC) Pulse Duration - tp (µs) td = IPP/2 30 20 10 Waveform Parameters: tr = 8µs td = 20µs 25 SD12C 20 15 SD05C 10 5 0 0 5 10 15 20 25 30 0 Time (µs) 0 5 10 15 20 25 30 Peak Pulse Current - IPP (A) 2004 Semtech Corp. 4 www.semtech.com SD05C through SD24C PRELIMINARY PROTECTION PRODUCTS Applications Information Device Connection Options Device Schematic and Pin Configuration The SDxxC TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is bidirectional and may be used on lines where the signal polarity is above and below ground. The device is symmetrical, so there is no cathode band. Size Comparison to 0805 MLV Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): z z z z z z z z z Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS and decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane. SOD-323 0805 MLV Note: Nominal dimensions in inches Component Placement Comparison 0805 MLV on 0805 Solder Pad Matte Tin Lead Finish SOD-323 on 0805 MLV Pad SOD-323 on Recommended (SOD-323) Solder Pad Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 5 www.semtech.com SD05C through SD24C PROTECTION PRODUCTS Outline Drawing - SOD-323 Land Pattern - SOD-323 2004 Semtech Corp. 6 www.semtech.com SD05C through SD24C PRELIMINARY PROTECTION PRODUCTS Marking Codes Part Number Marking Code SD05C 5/ SD12C 6/ SD15C 7/ SD24C 8/ 5 6 7 8 Ordering Information Par t Number Lead Finish Qty per Reel R eel Size SD05C.TC SnPb 3,000 7” SD12C.TC SnPb 3,000 7” SD15C.TC SnPb 3,000 7” SD24C.TC SnPb 3,000 7” SD05C.TCT Pb free 3,000 7” SD12C.TCT Pb free 3,000 7” SD15C.TCT Pb free 3,000 7” SD24C.TCT Pb free 3,000 7” Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 2004 Semtech Corp. 7 www.semtech.com